USPatent applicationPending
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
Pending · filed 27 Oct 2022 · 1 office action
Assignee: none recorded yet
Application· this page
18/050,099
filed 27 Oct 2022
Publication
US 20240145457 A1
published 2 May 2024
Patent
Not granted yet
still under examination
File wrapper
Examiner
Thao P. Le
art unit 2818 · TC 2800
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