Semiconductor module
Granted 21 Feb 2023 · 1 office action
Current assignee: Rohm Co., Ltd. · originally ROHM Co., Ltd.
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Inventors: Masashi Hayashiguchi, Takumi Kanda · Examiner: Elizabeth J Oswecki · AU 2926 · TC 2900
Life of the application
6 dated eventsDescription
1 parts›FIG. 1 is a front, top and right…
FIG. 1 is a front, top and right side perspective view of a semiconductor module, showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side view thereof, the left side view being identical to FIG. 7 ;
FIG. 8 is a cross-sectional view taken along line 8 - 8 in FIG. 5 ; and,
FIG. 9 is a cross-sectional view taken along line 9 - 9 in FIG. 5 .
The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 6 is transparent.
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