USPatent applicationPatented

Method for applying MSD and apparatus thereof

Granted 24 Oct 2023 · no office action yet

Assignee: LG Electronics

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Inventors: Jaehyuk Jang, Jinyup Hwang, Sangwook Lee, Suhwan Lim +2 · Examiner: Will W Lin · AU 2412 · TC 2400

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Abstract

A disclosure of this specification provides a device configured to operate in a wireless system, the device comprising: a transceiver configured with an Evolved Universal Terrestrial Radio Access (E-UTRA)—New Radio (NR) Dual Connectivity (EN-DC), wherein the EN-DC is configured to use three bands, a processor operably connectable to the transceiver, wherein the processer is configured to: control the transceiver to receive a downlink signal, control the transceiver to transmit an uplink signal via at least two bands among the three bands, wherein a value of Maximum Sensitivity Degradation (MSD) is applied to a reference sensitivity for receiving the downlink signal.

Description

16 parts
›CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patent application Ser. No. 17/709,919 filed on Mar. 31, 2022, which claims the benefit of Korean Patent Applications No. 10-2021-0042448 filed on Apr. 1, 2021, and No. 10-2021-0141184 filed on Oct. 21, 2021, the contents of which are all hereby incorporated by reference herein in their entirety.

BACKGROUND OF THE DISCLOSURE
›Field of the Disclosure

The present disclosure relates to mobile communication.

›Related Art

3rd generation partnership project (3GPP) long-term evolution (LTE) is a technology for enabling high-speed packet communications. Many schemes have been proposed for the LTE objective including those that aim to reduce user and provider costs, improve service quality, and expand and improve coverage and system capacity. The 3GPP LTE requires reduced cost per bit, increased service availability, flexible use of a frequency band, a simple structure, an open interface, and adequate power consumption of a terminal as an upper-level requirement.

Work has started in international telecommunication union (ITU) and 3GPP to develop requirements and specifications for new radio (NR) systems. 3GPP has to identify and develop the technology components needed for successfully standardizing the new RAT timely satisfying both the urgent market needs, and the more long-term requirements set forth by the ITU radio communication sector (ITU-R) international mobile telecommunications (IMT)-2020 process. Further, the NR should be able to use any spectrum band ranging at least up to 100 GHz that may be made available for wireless communications even in a more distant future.

The NR targets a single technical framework addressing all usage scenarios, requirements and deployment scenarios including enhanced mobile broadband (eMBB), massive machine-type-communications (mMTC), ultra-reliable and low latency communications (URLLC), etc. The NR shall be inherently forward compatible.

A mobile device should be configured to satisfy a reference sensitivity power level (REFSENS) which is the minimum average power for each antenna port of the mobile device when receiving the downlink signal.

When a harmonics component and/or an intermodulation distortion (IMD) component occurs, there is a possibility that the REFSENS for the downlink signal may not be satisfied due to the uplink signal transmitted by the mobile device.

›SUMMARY OF THE DISCLOSURE

In accordance with an embodiment of the present disclosure, a disclosure of this specification provides a device configured to operate in a wireless system, the device comprising: a transceiver configured with an Evolved Universal Terrestrial Radio Access (E-UTRA)—New Radio (NR) Dual Connectivity (EN-DC), wherein the EN-DC is configured to use three bands, a processor operably connectable to the transceiver, wherein the processer is configured to: control the transceiver to receive a downlink signal, control the transceiver to transmit an uplink signal via at least two bands among the three bands, wherein a value of Maximum Sensitivity Degradation (MSD) is applied to a reference sensitivity for receiving the downlink signal, wherein the value of the MSD is pre-configured for a first combination of bands 30, n5 and n77, a second combination of band 8, n28 and n79, a third combination of bands 7, n12 and n77, a fourth combination of bands 7, n71 and n77, a fifth combination of bands 5, n2 and n41, a sixth combination of bands 3, n28 and n75.

The present disclosure can have various advantageous effects.

For example, by performing disclosure of this specification, UE can transmit signal with dual uplink by applying MSD value.

Advantageous effects which can be obtained through specific embodiments of the present disclosure are not limited to the advantageous effects listed above. For example, there may be a variety of technical effects that a person having ordinary skill in the related art can understand and/or derive from the present disclosure. Accordingly, the specific effects of the present disclosure are not limited to those explicitly described herein, but may include various effects that may be understood or derived from the technical features of the present disclosure.

›BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an example of a communication system to which implementations of the present disclosure is applied.

FIG. 2 shows an example of wireless devices to which implementations of the present disclosure is applied.

FIG. 3 shows an example of a wireless device to which implementations of the present disclosure is applied.

FIG. 4 shows an example of UE to which implementations of the present disclosure is applied.

FIG. 5 a illustrates a concept view of an example of intra-band contiguous CA. FIG. 5 b illustrates a concept view of an example of intra-band non-contiguous CA.

FIG. 6 a illustrates a concept view of an example of a combination of a lower frequency band and a higher frequency band for inter-band CA. FIG. 6 b illustrates a concept view of an example of a combination of similar frequency bands for inter-band CA.

FIGS. 7 a to 7 c are exemplary diagrams illustrating exemplary architectures for services of the next generation mobile communication.

FIG. 8 illustrates an example of situation in which uplink signal transmitted via an uplink operating bands affects reception of a downlink signal via downlink operating bands.

FIG. 9 and FIG. 10 illustrate exemplary IMD by a combination of band 8, n28 and n79.

FIG. 11 illustrates exemplary IMD by a combination of band n3, n77 and n79.

FIG. 12 is a flow chart showing an example of a procedure of a terminal according to the present disclosure.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 1 of 10

The following techniques, apparatuses, and systems may be applied to a variety of wireless multiple access systems. Examples of the multiple access systems include a code division multiple access (CDMA) system, a frequency division multiple access (FDMA) system, a time division multiple access (TDMA) system, an orthogonal frequency division multiple access (OFDMA) system, a single carrier frequency division multiple access (SC-FDMA) system, and a multicarrier frequency division multiple access (MC-FDMA) system. CDMA may be embodied through radio technology such as universal terrestrial radio access (UTRA) or CDMA2000. TDMA may be embodied through radio technology such as global system for mobile communications (GSM), general packet radio service (GPRS), or enhanced data rates for GSM evolution (EDGE). OFDMA may be embodied through radio technology such as institute of electrical and electronics engineers (IEEE) 802.11 (Wi-Fi), IEEE 802.16 (WiMAX), IEEE 802.20, or evolved UTRA (E-UTRA). UTRA is a part of a universal mobile telecommunications system (UMTS). 3rd generation partnership project (3GPP) long term evolution (LTE) is a part of evolved UMTS (E-UMTS) using E-UTRA. 3GPP LTE employs OFDMA in DL and SC-FDMA in UL. Evolution of 3GPP LTE includes LTE-A (advanced), LTE-A Pro, and/or 5G NR (new radio).

For convenience of description, implementations of the present disclosure are mainly described in regards to a 3GPP based wireless communication system. However, the technical features of the present disclosure are not limited thereto. For example, although the following detailed description is given based on a mobile communication system corresponding to a 3GPP based wireless communication system, aspects of the present disclosure that are not limited to 3GPP based wireless communication system are applicable to other mobile communication systems.

For terms and technologies which are not specifically described among the terms of and technologies employed in the present disclosure, the wireless communication standard documents published before the present disclosure may be referenced.

In the present disclosure, “A or B” may mean “only A”, “only B”, or “both A and B”. In other words, “A or B” in the present disclosure may be interpreted as “A and/or B”. For example, “A, B or C” in the present disclosure may mean “only A”, “only B”, “only C”, or “any combination of A, B and C”.

In the present disclosure, slash (/) or comma (,) may mean “and/or”. For example, “A/B” may mean “A and/or B”. Accordingly, “A/B” may mean “only A”, “only B”, or “both A and B”. For example, “A, B, C” may mean “A, B or C”.

In the present disclosure, “at least one of A and B” may mean “only A”, “only B” or “both A and B”. In addition, the expression “at least one of A or B” or “at least one of A and/or B” in the present disclosure may be interpreted as same as “at least one of A and B”.

In addition, in the present disclosure, “at least one of A, B and C” may mean “only A”, “only B”, “only C”, or “any combination of A, B and C”. In addition, “at least one of A, B or C” or “at least one of A, B and/or C” may mean “at least one of A, B and C”.

Also, parentheses used in the present disclosure may mean “for example”. In detail, when it is shown as “control information (PDCCH)”, “PDCCH” may be proposed as an example of “control information”. In other words, “control information” in the present disclosure is not limited to “PDCCH”, and “PDDCH” may be proposed as an example of “control information”. In addition, even when shown as “control information (i.e., PDCCH)”, “PDCCH” may be proposed as an example of “control information”.

Technical features that are separately described in one drawing in the present disclosure may be implemented separately or simultaneously.

Although not limited thereto, various descriptions, functions, procedures, suggestions, methods and/or operational flowcharts of the present disclosure disclosed herein can be applied to various fields requiring wireless communication and/or connection (e.g., 5G) between devices.

Hereinafter, the present disclosure will be described in more detail with reference to drawings. The same reference numerals in the following drawings and/or descriptions may refer to the same and/or corresponding hardware blocks, software blocks, and/or functional blocks unless otherwise indicated.

FIG. 1 shows an example of a communication system to which implementations of the present disclosure is applied.

The 5G usage scenarios shown in FIG. 1 are only exemplary, and the technical features of the present disclosure can be applied to other 5G usage scenarios which are not shown in FIG. 1 .

Three main requirement categories for 5G include (1) a category of enhanced mobile broadband (eMBB), (2) a category of massive machine type communication (mMTC), and (3) a category of ultra-reliable and low latency communications (URLLC).

Referring to FIG. 1 , the communication system 1 includes wireless devices 100 a to 100 f , base stations (BSs) 200 , and a network 300 . Although FIG. 1 illustrates a 5G network as an example of the network of the communication system 1 , the implementations of the present disclosure are not limited to the 5G system, and can be applied to the future communication system beyond the 5G system.

The BSs 200 and the network 300 may be implemented as wireless devices and a specific wireless device may operate as a BS/network node with respect to other wireless devices.

The wireless devices 100 a to 100 f represent devices performing communication using radio access technology (RAT) (e.g., 5G new RAT (NR)) or LTE) and may be referred to as communication/radio/5G devices. The wireless devices 100 a to 100 f may include, without being limited to, a robot 100 a , vehicles 100 b - 1 and 100 b - 2 , an extended reality (XR) device 100 c , a hand-held device 100 d , a home appliance 100 e , an IoT device 100 f , and an artificial intelligence (AI) device/server 400 . For example, the vehicles may include a vehicle having a wireless communication function, an autonomous driving vehicle, and a vehicle capable of performing communication between vehicles. The vehicles may include an unmanned aerial vehicle (UAV) (e.g., a drone). The XR device may include an AR/VR/Mixed Reality (MR) device and may be implemented in the form of a head-mounted device (HMD), a head-up display (HUD) mounted in a vehicle, a television, a smartphone, a computer, a wearable device, a home appliance device, a digital signage, a vehicle, a robot, etc. The hand-held device may include a smartphone, a smartpad, a wearable device (e.g., a smartwatch or a smartglasses), and a computer (e.g., a notebook). The home appliance may include a TV, a refrigerator, and a washing machine. The IoT device may include a sensor and a smartmeter.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 2 of 10

In the present disclosure, the wireless devices 100 a to 100 f may be called user equipments (UEs). A UE may include, for example, a cellular phone, a smartphone, a laptop computer, a digital broadcast terminal, a personal digital assistant (PDA), a portable multimedia player (PMP), a navigation system, a slate personal computer (PC), a tablet PC, an ultrabook, a vehicle, a vehicle having an autonomous traveling function, a connected car, an UAV, an AI module, a robot, an AR device, a VR device, an MR device, a hologram device, a public safety device, an MTC device, an IoT device, a medical device, a FinTech device (or a financial device), a security device, a weather/environment device, a device related to a 5G service, or a device related to a fourth industrial revolution field.

The wireless devices 100 a to 100 f may be connected to the network 300 via the BSs 200 . An AI technology may be applied to the wireless devices 100 a to 100 f and the wireless devices 100 a to 100 f may be connected to the AI server 400 via the network 300 . The network 300 may be configured using a 3G network, a 4G (e.g., LTE) network, a 5G (e.g., NR) network, and a beyond-5G network. Although the wireless devices 100 a to 100 f may communicate with each other through the BSs 200 /network 300 , the wireless devices 100 a to 100 f may perform direct communication (e.g., sidelink communication) with each other without passing through the BSs 200 /network 300 . For example, the vehicles 100 b - 1 and 100 b - 2 may perform direct communication (e.g., vehicle-to-vehicle (V2V)/vehicle-to-everything (V2X) communication). The IoT device (e.g., a sensor) may perform direct communication with other IoT devices (e.g., sensors) or other wireless devices 100 a to 100 f.

Wireless communication/connections 150 a , 150 b and 150 c may be established between the wireless devices 100 a to 100 f and/or between wireless device 100 a to 100 f and BS 200 and/or between BSs 200 . Herein, the wireless communication/connections may be established through various RATs (e.g., 5G NR) such as uplink/downlink communication 150 a , sidelink communication (or device-to-device (D2D) communication) 150 b , inter-base station communication 150 c (e.g., relay, integrated access and backhaul (IAB)), etc. The wireless devices 100 a to 100 f and the BSs 200 /the wireless devices 100 a to 100 f may transmit/receive radio signals to/from each other through the wireless communication/connections 150 a , 150 b and 150 c . For example, the wireless communication/connections 150 a , 150 b and 150 c may transmit/receive signals through various physical channels. To this end, at least a part of various configuration information configuring processes, various signal processing processes (e.g., channel encoding/decoding, modulation/demodulation, and resource mapping/de-mapping), and resource allocating processes, for transmitting/receiving radio signals, may be performed based on the various proposals of the present disclosure.

AI refers to the field of studying artificial intelligence or the methodology that can create it, and machine learning refers to the field of defining various problems addressed in the field of AI and the field of methodology to solve them. Machine learning is also defined as an algorithm that increases the performance of a task through steady experience on a task.

Robot means a machine that automatically processes or operates a given task by its own ability. In particular, robots with the ability to recognize the environment and make self-determination to perform actions can be called intelligent robots. Robots can be classified as industrial, medical, home, military, etc., depending on the purpose or area of use. The robot can perform a variety of physical operations, such as moving the robot joints with actuators or motors. The movable robot also includes wheels, brakes, propellers, etc., on the drive, allowing it to drive on the ground or fly in the air.

Autonomous driving means a technology that drives on its own, and autonomous vehicles mean vehicles that drive without user's control or with minimal user's control. For example, autonomous driving may include maintaining lanes in motion, automatically adjusting speed such as adaptive cruise control, automatic driving along a set route, and automatically setting a route when a destination is set. The vehicle covers vehicles equipped with internal combustion engines, hybrid vehicles equipped with internal combustion engines and electric motors, and electric vehicles equipped with electric motors, and may include trains, motorcycles, etc., as well as cars. Autonomous vehicles can be seen as robots with autonomous driving functions.

Extended reality is collectively referred to as VR, AR, and MR. VR technology provides objects and backgrounds of real world only through computer graphic (CG) images. AR technology provides a virtual CG image on top of a real object image. MR technology is a CG technology that combines and combines virtual objects into the real world. MR technology is similar to AR technology in that they show real and virtual objects together. However, there is a difference in that in AR technology, virtual objects are used as complementary forms to real objects, while in MR technology, virtual objects and real objects are used as equal personalities.

NR supports multiples numerologies (and/or multiple subcarrier spacings (SCS)) to support various 5G services. For example, if SCS is 15 kHz, wide area can be supported in traditional cellular bands, and if SCS is 30 kHz/60 kHz, dense-urban, lower latency, and wider carrier bandwidth can be supported. If SCS is 60 kHz or higher, bandwidths greater than 24.25 GHz can be supported to overcome phase noise.

The NR frequency band may be defined as two types of frequency range, i.e., FR1 and FR2. The numerical value of the frequency range may be changed. For example, the frequency ranges of the two types (FR1 and FR2) may be as shown in Table 1 below. For ease of explanation, in the frequency ranges used in the NR system, FR1 may mean “sub 6 GHz range”, FR2 may mean “above 6 GHz range,” and may be referred to as millimeter wave (mmW).

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 3 of 10

As mentioned above, the numerical value of the frequency range of the NR system may be changed. For example, FR1 may include a frequency band of 410 MHz to 7125 MHz as shown in Table 2 below. That is, FR1 may include a frequency band of 6 GHz (or 5850, 5900, 5925 MHz, etc.) or more. For example, a frequency band of 6 GHz (or 5850, 5900, 5925 MHz, etc.) or more included in FR1 may include an unlicensed band. Unlicensed bands may be used for a variety of purposes, for example for communication for vehicles (e.g., autonomous driving).

Here, the radio communication technologies implemented in the wireless devices in the present disclosure may include narrowband internet-of-things (NB-IoT) technology for low-power communication as well as LTE, NR and 6G. For example, NB-IoT technology may be an example of low power wide area network (LPWAN) technology, may be implemented in specifications such as LTE Cat NB1 and/or LTE Cat NB2, and may not be limited to the above-mentioned names. Additionally and/or alternatively, the radio communication technologies implemented in the wireless devices in the present disclosure may communicate based on LTE-M technology. For example, LTE-M technology may be an example of LPWAN technology and be called by various names such as enhanced machine type communication (eMTC). For example, LTE-M technology may be implemented in at least one of the various specifications, such as 1) LTE Cat 0, 2) LTE Cat M1, 3) LTE Cat M2, 4) LTE non-bandwidth limited (non-BL), 5) LTE-MTC, 6) LTE Machine Type Communication, and/or 7) LTE M, and may not be limited to the above-mentioned names. Additionally and/or alternatively, the radio communication technologies implemented in the wireless devices in the present disclosure may include at least one of ZigBee, Bluetooth, and/or LPWAN which take into account low-power communication, and may not be limited to the above-mentioned names. For example, ZigBee technology may generate personal area networks (PANs) associated with small/low-power digital communication based on various specifications such as IEEE 802.15.4 and may be called various names.

FIG. 2 shows an example of wireless devices to which implementations of the present disclosure is applied.

Referring to FIG. 2 , a first wireless device 100 and a second wireless device 200 may transmit/receive radio signals to/from an external device through a variety of RATs (e.g., LTE and NR).

In FIG. 2 , {the first wireless device 100 and the second wireless device 200 } may correspond to at least one of {the wireless device 100 a to 100 f and the BS 200 }, {the wireless device 100 a to 100 f and the wireless device 100 a to 100 f } and/or {the BS 200 and the BS 200 } of FIG. 1 .

The first wireless device 100 may include at least one transceiver, such as a transceiver 106 , at least one processing chip, such as a processing chip 101 , and/or one or more antennas 108 .

The processing chip 101 may include at least one processor, such a processor 102 , and at least one memory, such as a memory 104 . It is exemplarily shown in FIG. 2 that the memory 104 is included in the processing chip 101 . Additional and/or alternatively, the memory 104 may be placed outside of the processing chip 101 .

The processor 102 may control the memory 104 and/or the transceiver 106 and may be configured to implement the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts described in the present disclosure. For example, the processor 102 may process information within the memory 104 to generate first information/signals and then transmit radio signals including the first information/signals through the transceiver 106 . The processor 102 may receive radio signals including second information/signals through the transceiver 106 and then store information obtained by processing the second information/signals in the memory 104 .

The memory 104 may be operably connectable to the processor 102 . The memory 104 may store various types of information and/or instructions. The memory 104 may store a software code 105 which implements instructions that, when executed by the processor 102 , perform the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. For example, the software code 105 may implement instructions that, when executed by the processor 102 , perform the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. For example, the software code 105 may control the processor 102 to perform one or more protocols. For example, the software code 105 may control the processor 102 to perform one or more layers of the radio interface protocol.

Herein, the processor 102 and the memory 104 may be a part of a communication modem/circuit/chip designed to implement RAT (e.g., LTE or NR). The transceiver 106 may be connected to the processor 102 and transmit and/or receive radio signals through one or more antennas 108 . Each of the transceiver 106 may include a transmitter and/or a receiver. The transceiver 106 may be interchangeably used with radio frequency (RF) unit(s). In the present disclosure, the first wireless device 100 may represent a communication modem/circuit/chip.

The second wireless device 200 may include at least one transceiver, such as a transceiver 206 , at least one processing chip, such as a processing chip 201 , and/or one or more antennas 208 .

The processing chip 201 may include at least one processor, such a processor 202 , and at least one memory, such as a memory 204 . It is exemplarily shown in FIG. 2 that the memory 204 is included in the processing chip 201 . Additional and/or alternatively, the memory 204 may be placed outside of the processing chip 201 .

The processor 202 may control the memory 204 and/or the transceiver 206 and may be configured to implement the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts described in the present disclosure. For example, the processor 202 may process information within the memory 204 to generate third information/signals and then transmit radio signals including the third information/signals through the transceiver 206 . The processor 202 may receive radio signals including fourth information/signals through the transceiver 106 and then store information obtained by processing the fourth information/signals in the memory 204 .

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 4 of 10

The memory 204 may be operably connectable to the processor 202 . The memory 204 may store various types of information and/or instructions. The memory 204 may store a software code 205 which implements instructions that, when executed by the processor 202 , perform the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. For example, the software code 205 may implement instructions that, when executed by the processor 202 , perform the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. For example, the software code 205 may control the processor 202 to perform one or more protocols. For example, the software code 205 may control the processor 202 to perform one or more layers of the radio interface protocol.

Herein, the processor 202 and the memory 204 may be a part of a communication modem/circuit/chip designed to implement RAT (e.g., LTE or NR). The transceiver 206 may be connected to the processor 202 and transmit and/or receive radio signals through one or more antennas 208 . Each of the transceiver 206 may include a transmitter and/or a receiver. The transceiver 206 may be interchangeably used with RF unit. In the present disclosure, the second wireless device 200 may represent a communication modem/circuit/chip.

Hereinafter, hardware elements of the wireless devices 100 and 200 will be described more specifically. One or more protocol layers may be implemented by, without being limited to, one or more processors 102 and 202 . For example, the one or more processors 102 and 202 may implement one or more layers (e.g., functional layers such as physical (PHY) layer, media access control (MAC) layer, radio link control (RLC) layer, packet data convergence protocol (PDCP) layer, radio resource control (RRC) layer, and service data adaptation protocol (SDAP) layer). The one or more processors 102 and 202 may generate one or more protocol data units (PDUs) and/or one or more service data unit (SDUs) according to the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. The one or more processors 102 and 202 may generate messages, control information, data, or information according to the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. The one or more processors 102 and 202 may generate signals (e.g., baseband signals) including PDUs, SDUs, messages, control information, data, or information according to the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure and provide the generated signals to the one or more transceivers 106 and 206 . The one or more processors 102 and 202 may receive the signals (e.g., baseband signals) from the one or more transceivers 106 and 206 and acquire the PDUs, SDUs, messages, control information, data, or information according to the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure.

The one or more processors 102 and 202 may be referred to as controllers, microcontrollers, microprocessors, or microcomputers. The one or more processors 102 and 202 may be implemented by hardware, firmware, software, or a combination thereof. As an example, one or more application specific integrated circuits (ASICs), one or more digital signal processors (DSPs), one or more digital signal processing devices (DSPDs), one or more programmable logic devices (PLDs), or one or more field programmable gate arrays (FPGAs) may be included in the one or more processors 102 and 202 . The descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure may be implemented using firmware or software and the firmware or software may be configured to include the modules, procedures, or functions. Firmware or software configured to perform the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure may be included in the one or more processors 102 and 202 or stored in the one or more memories 104 and 204 so as to be driven by the one or more processors 102 and 202 . The descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure may be implemented using firmware or software in the form of code, commands, and/or a set of commands

The one or more memories 104 and 204 may be connected to the one or more processors 102 and 202 and store various types of data, signals, messages, information, programs, code, instructions, and/or commands. The one or more memories 104 and 204 may be configured by read-only memories (ROMs), random access memories (RAMs), electrically erasable programmable read-only memories (EPROMs), flash memories, hard drives, registers, cash memories, computer-readable storage media, and/or combinations thereof. The one or more memories 104 and 204 may be located at the interior and/or exterior of the one or more processors 102 and 202 . The one or more memories 104 and 204 may be connected to the one or more processors 102 and 202 through various technologies such as wired or wireless connection.

The one or more transceivers 106 and 206 may transmit user data, control information, and/or radio signals/channels, mentioned in the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure, to one or more other devices. The one or more transceivers 106 and 206 may receive user data, control information, and/or radio signals/channels, mentioned in the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure, from one or more other devices. For example, the one or more transceivers 106 and 206 may be connected to the one or more processors 102 and 202 and transmit and receive radio signals. For example, the one or more processors 102 and 202 may perform control so that the one or more transceivers 106 and 206 may transmit user data, control information, or radio signals to one or more other devices. The one or more processors 102 and 202 may perform control so that the one or more transceivers 106 and 206 may receive user data, control information, or radio signals from one or more other devices.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 5 of 10

The one or more transceivers 106 and 206 may be connected to the one or more antennas 108 and 208 and the one or more transceivers 106 and 206 may be configured to transmit and receive user data, control information, and/or radio signals/channels, mentioned in the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure, through the one or more antennas 108 and 208 . In the present disclosure, the one or more antennas 108 and 208 may be a plurality of physical antennas or a plurality of logical antennas (e.g., antenna ports).

The one or more transceivers 106 and 206 may convert received user data, control information, radio signals/channels, etc., from RF band signals into baseband signals in order to process received user data, control information, radio signals/channels, etc., using the one or more processors 102 and 202 . The one or more transceivers 106 and 206 may convert the user data, control information, radio signals/channels, etc., processed using the one or more processors 102 and 202 from the base band signals into the RF band signals. To this end, the one or more transceivers 106 and 206 may include (analog) oscillators and/or filters. For example, the one or more transceivers 106 and 206 can up-convert OFDM baseband signals to OFDM signals by their (analog) oscillators and/or filters under the control of the one or more processors 102 and 202 and transmit the up-converted OFDM signals at the carrier frequency. The one or more transceivers 106 and 206 may receive OFDM signals at a carrier frequency and down-convert the OFDM signals into OFDM baseband signals by their (analog) oscillators and/or filters under the control of the one or more processors 102 and 202 .

In the implementations of the present disclosure, a UE may operate as a transmitting device in uplink (UL) and as a receiving device in downlink (DL). In the implementations of the present disclosure, a BS may operate as a receiving device in UL and as a transmitting device in DL. Hereinafter, for convenience of description, it is mainly assumed that the first wireless device 100 acts as the UE, and the second wireless device 200 acts as the BS. For example, the processor(s) 102 connected to, mounted on or launched in the first wireless device 100 may be configured to perform the UE behavior according to an implementation of the present disclosure or control the transceiver(s) 106 to perform the UE behavior according to an implementation of the present disclosure. The processor(s) 202 connected to, mounted on or launched in the second wireless device 200 may be configured to perform the BS behavior according to an implementation of the present disclosure or control the transceiver(s) 206 to perform the BS behavior according to an implementation of the present disclosure.

In the present disclosure, a BS is also referred to as a node B (NB), an eNode B (eNB), or a gNB.

FIG. 3 shows an example of a wireless device to which implementations of the present disclosure is applied.

The wireless device may be implemented in various forms according to a use-case/service (refer to FIG. 1 ).

Referring to FIG. 3 , wireless devices 100 and 200 may correspond to the wireless devices 100 and 200 of FIG. 2 and may be configured by various elements, components, units/portions, and/or modules. For example, each of the wireless devices 100 and 200 may include a communication unit 110 , a control unit 120 , a memory unit 130 , and additional components 140 . The communication unit 110 may include a communication circuit 112 and transceiver(s) 114 . For example, the communication circuit 112 may include the one or more processors 102 and 202 of FIG. 2 and/or the one or more memories 104 and 204 of FIG. 2 . For example, the transceiver(s) 114 may include the one or more transceivers 106 and 206 of FIG. 2 and/or the one or more antennas 108 and 208 of FIG. 2 . The control unit 120 is electrically connected to the communication unit 110 , the memory unit 130 , and the additional components 140 and controls overall operation of each of the wireless devices 100 and 200 . For example, the control unit 120 may control an electric/mechanical operation of each of the wireless devices 100 and 200 based on programs/code/commands/information stored in the memory unit 130 . The control unit 120 may transmit the information stored in the memory unit 130 to the exterior (e.g., other communication devices) via the communication unit 110 through a wireless/wired interface or store, in the memory unit 130 , information received through the wireless/wired interface from the exterior (e.g., other communication devices) via the communication unit 110 .

The additional components 140 may be variously configured according to types of the wireless devices 100 and 200 . For example, the additional components 140 may include at least one of a power unit/battery, input/output (I/O) unit (e.g., audio I/O port, video I/O port), a driving unit, and a computing unit. The wireless devices 100 and 200 may be implemented in the form of, without being limited to, the robot ( 100 a of FIG. 1 ), the vehicles ( 100 b - 1 and 100 b - 2 of FIG. 1 ), the XR device ( 100 c of FIG. 1 ), the hand-held device ( 100 d of FIG. 1 ), the home appliance ( 100 e of FIG. 1 ), the IoT device ( 100 f of FIG. 1 ), a digital broadcast terminal, a hologram device, a public safety device, an MTC device, a medicine device, a FinTech device (or a finance device), a security device, a climate/environment device, the AI server/device ( 400 of FIG. 1 ), the BSs ( 200 of FIG. 1 ), a network node, etc. The wireless devices 100 and 200 may be used in a mobile or fixed place according to a use-example/service.

In FIG. 3 , the entirety of the various elements, components, units/portions, and/or modules in the wireless devices 100 and 200 may be connected to each other through a wired interface or at least a part thereof may be wirelessly connected through the communication unit 110 . For example, in each of the wireless devices 100 and 200 , the control unit 120 and the communication unit 110 may be connected by wire and the control unit 120 and first units (e.g., 130 and 140 ) may be wirelessly connected through the communication unit 110 . Each element, component, unit/portion, and/or module within the wireless devices 100 and 200 may further include one or more elements. For example, the control unit 120 may be configured by a set of one or more processors. As an example, the control unit 120 may be configured by a set of a communication control processor, an application processor (AP), an electronic control unit (ECU), a graphical processing unit, and a memory control processor. As another example, the memory unit 130 may be configured by a RAM, a DRAM, a ROM, a flash memory, a volatile memory, a non-volatile memory, and/or a combination thereof.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 6 of 10

FIG. 4 shows an example of UE to which implementations of the present disclosure is applied.

Referring to FIG. 4 , a UE 100 may correspond to the first wireless device 100 of FIG. 2 and/or the wireless device 100 or 200 of FIG. 3 .

A UE 100 includes a processor 102 , a memory 104 , a transceiver 106 , one or more antennas 108 , a power management module 110 , a battery 112 , a display 114 , a keypad 116 , a subscriber identification module (SIM) card 118 , a speaker 120 , and a microphone 122 .

The processor 102 may be configured to implement the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. The processor 102 may be configured to control one or more other components of the UE 100 to implement the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. Layers of the radio interface protocol may be implemented in the processor 102 . The processor 102 may include ASIC, other chipset, logic circuit and/or data processing device. The processor 102 may be an application processor. The processor 102 may include at least one of a digital signal processor (DSP), a central processing unit (CPU), a graphics processing unit (GPU), a modem (modulator and demodulator). An example of the processor 102 may be found in SNAPDRAGON™ series of processors made by Qualcomm®, EXYNOS™ series of processors made by Samsung®, A series of processors made by Apple®, HELIO™ series of processors made by MediaTek®, ATOM™ series of processors made by Intel® or a corresponding next generation processor.

The memory 104 is operatively coupled with the processor 102 and stores a variety of information to operate the processor 102 . The memory 104 may include ROM, RAM, flash memory, memory card, storage medium and/or other storage device. When the embodiments are implemented in software, the techniques described herein can be implemented with modules (e.g., procedures, functions, etc.) that perform the descriptions, functions, procedures, suggestions, methods and/or operational flowcharts disclosed in the present disclosure. The modules can be stored in the memory 104 and executed by the processor 102 . The memory 104 can be implemented within the processor 102 or external to the processor 102 in which case those can be communicatively coupled to the processor 102 via various means as is known in the art.

The transceiver 106 is operatively coupled with the processor 102 , and transmits and/or receives a radio signal. The transceiver 106 includes a transmitter and a receiver. The transceiver 106 may include baseband circuitry to process radio frequency signals. The transceiver 106 controls the one or more antennas 108 to transmit and/or receive a radio signal.

The power management module 110 manages power for the processor 102 and/or the transceiver 106 . The battery 112 supplies power to the power management module 110 .

The display 114 outputs results processed by the processor 102 . The keypad 116 receives inputs to be used by the processor 102 . The keypad 116 may be shown on the display 114 .

The SIM card 118 is an integrated circuit that is intended to securely store the international mobile subscriber identity (IMSI) number and its related key, which are used to identify and authenticate subscribers on mobile telephony devices (such as mobile phones and computers). It is also possible to store contact information on many SIM cards.

The speaker 120 outputs sound-related results processed by the processor 102 . The microphone 122 receives sound-related inputs to be used by the processor 102 .

<Operating Band>

The LTE/LTE-A based cell operates in an Evolved Universal Terrestrial Radio Access (E-UTRA) operating band. And, the NR-based cell operates in a NR band. Here, the DC may be called as EN-DC.

The Table 3 is an example of E-UTRA operating bands.

An operating band in NR is as follows.

Table 4 shows examples of operating bands on FR1. Operating bands shown in Table 4 is a reframing operating band that is transitioned from an operating band of LTE/LTE-A. This operating band may be referred to as FR1 operating band.

Table 5 shows examples of operating bands on FR2. The following table shows operating bands defined on a high frequency. This operating band is referred to as FR2 operating band.

<Maximum Output Power>

Power class 1, 2, 3, and 4 are specified based on UE types as follows:

<Carrier Aggregation>

A carrier aggregation system is now described.

A carrier aggregation system aggregates a plurality of component carriers (CCs). A meaning of an existing cell is changed according to the above carrier aggregation. According to the carrier aggregation, a cell may signify a combination of a downlink component carrier and an uplink component carrier or an independent downlink component carrier.

Further, the cell in the carrier aggregation may be classified into a primary cell, a secondary cell, and a serving cell. The primary cell signifies a cell operated in a primary frequency. The primary cell signifies a cell which UE performs an initial connection establishment procedure or a connection reestablishment procedure or a cell indicated as a primary cell in a handover procedure. The secondary cell signifies a cell operating in a secondary frequency. Once the RRC connection is established, the secondary cell is used to provide an additional radio resource.

As described above, the carrier aggregation system may support a plurality of component carriers (CCs), that is, a plurality of serving cells unlike a single carrier system.

The carrier aggregation system may support a cross-carrier scheduling. The cross-carrier scheduling is a scheduling method capable of performing resource allocation of a PDSCH transmitted through other component carrier through a PDCCH transmitted through a specific component carrier and/or resource allocation of a PUSCH transmitted through other component carrier different from a component carrier basically linked with the specific component carrier.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 7 of 10

Carrier aggregation can also be classified into inter-band CA and intra-band CA. The inter-band CA is a method of aggregating and using each CC existing in different operating bands, and the intra-band CA is a method of aggregating and using each CC in the same operating band. In addition, the CA technology is more specifically, intra-band contiguous CA, intra-band non-contiguous CA and inter-band discontinuity. Non-Contiguous) CA.

FIG. 5 a illustrates a concept view of an example of intra-band contiguous CA. FIG. 5 b illustrates a concept view of an example of intra-band non-contiguous CA.

The CA may be split into the intra-band contiguous CA shown in FIG. 5 a and the intra-band non-contiguous CA shown in FIG. 5 b.

FIG. 6 a illustrates a concept view of an example of a combination of a lower frequency band and a higher frequency band for inter-band CA. FIG. 6 b illustrates a concept view of an example of a combination of similar frequency bands for inter-band CA.

The inter-band carrier aggregation may be separated into inter-band CA between carriers of a low band and a high band having different RF characteristics of inter-band CA as shown in FIG. 6 a and inter-band CA of similar frequencies that may use a common RF terminal per component carrier due to similar RF (radio frequency) characteristics as shown in FIG. 6 b.

For inter-band carrier aggregation, a carrier aggregation configuration is a combination of operating bands, each supporting a carrier aggregation bandwidth class.

<Introduction of Dual Connectivity (DC)>

Recently, a scheme for simultaneously connecting UE to different base stations, for example, a macro cell base station and a small cell base station, is being studied. This is called dual connectivity (DC).

In DC, the eNodeB for the primary cell (Pcell) may be referred to as a master eNodeB (hereinafter referred to as MeNB). In addition, the eNodeB only for the secondary cell (Scell) may be referred to as a secondary eNodeB (hereinafter referred to as SeNB).

A cell group including a primary cell (Pcell) implemented by MeNB may be referred to as a master cell group (MCG) or PUCCH cell group 1 . A cell group including a secondary cell (Scell) implemented by the SeNB may be referred to as a secondary cell group (SCG) or PUCCH cell group 2 .

Meanwhile, among the secondary cells in the secondary cell group (SCG), a secondary cell in which the UE can transmit Uplink Control Information (UCI), or the secondary cell in which the UE can transmit a PUCCH may be referred to as a super secondary cell (Super SCell) or a primary secondary cell (Primary Scell; PScell).

FIGS. 7 a to 7 c are exemplary diagrams illustrating exemplary architectures for services of the next generation mobile communication.

Referring to FIG. 7 a , the UE is connected to LTE/LTE-A based cells and NR based cells in a dual connectivity (DC) manner.

The NR-based cell is connected to a core network for existing 4G mobile communication, that is, an evolved packet core (EPC).

Referring to FIG. 7 b , unlike FIG. 7 a , the LTE/LTE-A based cell is connected to a core network for the 5G mobile communication, that is, a next generation (NG) core network.

The service scheme based on the architecture as illustrated in FIGS. 7 a and 7 b is called non-standalone (NSA).

Referring to FIG. 7 c , the UE is connected only to NR-based cells. The service method based on such an architecture is called standalone (SA).

On the other hand, in the NR, it may be considered that the reception from the base station uses a downlink subframe, and the transmission to the base station uses an uplink subframe. This method may be applied to paired spectra and unpaired spectra. A pair of spectra means that the two carrier spectra are included for downlink and uplink operations. For example, in a pair of spectra, one carrier may include a downlink band and an uplink band that are paired with each other.

FIG. 8 illustrates an example of situation in which uplink signal transmitted via an uplink operating bands affects reception of a downlink signal via downlink operating bands.

In FIG. 8 , an Intermodulation Distortion (IMD) may mean amplitude modulation of signals containing two or more different frequencies, caused by nonlinearities or time variance in a system. The intermodulation between frequency components will form additional components at frequencies that are not just at harmonic frequencies (integer multiples) of either, like harmonic distortion, but also at the sum and difference frequencies of the original frequencies and at sums and differences of multiples of those frequencies.

Referring to FIG. 8 , an example in which a CA is configured in a terminal is shown. For example, the terminal may perform communication through the CA based on three downlink operating bands (UL Band X, Y, Z) and two uplink operating bands (DL Band X, Y).

As shown in FIG. 8 , in a situation in which three downlink operating bands are configured and two uplink operating bands are configured by the CA, the terminal may transmit an uplink signal through two uplink operating bands. In this case, a harmonics component and an intermodulation distortion (IMD) component occurring based on the frequency band of the uplink signal may fall into its own downlink band. That is, in the example of FIG. 8 , when the terminal transmits the uplink signal, the harmonics component and the intermodulation distortion (IMD) component may occur, which may affect the downlink band of the terminal itself.

The terminal should be configured to satisfy a reference sensitivity power level (REFSENS) which is the minimum average power for each antenna port of the terminal when receiving the downlink signal.

When the harmonics component and/or IMD component occur as shown in the example of FIG. 8 , there is a possibility that the REFSENS for the downlink signal may not be satisfied due to the uplink signal transmitted by the UE itself.

For example, the REFSENS may be set such that the downlink signal throughput of the terminal is 95% or more of the maximum throughput of the reference measurement channel. When the harmonics component and/or IMD component occur, there is a possibility that the downlink signal throughput is reduced to 95% or less of the maximum throughput.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 8 of 10

<Disclosure of the Present Disclosure>

When a Power class 3 terminal performs NR CA or EN-DC operation, self-interference occurring in the UE is analyzed, and a relaxed standard for sensitivity thereof may be proposed.

Therefore, it is determined whether the harmonics component and the IMD component of the terminal occur, and when the harmonics component and/or IMD component occur, the maximum sensitivity degradation (MSD) value is defined for the corresponding frequency band, so relaxation for REFSENS in the reception band may be allowed in the reception band due to its own transmission signal. Here, the MSD may mean the maximum allowed reduction of the REFSENS. When the MSD is defined for a specific operating band of the terminal where the CA or DC is configured, the REFSENS of the corresponding operating band may be relaxed by the amount of the defined MSD.

The disclosure of the present specification provides results of analysis about self-interference in a terminal configured with CA and NR EN-DC and amount of relaxation to sensitivity.

I. Reference Sensitivity

The reference sensitivity power level REFSENS is the minimum mean power applied to each one of the UE antenna ports for all UE categories, at which the throughput shall meet or exceed the requirements for the specified reference measurement channel.

For EN-DC, E-UTRA and NR single carrier, CA, and MIMO operation of REFSENS requirements defined apply to all downlink bands of EN-DC configurations listed, unless sensitivity degradation exception is allowed in this clause of this specification. Allowed exceptions specified in this clause also apply to any higher order EN-DC configuration combination containing one of the band combinations that exception is allowed for. Reference sensitivity exceptions are specified by applying maximum sensitivity degradation (MSD) into applicable REFSENS requirement. EN-DC REFSENS requirements shall be met for NR uplink transmissions using QPSK DFT-s-OFDM waveforms as defined. Unless otherwise specified UL allocation uses the lowest SCS allowable for a given channel BW. Limits on configured maximum output power for the uplink shall apply.

In case of intra-band EN-DC the receiver REFSENS requirements in this clause do not apply for 1.4 and 3 MHz E-UTRA carriers. For the case of inter-band EN-DC with a single carrier per cell group and multi-carrier per cell group, in addition to the E-UTRA and NR single carrier, CA, and MIMO operation of REFSENS requirements defined the REFSENS requirements specified therein also apply with both downlink carriers and both uplink carriers active unless sensitivity exceptions are allowed in this clause of this specification.

For inter-band EN-DC, the reference sensitivity requirement with both uplink carriers active is allowed to be verified for only a single inter-band EN-DC configuration per NR band.

For intra-band contiguous EN-DC configurations, the reference sensitivity power level REFSENS is the minimum mean power applied to each one of the UE antenna ports at which the throughput for the carrier(s) of the E-UTRA and NR CGs shall meet or exceed the requirements for the specified E-UTRA and NR reference measurement channels. The reference sensitivity requirements apply with all uplink carriers and all downlink carriers active for EN-DC configuration and Uplink EN-DC configuration, as supported by the UE. For EN-DC configurations where uplink is not available in either the MCG or the SCG or for EN-DC configurations where the UE only supports single uplink operation, reference sensitivity requirements apply with single uplink transmission. The downlink carrier(s) from the cell group with uplink shall be configured closer to the uplink operating band than any of the downlink carriers from the cell group without uplink.

Sensitivity degradation is allowed for Intra-band contiguous EN-DC configurations, the reference sensitivity is defined only for the specific uplink and downlink test points and E-UTRA and NR single carrier requirements do not apply.

Sensitivity degradation is allowed for a band if it is impacted by UL harmonic interference from another band part of the same EN-DC configuration. Reference sensitivity exceptions for the victim band (high) are specified with uplink configuration of the aggressor band (low).

Sensitivity degradation is allowed for a band if it is impacted by receiver harmonic mixing due to another band part of the same EN-DC configuration. Reference sensitivity exceptions for the victim band (low) are specified with uplink configuration of the agressor band (high).

Sensitivity degradation is allowed for a band if it is impacted by UL of another band part of the same EN-DC configuration due to cross band isolation issues. Reference sensitivity exceptions for the victim band are specified with uplink configuration of the agressor band specified.

For EN-DC configurations in NR FR1 the UE may indicate capability of not supporting simultaneous dual uplink operation due to possible intermodulation interference overlapping in frequency to its own primary downlink channel bandwidth if

the intermodulation order is 2; the intermodulation order is 3 when both operating bands are between 450 MHz-960 MHz or between 1427 MHz-2690 MHz

In the case for EN-DC configurations in NR FR1 for which the intermodulation products caused by dual uplink operation do not interfere with its own primary downlink channel bandwidth as defined in Annex I the UE is mandated to operate in dual and triple uplink mode.

For these test points the reference sensitivity levels are relaxed by the amount of the parameter MSD.

II. MSD for DC

1. Summary of self-interference analysis for PC3 DC band combos

Tables 7 and 8 summarize the EN-DC band combinations with self-interference problems for 3DL/2UL EN-DC operation.

2. MSD Analysis

For the MSD analysis of these 3DL/2UL EN-DC NR UE, it is assumed that the parameters and attenuation levels based on current UE RF FE components as shown in below tables.

In rel-17 DC of LTE x Bands (xDL/1UL, x=1, 2, 3, 4) and NR 2 Bands (2DL/1UL) basket WI, RAN4 also consider shared antenna RF architectures for NSA UE in sub-6 GHz as LTE system. So we consider shared antenna RF architecture for general NSA DC UE to derive MSD levels. Also separate antenna RF architecture is considered in some specific band combinations which was considered in general NR RF session.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 9 of 10

For the MSD analysis of these several DC band combinations between LTE and NR, we assume the following parameters and attenuation levels based on current UE RF FE components.

Table 9 shows the RF Front-end component parameters.

Table 10 shows the isolation levels according to the RF component.

Table 10 shows UE RF Front-end component isolation parameters.

Based on these assumptions and test configuration, the present disclosure proposes the MSD levels as below.

Table 11 shows a proposed MSD test configuration and results by IMD problems

Offset of MSD values in table 10 is ±α, and a may be 0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, . . . , 2.7.

3. MSD Value

(1) DC_30_n5-n77

there may be IMD3 produced by Band 30 and NR band n5 that impact the reference sensitivity of NR band n77. Also there are IMD3 & IMD5 produced by Band 30 and NR band n77 that impact the reference sensitivity of NR band n5.

The required MSD levels and test configuration are shown in the following Table.

There is IMD3 products produced by Band n5 and 30 that impact the reference sensitivity of NR n77. If the UE transmits uplink signals via uplink bands of operating bands n5 and 30, IMD products are produced and then a reference sensitivity in operating band n77 is degraded. Therefore, a value of MSD is needed to apply the reference sensitivity. Hereinafter, MSD tables are same with the above description.

(2) DC_8_n28-n79

1) operating bands for DC

Table 13 shows DC band combination of LTE 1DL/1UL+inter-band NR 2DL/1UL.

2) Channel bandwidths per operating band for DC

Table 14 shows Supported bandwidths per DC LTE 1DL/1UL+inter-band NR 2DL/1UL.

3) Co-Existence Studies

Based on the co-existence studies of DC_8A-n28A and DC_8A-n79A, 5th order IMD generated by dual uplink of Band 8+Band n28 may also fall into own Rx of band n79 and 5th order IMD generated by dual uplink of Band 8+Band n79 may also fall into own Rx of band n28.

4) ΔTIB and ΔRIB values

For DC_8_n28-n79, the ΔT IB,c and ΔR IB,c values are given in the tables below.

5) MSD

As mentioned in above, IMD5 of B8 and n28 to Band n79 Rx and IMD5 of B8 and n79 to Band n28 Rx may need to be addressed for REFSENS relaxation. The following values may be proposed:

FIG. 9 and FIG. 10 illustrate exemplary IMD by a combination of band 8, n28 and n79.

Table 17 shows reference sensitivity exceptions due to dual uplink operation for EN-DC in NR FR1 (three bands).

(3) DC_7_n12-n77

There may be IMD3 produced by Band 7 and NR band n12 that impact the reference sensitivity of NR band n77. Also IMD4 product impacted to the n77. But the MSD by IMD4 is not specified.

The required MSD level and test configuration are shown in the following Table.

(4) DC_7_n71-n77

There may be IMD3 produced by Band 7 and NR band n71 that impact the reference sensitivity of NR band n77. Also IMD4 product impacted to the n77. But the MSD by IMD4 is not specified.

The required MSD level and test configuration are shown in the following Table.

(5) DC_5_n2-n41

There may be IMD2 produced by Band 5 and NR band n2 that impact the reference sensitivity of NR band n41.

The required MSD levels and test configuration are shown in the following Table.

(6) DC_3_n28-n75

There may be IMD5 produced by Band 3 and NR band n28 that impact the reference sensitivity of NR band n75.

The required MSD levels and test configuration are shown in the following Table.

(7) DC_2-5_n2-n41

There may be IMD2 produced by Band 5 and NR band n2 that impact the reference sensitivity of NR band n41.

The required MSD levels and test configuration are shown in the following Table.

III. MSD for CA

For remaining MSD analysis for NR CA_n28A-n74A, CA_n74A-n77A, the following MSD based on the simulation assumptions may be proposed.

Table 21 shows coexistence analysis for NR CA band combinations in Rel-17

For the MSD analysis of these several NR CA combinations, the following parameters and attenuation levels based on current UE RF FE components as following tables may be assumed.

Tables 22 and 23 show the RF component isolation parameters to derive MSD level at sub-6 GHz. Tables 22 and 23 show UE RF Front-end component parameters.

Table 24 shows the isolation levels according to the RF component. Table 21 shows UE RF Front-end component parameters.

Based on these assumptions, the MSD levels as below in Tables 25 and 26 may be proposed.

FIG. 11 illustrates exemplary IMD by a combination of band n3, n77 and n79.

Tables 25 and 26 show Proposed MSD test configuration and results for self desense problems.

Another NR DC band combos for DC_8A-41A_n77A or DC_8A-41C_n77A, the proposed MSD and test configuration may be proposed as follow

±α tolerance may be applied to the MSD values shown in the tables 11-12, 17-22, 27-29. For example, a is 0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, . . . may be 2.0. That is, the range of MSD values proposed in the present specification may include MSD values to which a tolerance of ±α is applied.

The following drawings are created to explain specific embodiments of the present disclosure. The names of the specific devices or the names of the specific signals/messages/fields shown in the drawings are provided by way of example, and thus the technical features of the present disclosure are not limited to the specific names used in the following drawings.

FIG. 12 is a flow chart showing an example of a procedure of a terminal according to the present disclosure.

Referring to FIG. 12 , steps S 1210 to S 1230 are shown. Operations described below may be performed by the terminal.

For reference, step S 1210 may not always be performed when the terminal performs communication. For example, step S 1210 may be performed only when the reception performance of the terminal is tested.

In step S 1210 , the terminal may preset the above proposed MSD value. For example, the terminal may preset the MSD values in Table 11. For example, for the combination of the DC_8A-n28A-n79A downlink band and the DC_8A-n79A uplink band, an MSD of 3.9 dB may be applied to the reference sensitivity of the downlink band n28.

›DESCRIPTION OF EXEMPLARY EMBODIMENTS · 10 of 10

In step S 1220 , the terminal may transmit the uplink signal.

When the combination of the DC_8A-n28A-n79A downlink band and the DC_8A-n9A uplink band is configured in the terminal, the terminal may transmit the uplink signal through the uplink operating bands 8 and n79.

In step S 1230 , the terminal may receive the downlink signal.

The terminal may receive the downlink signal based on the reference sensitivity of the downlink band n28, to which the MSD value is applied.

When the combination of the DC_8A-n28A-n79A downlink band and the DC_8A-n79A uplink band is configured in the terminal, the terminal may receive the downlink signal through the downlink operating band n28.

For reference, the order in which steps S 1220 and S 1230 are performed may be different from that shown in FIG. 24 . For example, step S 1230 may be performed first and then step S 1220 may be performed. Alternatively, step S 1220 and step S 1230 may be performed simultaneously. Alternatively, the time when step S 1220 and step S 1230 may be may overlap partially.

Hereinafter, an apparatus in mobile communication, according to some embodiments of the present disclosure, will be described.

For example, a base station may include a processor, a transceiver, and a memory.

For example, the processor may be configured to be coupled operably with the memory and the processor.

The processor may be configured to transmitting an uplink signal via at least two bands among three bands; and receiving a downlink signal, wherein the at least two bands are configured for an Evolved Universal Terrestrial Radio Access (E-UTRA)—New Radio (NR) Dual Connectivity (EN-DC), wherein a value of Maximum Sensitivity Degradation (MSD) is applied to a reference sensitivity for receiving the downlink signal, wherein the value of the MSD is pre-configured for a first combination of bands 30, n5 and n77, a second combination of band 8, n28 and n79, a third combination of bands 7, n12 and n77, a fourth combination of bands 7, n71 and n77, a fifth combination of bands 5, n2 and n41, a sixth combination of bands 3, n28 and n75.

Hereinafter, a processor in mobile communication, according to some embodiments of the present disclosure, will be described.

The processor may be configured to transmitting an uplink signal via at least two bands among three bands; and receiving a downlink signal, wherein the at least two bands are configured for an Evolved Universal Terrestrial Radio Access (E-UTRA)—New Radio (NR) Dual Connectivity (EN-DC), wherein a value of Maximum Sensitivity Degradation (MSD) is applied to a reference sensitivity for receiving the downlink signal, wherein the value of the MSD is pre-configured for a first combination of bands 30, n5 and n77, a second combination of band 8, n28 and n79, a third combination of bands 7, n12 and n77, a fourth combination of bands 7, n71 and n77, a fifth combination of bands 5, n2 and n41, a sixth combination of bands 3, n28 and n75.

Hereinafter, a non-transitory computer-readable medium has stored thereon a plurality of instructions for . . . in a wireless communication system, according to some embodiments of the present disclosure, will be described.

According to some embodiment of the present disclosure, the technical features of the present disclosure could be embodied directly in hardware, in a software executed by a processor, or in a combination of the two. For example, a method performed by a wireless device in a wireless communication may be implemented in hardware, software, firmware, or any combination thereof. For example, a software may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other storage medium.

Some example of storage medium is coupled to the processor such that the processor can read information from the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. For other example, the processor and the storage medium may reside as discrete components.

The computer-readable medium may include a tangible and non-transitory computer-readable storage medium.

For example, non-transitory computer-readable media may include random access memory (RAM) such as synchronous dynamic random access memory (SDRAM), read-only memory (ROM), non-volatile random access memory (NVRAM), electrically erasable programmable read-only memory (EEPROM), FLASH memory, magnetic or optical data storage media, or any other medium that can be used to store instructions or data structures. Non-transitory computer-readable media may also include combinations of the above.

In addition, the method described herein may be realized at least in part by a computer-readable communication medium that carries or communicates code in the form of instructions or data structures and that can be accessed, read, and/or executed by a computer.

According to some embodiment of the present disclosure, a non-transitory computer-readable medium has stored thereon a plurality of instructions. The stored a plurality of instructions may be executed by a processor of a base station.

The stored a plurality of instructions may cause the base station to

The present disclosure can have various advantageous effects.

For example, by performing disclosure of this specification, UE can transmit signal with dual uplink by applying MSD value.

Effects obtained through specific examples of the present specification are not limited to the effects listed above. For example, there may be a variety of technical effects that a person having ordinary skill in the related art can understand or derive from this specification. Accordingly, the specific effects of the present disclosure are not limited to those explicitly described herein, but may include various effects that may be understood or derived from the technical features of the present disclosure.

Claims in the present disclosure can be combined in a various way. For instance, technical features in method claims of the present disclosure can be combined to be implemented or performed in an apparatus, and technical features in apparatus claims can be combined to be implemented or performed in a method. Further, technical features in method claim(s) and apparatus claim(s) can be combined to be implemented or performed in an apparatus. Further, technical features in method claim(s) and apparatus claim(s) can be combined to be implemented or performed in a method. Other implementations are within the scope of the following claims.

›Tables in the description — 33
TABLE 1
Frequency RangeCorresponding frequency
designationrangeSubcarrier Spacing
FR1450 MHz-6000 MHz15, 30, 60 kHz
FR224250 MHz-52600 MHz60, 120, 240 kHz
TABLE 2
Frequency RangeCorresponding frequency
designationrangeSubcarrier Spacing
FR1410 MHz-7125 MHz15, 30, 60 kHz
FR224250 MHz-52600 MHz60, 120, 240 kHz
TABLE 3
Uplink (UL) operating bandDownlink (DL) operating band
E-UTRABS receiveBS transmit
OperatingUE transmitUE receiveDuplex
BandFUL_low-FUL_highFDL_low-FDL_highMode
11920-19802110-2170FDD
MHzMHzMHzMHz
21850-19101930-1990FDD
MHzMHzMHzMHz
31710-17851805-1880FDD
MHzMHzMHzMHz
41710-17552110-2155FDD
MHzMHzMHzMHz
5824-849869-894FDD
MHzMHzMHzMHz
6830-840875-885FDD
MHzMHzMHzMHz
72500-25702620-2690FDD
MHzMHzMHzMHz
8880-915925-960FDD
MHzMHzMHzMHz
91749.9-1784.91844.9-1879.9FDD
MHzMHzMHzMHz
101710-17702110-2170FDD
MHzMHzMHzMHz
111427.9-1447.91475.9-1495.9FDD
MHzMHzMHzMHz
12699-716729-746FDD
MHzMHzMHzMHz
13777-787746-756FDD
MHzMHzMHzMHz
14788-798758-768FDD
MHzMHzMHzMHz
15ReservedReservedFDD
16ReservedReservedFDD
17704-716734-746FDD
MHzMHzMHzMHz
18815-830860-875FDD
MHzMHzMHzMHz
19830-845875-890FDD
MHzMHzMHzMHz
20832-862791-821FDD
MHzMHzMHzMHz
211447.9-1462.91495.9-1510.9FDD
MHzMHzMHzMHz
223410-34903510-3590FDD
MHzMHzMHzMHz
232000-20202180-2200FDD
MHzMHzMHzMHz
241626.5-1660.51525-1559FDD
MHzMHzMHzMHz
251850-19151930-1995FDD
MHzMHzMHzMHz
26814-849859-894FDD
MHzMHzMHzMHz
27807-824852-869FDD
MHzMHzMHzMHz
28703-748758-803FDD
MHzMHzMHzMHz
29N/A717-728FDD2
MHzMHz
302305-23152350-2360FDD
MHzMHzMHzMHz
31452.5-457.5462.5-467.5FDD
MHzMHzMHzMHz
32N/A1452-1496FDD2
MHzMHz
331900-19201900-1920TDD
MHzMHzMHzMHz
342010-20252010-2025TDD
MHzMHzMHzMHz
351850-19101850-1910TDD
MHzMHzMHzMHz
361930-19901930-1990TDD
MHzMHzMHzMHz
371910-19301910-1930TDD
MHzMHzMHzMHz
382570-26202570-2620TDD
MHzMHzMHzMHz
391880-19201880-1920TDD
MHzMHzMHzMHz
402300-24002300-2400TDD
MHzMHzMHzMHz
412496269024962690TDD
MHzMHzMHzMHz
423400-36003400-3600TDD
MHzMHzMHzMHz
433600-38003600-3800TDD
MHzMHzMHzMHz
44703-803703-803TDD
MHzMHzMHzMHz
451447-14671447-1467TDD
MHzMHzMHzMHz
465150-59255150-5925TDD8
MHzMHzMHzMHz
475855-59255855-5925TDD11
MHzMHzMHzMHz
483550-37003550-3700TDD
MHzMHzMHzMHz
493550-37003550-3700TDD16
MHzMHzMHzMHz
501432-15171432-1517TDD13
MHzMHzMHzMHz
511427-14321427-1432TDD13
MHzMHzMHzMHz
523300-34003300-3400TDD
MHzMHzMHzMHz
532483.5-24952483.5-2495TDD
MHzMHzMHzMHz
. . .
64Reserved
651920-20102110-2200FDD
MHzMHzMHzMHz
661710-17802110-2200FDD4
MHzMHzMHzMHz
67N/A738-758FDD2
MHzMHz
68698-728753-783FDD
MHzMHzMHzMHz
69N/A2570-2620FDD2
MHzMHz
701695-17101995-2020FDD10
MHzMHzMHzMHz
71663-698617-652FDD
MHzMHzMHzMHz
72451-456461-466FDD
MHzMHzMHzMHz
73450-455460-465FDD
MHzMHzMHzMHz
741427-14701475-1518FDD
MHzMHzMHzMHz
75N/A1432-1517FDD2
MHzMHz
76N/A1427-1432FDD2
MHzMHz
85698-716728-746FDD
MHzMHzMHzMHz
87410-415420-425FDD
MHzMHzMHzMHz
88412-417422-427FDD
MHzMHzMHzMHz
TABLE 4 — NR
operatingUplink (UL) operating bandDownlink (DL) operating bandDuplex
bandF UL _low-F UL _highF DL _low-F DL _highmode
n11920 MHz-1980 MHz2110 MHz-2170 MHzFDD
n21850 MHz-1910 MHz1930 MHz-1990 MHzFDD
n31710 MHz-1785 MHz1805 MHz-1880 MHzFDD
n5824 MHz-849 MHz869 MHz-894 MHzFDD
n72500 MHz-2570 MHz2620 MHz-2690 MHzFDD
n8880 MHz-915 MHz925 MHz-960 MHzFDD
n12699 MHz-716 MHz729 MHz-746 MHzFDD
n13777 MHz-787 MHz746 MHz-756 MHzFDD
n14788 MHz-798 MHz758 MHz-768 MHzFDD
n18815 MHz-830 MHz860 MHz-875 MHzFDD
n20832 MHz-862 MHz791 MHz-821 MHzFDD
n251850 MHz-1915 MHz1930 MHz-1995 MHzFDD
n26814 MHz-849 MHz859 MHz-894 MHzFDD
n28703 MHz-748 MHz758 MHz-803 MHzFDD
n29N/A717 MHz-728 MHzSDL
n302305 MHz-2315 MHz2350 MHz-2360 MHzFDD
n342010 MHz-2025 MHz2010 MHz-2025 MHzTDD
n382570 MHz-2620 MHz2570 MHz-2620 MHzTDD
n391880 MHz-1920 MHz1880 MHz-1920 MHzTDD
n402300 MHz-2400 MHz2300 MHz-2400 MHzTDD
n412496 MHz-2690 MHz2496 MHz-2690 MHzTDD
n465150 MHz-5925 MHz5150 MHz-5925 MHzTDD
n475855 MHz-5925 MHz5855 MHz-5925 MHzTDD
n483550 MHz-3700 MHz3550 MHz-3700 MHzTDD
n501432 MHz-1517 MHz1432 MHz-1517 MHzTDD
n511427 MHz-1432 MHz1427 MHz-1432 MHzTDD
n532483.5 MHz-2495 MHz2483.5 MHz-2495 MHzTDD
n651920 MHz-2010 MHz2110 MHz-2200 MHzFDD
n661710 MHz-1780 MHz2110 MHz-2200 MHzFDD
n701695 MHz-1710 MHz1995 MHz-2300 MHzFDD
n71663 MHz-698 MHz617 MHz-652 MHzFDD
n741427 MHz-1470 MHz1475 MHz-1518 MHzFDD
n75N/A1432 MHz-1517 MHzSDL
n76N/A1427 MHz-1432 MHzSDL
n773300 MHz-4200 MHz3300 MHz-4200 MHzTDD
n783300 MHz-3800 MHz3300 MHz-3800 MHzTDD
n794400 MHz-5000 MHz4400 MHz-5000 MHzTDD
n801710 MHz-1785 MHzN/ASUL
n81880 MHz-915 MHzN/ASUL
n82832 MHz-862 MHzN/ASUL
n83703 MHz-748 MHzN/ASUL
n841920 MHz-1980 MHzN/ASUL
n861710 MHz-1780 MHzN/ASUL
n89824 MHz-849 MHzN/ASUL
n902496 MHz-2690 MHz2496 MHz-2690 MHzTDD
n91832 MHz-862 MHz1427 MHz-1432 MHzFDD
n92832 MHz-862 MHz1432 MHz-1517 MHzFDD
n93880 MHz-915 MHz1427 MHz-1432 MHzFDD
n94880 MHz-915 MHz1432 MHz-1517 MHzFDD
n952010 MHz-2025 MHzN/ASUL
n965925 MHz-7125 MHz5925 MHz-7125 MHzTDD
n972300 MHz-2400 MHzN/ASUL
n981880 MHz-1920 MHzN/ASUL
TABLE 5 — NR
operatingUplink (UL) operating bandDownlink (DL) operating bandDuplex
bandF UL _low-F UL _highF DL _low-F DL _highmode
n25726500 MHz-29500 MHz26500 MHz-29500 MHzTDD
n25824250 MHz-27500 MHz24250 MHz-27500 MHzTDD
n25939500 MHz-43500 MHz39500 MHz-43500 MHzTDD
n26037000 MHz-40000 MHz37000 MHz-40000 MHzTDD
n26127500 MHz-283500 MHz27500 MHz-283500 MHzTDD
TABLE 6
UE Power classUE type
1Fixed wireless access (FWA) UE
2Vehicular UE
3Handheld UE
4High power non-handheld UE
TABLE 7
DC_30_n5-n77DC_30_n54th & 5th3rd IMD—4th & 5th Harmonic
harmonic frominto n77issues already
n5 into n77covered in
DC_5A_n77A.
FFS by 3rd IMD
DC_30_n77—3rd & 5th IMDs—FFS
into n5
DC_3-3_n8-n78DC_3_n82nd3rd & 5th IMDs—The 3rd IMD
harmonic frominto n78problem, follow
B3 into n784th & 5thMSD (16.3 dB) for
4thIMDs into B3DC_3A_n8A-n78A.
harmonic fromThe 4th & 5th IMDs
n8 into n78problem already
covered in
DC_3A_n8A.
DC_3_n78———No issue
DC_7-7_n8-n78DC_7_n84th2nd & 4th IMDs4th Harmonic
harmonic frominto n78issues already
n8 into n78covered in
DC_8A_n78A.
The 2nd IMD
problem, follow
MSD (28.5 dB) for
DC_7A_n8A-n78A.
DC_7_n78—2nd IMDThe 2nd IMDs
into n8problem, follow
MSD (29.7 dB) for
DC_7A_n8A-n78A.
DC_3_n1-n8DC_3_n1——YesSmall freq. gap
DC_3-3_n1-n8was covered in
TABLE 7 — in TS38.101-3
DC_3_n8———No issue
DC_7_n1-n8DC_7_n1—5th IMD—Reuse 4.5 dB by
DC_7-7_n1-n8into n85th IMD from
DC_1A-28A n7A
DC_7_n83rd——The harmonic issue
harmonic fromalready covered in
n8 into B7DC_7A_n8A.
TABLE 8 — interference due to
Harmonicintermodulationsmall
DownlinkUplinkrelationto own rxfrequency
band configurationDC ConfigurationissuesbandseparationMSD
DC_8_n28-n79DC_8A_n28A5th5th IMD—Harmonic
harmonic fromproblem already
B8 into n79covered in
DC_8A_n79A-FFS
DC_8A_n79A5th IMD—FFS
DC_8_n77-n79DC_8A_n77A5th2nd, 4th & 5thHarmonic
harmonic fromIMDsproblem already
B8 into n79covered in
DC_8A_n79A
RAN4 agreed not
to consider
simultaneous
Rx/Tx capability
for the CA band
combinations with
n77 and n79.
DC_8A_n79A—2nd IMDRAN4 agreed
not to consider
simultaneous
Rx/Tx capability
for the CA band
combinations with
n77 and n79.
DC_8_n77-n257D/DC_8A_n77A——No issues
G/H/IDC_8A_n257D/G/H/I——No issues
DC_11_n77-n257D/DC_11A_n77A——No issues
G/H/IDC_11A_n257D/G/H/I——No issues
DC_2_n12-n77DC_2A_n12A2nd3rd, 4th & 5th—Harmonic
DC_2-2_n12-n77harmonic fromIMDsproblem already
B2 into n77covered in
DC_2A_n77A
16.0 dB MSD by
3rd IMD from
CA_n2-n12-n77
can be reused
DC_2A_n77A———No issues
DC_7_n12-n77DC_7A_n12A—3rd & 4th—FFS
IMDs
DC_7A_n77A—2nd IMD—30.8 dB MSD by
2nd IMD from
DC_7A-12A_n78A
can be reused
DC_66_n12-n77DC_66A_n12A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDsproblem already
B66 into n77covered in
DC_66A_n77A
16.0 dB MSD by
3rd IMD from
CA_n12-n66-n77
can be reused
DC_66A_n77A3rd IMD—15.2 dB MSD by
3rd IMD from
DC_12A-66A_n77A
can be reused
DC_12_n41-n66DC_12A_n41A3rd——Harmonic
harmonic fromproblem already
B12 into n66covered in
DC_12A_n66A
DC_12A_n66A—2nd IMD—Edge IMD2 regions
will be impact in
n41
28.7 dB MSD by
2nd IMD from
DC_12A_n2A-n41A
can be reused
DC_12_n66-n77DC_12A_n66A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDsproblem already
n66 into n77covered in
DC_66A_n77A
16.0 dB MSD by
3rd IMD from
CA_n12-n66-n77
can be reused
DC_12A_n77A3rd3rd & 4th—Harmonic
harmonic fromIMDsproblem already
B12 into n66covered in
DC_12A_n66A
13.2 dB MSD by
3rd IMD from
DC_12A-66A_n77A
can be reused
DC_71_n66-n77DC_71A_n66A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDsproblem already
n66 into n77covered in
5thDC_66A_n77A or
harmonic fromDC_71A_n77A
B71 into n7715.9 dB MSD by
3rd IMD from
CA_n66-n71-n77
can be reused
DC_71A_n77A—3rd & 4th—15.5 dB MSD by
IMDs3rd IMD from
DC_71A_n66A-n78A
can be reused
DC_2_n71-n77DC_2A_n71A2nd3rd, 4th & 5th—Harmonic
DC_2-2_n71-n77harmonic fromIMDsproblem already
B2 into n77covered in
5thDC_2A_n77A or
harmonic fromDC_71A_n77A
n71 into n778.0 dB MSD by
3rd IMD from
DC_2A_n71A-n78A
can be reused
DC_2A_n77A———No issues
DC_7_n71-n77DC_7A_n71A5th3rd & 4th—Harmonic
harmonic fromIMDsproblem already
n71 into n77covered in
DC_71A_n77A
FFS
DC_7A_n77A———No issues
DC_66_n71-n77DC_66A_n71A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDsproblem already
B66 into n77covered in
5thDC_66A_n77A or
harmonic fromDC_71A_n77A
n71 into n7715.9 dB MSD by
3rd IMD from
CA_n66-n71-n77
can be reused
DC_66A_n77A—3rd IMD—15.2 dB MSD by
3rd IMD from
DC_12A-66A_n77A
can be reused
DC_5_n2-n41DC_5A_n2A3rd2nd IMD—Harmonic
harmonic fromproblem already
B5 into n41covered in
DC_5A_n41A
FFS
DC_5A_n41A———No issues
DC_5_n2-n66DC_5A_n2A—4th IMD—7.2 dB MSD by 4th
IMD from
CA_n2-n5-n66
can be reused
DC_5A_n66A———No issues
DC_12_n2-n66DC_12A_n2A3rd——Harmonic
harmonic fromproblem already
B12 into n66covered in
DC_12A_n66A
DC_12A_n66A—4th IMD—0 dB MSD in
DC_2A-12A_n66A
in TS38.101-3
DC_7_n2-n77DC_7A_n2A2nd5th IMDHarmonic
harmonic fromproblem already
n2 into n77covered in
DC_2A_n77A
4.2 dB MSD by 5th
IMD from
DC_2A_n7A-n78A
can be reused
DC_7A_n77A—4th IMD—8.6 dB MSD by 4th
IMD from
DC_2A-7A_n78A
can be reused
DC_12_n2-n77DC_12A_n2A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDsproblem already
n2 into n77covered in
DC_2A_n77A
16.0 dB MSD by
3rd IMD from
CA_n2-n12-n77
can be reused
DC_12A_n77A—3rd & 4th—16.5 dB MSD by
IMDs3rd IMD from
DC_2A-12A_n77A
can be reused
DC_71_n2-n77DC_71A_n2A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDsproblem already
n2 into n77covered in
5thDC_2A_n77A or
harmonic fromDC_71A_n77A
B71 into n778.0 dB MSD by
3rd IMD from
DC_2A_n71A-n78A
DC_71A_n77A—3rd & 4th—16.5 dB MSD by
IMDs3rd IMD from
DC_2A-71A_n78A
can be reused
DC_5_n2-n78DC_5A_n2A2nd3rd IMD—Harmonic
harmonic fromproblem already
n2 into n78covered in
4thDC_2A_n78A or
harmonic fromDC_5A_n78A
B5 into n7816.0 dB MSD by
3rd IMD from
DC_2A_n5A-n77A
can be reused
DC_5A_n78A3rd IMD16.5 dB MSD by
3rd IMD from
DC_2A-5A_n77A
can be reused
DC_12_n2-n78DC_12A_n2A2nd3rd IMD—Harmonic
harmonic fromproblem already
n2 into n78covered in
DC_2A_n77A
MSD will follow
from DC_12_n2-n77
DC_12A_n78A—3rd IMD—MSD will follow
from DC_12_n2-n77
DC_2-2_n41-n66DC_2A_n41A———No issues
DC_2A_n66A———No issues
DC_2-2_n41-n71DC_2A_n41A—2nd & 5th—28.7 dB MSD by
IMDs2nd IMD from
DC_2A_n41A-n71A
can be reused
DC_2A_n71A4th——Harmonic
harmonic fromproblem already
n71 into n41covered in
DC_71A_n41A
DC_2-2_n66-n78DC_2A_n66A2nd2nd & 4thHarmonic issue
harmonic fromIMDs intoalready covered in
B2 or n66n78DC_2_n78 or
into n78CA_n66-n78
29.4 dB and 8.9
dB MSD by 2nd &
4th IMDs in
DC_2A_n66A-n78A
can be reused
in Table
7.3B.2.3.5.2-1 in
TS38.101-3
DC_2A_n78A—4th IMD into—10.3 dB MSD by
n664th IMD in
DC_2A-66A_n78A
can be reused in
TABLE 7 — in TS38.101-3
DC_2-5_n2-n41DC_2A_n2A———No issues when
RAN4 only
consider the single
switched uplink
transmission
DC_2A_n41A———No issue
DC_5A_n2A3rd2nd IMD intoHarmonic issue
harmonics fromn41already covered in
n2 into n41DC_2_n41
FFS
DC_5A_n41A———No issues
DC_2-12_n2-n41DC_2A_n2A———No issues when
RAN4 only
consider the single
switched uplink
transmission
DC_2A_n41A—2nd & 5th—28.7 dB MSD by
IMDs into2nd IMD from
B12DC_2A-12A_n41A
can be reused
DC_12A_n2A3rd2nd IMD intoHarmonic issue
harmonics fromn41already covered in
n2 into n41DC_2_n41
28.7 dB by IMD2
from
DC_12A_n2A-n41A
can be reused
DC_12A_n41A—2nd IMD into—26.0 dB MSD by
B2 and n22nd IMD from
DC_2A-12A_n41A
can be reused
DC_2-66_n2-n41DC_2A_n2A———No issues
DC_2A_n41A———No issues
DC_66A_n2A———No issues
DC_66A_n41A4th IMD into—11.0 dB MSD by
B2 and n22nd IMD from
DC_2A-66A_n41A
can be reused
DC_2-71_n2-n41DC_2A_n2A———No issues
DC_2A_n41A—2nd & 5 th—28.7 dB MSD by
IMDs into2nd IMD from
B71DC_2A_n41A-n71A
can be reused
DC_71A_n2A4th——Harmonic
harmonic fromproblem already
B71 into n41covered in
DC_71A_n41A
DC_71A_n41A3rd2nd IMD into—Harmonic issue
harmonic fromB2 and n2already covered in
B71 into B2/n2DC_2_n71
26.0 dB MSD by
DC_71A_n2A-n41A
can be reused
in TS38.101-3
DC_2-5_n2-n66DC_2A_n2A———No issues
DC_2A_n66A———No issues
DC_5A_n2A—4th IMD into—7.2 dB MSD by 4th
n66IMD from
CA_n2-n5-n66
can be reused
DC_5A_n66A———No issues
DC_2-7_n2-n66DC_2A_n2A———No issues
DC_2A_n66A———No issues
DC_7A_n2A———No issues
DC_7A_n66A———No issues
DC_2-12_n2-n66DC_2A_n2A———No issues
DC_2A_n66A———No issues
DC_12A_n2A3rd——Harmonic
harmonics fromproblem already
B12 into n66covered in
DC_12A_n66A
DC_12A_n66A—4th IMD into0 dB MSD in
B2 and n2DC_2A-12A_n66A
in TS38.101-3
DC_2-71_n2-n66DC_2A_n2A———No issues
DC_2A_n66A———No issues
DC_71A_n2A———No issues
DC_71A_n66A3rd——Harmonic
harmonics fromproblem already
B71 into B2covered in
and n2DC_2A_n71A
DC_2-7_n2-n71DC_2A_n2A———No issues
DC_2A_n71A———No issues
DC_7A_n2A—2nd & 5th—28.7 dB MSD for
IMDs into2nd IMD of
n71DC_7A_n2A-n71A
can be reused in
TS38.101-3
DC_7A_n71A3rd——Harmonic
harmonics fromproblem already
n71 into B2covered in
and n2DC_2A_n71A
DC_2-66_n2-n71DC_2A_n2A———No issues
DC_2A_n71A———No issues
DC_66A_n2A———No issues
DC_66A_n71A3rd——Harmonic
harmonics fromproblem already
B71 into B2covered in
and n2DC_2A_n71A
DC_2-7_n2-n77DC_2A_n2A2nd2nd & 4th—Harmonic
harmonic fromIMDs intoproblem already
B2 into n77n77covered in
DC_2A_n77A
Only switched
uplink transmission
is allowed
DC_2A_n77A—5th IMD into3.4 dB MSD for
B75th IMD of
DC_2A-7A_n77A
can be reused in
TS38.101-3
DC_7A_n2A2nd5th IMD intoHarmonic
harmonic fromn77problem already
n2 into n77covered in
DC_2A_n77A
4.2 dB MSD for
5th IMD of
DC_2A_n7A-n78A
can be reused in
TS38.101-3
DC_7A_n77A—4th IMD into—8.6 dB MSD for
B2 and n24th IMD of
DC_2A-7A_n77A
can be reused in
TS38.101-3
DC_2-12_n2-n77DC_2A_n2A2nd2nd & 4th—Harmonic
harmonic fromIMDs intoproblem already
B2 into n77n77covered in
DC_2A_n77A
Only switched
uplink transmission
is allowed
DC_2A_n77A—No issues
DC_12A_n2A2nd3rd, 4th & 5thHarmonic
harmonic fromIMDs intoproblem already
n2 into n77n77covered in
DC_2A_n77A
16.0 dB MSD by
3rd IMD from
CA_n2-n12-n77
can be reused
DC_12A_n77A—3rd & 4th—16.5 dB MSD by
IMDs into B23rd IMD from
and n2DC_2A-12A_n77A
can be reused
DC_2-71_n2-n77DC_2A_n2A2nd2nd & 4th—Harmonic
harmonic fromIMDs intoproblem already
B2 into n77n77covered in
DC_2A_n77A
Only switched
uplink transmission
is allowed
DC_2A_n77ANo issues
DC_71A_n2A2nd3rd, 4th & 5th—Harmonic
harmonic fromIMDs intoproblem already
n2 into n77n77covered in
5thDC_2A_n77A or
harmonic fromDC_71A_n77A
B71 into n778.0 dB MSD
DC_71A_n77A—3rd & 4th—16.5 dB MSD by
IMDs into3rd IMD from
B2and n2DC_2A-71A_n78A
can be reused
DC_2-5_n2-n78DC_2A_n2A2nd2nd & 4th—Harmonic
harmonic fromIMDs intoproblem already
B2 into n78n78covered in
DC_2A_n78A
Only switched
uplink transmission
is allowed
DC_2A_n78A5th IMD into—3.8 dB by 5th IMD
B5from
DC_2A-5A_n77A
can be reused
DC_5A_n2A2nd3rd IMD into—Harmonic
harmonic fromn78problem already
n2 into n78covered in
4thDC_2A_n78A or
harmonic fromDC_5A_n78A
B5 into n7816.0 dB MSD by
3rd IMD from
DC_2A_n5A-n77A
can be reused
DC_5A_n78A3rd IMD into16.5 dB MSD by
B2 and n23rd IMD from
DC_2A-5A_n77A
can be reused
DC_2-66_n2-n78DC_2A_n2A2nd2nd & 4th—Harmonic
harmonic fromIMDs intoproblem already
B2 inton78covered in
n78DC_2A_n78A
Only switched
uplink transmission
is allowed
DC_2A_n78A—4th IMD into—10.3 dB MSD by
n664th IMD in
DC_2A-66A_n78A
can be reused in
TABLE 7 — in TS38.101-3
DC_66A_n2A2nd2nd & 4thHarmonic issue
harmonic fromIMDs intoalready covered in
n2 into n78n78DC_2_n78 or
CA_n66-n78
29.4 dB and 8.9
dB MSD by 2nd &
4th IMDs in
DC_2A_n66A-n78A
can be reused
in Table
7.3B.2.3.5.2-1 in
TS38.101-3
DC_66A_n78A2nd, 4th & 5th32.1 dB MSD by
IMDs into B22nd IMD from
and n2DC_2A-66A_n78A
can be reused
DC_38_n3-n78DC_38A_n3A2nd3rd IMD intoHarmonic issue
harmonic fromn78already covered in
n3 into n78DC_3_n78
16.1 dB MSD by
3rd IMD from
DC_3A_n7A-n78A
can be reused
DC_38A_n78A3rd & 4th17.6 dB MSD by
IMDs into n33rd IMD from
DC_3A-7A_n78A
can be reused
DC_1_n38-n78DC_1A_n78A—4th IMD into9.1 dB MSD by 4th
n38IMD from
DC_1A-7A_n78A
can be reused
DC_3_n38-n78DC_3A_n78A——No issues
DC_7_n38-n78———No issues
DC_20_n38-n78DC_20A_n78A3rd2nd IMD into—Harmonic issue
harmonic fromn38already covered in
B20 into n38DC_20_n38
30.8 dB MSD by
2nd IMD from
DC_7A-20A_n78A
can be reused
DC_1_n28-n75DC_1A_n28A2nd——Harmonic issue
harmonic fromalready covered in
n28 into n75DC_28_n75
DC_3_n28-n75DC_3A_n28A2nd5th IMD into—Harmonic issue
harmonic fromn75already covered in
n28 into n75DC_28_n75
FFS
DC_20_n8-n78DC_20A_n8A4th4th IMD intoHarmonic issue
harmonic fromn78already covered in
B20 or n8DC_20_n78 or
into n78DC_8_n78
10.3 dB reuse by
4th IMD of
DC_8A_n28A-n78A
DC_20A_n78A—4th IMD into12.1 dB reuse by
n84th IMD of
DC_8A-20A_n78A
DC_1_n3-n8DC_1A_n3A——YesCross band
isolation issues
already solved
DC_1A_n8A2nd—YesHarmonic issue
harmonic fromalready covered in
n8 into n3DC_8_n3A
Cross band
isolation issues
already solved
DC_1_n8-n77DC_1A_n8A or3rd IMD into—14.9 dB MSD by
DC_1_n8-n77(2A)DC_n8A_1An773rd IMD of
DC_n8-n77_1DC_1A_n8A-n78A
DC_n8-n77(2A)_1can be reused.
DC_1A_n77A or—5th IMD into—3.3 dB MSD by 5th
DC_n77A_1An8IMD of
DC_1A-8A_n77A
can be reused.
DC_1-3_n3-n8DC_1A_n3A——YesCross band
isolation issues
already solved
DC_1A_n8A2nd—YesHarmonic issue
harmonic fromalready covered in
n8 into n3DC_8_n3A
Cross band
isolation issues
already solved
DC_(n)3AA———No issues
DC_3A_n8A———No issues
DC_3_n3-n77DC_(n)3AA2nd2nd & 4th—Harmonic
DC_3_n3-n77(2A)harmonic fromIMD into n77problems was
DC_n3-n77_3n3 into n77already covered in
DC_n3-n77(2A)_3DC_3A_n77A.
Due to apply
MPR, no need to
define MSD
DC_3A_n77A—2nd, 4th &5th—MSD problems in
DC_n77A_3AIMD into n3n3 were already
solved in
DC_3A_n77A
DC_3_n3-n8DC_(n)3AA———No issues
DC_n3-n8_3DC_3A_n8A or———No issues
DC_n8A_3A
DC_3_n8-n77DC_3A_n8A or2nd3rd & 5thHarmonic
DC_3_n8-n77(2A)DC_n8A_3Aharmonic fromIMDs intoproblems was
DC_n8-n77_3B3 into n77n77already covered in
DC_n8-n77(2A)_34thDC_3A_n77A or
harmonic fromDC_8A_n77A.
n8 into n7716.3 dB MSD by
3rd IMD in
DC_3A_n8A-n78A
can be reused
DC_3A_n77A or—4th IMD into9.7 dB MSD by
DC_n77A_3An84th IMD in
DC_3A-8A_n77A
can be reused
DC_8-3_n3-n77DC_(n)3AA2nd2nd & 4thHarmonic
DC_8-3_n3-n77(2A)harmonic fromIMDs intoproblems was
B3 into n77n77already covered in
DC_3A_n77A
Due to apply
MPR, no need to
define MSD
DC_3A_n77A—4th IMD into9.7 dB MSD by
n84th IMD in
DC_3A-8A_n77A
can be reused
DC_8A_n3A2nd3rd & 5thHarmonic
harmonic fromIMDs intoproblems was
B3 into n77n77already covered in
4thDC_3A_n77A or
harmonic fromDC_8A_n77A.
n8 into n7716.3 dB MSD by
3rd IMD in
DC_3A_n8A-n78A
can be reused
DC_8A_n77A2nd3rd IMD intoHarmonic
harmonic fromB3 and n3problems was
B8 into B3already covered in
DC_3A_n8A
16.5 dB MSD by
3rd IMD in
DC_3A-8A_n77A
can be reused
DC_1-3_n3-n257A/DC_1A_n3A——YesCross band
G/H/I/J/K/L/Misolation issues
already solved
DC_1A_n257A——YesCross band
isolation issues
already solved
DC_(n)3AA———No issues
DC_3A_n257A———No issues
DC_1_n77-n257J/DC_1A_n77A or———No issues
K/L/MDC_n77A_1A
DC_1_n77(2A)-n257J/DC_1A_n257A or———No issues
K/L/MDC_n257A_1A
DC_n77-n257_1
DC_n77(2A)-n257_1
DC_1_n8-n257A/DC_1A_n8A or———No issues
G/H/I/J/K/L/MDC_n8A_1A
DC_n8-n257_1DC_1A_n257A or———No issues
DC_n257A_1A
DC_3_n3-n257A/DC_(n)3AA———No issues
G/H/I/J/K/L/MDC_3A_n257A or———No issues
DC_n3-n257_3DC_n257A_3A
DC_3_n77-n257J/DC_3A_n77A or———No issues
K/L/M,DC_n77A_3A
DC_3_n77(2A)-n257J/DC_3A_n257A or———No issues
K/L/MDC_n257A_3A
DC_n77-n257_3
DC_n77(2A)-n257_3
DC_3_n8-n257A/DC_3A_n8A or———No issues
G/H/I/J/K/L/MDC_n8A_3A
DC_n8-n257_3DC_3A_n257A or———No issues
DC_n257A_3A
DC_8_n3-n257A/DC_8A_n3A———No issues
G/H/I/J/K/L/MDC_8A_n257A2nd——Harmonic
harmonic fromproblems was
B8 into n3already covered in
DC_3A_n8A
DC_8-3_n3-n257A/DC_8A_n3A———No issues
G/H/I/J/K/L/M
DC_8A_n257A2nd——Harmonic
harmonic fromproblems was
B8 into n3already covered in
DC_3A_n8A
DC_(n)3AA———No issues
DC_3A_n257A———No issues
DC_n3-n257A/DC_n3A_1A——YesCross band
G/H/I/J/K/L/isolation issues
M_1-3already solved
DC_(n)3AA———No issues
DC_n257A_1A——YesCross band
isolation issues
already solved
DC_n257A_3A———No issues
DC_n3-n77_1-3DC_n3A_1A2nd2nd & 4thYesHarmonic
DC_n3-n77(2A)_1-3harmonic fromIMDs intoproblems already
B1 or n3n77covered in
into n77DC_n3A-n78A.
Same as IMD
issues in
DC_1A_n3A-n78A
Small freq. gap
was covered in
TABLE 7 — inTS36.101
DC_(n)3AA2nd2nd & 4thHarmonic
harmonic fromIMDs intoproblems was
B3 into n77n77already covered in
DC_3A_n77A
Due to apply
MPR, no need to
define MSD
DC_n77A_1A—2nd , 4th &—Same as IMD
5th IMDs intoissues in
B3/n3DC_1A_n3A-n78A
DC_n77A_3A—2nd & 5 th—31.0 dB by 2nd
IMD into B1IMD that follow
2nd, 4th &5thDC_1A-3A_n77A
IMD into n3in TR37.863-02-01
in rel-15.
Follow
DC_3A_n1A-n78A
for 5th IMD
problem.
MSD problems in
n3 were already
solved in
DC_3A_n77A
DC_n3-n8_1DC_n3A_1A——YesCross band
isolation issues
already solved
DC_n8A_1A2nd—YesHarmonic issue
harmonic fromalready covered in
n8 into n3DC_8_n3A
Cross band
isolation issues
already solved
DC_n3-n8_1-3DC_n3A_1A——YesCross band
isolation issues
already solved
DC_(n)3AA———No issues
DC_n8A_1A2nd—YesHarmonic issue
harmonic fromalready covered in
n8 into n3DC_8_n3A
Cross band
isolation issues
already solved
DC_n8A_3A———No issues
TABLE 9 — Triplexer-Diplexer
Architecture w/ single ant. or dual ant.Cascaded Diplexer
DC_8A_n28A-n79A,Architecture w/ single ant.
DC_7A_n12A-n77A,DC_5A_n2A-n41A,
DC_7A_n71A-n77A,DC_2A-5A_n2A-n41A,
UE ref.DC_30A_n5A-n77ADC_3A_n28A-n75A
architectureIP2IP3IP4IP5IP2IP3IP4IP5
Component(dBm)(dBm)(dBm)(dBm)(dBm)(dBm)(dBm)(dBm)
Ant. Switch112685555112685555
Triplexer110725552
Quadplexer112725552
Diplexer115875555115875555
Duplexer100755553100755553
PA Forward28.032302828.0323028
PA Reversed4030.530304030.53030
LNA1000−101000−10
TABLE 10
Isolation ParameterValue (dB)Comment
Antenna to Antenna10Main antenna to diversity antenna
PA (out) to PA (in)60PCB isolation (PA forward mixing)
Triplexer20High/low band isolation
Diplexer25High/low band isolation
PA (out) to PA (out)60L-H/H-L cross-band
PA (out) to PA (out)50H-H cross-band
LNA (in) to PA (out)60L-H/H-L cross-band
LNA (in) to PA (out)50H-H cross-band
Duplexer50Tx band rejection at Rx band
TABLE 11
ULULDL
NR CA inter-UL FcBWRBDL FcBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_8A_n28A-8IMD5|fn28 +912.5525957.55N/A
n79An284*fB8|745.5525800.55
n794420402164420400.0
8IMD5|fn79 −9055259505N/A
n794*fB8|442040216442040
n2874552580053.9
DC_7A_n12A-B7IMD3|2*fn12 +25201050264010N/A
n77An12B7|7085257385
n773936105039361015.2
DC_7A_n71A-B7IMD3|2*fn71 +25201050264010N/A
n77An71B7|6935256475
n773906105039061015.2
DC_5A_n2A-B5IMD2|fB5 +8295258745N/A
n41A orn2fn2|185552519355
DC_2A-n4126845252684529.7
5A_n2A-n41A
DC_3A_n28A-B3IMD5|3*fn28 −178052518755N/A
n75An282*fB3|7085257635
n75———143653.3
TABLE 12
ULULDL
UL F cBWRBDL F cBWMSD
DC bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_30A_n5A-B30IMD3|2*f B30 −231052523555N/A
n77An5f n5 |8345258795
n773786105037861016.1
B30IMD3|2*f B30 −231052523555N/A
n77f n77 |37411050374110
n5834525879515.3
B30IMD5|3*f B30 −231052523555N/A
n772*f n77 |39051050390510
n583552588054.4
TABLE 13
Uplink (UL) bandDownlink (DL) band
E-UTRA andE-UTRABS receive/UEBS transmit/UE
NR DC Bandand NR DCtransmitreceiveDuplex
combinationBandFUL_low-FUL_highFDL_low-FDL_highMode
DC_8_n28-n798880 MHz-915 MHz925 MHz-960 MHzFDD
n28703 MHz-748 MHz758 MHz-803 MHzFDD
n794400 MHz-5000 MHz4400 MHz-5000 MHzTDD
TABLE 14 — DC operating/channel bandwidth
E-UTRAMaximum
andSub-aggregated
NR DCULE-UTRAcarrierbandwidth
Config-Config-and NRSpacing51015202530405060708090100For DL
urationurationsBand[kHz]MHzMHzMHzMHzMHzMHzMHzMHzMHzMHzMHzMHzMHz[MHz]
DC_8A_DC_8A_815YesYes140
n28A-n28An2815YesYesYesYesYes
n79ADC_8A_30YesYesYesYes
n79A60
n7915YesYes
30YesYesYesYesYes
60YesYesYesYesYes
TABLE 15 — Inter-band
DCE-UTRA and NR
ConfigurationBandΔT IB, c [dB]
DC_8_n28-n7980.6
n280.5
n790.8
TABLE 16 — Inter-band
DCE-UTRA and NR
ConfigurationBandΔR IB [dB]
DC_8_n28-n7980.2
n280.2
n790.5
TABLE 17 — NR or E-UTRA Band/Channel bandwidth/NRB/MSD UL/DL
EN-DCEUTRA/NRUL F cBWULDL F cMSDDuplexIMD
Configurationband(MHz)(MHz)L CRB(MHz)(dB)modeorder
DC_8A_n28A-n79A8912.5525957.5N/AFDDN/A
n28745.5525800.5N/AFDDN/A
n7944204021644200.0FDDIMD5
8905525950N/AFDDN/A
n794420402164420N/ATDDN/A
n287455258003.9FDDIMD5
TABLE 18
ULULDL
NR CA inter-UL F cBWRBDL F cBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_7A_n12A-n77AB7IMD3|2*f n12 +25201050264010N/A
n12f B7 |7085257385
n773936105039361015.2
TABLE 19
ULULDL
NR CA inter-UL F cBWRBDL F cBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_7A_n71A-n77AB7IMD3|2*f n71 +25201050264010N/A
n71f B7 |6935256475
n773906105039061015.2
TABLE 20
ULULDL
NR CA inter-UL FcBWRBDL FcBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_5A_n2A-n41AB5IMD2|f B5 +8295258745N/A
n2f n2 |185552519355
n4126845252684529.7
TABLE 21
ULULDL
NR CA inter-UL FcBWRBDL FcBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_3A_n28A-n75AB3IMD5|3*f n28 −178052518755N/A
n282*f B3 |7085257635
n75———143653.3
TABLE 22
ULULDL
NR CA inter-UL F cBWRBDL F cBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
DC_2A-5A_n2A-B5IMD2|f B5 + f n2 |8295258745N/A
n41An2185552519355
n4126845252684529.7
TABLE 23
NR CAUplink CAHarmonic issueIMD problem
configurationconfigurationin 3rd bandin 3rd band
CA_n1A-n18A-CA_n1A-—5th IMD into n18
n28An28A
CA_n18A-—5th IMD into n1
n28A
CA_n1A-n18A-CA_n1A-—5th IMD into n18
n41An41A
CA_n18A-n28A-CA_n18A-—5th IMD into n41
n41An28A
CA_n18A-—5th IMD into n28
n41A
CA_n18A-n41A-CA_n41A-—2nd & 3rd IMDs
n77An77Ainto n18
CA_n18A-n41A-CA_n41A-—2nd IMD into n18
n78An78A
CA_n1A-n18A-CA_n1A-—5th IMD into n18
n77An77A
CA_n3A-n77A-CA_n77A-—4th & 5th IMD
n79An79Ainto n3
TABLE 24 — Diplexer-Duplexer or Triplexer-Duplexer Architecture w/single ant.
UE ref.CA_n28A-n74A, CA_n74A-n77A
architectureIP2IP3IP4IP5
Component(dBm)(dBm)(dBm)(dBm)
Ant. Switch112685555
Triplexer110725552
Diplexer115875555
Duplexer100755553
Duplexer (n74)95705050
PA Forward28.0323028
PA Reversed4030.53030
LNA1000−10
TABLE 25
Triplexer-DiplexerCascaded Diplexer
Architecture w/ single ant. or dual ant.Architecture w/ single ant.
CA_n18-n41-n77, CA_n18-n41-n78,CA_n1-n18-n28, CA_n1-n18-n41,
UE ref.CA_n1-n18-n77, CA_n3-n77-n79CA_n18-n28-n41
architectureIP2IP3IP4IP5IP2IP3IP4IP5
Component(dBm)(dBm)(dBm)(dBm)(dBm)(dBm)(dBm)(dBm)
Ant. Switch112685555112685555
Triplexer110725552
Quadplexer112725552
Diplexer115875555115875555
Duplexer100755553100755553
PA Forward28.032302828.0323028
PA Reversed4030.530304030.53030
LNA1000−101000−10
TABLE 26
Isolation ParameterValue (dB)Comment
Antenna to Antenna10Main antenna to diversity antenna
PA (out) to PA (in)60PCB isolation (PA forward mixing)
Triplexer20High/low band isolation
Diplexer25High/low band isolation
PA (out) to PA (out)60L-H/H-L cross-band
PA (out) to PA (out)50H-H cross-band
LNA (in) to PA (out)60L-H/H-L cross-band
LNA (in) to PA (out)50H-H cross-band
Duplexer50Tx band rejection at Rx band
Duplexer (n74)40Tx band rejection at Rx band
TABLE 27
ULULDL
UL FcBWRBDL FcBWMSD
DC bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
CA_n28A-n74An28IMD2|fn28 −706525761532.7
n74fn74|146752515155N/A
n28IMD4|2*fn28 −708.5525763.55N/A
n742*fn74|14655251513511.4
CA_n74A-n77An74IMD5|3*fn28 −708.5525763.556.6
n772*fn74|1444.55251492.55N/A
TABLE 28
ULULDL
NR CA inter-UL F cBWRBDL F cBWMSD
bandsUL DCIMD(MHz)(MHz)#(MHz)(MHz)(dB)
CA_n1A-n18A-n1IMD5|f n1 −196552521555N/A
n28An284*f n28 |7085257635
n1882252586754.6
n18IMD5|f n18 −8255258705N/A
n284*f n28 |7385257935
n11937525212754.0
CA_n1A_n18A-n1IMD5|3*f n1 −196052521505N/A
n41An412*f n41 |25051050250510
n1882552587053.3
CA_n18A-n28A-n18IMD5|4*f n18 −8255258705N/A
n41An28f n28 |7385257935
n41256210502562104.4
n18IMD5|4*f n18 −8255258705N/A
n41f n41 |25051050250510
n2874052579553.9
CA_n18A_n41A-n41IMD2|f n41 −25901050259010N/A
n77An77f n77 |34601050346010
n18825525870529.3
CA_n18A_n41A-n41IMD2|f n41 −25901050259010N/A
n78An78f n78 |34601050346010
n18825525870529.3
CA_n1A_n18A-n1IMD5|3*f n1 −197052521605N/A
n77An772*f n77 |33901050339010
n1882552587053.5
CA_n3A_n77A-n77IMD4|2*f n77 −33501050335010N/A
n79An79f n79 |484040216484040
n317655251860515.7
TABLE 29 — NR or E-UTRA Band/Channel bandwidth/NRB/MSD UL/DL NOTE 1: This band is subject to IMD3 also which MSD is not specified. NOTE 4: This band is subject to IMD5 also which MSD is not specified.
EN-DCEUTRA/NRUL F cBWULDL F cMSDDuplexIMD
Configurationband(MHz)(MHz)L CRB(MHz)(dB)modeorder
DC_8A-41263010502630N/ATDDN/A
41A_n77An77358010503580N/ATDDN/A
DC_8A-890552595029.1FDDIMD2 1,4
41C_n77A

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IPC · International Patent Classification
Section H — Electricity
  • H04W76/15
  • H04L5/00
  • H04W24/10

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