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USPatent applicationPending

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

Pending · filed 7 Mar 2024 · 3 office actions

Assignee: none recorded yet

Application· this page
18/598,250
filed 7 Mar 2024
Publication
US 20240250067 A1
published 25 Jul 2024
Patent
Not granted yet
still under examination
Pending
Status
still under examination
20
Claims as published
3 independent
none
Litigation
checked

File wrapper

Examiner
Gustavo G. Ramallo
art unit 2812 · TC 2800

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