USPatent applicationPatented

Semiconductor module

Granted 21 Feb 2023 · 1 office action

Current assignee: Rohm Co., Ltd. · originally ROHM Co., Ltd.

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Inventors: Masashi Hayashiguchi, Takumi Kanda · Examiner: Elizabeth J Oswecki · AU 2926 · TC 2900

Application· this page
29/757,007
filed 2 Nov 2020
Publication
Not published
not published
Patent
US D978809
granted 21 Feb 2023

Life of the application

6 dated events
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Description

1 parts
›FIG. 1 is a front, top and right…

FIG. 1 is a front, top and right side perspective view of a semiconductor module, showing our new design;

FIG. 2 is a rear, bottom, and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a right side view thereof, the left side view being identical to FIG. 7 ;

FIG. 8 is a cross-sectional view taken along line 8 - 8 in FIG. 5 ; and,

FIG. 9 is a cross-sectional view taken along line 9 - 9 in FIG. 5 .

The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 6 is transparent.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims as granted

1 claim

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Classifications

1 codes
USPC · US Patent Classification
D13/182

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File wrapper

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Pendency
2.3 y
841 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Interviews
1
examiner interview summaries
Examiner
Elizabeth J Oswecki
art unit 2926 · TC 2900
Citations: 83 back · 0 forward

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Documents

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Chain of title

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