›2.↳ 1The system of claim 1, wherein, during use, 75% or more of the ions in the ion beam that reach a surface of a sample are generated via an interaction …d2
The system of claim 1, wherein, during use, 75% or more of the ions in the ion beam that reach a surface of a sample are generated via an interaction of the gas with only one atom of the one or more atoms.
›3.↳ 1The system of claim 1, wherein, during use, 80% or more of the ions in the ion beam that reach a surface of a sample are generated via an interaction …d2
The system of claim 1, wherein, during use, 80% or more of the ions in the ion beam that reach a surface of a sample are generated via an interaction of the gas with only one atom of the one or more atoms.
›4.↳ 1The system of claim 1, wherein, during use, 85% or more of the ions of the ions in the ion beam that reach a surface of a sample are generated via an …d2
The system of claim 1, wherein, during use, 85% or more of the ions of the ions in the ion beam that reach a surface of a sample are generated via an interaction of the gas with only one atom of the one or more atoms.
›5.↳ 1The system of claim 1, further comprising ion optics that include electrodes and an aperture.d2+2
The system of claim 1, further comprising ion optics that include electrodes and an aperture.
›6.↳ 5The system of claim 5, wherein the aperture is a disk.d3
The system of claim 5, wherein the aperture is a disk.
›7.↳ 5The system of claim 5, wherein the aperture has multiple openings.d3
The system of claim 5, wherein the aperture has multiple openings.
›8.↳ 1The system of claim 1, wherein the terminal shelf comprises 20 atoms or less.d2
The system of claim 1, wherein the terminal shelf comprises 20 atoms or less.
›9.↳ 1The system of claim 1, wherein the terminal shelf is a trimer.d2
The system of claim 1, wherein the terminal shelf is a trimer.
›10.↳ 1The system of claim 1, wherein the electrically conductive tip has an average radius of curvature of 200 nm or less.d2
The system of claim 1, wherein the electrically conductive tip has an average radius of curvature of 200 nm or less.
›11.↳ 1The system of claim 1, wherein the electrically conductive tip has an average full cone angle of from 15° to 45°.d2
The system of claim 1, wherein the electrically conductive tip has an average full cone angle of from 15° to 45°.
›12.↳ 1The system of claim 1, the electrically conductive tip has average cone direction of 10° or less.d2
The system of claim 1, the electrically conductive tip has average cone direction of 10° or less.
›13.↳ 1The system of claim 1, wherein the electrically conductive tip includes an end that comprises a single crystal that is aligned with a longitudinal axi…d2
The system of claim 1, wherein the electrically conductive tip includes an end that comprises a single crystal that is aligned with a longitudinal axis of the electrically conductive to within 3° or less.
›14.↳ 1The system of claim 1, wherein the electrically conductive tip comprises a material selected from the group consisting of tungsten, carbon, tantalum, …d2
The system of claim 1, wherein the electrically conductive tip comprises a material selected from the group consisting of tungsten, carbon, tantalum, iridium, rhenium, niobium, platinum and molybdenum.
›15.↳ 1The system of claim 1, wherein the electrically conductive tip is a tungsten tip.d2
The system of claim 1, wherein the electrically conductive tip is a tungsten tip.
›16.↳ 1The system of claim 1, wherein the electrically conductive tip is a W(111) tip.d2+1
The system of claim 1, wherein the electrically conductive tip is a W(111) tip.
›17.↳ 16The system of claim 16, wherein the terminal shelf is a trimer.d3
The system of claim 16, wherein the terminal shelf is a trimer.
›18.↳ 1The system of claim 1, wherein the system is a gas field ion microscope.d2
The system of claim 1, wherein the system is a gas field ion microscope.
›19.↳ 1The system of claim 1, wherein the system is a helium ion microscope.d2
The system of claim 1, wherein the system is a helium ion microscope.
›20.↳ 1The system of claim 1, wherein the system is a scanning ion microscope.d2
The system of claim 1, wherein the system is a scanning ion microscope.
›21.↳ 1The system of claim 1, wherein the system is a scanning helium ion microscope.d2
The system of claim 1, wherein the system is a scanning helium ion microscope.
›22.↳ 1The system of claim 1, further comprising a mechanism, the gas field ion source including an electrically conductive tip, the mechanism being coupled …d2+3
The system of claim 1, further comprising a mechanism, the gas field ion source including an electrically conductive tip, the mechanism being coupled to the gas field ion source so that the mechanism can translate the electrically conductive tip, tilt the electrically conductive tip or both.
›23.↳ 22The system of claim 22, wherein the mechanism comprises a curved surface.d3
The system of claim 22, wherein the mechanism comprises a curved surface.
›24.↳ 22The system of claim 22, wherein the mechanism tilts the ion source relative to the aperture.d3
The system of claim 22, wherein the mechanism tilts the ion source relative to the aperture.
›25.↳ 22The system of claim 22, wherein the electrically conductive tip is a W(111) tip, and the terminal shelf is a trimer.d3
The system of claim 22, wherein the electrically conductive tip is a W(111) tip, and the terminal shelf is a trimer.
›26.↳ 1The system of claim 1, wherein the system is a gas field ion microscope having a damage test value is 25 nm or less.d2
The system of claim 1, wherein the system is a gas field ion microscope having a damage test value is 25 nm or less.
›27.↳ 1The system of claim 1, wherein the system is a gas field ion microscope having a quality factor of 0.25 or more.d2
The system of claim 1, wherein the system is a gas field ion microscope having a quality factor of 0.25 or more.
›28.↳ 1The system of claim 1, wherein the system is a gas field ion microscope that is capable of producing an image of a sample, the image of the sample hav…d2
The system of claim 1, wherein the system is a gas field ion microscope that is capable of producing an image of a sample, the image of the sample having a resolution of 10 nm or less.
›29.↳ 1The system of claim 1, wherein the gas field ion source is capable of interacting with the gas to generate an ion beam for a time period of one week o…d2
The system of claim 1, wherein the gas field ion source is capable of interacting with the gas to generate an ion beam for a time period of one week or more with a maximum interruption time of 10 hours or less.
›30.↳ 1The system of claim 1, wherein gas field ion source comprises an electrically conductive tip, the ion source being capable of interacting with the gas…d2
The system of claim 1, wherein gas field ion source comprises an electrically conductive tip, the ion source being capable of interacting with the gas to generate the ion beam for a time period of one week or more without removing the electrically conductive tip from the system.
›31.↳ 1The system of claim 1, wherein the ion beam has a reduced etendue of 1×10−16 cm2srV or less.d2
The system of claim 1, wherein the ion beam has a reduced etendue of 1×10−16 cm2srV or less.
›32.↳ 1The system of claim 1, wherein the ion beam has an etendue of 5×10−21 cm2sr or less.d2
The system of claim 1, wherein the ion beam has an etendue of 5×10−21 cm2sr or less.
›33.↳ 1The system of claim 1, wherein the ion beam has a reduced brightness at the surface of the sample of 5×108 A/m2srV or more.d2
The system of claim 1, wherein the ion beam has a reduced brightness at the surface of the sample of 5×108 A/m2srV or more.
›34.↳ 1The system of claim 1, wherein the ion beam has a brightness at the surface of the sample of 1×109 A/cm2sr or more.d2
The system of claim 1, wherein the ion beam has a brightness at the surface of the sample of 1×109 A/cm2sr or more.
›35.↳ 1The system of claim 1, wherein the ion beam has a spot size with a dimension of 10 nm or less at the surface of the sample.d2
The system of claim 1, wherein the ion beam has a spot size with a dimension of 10 nm or less at the surface of the sample.
›36.↳ 1The system of claim 1, wherein the ion beam has an ion beam current at the surface of the sample of one nA or less.d2+1
The system of claim 1, wherein the ion beam has an ion beam current at the surface of the sample of one nA or less.
›37.↳ 36The system of claim 36, wherein the ion beam current at the surface of the sample is 0.1 fA or more.d3
The system of claim 36, wherein the ion beam current at the surface of the sample is 0.1 fA or more.
›38.↳ 1The system of claim 1, wherein the ion beam has an energy spread at the surface of the sample of five eV or less.d2
The system of claim 1, wherein the ion beam has an energy spread at the surface of the sample of five eV or less.
›39.↳ 1The system of claim 1, further comprising the sample, wherein the gas field ion source including a tip, and the surface of the sample is five cm or mo…d2
The system of claim 1, further comprising the sample, wherein the gas field ion source including a tip, and the surface of the sample is five cm or more from the tip.
›40.↳ 1The system of claim 1, further comprising a coolant source thermally coupled to the gas field ion source so that during operation of the ion source th…d2
The system of claim 1, further comprising a coolant source thermally coupled to the gas field ion source so that during operation of the ion source the temperature of the ion source is 5K or more.
›41.↳ 1The system of claim 1, further comprising a cryogenic refrigerator source thermally coupled to the gas field ion source so that during operation of th…d2
The system of claim 1, further comprising a cryogenic refrigerator source thermally coupled to the gas field ion source so that during operation of the ion source the temperature of the ion source is 5K or more.
›42.↳ 1The system of claim 1, wherein the ion beam having a convergence half angle of 5 mrad or less at a surface of the sample.d2
The system of claim 1, wherein the ion beam having a convergence half angle of 5 mrad or less at a surface of the sample.
›43.↳ 1The system of claim 1, wherein the gas field ion source comprises an electrically conductive tip having a terminal shelf with 20 atoms or less.d2
The system of claim 1, wherein the gas field ion source comprises an electrically conductive tip having a terminal shelf with 20 atoms or less.