Antenna module implemented in multi-layered substrate

Pursuant to 35 U.S.C. § 119(a), this application claims the benefit of the earlier filing date and the right of priority to Korean Patent Application No. 10-2023-0082874, filed on Jun. 27, 2023, the contents of which are all incorporated by reference herein in its entirety.

The present disclosure relates to an antenna module implemented in a multi-layered substrate. One particular implementation relates to an electronic device having an antenna module implemented in a multi-layered substrate.

As image technology changes from analog to digital, development has been made from SD (Standard-Definition) to HD (Hi-Definition) to provide an image closer to a real world. SD supports a resolution of 704×480 and consists of about 350,000 pixels, and HD is divided into HD and Full HD. Between them, Full HD supports a resolution of 1920×1080 and consists of 2 million pixels to provide a significantly higher quality image compared to SD.

Recent image technology is growing one step further to Ultra High-Definition (UHD) beyond Full HD, and the UHD, which supports high image quality and ultra-high resolution, is spotlighted as a next-generation media environment. The UHD supports 4 K (3840×2160) and 8 K (7680×4320) resolutions and surround audio of up to 22.2 channels. Compared to the HD, the UHD provides 4 times higher picture quality than the 4 K UHD, and the 8 K UHD provides 16 times higher image quality than the HD.

In recent years, a wireless display system that wirelessly transmits such a high-resolution image to a display device has emerged.

The wireless display system is a system that transmits and receives A/V data between an A/V transmitting device and an A/V receiving device through a local area network.

The A/V receiving device displays A/V data received from the A/V transmitting device.

An example of the A/V transmitting device may be a transmission box having an antenna module that wirelessly transmits A/V data.

An example of the A/V receiving device may be a display device provided with an antenna module that receives A/V data transmitted from the A/V transmitting device to output the received A/V data.

The display device may include a pair of antenna modules and an IR module located between the pair of antenna modules, and the pair of antenna modules may be disposed to spaced apart from each other on left and right sides thereof.

In the wireless display system, an antenna module of the A/V transmitting device may be located on the left or right side of the display device, and in this case, a pair of antenna modules provided in the display device may receive data transmitted from the antenna module of the A/V transmitting device in a two-stream method, and the display device may output an image.

When the A/V transmitting device is disposed on the left or right side of the display device, one of the pair of antenna modules of the display device cannot receive data because its signal is blocked by the IR module, and the display device operates with one stream.

When operating with one stream, its compression rate must be doubled compared to the case with two streams to transmit and receive data at the same level as in the case of two streams, but when the compression rate is increased, its image quality level may be decreased.

An aspect of the present disclosure is to provide an electronic device capable of performing wireless communication of A/V data regardless of the location of an A/V transmitting device.

Another aspect of the present disclosure is to perform A/V wireless communication in an optimized manner according to an array antenna disposition structure of an A/V transmitting device and an electronic device.

Still another aspect of the present disclosure is to perform A/V wireless communication in an optimized manner in consideration of the location of an A/V transmitting device and an electronic device, and the polarization characteristics of an array antenna.

Yet still another aspect of the present disclosure is to provide seamless A/V wireless communication even when an obstacle is disposed on a wireless communication path between an A/V transmitting device and an electronic device.

Yet still another aspect of the present disclosure is to implement an antenna module that is capable of transmitting signals over a long distance to a front region of an A/V transmission device and that is also capable of transmitting signals upward.

Yet still another aspect of the present disclosure is to implement an antenna module that is capable of implementing a wider beam coverage in side regions of an A/V transmission device than that in a front or bottom regions.

An antenna module implemented in a multi-layered antenna package according to the present disclosure includes an RFIC; a first dielectric layer; a first coplanar waveguide layer disposed on a top of the first dielectric layer and configured to receive RF signals transmitted by an interface layer of the RFIC; a first antenna portion disposed on the first coplanar waveguide layer and configured to radiate signals transmitted from the first coplanar waveguide layer; a second dielectric layer disposed on the first coplanar waveguide layer; a third dielectric layer disposed on the second dielectric layer; a second coplanar waveguide layer disposed on a top of the third dielectric layer and configured to receive RF signals transmitted by the interface layer of the RFIC; and a second antenna portion disposed on the second coplanar waveguide layer to radiate signals transmitted from the second coplanar waveguide layer.

According to an embodiment, the antenna module may further include a fourth dielectric layer disposed on the third dielectric layer. The first coplanar waveguide layer may include a plurality of first signals connection lines and a first ground portion. The plurality of first signal connection lines and the first ground portion may be disposed to be flush with each other on the top of the first dielectric layer, and the first dielectric layer and the second dielectric layer may operate as shields of the first coplanar waveguide layer.

According to an embodiment, the first coplanar waveguide layer may include a plurality of second signal connection lines and a second ground portion. The plurality of second signal connection lines and the second ground portion may be disposed to be flush with each other on the top of the third dielectric layer, and the third dielectric layer and the fourth dielectric layer may operate as shields of the second coplanar waveguide layer.

An electronic device according to an embodiment of the present disclosure may perform wireless communication of A/V data regardless of the location of an A/V transmitting device through first and second antenna structures in which a plurality of array antennas are disposed.

Furthermore, the A/V transmitting device may transmit two streams of data, thereby minimizing video quality deterioration that occurs when increasing a data compression rate.

In addition, since a horizontally polarized antenna and a vertically polarized antenna can be disposed together on one substrate, thereby allowing an antenna module to be compact and providing a high data reception rate.

Moreover, horizontally and vertically polarized signals may be used according to an array antenna disposition structure of the A/V transmitting device and the electronic device, thereby performing A/V wireless communication with reduced mutual interference while increasing a communication capacity.

Besides, horizontally and vertically polarized signals may be used in consideration of the location of the A/V transmitting device and electronic device the polarization characteristics of the array antennas, thereby performing A/V wireless communication with reduced mutual interference while increasing a communication capacity.

In addition, even when an obstacle is disposed on a wireless communication path between the A/V transmitting device and the electronic device, a beamforming direction may be changed and reflected waves may be used, thereby providing seamless A/V wireless communication.

Also, the number of array antennas disposed in a front region of the antenna module of the A/V transmitting device may be greater than the number of antennas in a side region or bottom region. Accordingly, signals can be transmitted over a longer distance in the front region of the antenna module than in the side region or bottom region. Also, an antenna module that has two-dimensional array antennas and is capable of transmitting signals even upward through beamforming can be implemented.

Also, the number of array antennas disposed in side regions of the antenna module of the A/V transmitting device may be greater than the number of antennas in other areas. Accordingly, an antenna module capable of achieving a wider beam coverage in the side regions than that in a front or bottom region can be implemented.

Each of a plurality of array antennas can be disposed in different stacked structures in different regions while implementing a coplanar waveguide structure, thereby minimizing interference between different array antennas.

Further scope of applicability of the present disclosure will become apparent from the following detailed description. It should be understood, however, that the detailed description and specific examples, such as the preferred embodiments of the present disclosure, are given by way of illustration only, since various modifications and alternations within the spirit and scope of the disclosure will be apparent to those skilled in the art.

FIGS. 1 and 2 are front and sectional views illustrating a substrate having antenna modules that may be disposed on one side of an electronic device.

FIG. 3 shows a perspective view of the antenna module of FIG. 2 and an enlarged view of a partial area.

FIGS. 4 A and 4 B are front views illustrating the antenna module of FIGS. 1 to 3 for each layer.

FIG. 4 C is an enlarged view of first, third, and sixth layers among a plurality of layers of a PCB of FIG. 4 A .

FIG. 5 is an enlarged view of first and sixth layers among a plurality of layers of a PCB of FIG. 4 A .

FIG. 6 is an enlarged view of tenth and twelfth layers among a plurality of layers of a PCB of FIG. 4 B .

A description will now be given in detail of specific embodiments of the present disclosure, together with drawings.

Hereinafter, a description will be given in more detail of embodiments related to the present disclosure, with reference to the accompanying drawings. In general, a suffix such as “module” and “unit” may be used to refer to elements or components. Use of such a suffix herein is merely intended to facilitate description of the specification, and the suffix itself is not intended to give any special meaning or function.

Hereinafter, an antenna module disposed in an electronic device according to the present disclosure will be described. In this regard, FIGS. 1 and 2 are front and sectional views illustrating a substrate having an antenna module that may be disposed on one side of an electronic device. FIG. 3 shows a perspective view of the antenna module of FIG. 2 and an enlarged view of a partial area.

(a) of FIG. 1 shows a substrate with an antenna module 1000 b for each area. A substrate 1010 a may include a central region CR and a periphery PE surrounding the central region CR. The periphery PE of the substrate 1010 a may include a first part P 1 to a fourth part P 4 . The first part P 1 constitutes a bottom region of the substrate 1010 a , and the second part P 2 constitutes one side region of the substrate 1010 a . The third part P 3 constitutes another side region of the substrate 1010 a , and the fourth part P 4 constitutes a top region of the substrate 1010 a.

Referring to FIGS. 1 and 2 , the antenna module 1000 a may include a substrate 1010 a , a first array antenna 1200 a , a second array antenna 1300 a , a third array antenna 1100 a , and a fourth array antenna 1100 b . Since the third and fourth array antennas 1100 a and 1100 b are disposed on the one side region and the another side region of the substrate 1010 a , they may be referred to as first and second side array antennas.

(a) of FIG. 2 is a sectional view of the antenna module 1000 a , and (b) of FIG. 2 is a sectional view of the substrate 1010 a shown for each layer. (a) of FIG. 3 is a perspective view illustrating one side region based on the center of the antenna module 1000 a . (b) of FIG. 3 is an enlarged view illustrating an area where some of dipole antennas DA 1 to DA 4 constituting the second array antenna 1300 a of the antenna module are disposed.

Referring to FIG. 2 , an RFIC 1400 a may be disposed on the first layer La 1 of the antenna module 1000 a . A plurality of ground layers may be disposed in an inner region of the antenna module 1000 a . For example, first, second, third, and fourth ground layers GND 1 , GND 2 , GND 3 , and GND 4 may be disposed on the second, fourth, fifth, and seventh layers La 2 , La 4 , La 5 , and La 7 .

Conductive patterns in the inner region of the antenna module 1000 a may be stacked in a height direction with being spaced apart from one another by a plurality of dielectric layers. For example, the first dielectric layer GND 1 may be disposed between the first and second layers La 1 and La 2 , and the second dielectric layer GND 2 may be disposed between the third and fourth layers La 3 and La 4 . The third dielectric layer GND 3 may be disposed between the fourth and fifth layers La 4 and La 5 , and the fourth dielectric layer GND 4 may be disposed between the sixth and seventh layers La 6 and La 7 .

A plurality of coplanar waveguide layers may be disposed on the respective layers in the inner region of the antenna module 1000 a . A first coplanar waveguide layer WG 1 in which a plurality of signal connection lines and ground portions are formed may be disposed on the third layer La 3 . A second coplanar waveguide layer WG 2 in which a plurality of signal connection lines and ground portions are formed may be disposed on the sixth layer La 6 .

It may be considered that a plurality of dielectric layers are disposed on respective layers corresponding to ground layers of the antenna module 1000 a . In this regard, a plurality of dielectric layers may be disposed in the inner region of the antenna module 1000 a . For example, first, second, third, and fourth dielectric layers DL 1 , DL 2 , DL 3 , and DL 4 may be disposed on the second, fourth, fifth, and seventh layers La 2 , La 4 , La 5 , and La 7 .

Referring to FIG. 2 , the first layer La 1 may be an interface layer IL of the RFIC 1400 a , and the second layer La 2 is the first ground layer GND 1 having ground and via. The first dielectric layer DL 1 may be disposed between the first and second layers La 1 and La 2 , and the second layer La 2 may include the first ground layer GND 1 and the first dielectric layer DL 1 .

The third layer La 3 is a first coplanar waveguide layer WG 1 in which a plurality of conductive patterns and ground portions are formed. The fourth layer La 4 is the second ground layer GND 2 including ground and via. The second dielectric layer DL 2 may be disposed between the third and fourth layers La 3 and La 4 , or the fourth layer La 4 may include the second dielectric layer DL 2 .

The third dielectric layer DL 3 may be disposed between the fourth and fifth layers La 4 and La 5 , or the fifth layer La 5 may include the third dielectric layer DL 3 . The fifth layer La 5 is the third ground layer GND 3 including ground and via. The sixth layer La 6 is the second coplanar waveguide layer WG 2 in which a plurality of conductive patterns and ground portions are formed. The fourth dielectric layer DL 4 may be disposed between the sixth and seventh layers La 6 and La 7 , or the seventh layer La 7 may include the fourth dielectric layer DL 4 .

Referring to FIGS. 1 to 3 , a ground wall (GW) 1130 is formed on the periphery PE of the substrate 1010 a and includes vias connecting a plurality of layers. The ground wall (GW) 1130 is disposed in one axial direction and another axial direction between patch antennas PA 11 to PA 28 to surround each of the patch antennas PA 11 to PA 28 .

The ground wall (GW) 1130 operates as a ground for radiation of the patch antennas PA 11 to PA 28 and may be referred to as a ground cavity wall. The ground wall (GW) 1130 suppresses side surface radiation and rear surface radiation of the patch antennas PA 11 to PA 28 having a front surface radiation structure, and functions as a reflector toward the front surface. The ground wall (GW) 1130 suppresses side surface radiation and rear surface radiation in another side direction of monopole antennas MA 1 to MA 6 having a side surface radiation structure, and functions as a reflector toward the front surface in one side direction. In addition, the ground wall (GW) 1130 suppresses side surface radiation in a top direction of dipole antennas DA 1 to DA 10 having a bottom radiation structure, and functions as a reflector in a bottom direction.

The antenna module 1100 a may include a first ground layer 1300 g , a second ground layer 1200 a , and a third ground layer 1300 g . The ground wall 1130 may be formed on the first ground layer 1100 g . The second coplanar waveguide layer WG 2 may be disposed on the second ground layer 1200 g . The first coplanar waveguide layer WG 1 may be disposed on the third ground layer 1300 g . The ground wall 1130 may include a first horizontal ground region GH 1 , a second horizontal ground region GH 2 , and vertical ground walls GV 1 to GV 4 connecting the first and second horizontal ground regions GH 1 and GH 2 .

The first array antenna 1200 a may further include dummy patches DP 11 to DP 22 disposed on one side and another side of the patch antennas PA 11 to PA 28 . Among the dummy patches DP 11 to DP 22 , the first dummy patch DP 11 is disposed between the first patch antenna PA 11 in a first row and the second part P 2 . The second dummy patch DP 12 is disposed between the second patch antenna PA 12 in the first row and the second part P 2 . Among the dummy patches DP 11 to DP 22 , the third dummy patch DP 21 is disposed between the first patch antenna PA 21 in a second row and the third part P 3 . The fourth dummy patch DP 22 is disposed between the second patch antenna PA 22 in the second row and the third part P 3 .

The ground wall (GW) 1130 may be formed to surround the dummy patches DP 11 to DP 22 . First patch elements 1210 of the plurality of patch antennas PA 11 to PA 28 may be connected to feed lines. The dummy patches DP 11 to DP 22 are not connected to the feed lines. Second patch elements 1220 of the plurality of patch antennas PA 11 to PA 28 are not connected to the feed lines.

A distance between the ground wall (GW) 1130 and the dummy patches DP 11 to DP 22 , respective sizes thereof, and the like may be implemented within a predetermined range based on a half wavelength of an operating frequency of 60 GHz. Layer positions and sizes of conductive plates CP 11 to CP 28 corresponding to coupling pads and overlap areas with the patch antennas PA 11 to PA 28 may be designed in consideration of radiation characteristics and disposition characteristics.

Referring to FIGS. 1 to 3 , the antenna module 1000 a may further include a millimeter wave transceiver circuitry 1400 a.

The substrate 1010 a may include a first surface S 1 , a second surface S 2 , a periphery PE, and a central region CR. The periphery PE may be formed between the first surface S 1 and the second surface S 2 . The first surface S 1 may be opposite to the second surface S 2 . The substrate 1010 a may be implemented as a multi-layer substrate. For example, the substrate 1010 a may be implemented as a 12-layer substrate, but is not limited thereto, and may vary depending on applications. The first surface S 1 of the substrate 1010 a may correspond to a surface of a twelfth layer La 12 .

The substrate 1010 a may have a plurality of side surfaces. Among the plurality of side surfaces, the first surface S 1 may be disposed to face a front direction of the antenna module 1000 a , and the second surface S 2 may be disposed to face a rear direction of the antenna module 1000 a . Among the plurality of side surfaces, the third and fourth surfaces S 3 and S 4 may be disposed to face left and right directions, respectively. Among the plurality of side surfaces, a fifth surface S 5 may be configured to face a bottom direction of the antenna module.

The third array antenna 1100 a and the fourth array antenna 1100 b may be disposed on the second part P 2 and the third part P 3 of the periphery PE of the substrate 1010 a . The third array antenna 1100 a and the fourth array antenna 1100 b may form beam patterns to side regions of the electronic device. The third array antenna 1100 a and the fourth array antenna 1100 b may radiate horizontally polarized signals to the side regions of the electronic device.

The third array antenna 1100 a may include a plurality of monopole antennas MA 1 to MA 3 disposed on the second part P 2 of the periphery PE of the substrate 1010 a . The fourth array antenna 1100 b may include the plurality of monopole antennas MA 4 to MA 6 disposed on the third part P 3 of the periphery PE of the substrate 1010 a . The third array antenna 1100 a and the fourth array antenna 1100 b may be implemented with three antenna elements on one side and another side of the periphery PE of the substrate 1010 a , respectively. The third array antenna 1100 a may be implemented as a 1×3 array antenna on one side of the substrate 1010 a , but is not limited thereto. The fourth array antenna 1100 b may be implemented as a 1×3 array antenna on another side of the substrate 1010 a , but is not limited thereto.

The first array antenna 1200 a may be disposed on the first surface S 1 of the substrate 1010 a . The first array antenna 1200 a may form a beam pattern toward the front region of the electronic device. The first array antenna 1200 a may radiate a horizontally polarized signal to the front region of the electronic device. The first array antenna 1200 a may be implemented as 16 antenna elements on the center region CR of the substrate 1010 a.

The first array antenna 1200 a may include the plurality of patch antennas PA 11 to PA 18 and PA 21 to PA 28 disposed on the first surface S 1 of the substrate 1010 a . The dummy patches DP 11 and DP 21 may be disposed on one side of the patch antennas PA 11 and P 21 to suppress side surface radiation. The dummy patches DP 12 and DP 22 may be disposed on another side of the patch antennas PA 11 and P 21 to suppress side surface radiation. The first array antenna 1200 a may be implemented as 16 2×8 array antennas on the center region CR of the substrate 1010 a , but is not limited thereto.

Each patch antenna of the first array antenna 1200 a may include first patch elements 1210 and second patch elements 1220 . The second patch elements 1220 may be stacked in a direction perpendicular to the first patch elements 1210 such that signals of the first patch elements 1210 are coupled. The center of the second patch element 1220 may be offset from the center of the first patch element 1210 in one axial direction.

A second gap between adjacent first patch elements 1221 and 1222 may be larger than a first gap between adjacent second patch elements 1211 and 1212 . To this end, the first patch element 1221 in a first column may be disposed to be offset in the left direction with respect to the second patch element 1211 in the first column. Meanwhile, the first patch element 1222 in a second column may be disposed to be offset in the right direction with respect to the second patch element 1212 in the second column. A current flow direction of a signal applied to the second patch element 1211 in the first column is the left direction, and a current flow direction of a signal applied to the second patch element 1212 in the second column is the right direction. The current flow directions of the signals applied to the second patch elements 1211 and 1212 in the first and second columns are opposite to each other.

Accordingly, a phase difference of the signals applied to the second patch elements 1211 and 1212 in the first and second columns is supposed to be 180 degrees so that the current flow directions can be the same. To this end, the RFIC 1400 a may control a phase shifter such that the phase difference between the signals applied to the first patch elements 1211 and 1212 in the first and second columns is 180 degrees.

The second array antenna 1300 a may be disposed on the first part P 1 of the periphery PE of the substrate 1010 a . The second array antenna 1300 a may form a beam pattern toward the bottom region of the electronic device. The second array antenna 1300 a may radiate a horizontally polarized signal to the bottom region of the electronic device.

The second array antenna 1300 a may include a plurality of dipole antennas DA 1 to DA 10 disposed on the first part P 1 of the periphery PE of the substrate 1010 a . The second array antenna 1300 a may be implemented as 10 antenna elements on the lower side of the periphery PE of the substrate 1010 a . The second array antenna 1300 a may be implemented as 10 1×10 array antennas on the lower side of the periphery PE of the substrate 1010 a , but is not limited thereto.

The plurality of array antennas may be disposed in an X-axial direction (one axial direction) and a Y-axial direction (another axial direction) of the substrate 1010 a . The third array antenna 1100 a and the fourth array antenna 1100 b may include a plurality of monopole antennas MA 1 to MA 3 and MA 4 to MA 6 disposed in the another axial direction. The first array antenna 1200 a may include a plurality of patch antennas PA 11 to PA 18 and PA 21 to PA 28 disposed in the one axial direction. The second array antenna 1300 a may include a plurality of dipole antennas DA 1 to DA 10 disposed in the one axial direction.

The millimeter wave transceiver circuitry 1400 a may be disposed on the second surface S 2 . The millimeter wave transceiver circuitry 1400 a may be configured to transmit and receive signals at frequencies between 10 GHz and 400 GHz using at least one of the first array antenna 1200 a , the second array antenna 1300 a , and the third and fourth array antennas 1100 a and 1100 b . The millimeter wave transceiver circuitry 1400 a may be configured to transmit and receive signals at frequencies between 10 GHz and 400 GHz using at least one of the plurality of monopole antennas MA 1 to MA 6 , the plurality of patch antennas PA 11 to PA 18 and PA 21 to PA 28 , and the plurality of dipole antennas DA 1 to DA 10 . The millimeter wave transceiver circuitry 1400 a may be referred to as a radio frequency integrated chip (RFIC).

The number of elements of the first array antenna 1200 a forming the beam pattern toward the front region may be set to be greater than the number of elements of the second array antenna 1300 a forming the beam pattern toward the bottom region. The number of elements of the second array antenna 1300 a forming the beam pattern toward the bottom region may be set to be greater than the number of elements of the third and fourth array antennas 1100 a and 1100 b forming the beam pattern toward the side regions.

In this regard, 16 pins among 32 pins of the RFIC 1400 a may be connected to the first array antenna 1200 a forming the beam pattern toward the front region. Ten pins of the 32 pins of the RFIC 1400 a may be connected to the second array antenna 1300 a forming the beam pattern toward the bottom region. 6 pins of the 32 pins of the RFIC 1400 a may be connected to the third and fourth array antennas 1100 a and 1100 b forming the beam pattern toward the side regions.

In this regard, the first array antenna 1200 a has the largest number of elements, so it can transmit signals over a long distance to the front region of the electronic device, but has a narrow beam coverage. The narrow beam coverage can be supplemented by changing a beam forming direction to a horizontal direction of the front region. Accordingly, the number of elements of the first array antenna 1200 a may be plural in one axial direction and two in another axial direction. For example, the second array antenna 1300 a may be implemented as 2×8 array antennas. A beam may be formed upward by a predetermined angle from the front direction through a phase difference between signals applied between the antenna elements in the first row and the antenna elements in the second row.

The electronic device needs to perform AV wireless communication with another electronic device disposed in a bottom region of the electronic device. For the AV wireless communication, beamforming may be implemented in units of narrow beam coverage in a horizontal direction, which is the one axial direction, in the bottom region of the electronic device. Meanwhile, it is not necessary to transmit a signal to a bottom region of the electronic device over a long distance. Accordingly, the number of elements of the second array antenna 1300 a may be plural in the one axial direction and one in the another axial direction. For example, the second array antenna 1300 a may be implemented as 1×8, 1×10, or 1×12 array antennas.

Signals may be transferred to the side regions of the electronic device in an indoor radio environment where the electronic device is disposed. It is more important to implement a wide beam coverage for the side regions of the electronic device even without beamforming, than to implement a signal transmission over a long distance. In this regard, since the number of elements of the third and fourth array antennas 1100 a and 1100 b is the smallest, a wide beam coverage to the side regions of the electronic device can be achieved. Accordingly, the number of elements of the third and fourth array antennas 1100 a and 1100 b may be plural in the one axial direction and one in the another axial direction. For example, the third and fourth array antennas 1100 a and 1100 b may be implemented as 1×3 array antennas on one side and another side.

Hereinafter, a disposition structure for each layer of the antenna module according to the present disclosure will be described. In this regard, FIGS. 4 A and 4 B are front views illustrating the antenna module of FIGS. 1 to 3 for each layer. FIG. 4 C is an enlarged view of first, third, and sixth layers among a plurality of layers of a PCB of FIG. 4 A .

Referring to FIGS. 1 to 4 , each layer of the antenna module 1000 a will be described in detail with reference to FIGS. 1 to 4 B . The antenna module 1000 a may be configured by stacking layers from a first layer La 1 , on which the transceiver circuitry 1400 a is disposed, to a sixth layer La 6 , on which the feed lines for the first array antenna 1200 a are located. In addition, the antenna module 1000 a may further include layers from a seventh layer La 7 , which is a ground layer for the sixth layer La 6 , to a twelfth layer La 12 , on which antenna elements of the first array antenna 1200 a are disposed.

The transceiver circuitry 1400 a may be disposed on the first layer La 1 . The transceiver circuitry 1400 a may have a plurality of pins, and connection lines may be connected to the plurality of pins. The transceiver circuitry 1400 a may be disposed based on a center line of the first layer La 1 in one axial direction.

The second layer La 2 may include a metal layer on the central region CR, so as to be configured as a first ground layer GND 1 for the first layer La 1 . The monopole antennas MA 1 to MA 6 of the third and fourth array antennas 1100 a and 1100 b may be disposed on one side region and another side region of the third layer La 3 .

The dipole antennas DA 1 to DA 10 of the second array antenna 1300 a may be disposed in a bottom region of the third layer La 3 .

The fourth layer La 4 may include a metal layer on the central region CR, so as to be configured as a second ground layer GND 2 for the third layer La 3 . The first and second feed lines of the third layer La 3 are disposed between the first ground layer of the second layer La 2 and the second ground layer of the fourth layer La 4 . Accordingly, the first and second feed lines of the third layer La 3 constitute a first coplanar waveguide structure in which ground layers are disposed on an upper layer and a lower layer in a heightwise direction. The metal layers of the first and second ground layers may be partially removed so that the first and second type vias can be vertically connected.

The fifth layer La 5 may include a metal layer on the central region CR, so as to be configured as a third ground layer GND 3 for the sixth layer La 6 . On the sixth layer La 6 , first feed lines for the patch antennas PA 11 to PA 18 and PA 21 to PA 28 of the first array antenna 1200 a may be disposed. Distances between one end portion and another end portion of the first feed lines may be the same.

The outermost dipole antennas DA 1 and DA 10 of the third layer La 3 may be connected through fourth feed lines of the sixth layer La 6 .

The seventh layer La 7 may include a metal layer on the central region CR, so as to be configured as a fourth ground layer GND 4 for the sixth layer La 6 . The third and fourth feed lines of the sixth layer La 6 are disposed between the third ground layer of the fifth layer La 5 and the fourth ground layer of the fifth layer La 5 . Accordingly, the third and fourth feed lines of the sixth layer La 6 constitute a second coplanar waveguide structure in which ground layers are disposed on an upper layer and a lower layer in a heightwise direction. The metal layers of the third and fourth ground layers may be partially removed so that the second and third type vias can be vertically connected.

As described above, the second, fourth, fifth, and seventh layers La 2 , La 4 , La 5 , and La 7 may configure the first to fourth ground layers GND 1 to GND 4 , respectively. The substrate 1010 a may include the first ground layer GND 1 for the transceiver circuitry 1400 a to the fourth ground layer GND 4 for the first array antenna 1200 a . The third and fourth array antennas 1100 a and 1100 b may vertically extend from a layer between the first ground layer GND 1 and the second ground layer GND 2 to the upper layer of the fourth ground layer GND 4 .

The first array antenna 1200 a may be disposed on the upper layer of the fourth ground layer GND 4 . The second array antenna 1300 a may be disposed on a layer between the first ground layer GND 1 and the second ground layer GND 2 . Accordingly, even if the same horizontal polarization is implemented through the first and second array antennas 1200 a and 1300 a , mutual interference hardly occurs due to the second to fourth ground layers GND 2 to GND 4 .

In the RFIC 1400 a , a length of a feed pattern of the first array antenna 1200 a may be configured to be the same for all antenna elements. The length of the feed pattern of the first array antenna 1200 a may be determined as the sum of a first length L 1 a to a fourth length L 4 a . The length of the feed pattern may be configured to be the same for all the patch antennas PA 11 to PA 18 and PA 21 to PA 28 of the third array antenna 1200 a . First length L 1 a to the fourth length L 4 a may be configured to be the same for all the patch antennas PA 11 to PA 18 and PA 21 to PA 28 . Accordingly, signals applied from the RFIC 1400 a to all of the patch antennas PA 11 to PA 18 and PA 21 to PA 28 are in phase, and a beam can be formed toward the center point in the front direction.

First and second via pads VP 1 and VP 2 may be formed in eighth and ninth layers La 8 to La 9 to vertically connect the third type vias Vc 1 to Vc 8 and Vc 9 to Vc 16 . Conductive plates CP 11 to CP 18 and CP 21 to CP 28 connected to ends of the third type vias Vc 1 to Vc 8 and Vc 9 to Vc 16 may be disposed on a tenth layer La 10 . The conductive plates CP 1 to CP 18 and CP 21 to CP 28 may be referred to as power feeding plates. A first gap G 1 between the adjacent conductive plates CP 11 and CP 12 may be shorter than a second gap G 2 between the adjacent conductive plates CP 12 and CP 13 .

A metal layer forming a ground wall GW may be partially disposed on the eleventh layer La 11 . The conductive plates of the monopole antennas MA 1 to MA 6 configuring the third and fourth array antennas 1100 a and 1100 b may be disposed on one side region and another side region of the third layer La 3 to the eleventh layer La 11 .

On the twelfth layer La 12 , the patch antennas PA 11 to PA 18 and PA 21 to PA 28 of the second array antenna 1300 a may be disposed. Centers of the patch antennas PA 11 to PA 18 and PA 21 to PA 28 may be offset in another axis direction from the conductive plates CP 11 to CP 18 and CP 21 to CP 28 . A third gap G 3 between the adjacent patch antennas PA 11 and PA 12 may be formed to be longer than the first gap G 1 and shorter than the second gap G 2 .

Hereinafter, a feeding structure for each layer of a first array antenna that performs front surface radiation in an antenna module implemented as a multi-layered antenna package according to the present disclosure will be described in detail. In this regard, FIG. 5 is an enlarged view of first and sixth layers among the plurality of layers of the PCB of FIG. 4 A . FIG. 6 is an enlarged view of tenth and twelfth layers among a plurality of layers of a PCB of FIG. 4 B .

Referring to FIGS. 1 to 6 , signal connection lines (feed lines) of the first layer La 1 and the sixth layer La 6 may be formed in a coplanar waveguide structure. The signal connection lines of the first layer La 1 and the sixth layer La 6 may be disposed as feed lines FL on a central portion of the coplanar waveguide structure. In the coplanar waveguide structure of the first layer La 1 and the sixth layer La 6 , ground regions GL and GR may be disposed at one side and another side of the feed lines FL on the central portion. A plurality of ground vias may be disposed in the ground regions GL and GR to be connected to ground regions of other layers. Boundaries on one side and another side of the coplanar waveguide structure may be spaced apart from boundaries of the ground regions GL and GR by predetermined distances.

The RFIC 1400 a may be disposed on a central portion of the first layer La 1 . The plurality of pins of the RFIC 1400 a may be connected to feed lines of a first side Sd 1 as a top region, feed lines of a second side Sd 2 as one side region, feed lines of a third side Sd 3 as another side region, and feed lines of a fourth side Sd 4 as a bottom region.

End portions Vc 1 to Vc 8 of first to eighth feed lines F 1 to F 8 may be disposed in the top region with respect to a central axis of the PCB 1010 a . End portions Vc 9 to Vc 16 of ninth to sixteenth feed lines F 9 to F 16 may be disposed in the bottom region with respect to the central axis of the PCB 1010 a.

The first to third feed lines F 1 , F 2 , and F 3 of the sixth layer La 6 are formed in a structure disposed in the top (left) region of the PCB 1010 a . The fourth feed line F 4 of the sixth layer La 6 is formed in a structure connected from the top region back to the top region via the bottom region. A portion of the fourth feed line F 4 is disposed at a position overlapping the inside of the RFIC 1400 a.

The ninth to eleventh feed lines F 9 , F 10 , and F 11 of the sixth layer La 6 are formed in a structure disposed in the bottom (left) region of the PCB 1010 a . The twelfth feed line F 12 of the sixth layer La 6 is formed in a structure connected from the top region to the bottom region of the PCB 1010 a . One end portion Vx 12 of the twelfth feed line F 12 is disposed in the top region and another end portion Vc 12 is disposed in the bottom region. A portion of the twelfth feed line F 12 is disposed at a position overlapping the inside of the RFIC 1400 a.

The sixth to eighth feed lines F 6 , F 7 , and F 8 of the sixth layer La 6 are formed in a structure disposed in the top (right) region of the PCB 1010 a . The fifth feed line F 5 of the sixth layer La 6 is formed in a structure connected from the top region back to the top region via the bottom region. A portion of the fifth feed line F 5 is disposed at a position overlapping the inside of the RFIC 1400 a.

The fourteenth to sixteenth feed lines F 14 , F 15 , and F 16 of the sixth layer La 6 are formed in a structure disposed in the bottom (right) region of the PCB 1010 a . The thirteenth feed line F 13 of the sixth layer La 6 is formed in a structure connected from the top region to the bottom region of the PCB 1010 a . One end portion Vx 13 of the thirteenth feed line F 13 is disposed in the top region and another end portion Vc 13 is disposed in the bottom region. A portion of the thirteenth feed line F 13 is disposed at a position overlapping the inside of the RFIC 1400 a.

End portions of the feed lines at the first side Sd 1 of the first layer La 1 may be connected to end portions Vx 2 , Vx 3 , Vx 4 , Vx 12 , Vx 13 , Vx 5 , Vx 6 , and Vx 7 of the feed lines F 2 , F 3 , F 4 , F 12 , F 13 , F 5 , F 6 , and F 7 of the sixth layer La 6 through the vertical vias. End portions of the feed lines at the second side Sd 2 of the first layer La 1 may be connected to end portions Vx 1 , Vx 9 , and Vx 10 , and Vx 11 of the feed lines F 1 , F 9 , F 10 , and F 11 of the sixth layer La 6 through the vertical vias. End portions of the feed lines at the third side Sd 3 of the first layer La 1 may be connected to end portions Vx 8 , Vx 14 , Vx 15 , and Vx 16 of the feed lines F 8 , F 14 , F 15 , and F 16 of the sixth layer La 6 through the vertical vias.

The feed lines F 1 to F 16 for all antenna elements constituting the first array antenna 1200 a may be formed to have the same length on the sixth layer La 6 . Ground layers on which vias are formed are disposed at one side and another side of the feed lines F 1 to F 16 . Accordingly, the sixth layer La 6 on which the feed lines F 1 to F 16 are formed is configured as a coplanar waveguide layer.

Center positions of another end portions Vc 1 to Vc 16 of the feed lines F 1 to F 16 for all antenna elements constituting the first array antenna 1200 a correspond to feeding points for all the antenna elements through the vertical vias. In this regard, FIG. 9 is an enlarged view of the tenth and twelfth layers, on which the first and second patch elements are disposed, among the plurality of layers of FIG. 6 B .

The feed lines F 1 to F 16 for all the antenna elements constituting the first array antenna 1200 a may be formed in a symmetrical structure with respect to an Y axis as a vertical axis. The first and eighth feed lines F 1 and F 8 may be formed in a symmetrical structure with respect to the Y axis. A plurality of regions of the first and eighth feed lines F 1 and F 8 are formed as straight lines parallel to an X axis. Considering a coordinate difference in the vertical axis between the one end portions Vx 1 and Vx 8 and the another end portions Vc 1 and Vc 8 of the first and eighth feed lines F 1 and F 8 , partial regions of end points of the first and eighth feed lines F 1 and F 8 may be formed with a curved portion and an inclined straight line.

The second and seventh feed lines F 2 and F 7 may be formed in a symmetrical structure with respect to the Y axis. A plurality of regions of the second and seventh feed lines F 2 and F 7 are formed as straight lines parallel to the X axis. Considering a coordinate difference in the vertical axis between the one end portions Vx 2 and Vx 7 and the another end portions Vc 2 and Vc 7 of the second and seventh lines F 2 and F 7 , partial regions of end points of the second and seventh feed lines F 2 and F 7 may be formed with a curved portion and an inclined straight line. The first and eighth feed lines F 1 and F 8 may have the same length and also the second and seventh feed lines F 2 and F 7 may have the same length.

The third and sixth feed lines F 3 and F 6 may be formed in a symmetrical structure with respect to the Y axis. The third and sixth feed lines F 3 and F 6 may include two straight lines parallel to the X axis. A distance between the two straight lines of each of the third and sixth feed lines F 3 and F 6 may be ¼ or more of a wavelength corresponding to an operating frequency, so that mutual interference can be maintained below a predetermined level. The first and eighth feed lines F 1 and F 8 may have the same length, the second and seventh feed lines F 2 and F 7 may have the same length, and the third and sixth feed lines F 3 and F 6 may have the same length.

The fourth and fifth feed lines F 4 and F 5 may be formed in a symmetrical structure with respect to the Y axis. The fourth and fifth feed lines F 4 and F 5 may include two straight lines parallel to the Y axis. A distance between the two straight lines of each of the fourth and fifth feed lines F 4 and F 5 may be ¼ or more of a wavelength corresponding to an operating frequency, so that mutual interference can be maintained below a predetermined level. The first and eighth feed lines F 1 and F 8 , the second and seventh feed lines F 2 and F 7 , the third and sixth feed lines F 4 and F 5 , and the fourth and fifth feed lines F 4 and F 5 may have the same length, respectively.

The ninth and sixteenth feed lines F 9 and F 16 may be formed in a symmetrical structure with respect to the Y axis. The ninth and sixteenth feed lines F 9 and F 16 each may include a straight line parallel to the X axis, a straight line inclined upward, and a straight line inclined downward.

The tenth and fifteenth feed lines F 10 and F 15 may be formed in a symmetrical structure with respect to the Y axis. The tenth and fifteenth feed lines F 10 and F 15 each may include a straight line parallel to the X axis, a straight line inclined upward, and two straight lines parallel to the Y axis. A distance between the two straight lines of each of the tenth and fifteenth feed lines F 10 and F 15 may be ¼ or more of a wavelength corresponding to an operating frequency, so that mutual interference can be maintained below a predetermined level. The ninth and sixteenth feed lines F 9 and F 16 may have the same length and also the tenth and fifteenth feed lines F 10 and F 15 may have the same length.

The eleventh and fourteenth feed lines F 11 and F 14 may be formed in a symmetrical structure with respect to the Y axis. The eleventh and fourteenth feed lines F 11 and F 14 each may include two straight lines parallel to the X axis, and two straight lines parallel to the Y axis. A distance between the two straight lines of each of the eleventh and fourteenth feed lines F 11 and F 14 may be ¼ or more of a wavelength corresponding to an operating frequency, so that mutual interference can be maintained below a predetermined level. The ninth and sixteenth feed lines F 9 and F 16 may have the same length, the tenth and fifteenth feed lines F 10 and F 15 may have the same length, and the eleventh and fourteenth feed lines F 11 and F 14 may have the same length.

The twelfth and thirteenth feed lines F 12 and F 13 may be formed in a symmetrical structure with respect to the Y axis. The twelfth and thirteenth feed lines F 12 and F 13 each may include a straight line parallel to the X axis, and a straight line parallel to the Y axis. The ninth and sixteenth feed lines F 9 and F 16 , the tenth and fifteenth feed lines F 10 and F 15 , the eleventh and fourteenth feed lines F 11 and F 14 , and the twelfth and thirteenth feed lines F 12 and F 13 may have the same length, respectively.

In addition, the first to eighth feed lines F 1 to F 8 in the top region based on the X axis of the sixth layer La 6 and the ninth to sixteenth feed lines F 9 to F 16 in the bottom region based on the X axis of the sixth layer La 6 may all be formed in the same way. This can suppress a beam direction from being changed or beam quality from being degraded due to a phase difference applied to each antenna element, which is caused by a difference in length of the feed lines for each layer.

The tenth layer La 10 may include a plurality of first patch elements CP 11 to CP 18 and CP 21 to CP 28 . Among the plurality of first patch elements, the patch elements CP 11 and CP 12 adjacent to each other in one axial direction may be spaced apart from each other by a first gap G 1 . Among the plurality of first patch elements, the patch elements CP 12 and CP 13 adjacent to each other in the one axial direction may be spaced apart from each other by a second gap G 2 .

The twelfth layer La 12 may include a plurality of second patch elements PA 11 to PA 18 and PA 21 to PA 28 . Among the plurality of second patch elements PA 11 to PA 18 and PA 21 to PA 28 , the adjacent patch elements may be disposed to be spaced apart from each other equally by a third gap G 3 in the one axial direction.

In this regard, the first patch elements CP 11 and CP 21 in a first row may be disposed to be offset by a first distance Lx 1 in a positive axial direction from a center of a window region WR within the ground wall 1130 . Meanwhile, the first patch elements CP 12 and CP 22 in a second row may be disposed to be offset by the first distance Lx 1 in a negative axial direction from the center of the window region WR within the ground wall 1130 . The first distance Lx 1 may be determined as (G 3 −G 1 )/2.

The first patch elements CP 13 , CP 15 , CP 17 , CP 23 , CP 25 , and CP 27 in third, fifth, and seventh rows may be disposed to be offset by the first distance Lx 1 in the positive axial direction from the center of the window region WR within the ground wall 1130 . On the other hand, the first patch elements CP 14 , CP 16 , CP 18 , CP 23 , CP 26 , and CP 28 in fourth, sixth, and eighth rows may be disposed to be offset by the first distance Lx 1 in the positive axial direction from the center of the window area WR within the ground wall 1130 . The first distance Lx 1 may be determined as (G 3 −G 1 )/2.

Feeding point Vc 1 to Vc 16 of the feed lines F 1 to F 16 for all the antenna elements constituting the first array antenna 1200 a correspond to feeding positions of the first patch elements CP 11 to CP 18 and CP 21 to CP 28 . Accordingly, the feeding points Vc 1 to Vc 16 of the feed lines F 1 to F 16 are vertically connected through the vertical vias to points that are offset from the centers of the first patch elements CP 11 to CP 18 and CP 21 to CP 28 . Therefore, the feeding positions of the first patch elements CP 11 to CP 18 and CP 21 to CP 28 are defined as the points offset from the centers of the first patch elements CP 11 to CP 18 and CP 21 to CP 28 according to the feeding points Vc 1 to Vc 16 determined for impedance matching.

Center positions of another end portions Vc 1 to Vc 16 of the feed lines F 1 to F 16 for all the antenna elements constituting the first array antenna 1200 a correspond to center positions of the feeding points for all the antenna elements through the vertical vias.

Hereinafter, a plurality of antenna structures in a multi-layered antenna package implemented as a coplanar waveguide layer according to the present disclosure will be described with reference to FIGS. 1 to 6 .

A description will be given of a plurality of antenna structures in a multi-layered antenna package implemented as a coplanar waveguide layer according to the present disclosure, with reference to FIGS. 1 to 6 . The antenna module 1000 a may include a radio frequency integration circuit (RFIC) 1400 a , a first dielectric layer DL 1 , a first coplanar waveguide layer WG 1 , a second dielectric layer DL 2 , a third dielectric layer DL 3 , a second coplanar waveguide layer WG 2 , and a fourth dielectric layer DL 4 . The antenna module 1000 a may further include a first antenna portion 1300 a and a second antenna portion 1200 a.

The RFIC 1400 a may be configured to transmit radio frequency (RF) signals. The RFIC 1400 a may be operably coupled to the first antenna portion 1300 a and the second antenna portion 1200 a . The RFIC 1400 a may generate a beamformed radio signal by adjusting phases of signals applied to the first antenna portion 1300 a and the second antenna portion 1200 a.

The first dielectric layer DL 1 may be disposed directly on an interface layer IL of the RFIC 1400 a . The first coplanar waveguide layer WG 1 may be disposed on a top of the first dielectric layer DL 1 . The first coplanar waveguide layer WG 1 may be configured to receive an RF signal transmitted by the interface layer IL of the RFIC 1400 a and convey the received RF signal to the first antenna portion 1300 a . The first coplanar waveguide layer WG 1 may be configured to transmit the RF signal received from the first antenna portion 1300 a to the interface layer IL of the RFIC 1400 a.

The second dielectric layer DL 2 may be disposed on the first coplanar waveguide layer WG 1 . The third dielectric layer DL 3 may be disposed on the second dielectric layer DL 2 . The second coplanar waveguide layer WG 2 may be disposed on a top of the third dielectric layer DL 3 .

The second coplanar waveguide layer WG 2 may be configured to receive an RF signal transmitted by the interface layer IL of the RFIC 1400 a and convey the received RF signal to the second antenna portion 1200 a . The second coplanar waveguide layer WG 2 may be configured to transmit the RF signal received from the second antenna portion 1200 a to the interface layer IL of the RFIC 1400 a.

The first antenna portion 1300 a may be disposed on the first coplanar waveguide layer WG 1 . The first antenna portion 1300 a may be configured to radiate a signal transmitted from the first coplanar waveguide layer WG 1 . The second antenna portion 1200 a may be disposed on the second coplanar waveguide layer WG 2 . The second antenna portion 1200 a may be configured to radiate a signal transmitted from the second coplanar waveguide layer WG 2 .

The first coplanar waveguide layer WG 1 may include a plurality of first signal connection lines Fa 1 to Fa 10 and a first ground portion GP 1 . The first coplanar waveguide layer WG 1 may be disposed on a third layer La 3 . The plurality of first signal connection lines Fa 1 to Fa 10 and the first ground portion GP 1 may be disposed to be flush with each other on the top of the first dielectric layer DL 1 . The first dielectric layer DL 1 and the second dielectric layer DL 2 may operate as shields of the first coplanar waveguide layer WG 1 . The first ground layer GND 1 on the first dielectric layer DL 1 and the second ground layer GND 2 on the second dielectric layer DL 2 may operate as shields of the first coplanar waveguide layer WG 1 .

The second coplanar waveguide layer WG 2 may include a plurality of second signal connection lines F 1 to F 16 and a second ground portion GP 2 . The second coplanar waveguide layer WG 2 may be disposed on a sixth layer La 6 . The plurality of second signal connection lines F 1 to F 16 and the second ground portion GP 2 may be disposed to be flush with each other on the top of the third dielectric layer DL 3 . The third dielectric layer DL 3 and the fourth dielectric layer DL 4 may operate as shields of the second coplanar waveguide layer WG 2 . The third ground layer GND 3 on the third dielectric layer DL 3 and the fourth ground layer GND 4 on the fourth dielectric layer DL 4 may operate as shields of the second coplanar waveguide layer WG 2 .

A part (DA 2 to DA 9 ) of the first antenna portion 1300 a may be connected to the signal connection lines Fa 2 to Fa 9 of the first coplanar waveguide layer WG 1 . Another part (DA 1 and DA 10 ) of the first antenna portion 1300 a may be connected to the signal connection lines Fb 1 and Fb 10 of the second coplanar waveguide layer WG 2 . The another part (DA 1 and DA 10 ) of the first antenna portion 1300 a may be connected to the signal connection lines Fb 1 and Fb 10 of the second coplanar waveguide layer WG 2 through the signal connection lines Fa 1 and Fa 10 of the first coplanar waveguide layer WG 1 .

The antenna module 1000 a may include a plurality of ground layers GND 1 to GND 4 and a plurality of array antennas 1100 a , 1100 b , 1200 , and 1300 . The first ground layer GND 1 may be disposed between the first dielectric layer DL 1 and the second dielectric layer DL 2 . The second ground layer GND 2 may be disposed between the second dielectric layer DL 2 and the third dielectric layer DL 3 . The third ground layer GND 3 may be disposed between the third dielectric layer DL 3 and the fourth dielectric layer DL 4 . The fourth dielectric layer DL 4 may be disposed on the top of the fourth dielectric layer GND 4 .

The antenna module 1000 a may include a first array antenna 1200 a , a second array antenna 1300 a , and third and fourth array antennas 1100 a and 1100 b . The third and fourth array antennas 1100 a and 1100 b may be disposed on one side and another side of the second dielectric layer DL 2 between the first and second ground layers GND 1 and GND 2 . The first antenna portion 1300 a and the second antenna portion 1200 a may correspond to the second array antenna 1300 a and the first array antenna 1200 a , respectively.

The interface layer IL of the RFIC 1400 a , the first ground layer GND 1 , and the first coplanar waveguide layer WG 1 may correspond to the first layer La 1 , the second layer La 2 , and the third layer La 3 of the PCB 1010 a , respectively. The second and third ground layers GND 2 and GND 3 and the second coplanar waveguide layer WG 2 may correspond to the fourth layer La 4 , the fifth layer La 5 , and the sixth layer La 6 of the PCB 1010 a , respectively.

A group of third feed lines Fc 1 to Fc 6 for feeding the third and fourth array antennas 1100 a and 1100 b may be connected through vias Va 1 to Va 6 from the first layer La 1 to the third layer La 3 . The group of the third feed lines Fc 1 to Fc 6 may be connected to the antennas MA 1 to MA 6 of the third and fourth array antennas 1100 a and 1100 b of the third layer La 3 , respectively.

The second array antenna 1300 a may be disposed on a lower side of the second dielectric layer DL 2 between the first and second ground layers GND 1 and GND 2 . The second array antenna 1300 a may be disposed on the same plane as the third and fourth array antennas 1100 a and 1100 b . A first group Fa 1 to Fa 10 of second feed lines for feeding the second array antenna 1300 a may be disposed on the top of the second dielectric layer DL 2 between the first and second ground layers GND 1 and GND 2 . A second group Fb 1 and Fb 10 of the second feed lines may be disposed on the top of the second dielectric layer DL 3 between the first and second ground layers GND 3 and GND 4 .

The second group Fb 1 and Fb 10 of the second feed lines may be connected through first vias Vb 1 and Vb 10 from the first layer La 1 to the sixth layer Vb 10 . The second group Fb 1 and Fb 10 of the second feed lines may be connected by feed lines having predetermined lengths on the sixth layer La 6 . The second group Fb 1 and Fb 10 of the second feed lines may be connected through second vias Vb 1 ′ and Vb 10 ′ from the sixth layer La 6 to the third layer La 3 . The second group Fb 1 and Fb 10 of the second feed lines may be connected to the outermost antennas DA 1 and DA 10 of the second array antenna 1300 a through the feed lines Fa 1 and Fa 10 on the third layer La 3 .

The first array antenna 2100 a may include first patch elements 1210 and second patch elements 1220 disposed on the tenth layer La 10 and the twelfth layer La 12 of the PCB 1010 a . The first feed lines for feeding the first array antenna 1200 a may include first top feed lines F 1 to F 8 on a top region, and first bottom feed lines F 9 to F 16 on a bottom region. The second group Fb 1 and Fb 10 of the second feed lines may be disposed between the first feed lines F 1 to F 16 . The second group Fb 1 and Fb 10 of the second feed lines may be disposed between the first top feed lines F 1 to F 8 and the first bottom feed lines F 9 to F 16 . One Fb 1 of the second group of the second feed lines may be disposed between a pair F 1 and F 9 of the first feed lines. Another one Fb 10 of the second group of the second feed lines may be disposed between another pair F 8 and F 16 of the first feed lines.

A length of the first group Fa 1 to Fa 10 of the second feed lines may increase from a central region toward side regions. The length of the first group Fa 1 to Fa 10 of the second feed lines may have a phase difference by ¼ of a wavelength of an operating frequency. A second pair Fb 4 and Fb 7 of the second feed lines may be longer than a first pair Fb 5 and Fb 6 of the second feed lines by ¼ of the wavelength. A third pair Fb 3 and Fb 8 of the second feed lines may be longer than the second pair Fb 4 and Fb 7 of the second feed lines by ¼ of the wavelength. A fourth pair Fb 2 and Fb 9 of the second feed lines may be longer than the third pair Fb 3 and Fb 8 of second feed lines by ¼ of the wavelength. A fifth pair Fa 1 +Fb 1 and Fa 10 +Fa 10 of the second feed lines may be longer than the fourth pair Fb 2 and Fb 9 of the second feed lines by ¼ of the wavelength. The second feed lines Fa 1 to Fa 10 disposed on the third layer La 3 may be formed in a symmetrical shape with respect to the Y-axis of a center line.

The RFIC 1400 a may include a plurality of pins disposed on a first side Sd 1 as a top region, a second side Sd 2 as one side region, a third side Sd 3 as another side region, and a fourth side Sd 4 as a bottom region.

The feed lines of the first layer La 1 connected to the first group Fa 1 to Fa 10 of the second feed lines disposed on the third layer La 3 may be connected to the fourth side surface Sd 4 of the RFIC 1400 a . The feed lines of the first layer La 1 connected to the first group Fa 1 to Fa 10 of the second feed lines may be formed in a symmetrical shape with respect to the Y-axis of the center line.

The feed lines of the first layer La 1 connected to the second group Fb 1 and Fb 10 of the second feed lines disposed on the sixth layer La 6 may be connected to the second and third side surfaces Sd 2 and Sd 3 of the RFIC 1400 a . The feed lines of the first layer La 1 connected to the second group Fb 1 and Fb 10 of the second feed lines may be formed in a symmetrical shape with respect to the Y-axis of the center line.

The feed lines of the first layer La 1 connected to the second group Fb 1 and Fb 10 of the second feed lines disposed on the sixth layer La 6 may be disposed between the first feed lines F 1 to F 16 . The feed lines of the first layer La 1 connected to the second group Fb 1 and Fb 10 of the second feed lines disposed on the sixth layer La 6 may be formed in a symmetrical shape with respect to the Y-axis of the center line.

Meanwhile, the signal connection lines on the first and second coplanar waveguide layers WG 1 and WG 2 of the multi-layered antenna package according to the present disclosure may form ground planes on one side and another side of the same plane. The ground planes may also be formed on the top and bottom regions of the signal connection lines on the first and second coplanar waveguide layers WG 1 and WG 2 .

In this regard, the first dielectric layer DL 1 may include a ground plane GND 1 . A first ground portion GP 1 is disposed on the same plane as the signal connection lines of the first coplanar waveguide layer WG 1 disposed on the second dielectric layer DL 2 . The ground planes GND 1 and GND 2 are also disposed on the top and bottom sides of the signal connection lines of the first coplanar waveguide layer WG 1 in the height direction. Therefore, the second dielectric layer DL 2 may include a double graded-ground plane having a pair of overlapped ground lines.

The antenna elements of the first antenna portion 1300 a of the first coplanar waveguide layer WG 1 may be implemented in a multi-layered ground structure by the double graded-ground plane. The signal connection lines Fa 1 to Fa 10 of the first antenna portion 1300 a of the first coplanar waveguide layer WG 1 may be formed by the double-graded ground plane, which has a pair of ground lines overlapping the first and second ground layers GND 1 and GND 2 , between the first and second ground layers GND 1 and GND 2 .

A second ground portion GP 2 is disposed on the same plane as the signal connection lines of the second coplanar waveguide layer WG 2 disposed on the third dielectric layer DL 3 . The ground planes GND 3 and GND 4 are also disposed on top and bottom sides of the signal connection lines of the second coplanar waveguide layer WG 2 in the height direction. Therefore, the third dielectric layer DL 3 may include a double graded-ground plane having a pair of overlapped ground lines. The fourth dielectric layer DL 4 may include a ground plane GND 4 .

The antenna elements of the second antenna portion 1200 a of the second coplanar waveguide layer WG 2 may be implemented in a multi-layered ground structure by the double graded-ground plane. The signal connection lines F 1 to F 13 of the second antenna portion 1200 a of the second coplanar waveguide layer WG 2 may be formed by the double graded-ground plane, which has a pair of ground lines overlapping the third and fourth ground layers GND 3 and GND 4 , between the third and fourth ground layers GND 3 and GND 4 .

In the above, the disposition structure of the feed lines for each layer in the multi-layered antenna package having the plurality of array antennas according to one aspect of the present disclosure has been described. Hereinafter, a description will be given of a disposition structure of feed lines for each layer in a multi-layered antenna package including a plurality of array antennas formed in a plurality of coplanar waveguide structures according to another aspect of the present disclosure. In this regard, an antenna module 1000 a implemented as a multi-layered antenna package including a plurality of array antennas formed in a plurality of coplanar waveguide structures will be described with reference to FIGS. 1 to 6 .

The antenna module 1000 a includes a transceiver circuitry 1400 a , first resonating elements 1300 a , second resonating elements 1200 a , and a plurality of signal connection lines SL 1 to SL 4 . The antenna module 1000 a may further include a first coplanar waveguide WG 1 and a second coplanar waveguide WG 2 . The first resonating elements 1300 a may correspond to the second array antenna 1300 a . The second resonating elements 1200 a may correspond to the first array antenna 1200 a and the phased array antenna portion 1200 a.

The first coplanar waveguide layer WG 1 may be configured to convey first signals at a frequency of 10 GHz or higher between the transceiver circuitry 1400 a and the first resonating elements 1300 a . The second coplanar waveguide layer WG 2 may be configured to convey second signals at the frequency of 10 GHz or higher between the transceiver circuitry 1400 a and the second resonating elements 1200 a.

The first coplanar waveguide layer WG 1 may be interposed between the second coplanar waveguide layer WG 2 and the transceiver circuitry 1400 a . The second coplanar waveguide layer WG 2 may be interposed between the first coplanar waveguide layer WG 1 and the second resonating element 1200 a.

The first resonating elements 1300 a may be interposed between the second coplanar waveguide layer WG 2 and the transceiver circuitry 1400 a . The second resonating elements 1200 a may be disposed on an opposite side of the transceiver circuitry 1400 a . The second resonating elements 1200 a may configure a planar array antenna.

Each of the second resonating elements 1200 a may include at least two patch antenna layers configured to radiate radio signals. The first patch antenna 1220 of the two patch antennas may be disposed on the first surface S 1 of the PCB 1010 a , and the first surface S 1 may be the outermost surface of the PCB 1010 a . The second patch antenna 1210 of the two patch antennas may be disposed inside the PCB 1010 a . A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 may be stacked to overlap each other.

The plurality of signal connection lines SL 1 to SL 4 may be configured to connect the transceiver circuitry 1400 a to the phased array antenna portion 1200 a . Each of the plurality of signal connection lines SL 1 to SL 4 may be fed by being connected to the second patch antennas 1210 disposed inside the PCB 1010 a . Each of the plurality of signal connection lines SL 1 to SL 4 may be configured not to be directly connected to the first patch antennas 1220 on the first surface S 1 of the PCB 1010 a.

A length of each of the plurality of signal connection lines SL 1 to SL 4 may be defined as a connected length between the transceiver circuitry 1400 a and the phased array antenna portion 1200 a . The plurality of signal connection lines SL 1 to SL 4 may have the same length for each of the second resonating elements 1200 a.

The plurality of signal connection lines SL 1 to SL 4 may be disposed between the second resonating elements 1200 a inside the PCB 1010 a and the transceiver circuitry 1400 a . The plurality of signal connection lines SL 1 to SL 4 may be disposed on the second coplanar waveguide layer WG 2 .

The second coplanar waveguide layer WG 2 may be disposed on a conductive plate between two ground conductive plates GND 3 and GND 4 inside the PCB 1010 a . The conductive plate of the second coplanar waveguide layer WG 2 may include a plurality of signal connection lines SL 3 and ground portions. The plurality of signal connection lines SL 3 and ground portions may be disposed on the coplanar conductive plate between the two ground conductive plates GND 3 and GND 4 inside the PCB 1010 a.

Each of the plurality of signal connection lines may include the first part SL 1 to the fourth part SL 4 . The first part SL 1 may be disposed on the second surface S 2 of the PCB 1010 a . The third part SL 3 may be disposed on the second coplanar waveguide WG 2 . The second part S 2 may be configured to electrically connect the first part SL 1 and the third part SL 3 . The fourth part SL 4 may be configured to electrically connect the third part SL 3 and one of the second patch antennas 1210 .

The PCB 1010 a may include first to sixth layers La 1 to La 6 . The first parts SL 1 of the plurality of signal connection lines may be disposed on the first layer La 1 of the PCB 1010 a . The second parts SL 2 of the plurality of signal connection lines may be first vertical vias formed from the first layer La 1 to the sixth layer La 6 of the PCB 1010 a . The third parts SL 3 of the plurality of signal connection lines may be disposed on the sixth layer La 6 of the PCB 1010 a . The fourth parts SL 4 of the plurality of signal connection lines may be second vertical vias formed from the sixth layer La 6 to the second patch antenna 1220 .

For the second resonating elements 1200 a , the first parts SL 1 on the first layer La 1 may have the same length. For the second resonating elements 1200 a , the third parts SL 3 on the sixth layer La 6 may have the same length.

For the second resonating elements 1200 a , the first vertical vias corresponding to the second parts SL 2 may have the same length (height). For the second resonating elements 1200 a , 1200 b , the second vertical vias corresponding to the fourth parts SL 4 may have the same height.

The feed lines of the first layer La 1 may be connected to the feed lines F 1 to F 16 of the sixth layer La 1 through the first vertical vias passing through the first and second ground layers GND 1 and GND 2 . The feed lines F 1 to F 16 of the sixth layer La 1 may be connected to the second patch antennas 1210 . All of the feed lines F 1 to F 16 of the sixth layer La 1 may be formed to have the same length.

The first resonating elements 1300 a and the second resonating elements 1200 a may constitute the first antenna portion 1300 a and the second antenna portion 1200 a , respectively. Some dipole antennas DA 2 to DA 9 of the first antenna portion 1300 a may be connected to the signal connection lines Fa 2 to Fa 9 of the first coplanar waveguide layer WG 1 . Some other dipole antennas DA 1 and DA 10 of the first antenna portion 1300 a may be connected to the signal connection lines Fb 1 and Fb 10 of the second coplanar waveguide layer WG 2 .

The transceiver circuitry 1400 a may be disposed on the first dielectric layer DL 1 . The first coplanar waveguide layer WG 1 may be disposed on the second dielectric layer DL 2 and the second coplanar waveguide layer WG 2 may be disposed on the third dielectric layer DL 3 . The second antenna portion 1300 a and the first antenna portion 1200 a may correspond to the second array antenna 1300 a and the first array antenna 1200 a , respectively.

The antenna module 1000 a may include a first ground layer GND 1 , second and third ground layers GND 2 and GND 3 , and a fourth ground layer GND 4 . The first ground layer GND 1 may be disposed between the first dielectric layer DL 1 and the second dielectric layer DL 2 . The second and third ground layers GND 2 and GND 3 may be disposed between the second dielectric layer DL 2 and the third dielectric layer DL 3 . The fourth dielectric layer GND 4 may be disposed on the top of the third ground layer GND 3 . The antenna module 1000 a may include the third array antenna 1100 a and the fourth array antenna 1100 b that are disposed on one side and another side of the second dielectric layer DL 2 between the first and second ground layers GND 1 and GND 2 .

The first dielectric layer DL 1 , the first ground layer GND 1 , and the second dielectric layer DL 2 may correspond to the first layer La 1 , the second layer La 2 , and the third layer La 3 , respectively. The second and third ground layers GND 2 and GND 3 and the third dielectric layer DL 3 may correspond to the fourth layer La 4 , the fifth layer La 5 , and the sixth layer La 6 , respectively.

A group of third feed lines Fc 1 to Fc 6 for feeding the third and fourth array antennas 1100 a and 1100 b may be connected through vias Va 1 to Va 6 from the first layer La 1 to the third layer La 3 . The group of the third feed lines Fc 1 to Fc 6 may be connected to antennas MA 1 to MA 6 of the first array antennas 1100 a and 1100 b of the third layer La 3 , respectively.

The second array antenna 1300 a may be disposed on a lower side of the second dielectric layer DL 2 between the first and second ground layers GND 1 and GND 2 . A first group Fa 1 to Fa 10 of second feed lines for feeding the second array antenna 1300 a may be disposed on the top of the second dielectric layer DL 2 between the first and second ground layers GND 1 and GND 2 . A second group Fb 1 and Fb 10 of the second feed lines may be disposed on the top of the second dielectric layer DL 3 between the first and second ground layers GND 3 and GND 4 .

So far, an electronic device having an antenna module has been described. The technical effects of the electronic device having the antenna module according to the present disclosure are as follows.

An electronic device according to an embodiment of the present disclosure may perform wireless communication of A/V data regardless of the location of an A/V transmitting device through first and second antenna structures in which a plurality of array antennas are disposed.

Furthermore, the A/V transmitting device may transmit two streams of data, thereby minimizing video quality deterioration that occurs when increasing a data compression rate.

In addition, since a horizontally polarized antenna and a vertically polarized antenna can be disposed together on one substrate, thereby allowing an antenna module to be compact and providing a high data reception rate.

Moreover, horizontally and vertically polarized signals may be used according to an array antenna disposition structure of the A/V transmitting device and the electronic device, thereby performing A/V wireless communication with reduced mutual interference while increasing a communication capacity.

Besides, horizontally and vertically polarized signals may be used in consideration of the location of the A/V transmitting device and electronic device the polarization characteristics of the array antennas, thereby performing A/V wireless communication with reduced mutual interference while increasing a communication capacity.

In addition, even when an obstacle is disposed on a wireless communication path between the A/V transmitting device and the electronic device, a beamforming direction may be changed and reflected waves may be used, thereby providing seamless A/V wireless communication.

Also, the number of array antennas disposed in a front region of the antenna module of the A/V transmitting device may be greater than the number of antennas in a side region or bottom region. Accordingly, signals can be transmitted over a longer distance in the front region of the antenna module than in the side region or bottom region. Also, an antenna module that has two-dimensional array antennas and is capable of transmitting signals even upward through beamforming can be implemented.

Also, the number of array antennas disposed in side regions of the antenna module of the A/V transmitting device may be greater than the number of antennas in other areas. Accordingly, an antenna module capable of achieving a wider beam coverage in the side regions than that in a front or bottom region can be implemented.

Each of a plurality of array antennas can be disposed in in different layered structures on different regions while implementing a coplanar waveguide structure, thereby minimizing interference between different array antennas.

Further scope of applicability of the present disclosure will become apparent from the following detailed description. It should be understood, however, that the detailed description and specific examples, such as the preferred embodiments of the present disclosure, are given by way of illustration only, since various modifications and alternations within the spirit and scope of the disclosure will be apparent to those skilled in the art. Therefore, the detailed description should not be limitedly construed in all of the aspects, and should be understood to be illustrative. Therefore, all changes and modifications that fall within the metes and bounds of the claims, or equivalents of such metes and bounds are therefore intended to be embraced by the appended claims.