An adhesive composition and methods incorporating the adhesive composition in semiconductor applications are provided. The adhesive composition is an instant setting adhesive composition that does not require external energy input such as heat or radiation such for application of the adhesive composition on a surface. The instant setting composition possesses sufficient thixotropic characteristics such that applying the instant setting adhesive composition to a surface can be accomplished by a variety of application techniques and in a variety of patterns. Once applied to the surface, the instant setting adhesive composition sets to retain the discrete pattern as applied, in a relatively short period of time, typically from about 0.10 to about 120 seconds at an ambient temperature, typically from 20 C. to 30 C. Advantageously, the instant setting adhesive composition can be screen printed on a semiconductor wafer prior to singulation because streets between the dice are essentially free of the instant setting adhesive composition.

Claims

31 · 5 independent · depth 3

31 granted claims

›1.independentA semiconductor package comprising: one or more leads; a die including one or more die bond pads; one or more electrically conductive elements for ele…+8

›2.↳ 1The semiconductor package of claim 1 wherein the adhesive is between a back side of the die and the at least one portion of the one or more leads.d2

›3.↳ 1The semiconductor package of claim 1 the adhesive is between a face side of the die and the at least a portion of the one or more leads.d2+1

›5.↳ 1The semiconductor package of claim 1 wherein the instant setting adhesive composition comprises an adhesive component selected from the group of a cya…d2

›6.↳ 1The semiconductor package of claim 1 wherein the instant setting adhesive composition includes at least one optional additive selected from the group …d2

›7.↳ 1The semiconductor package of claim 1 further comprising an encapsulant formed over at least a portion of the leads and the die, wherein the encapsulan…d2

›8.↳ 1The semiconductor package of claim 1 further comprising a heat sink attached to a portion of the die, wherein the heat sink is formed from an instant …d2

›9.↳ 1The semiconductor package of claim 1 further comprising a heat sink attached to a portion of the package, wherein the heat sink is formed from an inst…d2

›10.independentA semiconductor package comprising: a singulated portion of a leadframe including a mounting paddle and a plurality of trimmed lead fingers; a die; an…+3

›14.independentA semiconductor package comprising: one or more leads; a die including one or more die bond pads; one or more electrically conductive elements for ele…+4

›19.independentA semiconductor package comprising: one or more leads; a die including one or more die bond pads; one or more electrically conductive elements for ele…+8

›20.↳ 19The semiconductor package of claim 19 wherein the adhesive is between a back side of the die and the at least one portion of the one or more leads.d2

›21.↳ 19The semiconductor package of claim 19 wherein the adhesive is between a face side of the die and the at least a portion of the one or more leads.d2+1

›23.↳ 19The semiconductor package of claim 19 wherein the instant setting adhesive composition comprises an adhesive component selected from the group of a cy…d2

›24.↳ 19The semiconductor package of claim 19 wherein the instant setting adhesive composition includes at least one optional additive selected from the group…d2

›25.↳ 19The semiconductor package of claim 19 further comprising an encapsulant formed over at least a portion of the leads and the die, wherein the encapsula…d2

›26.↳ 19The semiconductor package of claim 19 further comprising a heat sink attached to a portion of the die, wherein the heat sink is formed from an instant…d2

›27.↳ 19The semiconductor package of claim 19 further comprising a heat sink attached to a portion of the package, wherein the heat sink is formed from an ins…d2

›28.independentA semiconductor package comprising: a singulated portion of a leadframe including a mounting paddle and a plurality of trimmed lead fingers; a die; an…+3

Classifications

4 codes

IPC · International Patent Classification

Section H — Electricity

H01L2/348

USPC · US Patent Classification

257/782257/783257/676

Claim changes

Soon

Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this patent are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoom

USPTOApplicanthover for detail · click to open

Pendency

3.7 y

1,362 days filing → grant

Office actions

non-final + final

Responses

3 RCE

Examiner

Roy Potter

art unit —

Law firm

Law firm · Log in to unlock

Citations: 91 back · 1 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Term & fees

See the term timeline — pendency span, in-force span, the maintenance fees paid and both computed expiry dates.

Validity challenges

See the validity challenges on record — reexaminations, IPRs and PGRs, with their institution decisions and outcomes.

Citations

See every patent this one cites and every patent that cites it back — publication, assignee, and how each one was found.