USPatent applicationPatented

Portion of a matrix for surface mount package leadframe

Granted 9 Dec 2003 · 1 office action

Assignee: GEM Patent Services

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Attorney: Attorney · Log in to unlock

Inventors: James Harnden, Chu Weibing, Richard K. Williams, Anthony Chia · Examiner: Philip S. Hyder · AU 2912 · TC 2900

Application· this page
29/171,086
filed 15 Nov 2002
Publication
Not published
not published
Patent
US D483336
granted 9 Dec 2003

Life of the application

7 dated events
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Description

1 parts
›FIG. 1 is a top plan view of…

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.

the grant prints no section headings; every part label below is ours, taken from that part's own first words

Claims as granted

1 claim

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Classifications

2 codes
IPC · International Patent Classification
Section /
  • /DRW
USPC · US Patent Classification
D13/182

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File wrapper

⤢ drag to zoomOct 2002Jan 2003Apr 2003Jul 2003Oct 2003Jan 2004USPTOApplicantNon-final rejectionResponse after non-final
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Pendency
1.1 y
389 days filing → grant
Office actions
1
non-final + final
Responses
1
no RCE
Examiner
Philip S. Hyder
art unit 2912 · TC 2900
Citations: 13 back · 0 forward

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Documents

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Chain of title

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