USPatent applicationPatented

Fluid apparatus for semiconductor manufacturing equipment

Granted 16 Apr 2019 · 2 office actions

Assignee: Surpass Industry Co., Ltd.

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Inventors: Takashi Imai · Examiner: Elizabeth J Oswecki · AU 2912 · TC 2900

Application· this page
29/561,806
filed 20 Apr 2016
Publication
Not published
not published
Patent
US D845803
granted 16 Apr 2019

Life of the application

9 dated events
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Description

1 parts
›The file of this patent contains at least…

The file of this patent contains at least one drawing/photograph executed in color. Copies of this patent with color drawing(s)/photograh(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front view of a fluid apparatus for semiconductor manufacturing equipment showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof; and,

FIG. 7 is an enlarged view of encircled portion labeled FIG. 7 in FIG. 1 .

The drawings are lined for the color black.

Figures indicated in broken lines in the drawings represent environmental structure, which forms no part of the claimed design. Dash-dot lines in the drawings represent the boundary of the claimed design. In FIGS. 1-4 , the solid-color portion at the center of the claimed design represents a black-colored portion.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims as granted

1 claim

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Classifications

1 codes
USPC · US Patent Classification
D10/96

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File wrapper

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Pendency
3.0 y
1,091 days filing → grant
Office actions
2
non-final + final
Responses
2
no RCE
Examiner
Elizabeth J Oswecki
art unit 2912 · TC 2900
Citations: 33 back · 0 forward

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Documents

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Chain of title

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