USPatent applicationPatented

System including multiple instrument modules and arrangement thereof

Granted 19 Jun 2018 · 1 office action

Current assignee: Siemens Healthcare Diagnostics Inc. · originally Siemens AG

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Inventors: Gregory Bange, Mark Lloyd, Robert Faranda, Richard Watson +6 · Examiner: Wan Laymon · AU 2921 · TC 2900

Application· this page
29/569,428
filed 27 Jun 2016
Publication
Not published
not published
Patent
US D820995
granted 19 Jun 2018

Life of the application

10 dated events
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Description

1 parts
›FIG. 1 is a front perspective view of…

FIG. 1 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 2 is a rear perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 3 is a front elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 4 is a rear elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 5 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 6 is a right side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 7 is a top view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 8 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 9 is a front perspective view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 10 is a front elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 11 is a rear elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 12 is a left side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 13 is a right side elevational view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment;

FIG. 14 is a top view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment; and,

FIG. 15 is a bottom view of a system including multiple instrument modules and arrangement thereof in accordance with an embodiment.

Applicants claim the design for a system including multiple instrument modules and arrangement thereof as shown in the drawing figures. The broken lines shown in the figures represent portions of the system including multiple instrument modules and arrangement thereof that form no part of the claimed design.

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Claims as granted

1 claim

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Classifications

1 codes
USPC · US Patent Classification
D24/216

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File wrapper

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Pendency
2.0 y
722 days filing → grant
Office actions
0
after a restriction
Examiner
Wan Laymon
art unit 2921 · TC 2900
Citations: 8 back · 0 forward

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Documents

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Chain of title

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