Trigger circuit and operating circuit

The present invention relates to a trigger circuit, and, in particular, to a trigger circuit device that turns off important elements during an electrostatic discharge (ESD) event.

As the semiconductor manufacturing process has developed, electrostatic discharge (ESD) protection has become one of the most critical reliability issues for integrated circuits (IC). In particular, as semiconductor processing advances into the deep sub-micron stage, scaled-down devices and thinner gate oxides are more vulnerable to ESD stress. Generally, the input-output pads on IC chips are required to sustain 2000V ESD stress in high Human Body Mode (HBM), and 200V in Machine Mode.

In accordance with an embodiment of the disclosure, a trigger circuit is coupled between an input-output pad and a core circuit and comprises an adjustment circuit and a protection circuit. The adjustment circuit adjusts the voltage of the input-output pad to generate an output voltage. The protection circuit is coupled between the adjustment circuit and the core circuit and receives a system enable signal. In response to the system enable signal being disabled or an electrostatic discharge (ESD) event occurring on the input-output pad, the protection circuit disables the core circuit according to the output voltage. In response to the system enable signal being enabled, the protection circuit stops disabling the core circuit.

In accordance with another embodiment of the disclosure, an operating circuit comprises a core circuit and a trigger circuit. The core circuit is configured to set the voltage of an input-output pad. The trigger circuit is coupled to the input-output pad and comprises an adjustment circuit and a protection circuit. The adjustment circuit adjusts the voltage of the input-output pad to generate an output voltage. The protection circuit is coupled between the adjustment circuit and the core circuit and receives a system enable signal. In response to the system enable signal being disabled or an ESD event occurring on the input-output pad, the protection circuit disables the core circuit according to the output voltage. In response to the system enable signal being enabled, the protection circuit stops disabling the core circuit.

The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

FIG. 1 A is a schematic diagram of an exemplary embodiment of an operating circuit according to various aspects of the present disclosure.

FIG. 1 B is a schematic diagram of another exemplary embodiment of the operating circuit according to various aspects of the present disclosure.

FIG. 2 is a schematic diagram of an exemplary embodiment of a trigger circuit according to various aspects of the present disclosure.

FIG. 3 is a schematic diagram of an exemplary embodiment of the operation of the trigger circuit according to various aspects of the present disclosure.

FIG. 4 is a schematic diagram of another exemplary embodiment of the trigger circuit according to various aspects of the present disclosure.

The present invention will be described with respect to particular embodiments and with reference to certain drawings, but the invention is not limited thereto and is only limited by the claims. The drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements may be exaggerated for illustrative purposes and not drawn to scale. The dimensions and the relative dimensions do not correspond to actual dimensions in the practice of the invention.

FIG. 1 A is a schematic diagram of an exemplary embodiment of an operating circuit according to various aspects of the present disclosure. The operating circuit 100 A comprises a core circuit 110 and a trigger circuit 120 A. The core circuit 110 is coupled between a node ND and an input-output pad PD_ 1 . In this embodiment, the core circuit 110 sets the voltage of the input-output pad PD_ 1 according to the voltage of the node ND. For example, when the voltage of the node ND is equal to a first voltage, the core circuit 110 sets the voltage of the input-output pad PD_ 1 is equal to a second voltage. The first voltage may be higher than or lower than the second voltage.

The structure of the core circuit 110 is not limited in the present disclosure. In one embodiment, the core circuit 110 comprises a driving transistor NDRV. The driving transistor NDRV sets the voltage of the input-output pad PD_ 1 according to the voltage of the node ND. For example, when the voltage of the node ND is a high voltage, the driving transistor NDRV is turned on. Therefore, the voltage of the input-output pad PD_ 1 is about equal to an operation voltage VSS, such as 0V. When the voltage of the node ND is a low voltage, the driving transistor NDRV is turned off. Therefore, the voltage of the input-output pad PD_ 1 is not equal to the operation voltage VSS.

In this embodiment, the driving transistor NDRV is an N-type transistor, but the disclosure is not limited thereto. In other embodiments, the driving transistor NDRV is a P-type transistor. As shown in FIG. 1 A , the gate of the driving transistor NDRV is coupled to the node ND. The drain of the driving transistor NDRV is coupled to the input-output pad PD_ 1 . The source of the driving transistor NDRV receives the operation voltage VSS, which may be referred to as a first operation voltage.

In some embodiments, the driving transistor NDRV is a low-gate high-drain transistor. In this case, the drain of the driving transistor NDRV can withstand a higher voltage than the gate of the driving transistor NDRV. For example, the maximum voltage that the gate of the driving transistor NDRV is capable of withstanding may be 6V, and the maximum voltage that the drain of the driving transistor NDRV is capable of withstanding may be 20V.

The trigger circuit 120 A is coupled to the input-output pad PD_ 1 and the core circuit 110 and receives a system enable signal SYS_EN. When the system enable signal SYS_EN is disabled, the trigger circuit 120 A disables the core circuit 110 so that the core circuit 110 stops setting the voltage of the input-output pad PD_ 1 . When the system enable signal SYS_EN is enabled, the trigger circuit 120 A stops disabling the core circuit 110 . Therefore, the core circuit 110 sets the voltage of the input-output pad PD_ 1 according to the voltage of the node ND. In one embodiment, when an electrostatic discharge (ESD) event occurs on the input-output pad PD_ 1 , the trigger circuit 120 A disables the core circuit 110 to avoid an ESD current from the input-output pad PD_ 1 from entering and damaging the core circuit 110 .

In other embodiments, the operating circuit 100 A further comprises an ESD protection circuit 130 . The ESD protection circuit 130 is coupled to the input-output pad PD_ 1 . When an ESD event occurs on the input-output pad PD_ 1 , the ESD protection circuit 130 releases an ESD current to avoid the ESD current from entering the core circuit 110 . In one embodiment, the ESD protection circuit 130 is further coupled to an input-output pad PD_ 2 . In this case, when an ESD event occurs on the input-output pad PD_ 1 and the input-output pad PD_ 2 is coupled to ground, the ESD protection circuit 130 provides a discharge path. An ESD current is released from the input-output pad PD_ 1 , passes the ESD protection circuit 130 and enters the input-output pad PD_ 2 .

In some embodiments, the operating circuit 100 A further comprises a specific circuit 140 . The specific circuit 140 receives the system enable signal SYS_EN and an input signal DIN. When the system enable signal SYS_EN is enabled, the specific circuit 140 sets the voltage of the node ND according to the input signal DIN. For example, when the input signal DIN is a third voltage, the voltage of the node ND may be equal to a fourth voltage. When the input signal DIN is a fifth voltage, the voltage of the node ND may be equal to a sixth voltage. The third voltage is opposite of the fifth voltage. The fourth voltage is opposite of the sixth voltage. Additionally, the third voltage may be higher than or lower than the fourth voltage. The fifth voltage may be higher than or lower than the sixth voltage. However, when the system enable signal SYS_EN is disabled, the specific circuit 140 stops setting the voltage of the node ND. At this time, the voltage of the node ND may be 0V.

FIG. 1 B is a schematic diagram of another exemplary embodiment of the operating circuit according to various aspects of the present disclosure. FIG. 1 B is similar to FIG. 1 A except for the addition of a trigger circuit 120 B. The trigger circuit 120 B is coupled to a input-output pad PD_ 3 and the core circuit 110 and receives the system enable signal SYS_EN.

When the system enable signal SYS_EN is disabled, the trigger circuit 120 B disables the core circuit 110 so that the core circuit 110 stops setting the voltage of the input-output pad PD_ 1 . When the system enable signal SYS_EN is enabled, the trigger circuit 120 B stops disabling the core circuit 110 . Therefore, the core circuit 110 sets the voltage of the input-output pad PD_ 1 according to the voltage of the node ND. In one embodiment, when an ESD event occurs on the input-output pad PD_ 3 , the trigger circuit 120 B disables the core circuit 110 to avoid an ESD current from the input-output pad PD_ 3 from entering and damaging the core circuit 110 .

The uses of the input-output pads PD_ 1 and PD_ 3 are not limited in the present disclosure. In one embodiment, the input-output pad PD_ 1 or PD 3 is used as an output terminal to output a signal. In another embodiment, the input-output pad PD_ 1 or PD_ 3 is used as an input terminal to receive an operation voltage. The use of the input-output pad PD_ 1 may be the same as or different from the use of the input-output pad PD_ 3 . For example, the input-output pad PD_ 1 is used as an output terminal to output a signal, and the input-output pad PD_ 3 is used as an input terminal to receive a signal or power.

The number of trigger circuits is not limited in the present disclosure. In other embodiments, the operating circuit 100 B comprises more trigger circuits. Different trigger circuits are coupled to different input-output pads to avoid the ESD current from different input-output pads from entering the core circuit 110 . In this case, each trigger circuit receives the system enable signal SYS_EN.

In some embodiments, the core circuit 110 comprises a high side controller 111 and a driving transistor NDRV. The high side controller 111 is coupled between the input-output pad PD_ 3 and the driving transistor NDRV. In one embodiment, the high side controller 111 sets the voltage of the input-output pad PD_ 1 to equal to the voltage of the input-output pad PD_ 3 . In some embodiments, the input-output pad PD_ 3 receives an operation voltage VDDH. The operation voltage VDDH is higher than the operation voltage VSS.

The circuit structure of the high side controller 111 is not limited in the present disclosure. Any circuit can serve as the high side controller 111 , as long as the circuit is capable of setting the voltage of the input-output pad PD_ 1 into a high level. In this embodiment, the driving transistor NDRV is a low side controller to set the voltage of the input-output pad PD_ 1 into a low level.

FIG. 2 is a schematic diagram of an exemplary embodiment of a trigger circuit according to various aspects of the present disclosure. Since the structure of the trigger circuit 120 A is the same as the structure of the trigger circuit 120 B, FIG. 2 only shows the structure of the trigger circuit 120 A. As shown in FIG. 2 , the trigger circuit 120 A comprises an adjustment circuit 210 and a protection circuit 220 . The adjustment circuit 210 is coupled to the input-output pad PD_ 1 and adjusts the voltage of the input-output pad PD_ 1 to generate an output voltage SO. The protection circuit 220 is coupled between the adjustment circuit 210 and the core circuit 110 and receives the system enable signal SYS_EN.

In other embodiments, the trigger circuit 120 B shown in FIG. 1 B comprises another adjustment circuit (referred to as a second adjustment circuit) and another protection circuit (referred to as a second protection circuit). In this case, the second adjustment circuit is coupled to the input-output pad PD_ 3 and adjusts the voltage of the input-output pad PD_ 3 to generate another output voltage (referred to as a second output voltage). The second protection circuit is coupled between the second adjustment circuit and the core circuit 110 and receives the system enable signal SYS_EN.

Since the operation of the trigger circuit 120 B is the same as the operation of the trigger circuit 120 A, the trigger circuit 120 A is given as an example to describe the operation of the trigger circuit 120 A. When the system enable signal SYS_EN is disabled or an ESD event occurs on the input-output pad PD_ 1 , the protection circuit 220 sets the voltage of the node ND according to the output voltage SO to disable the core circuit 110 . When the system enable signal SYS_EN is enabled, the protection circuit 220 stops setting the voltage of the node ND to suspend the disabling of the core circuit 110 .

In one embodiment, the adjustment circuit 210 comprises transistors Q 1 -Q 3 . The gate of the transistor Q 1 is coupled to the drain of the transistor Q 1 . The source of the transistor Q 1 receives the operation voltage VSS. The gate of the transistor Q 2 is coupled to the gate of the transistor Q 1 . The drain of the transistor Q 2 is coupled to the input-output pad PD_ 1 . In one embodiment, the transistor Q 2 is a low-gate high-drain transistor. In this case, the drain of the transistor Q 2 is capable of accepting high voltage, such as more than 10V. Therefore, when an ESD event occurs on the input-output pad PD_ 1 , the transistor Q 2 does not be damaged by an ESD current. The gate of the transistor Q 3 is coupled to the source of the transistor Q 2 . The drain of the transistor Q 3 is coupled to the drain of the transistor Q 1 . The source of the transistor Q 3 receives an operation voltage VDDL (referred to as a second operation voltage). In some embodiments, the transistors Q 1 and Q 2 are N-type transistors, and the transistor Q 3 is a P-type transistor.

In other embodiments, the drain of the transistor Q 2 may be coupled to the input-output pad PD_ 3 . In this case, in an normal mode (the system enable signal SYS_EN is enabled), the voltage of the input-output pad PD_ 3 is higher than the operation voltage VDDL and the operation voltage VDDL is higher than the operation voltage VSS. For example, the voltage of the input-output pad PD_ 3 may be 12V, the operation voltage VDDL may be 6V, and the operation voltage VSS may be 0V.

The protection circuit 220 comprises transistors Q 4 -Q 6 . The gate of the transistor Q 4 receives the operation voltage VSS. The source of the transistor Q 4 is coupled to the source of the transistor Q 2 . The gate of the transistor Q 5 receives the system enable signal SYS_EN. The drain of the transistor Q 5 is coupled to the drain of the transistor Q 4 . The source of the transistor Q 5 receives the operation voltage VSS. The gate of the transistor Q 6 is coupled to the drain of the transistor Q 5 . The drain of the transistor Q 6 is coupled to the core circuit 110 . The source of the transistor Q 6 receives the operation voltage VSS. In some embodiments, the transistor Q 4 is a P-type transistor, and the transistors Q 5 and Q 6 are N-type transistors.

In other embodiments, the trigger circuit 120 A further comprises a level set circuit 230 . The level set circuit 230 provides a setting voltage PB to the bulks of the transistors Q 3 and Q 4 . In this case, since the setting voltage PB is equal to the source voltage of the transistor Q 3 , the parasitical diode (not shown) between the source and bulk of the transistor Q 3 is not turned on to avoid a leakage current from passing the transistor Q 3 . Additionally, the setting voltage PB is higher than the drain voltage of the transistor Q 3 . Therefore, the parasitical diode between the drain and bulk of the transistor Q 3 is also not turned on. In addition, since the setting voltage PB is higher than the source voltage and the drain voltage of the transistor Q 4 , the parasitical diode between the source and bulk of the transistor Q 4 and the parasitic diode between the drain and bulk of the transistor Q 4 are not turned on.

The structure of level set circuit 230 is not limited in the present disclosure. In one embodiment, the level set circuit 230 comprises transistors Q 7 and Q 8 . The gate of the transistor Q 7 is coupled to the drain of the transistor Q 1 . The drain of the transistor Q 7 is coupled to the bulks of the transistors Q 3 and Q 4 . The source of the transistor Q 7 receives the operation voltage VDDL. The gate of the transistor Q 8 receives the operation voltage VDDL. The drain of the transistor Q 8 is coupled to the bulks of the transistors Q 3 and Q 4 . The source of the transistor Q 8 is coupled to the gate of the transistor Q 7 . In some embodiments, the transistors Q 7 and Q 8 are P-type transistors.

FIG. 3 is a schematic diagram of an exemplary embodiment of the operation of the trigger circuit 120 A according to various aspects of the present disclosure. When the operating circuit 100 A is powered on, the input-output pad PD_ 3 receives the operation voltage VDDH, such as 12V. At this time, the operation voltage VDDL may be 6V. In periods ON_ 1 and ON_ 2 , the system enable signal SYS_EN is enabled. Therefore, the trigger circuit 120 A operates in a normal-on mode. In this embodiment, when the system enable signal SYS_EN is enabled, the voltage of the system enable signal SYS_EN is at a high level, such as 6V.

Refer to FIG. 2 . In the normal-on mode, since the system enable signal SYS_EN is enabled, the transistor Q 5 is turned on. Therefore, the voltage of the signal GC is close to the operation voltage VSS, such as 0V. Since the transistor Q 6 is turned off, the protection circuit 220 stops controlling the voltage of the node ND. At this time, the voltage of the node ND is controlled by a specific circuit (e.g., 140 ).

In the normal-on mode, since the transistor Q 1 is served as a pull-high element and the transistor Q 1 is a diode connection structure, the voltage of the signal NGC is approximately the sum of the operation voltage VSS and the threshold voltage of the transistor Q 1 . In one embodiment, the voltage level of the signal NGC is about 0.7V˜1V. Therefore, the transistor Q 2 is turned on slightly, and the output voltage SO is about 0.3V (the gate voltage 1V of the transistor Q 2 minus the threshold voltage 0.7V of the transistor Q 2 ). The transistor Q 3 is turned on so that the transistor Q 2 is turned on continuously. At this time, the output voltage SO may be increased to 2V. However, since the transistor Q 5 is turned on, the signal GC is approximately 0V so that the transistor Q 4 is not easily turned on. Therefore, the voltage level of the signal GC is maintained at 0V.

In periods OFF_ 1 and OFF_ 2 , the system enable signal SYS_EN is disabled. In one embodiment, when the system enable signal SYS_EN is disabled, the voltage level of the system enable signal SYS_EN may be a low level, such as 0V. Additionally, in periods OFF_ 1 and OFF_ 2 , the trigger circuit 120 A operates in a normal-off mode. In the normal-off mode, the system enable signal SYS_EN is disabled so that the transistor Q 5 is turned off.

Since the level of the signal NGC is about 0.7V˜1V, the transistor Q 2 is turned on slightly. Therefore, the output voltage SO is approximately 0.3V so that the transistor Q 3 is turned on and the transistor Q 2 is turned on continuously. In this case, the transistors Q 2 and Q 3 form a negative feedback circuit. The output voltage SO may be increased to 2V. Since the transistor Q 5 is turned off, the transistor Q 4 is turned on. The voltage of the signal GC is increased. In one embodiment, the voltage of the signal GC is approximately 4.45V. Since the voltage of the signal GC is higher than the threshold voltage of the transistor Q 6 , the transistor Q 6 is turned on so that the voltage of the node ND is approximately equal to the operation voltage VSS.

In one embodiment, the maximum value of the output voltage SO is about equal to the operation voltage VDDL minus the threshold voltage of the transistor Q 2 . In other embodiments, the voltage of the signal GC is related to the size of the transistor, such as the channel size. Therefore, by using different size transistors, the signal GC is at different voltage levels.

FIG. 4 is a schematic diagram of another exemplary embodiment of the operation of the trigger circuit 120 A according to various aspects of the present disclosure. when the operating circuit 100 A is not powered on, the operation voltage VDDL is at a floating level. The operation voltage VDDH of the input-output pad PD_ 3 is also at a floating level. In one embodiment, a circuit (not shown) generates the system enable signal SYS_EN according to the operation voltage VDDL. In this case, since the operation voltage VDDL is at a floating level, the circuit cannot generate the system enable signal SYS_EN. Therefore, the voltage level of the system enable signal SYS_EN may be 0V or a lower floating level. At this time, the transistor Q 5 is turned off.

At time point 400 , an ESD event occurs on the input-output pad PD_ 1 . Therefore, the trigger circuit 120 A enters a protection mode. Refer to FIG. 2 , the voltage level of the signal NGC is about 0.7V˜1V in the protection mode. Therefore, the transistor Q 2 is turned on marginally. At this time, the output voltage SO is about 0.3V so that the transistor Q 3 is turned on and the transistor Q 2 is still turned on. The output voltage SO may be increased to 2V. Since the transistor Q 5 is turned off, the transistor Q 4 is turned on. Therefore, the voltage level of the signal GC is increased. At this time, the voltage of the signal GC may be 2.48V. Sine the voltage level of the signal GC is higher than the threshold voltage of the transistor Q 6 , the transistor Q 6 is turned on. Therefore, the voltage level of the node ND is about equal to the operation voltage VSS.

Refer to FIG. 1 A . When the voltage level of the node ND is equal to the operation voltage VSS, the core circuit 110 is turned off. Therefore, the ESD current does not enter the core circuit 110 from the input-output pad PD_ 1 . In some embodiments, when an ESD event occurs in the input-output pad PD_ 1 or PD_ 3 , the gate voltage of the driving transistor NDRV of the core circuit 110 is equal to the operation voltage VSS. Therefore, the driving transistor NDRV is turned off. Since the ESD current does not pass through the driving transistor NDRV, the driving transistor NDRV is protected and safe. Additionally, when the ESD current is released, the voltage level of the signal GC is gradually reduced, such as from 2.48V to 1V.

In the normal-on mode and the normal-off mode, the operation voltage VDDL is approximately equal to 6V and the voltage level of the signal NGC is approximately equal to 0.7V˜1V. Therefore, the transistor Q 7 of the level set circuit 230 is turned on so that the setting voltage PB is approximately equal to the operation voltage VDDL. Since the bulk voltages of the transistors Q 3 and Q 4 are approximately equal to the operation voltage VDDL, the parasitical diodes of the transistors Q 3 and Q 4 are turned off to avoid the leakage current.

In other embodiments, when an ESD event occurs in the input-output pad PD_ 3 , the protection circuit (not shown) of the trigger circuit 120 B sets the voltage level of the node ND to a low level, such as 0V. Therefore, the driving transistor NDRV of the core circuit 110 is turned off so that an ESD current does not pass through the driving transistor NDRV.

It will be understood that when an element is referred to as being “on”, “connected to” or “coupled to” another element, it can be directly on, connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as be “directly on”, “directly connected to” or “directly coupled to” another element, there are no intervening elements present. Additionally, “enable” shall mean changing the state of a Boolean signal. Boolean signals may be enabled high or with a higher voltage, and Boolean signals may be enabled low or with a lower voltage, at the discretion of the circuit designer. Similarly, “disable” shall mean changing the state of the Boolean signal to the voltage level opposite the enabled state.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. It will be understood that although the terms “first,” “second,” etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. In the following claims, the terms “first,” “second,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.

While the invention has been described by way of example and in terms of the preferred embodiments, it should be understood that the invention is not limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.