LexDanaLexDanabeta
USPatent applicationPending

METHOD FOR CHUCK COMPENSATION VIA WAFER SHAPE CONTROL

Pending · filed 17 Oct 2022 · 1 office action

Assignee: none recorded yet

Application· this page
17/967,257
filed 17 Oct 2022
Publication
US 20230326738 A1
published 12 Oct 2023
Patent
Not granted yet
still under examination
Pending
Status
20
Claims as published
1 independent
none
Litigation
checked

File wrapper

Examiner
Nathan H. Empie
art unit 1712 · TC 1700

Documents

Log in to open the documents of this file: the application as filed, every office action and response, the notice of allowance.

Log in to unlock

Chain of title

No assignments have been recorded for this application yet.