Power semiconductor module
Granted 26 Jul 2016 · no office action yet
Assignee: Infineon Technologies AG
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Attorney: Attorney · Log in to unlock
Inventors: Jutta Muehlensiep, Michael Sielaff · Examiner: Elizabeth J Oswecki · AU 2912 · TC 2900
Life of the application
5 dated eventsDescription
1 parts›FIG. 1 is a top, side perspective view…
FIG. 1 is a top, side perspective view of a power semiconductor module, showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is rear elevation view thereof; and,
FIG. 5 is a side elevation view thereof.
All surfaces not shown form no part of the claimed design.
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