USPatent applicationPending
LIQUID COOLING VAPOR CHAMBER HEAT DISSIPATION MODULE
Pending · filed 17 May 2024 · no office action yet
Assignee: none recorded yet
Application· this page
18/666,855
filed 17 May 2024
Publication
US 20250003696 A1
published 2 Jan 2025
Patent
Not granted yet
still under examination
File wrapper
Examiner
Travis C. Ruby
art unit 3763 · TC 3700
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