Electrode plate peripheral ring for a plasma processing apparatus
Granted 31 Dec 2019 · no office action yet
Current assignee: Hitachi High-Tech Instruments Co., Ltd · originally Hitachi, Ltd.
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Inventors: Masahito Mori, Masakazu Isozaki, Kenetsu Yokogawa, Takao Arase +1 · Examiner: Susan Bennett Hattan · AU 2924 · TC 2900
Life of the application
6 dated eventsDescription
1 parts›This application contains subject matter related to the…
This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/635,287, filed herewith and entitled “Electrode Plate for a Plasma Processing Apparatus”;
Application Ser. No. 29/635,289, filed herewith and entitled “Gas Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/635,292, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”.
FIG. 1 is a front, bottom and right side perspective view of an electrode plate peripheral ring for a plasma processing apparatus according to the design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear elevational view thereof;
FIG. 9 is a cross-sectional view taken along line 9 - 9 of FIG. 3 ;
FIG. 10 is a cross-sectional view taken along line 10 - 10 of FIG. 3 ;
FIG. 11 is an enlarged view of the portion shown in BOX 11 in FIG. 9 ;
FIG. 12 is an enlarged view of the portion shown in BOX 12 in FIG. 11 ; and,
FIG. 13 is a rear, bottom and left side perspective view of a cross-sectional view taken along line 10 - 10 of FIG. 3 .
The broken lines in FIG. 9 show the boundary of the enlarged portion illustrated in FIG. 11 and form no part of the claimed design. The broken lines in FIG. 11 show the boundary of the enlarged portion illustrated in FIG. 12 and form no part of the claimed design.
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