A positive photosensitive composition using immersion exposure comprising:n(A) 5 to 20 parts by weight of the total amount of at least one sulfonium salt compound that generates an acid upon irradiation with an actinic ray;(B) 100 parts by weight of the total amount of at least one fluorine atom-containing resin having a group that increases solubility of the resin in an alkaline developer by the action of an acid,wherein at least one basic compound is contained in an amount of 0.01 to 5% by weight in the positive photosensitive composition, based on the solid components of the positive photosensitive composition, andwherein the resin (B) has a repeating unit with no fluorine atom selected from the group consisting of (a) a monocyclic or polycyclic alicyclic hydrocarbon structure-having, acid-dissociating repeating unit; (b) a lactone structure-having repeating unit; and (c) a monocyclic or polycyclic alicyclic hydrocarbon structure and hydroxyl group-having repeating unit; anda fluorine-atom containing repeating unit having from 1 to 3 groups represented by formula (A-1):
›2.↳ 1The positive photosensitive composition according to claim 1, wherein the resin (B) has a main chain to which at least one fluorine atom is bonded.d2
The positive photosensitive composition according to claim 1, wherein the resin (B) has a main chain to which at least one fluorine atom is bonded.
›3.↳ 1The photosensitive composition according to claim 1, wherein the compound (A) is a sulfonium salt of a fluorine-substituted aliphatic sulfonic acid ha…d2
The photosensitive composition according to claim 1, wherein the compound (A) is a sulfonium salt of a fluorine-substituted aliphatic sulfonic acid having 4 to 8 carbon atoms.
›4.↳ 1A method of forming a resist pattern using immersion exposure comprising:ncoating the positive photosensitive composition according to claim 1 on a su…d2
A method of forming a resist pattern using immersion exposure comprising:ncoating the positive photosensitive composition according to claim 1 on a substrate, to form a resultant coating;irradiating the resultant coating with an actinic ray, to form an irradiated coating; anddeveloping the irradiated coating.
›5.↳ 1The positive photosensitive composition according to claim 1, wherein the amount of the compound (A) per 100 parts by weight of the resin (B) is from …d2
The positive photosensitive composition according to claim 1, wherein the amount of the compound (A) per 100 parts by weight of the resin (B) is from 6 to 15 parts by weight.
›6.↳ 1The positive photosensitive composition according to claim 1, wherein the amount of the compound (A) per 100 parts by weight of the resin (B) is from …d2
The positive photosensitive composition according to claim 1, wherein the amount of the compound (A) per 100 parts by weight of the resin (B) is from 7 to 12 parts by weight.
›7.↳ 1The positive photosensitive composition according to claim 1, wherein the resin (B) comprises: the fluorine atom-containing repeating unit; and at lea…d2
The positive photosensitive composition according to claim 1, wherein the resin (B) comprises: the fluorine atom-containing repeating unit; and at least one repeating unit with no fluorine, selected from the group consisting of repeating units (pA), (AI) and (AII):
›8.↳ 1The positive photosensitive composition according to claim 1,nwherein said 5 to 20 parts by weight of the total amount of at least one sulfonium salt …d2+1
The positive photosensitive composition according to claim 1,nwherein said 5 to 20 parts by weight of the total amount of at least one sulfonium salt compound (A) comprises 5 to 20 parts by weight of a sulfonium salt compound represented by formula (ZI) or (ZI-3):
›9.↳ 8The positive photosensitive composition according to claim 8, wherein X− represents a nonafluorobutanesulfonic acid anion.d3
The positive photosensitive composition according to claim 8, wherein X− represents a nonafluorobutanesulfonic acid anion.
›10.↳ 1The positive photosensitive composition according to claim 1, further comprising a mixed solvent of a solvent containing one or more hydroxyl groups i…d2
The positive photosensitive composition according to claim 1, further comprising a mixed solvent of a solvent containing one or more hydroxyl groups in the structure and a solvent containing no hydroxyl group.
›11.↳ 1The positive photosensitive composition according to claim 1, wherein the repeating unit with no fluorine atom comprises (c) a monocyclic or polycycli…d2
The positive photosensitive composition according to claim 1, wherein the repeating unit with no fluorine atom comprises (c) a monocyclic or polycyclic, alicyclic hydrocarbon structure and hydroxyl group-having repeating unit.
›12.↳ 1The positive photosensitive composition according to claim 1, further comprising a basic compound,nwherein the basic compound is at least one compound…d2
The positive photosensitive composition according to claim 1, further comprising a basic compound,nwherein the basic compound is at least one compound selected from the group consisting of: (i) a compound having an imidazole structure, a diazabicyclo structure, an onium hydroxide structure, an onium carboxylate structure, a trialkylamine structure, an aniline structure or a pyridine structure; (ii) an alkylamine derivative having at least one of a hydroxyl group and an ether bond; and (iii) an aniline derivative having at least one of a hydroxyl group and an ether bond.
›13.↳ 1The positive photosensitive composition according to claim 1, wherein the fluorine atom-containing repeating unit constitutes from 10 to 30 mol % of t…d2
The positive photosensitive composition according to claim 1, wherein the fluorine atom-containing repeating unit constitutes from 10 to 30 mol % of the total polymer composition.
›14.↳ 1The positive photosensitive composition according to claim 1, wherein the repeating unit with no fluorine atom comprises a repeating unit represented …d2
The positive photosensitive composition according to claim 1, wherein the repeating unit with no fluorine atom comprises a repeating unit represented by formula (pA):
›15.↳ 1The positive photosensitive composition according to claim 1, wherein the repeating unit with no fluorine atom of resin (B) hasn(a) a monocyclic or po…d2
The positive photosensitive composition according to claim 1, wherein the repeating unit with no fluorine atom of resin (B) hasn(a) a monocyclic or polycyclic, alicyclic hydrocarbon structure-having, acid-dissociating repeating unit;(b) a lactone structure-having repeating unit; and(c) a monocyclic or polycyclic, alicyclic hydrocarbon structure and hydroxyl group-having repeating unit.
›16.↳ 1The positive photosensitive composition according to claim 1, wherein the resin (B) includes repeating units (pA), (AI) and (AII):d2
The positive photosensitive composition according to claim 1, wherein the resin (B) includes repeating units (pA), (AI) and (AII):
›17.↳ 1A pattern-forming method comprising:nforming a resist film with the positive photosensitive composition according to claim 1;exposing the resist film …d2
A pattern-forming method comprising:nforming a resist film with the positive photosensitive composition according to claim 1;exposing the resist film through an immersion liquid so as to form an exposed resist film; anddeveloping the exposed resist film.
›18.↳ 1The positive photosensitive composition according to claim 1, wherein said compound (A) is a compound represented by formula (Z1-3):d2
The positive photosensitive composition according to claim 1, wherein said compound (A) is a compound represented by formula (Z1-3):
