Driving mechanism for optical element

This application claims the benefit of U.S. Provisional Application No. 62/861,440, filed on Jun. 14, 2019, and China Patent Applications No. 202020150619.1, filed on Feb. 3, 2020, which are incorporated by reference herein in their entirety.

The present disclosure relates to an optical element driving mechanism.

As technology has developed, it has become more common to include image-capturing and video-recording functions into many types of modern electronic devices, such as smartphones and digital cameras. These electronic devices are used more and more often, and new models have been developed that are convenient, thin, and lightweight, offering more choices for consumers.

Electronic devices that have image-capturing or video-recording functions normally include a driving mechanism to drive an optical element (such as a lens) to move along its optical axis, thereby achieving auto focus (AF) or optical image stabilization (OIS). Light may pass through the optical element and may form an image on an optical sensor. However, the trend in modern mobile devices is to have a smaller size and a higher durability. As a result, how to effectively reduce the size of the driving mechanism and how to increase its durability has become an important issue.

An optical element driving mechanism is provided, includes a movable portion, a fixed portion, a driving assembly, and a support element. The movable portion is used for connecting to an optical element having a main axis. The movable portion is movable relative to the fixed portion. The driving assembly is disposed on the fixed portion or the movable portion, and is used to drive the movable portion to move relative to the fixed portion. The movable portion is connected to the fixed portion through the support element.

In some embodiments, the driving assembly includes a first magnetic element disposed on the movable portion and a second magnetic element disposed on the fixed portion, wherein the first magnetic element and the second magnetic element at least partially overlap each other when viewed in a direction that is perpendicular to the main axis. In some embodiments, the optical element driving mechanism further includes a circuit board, and the second magnetic element is disposed on the circuit board. In some embodiments, the circuit board and the first magnetic element are separated from each other by a distance.

In some embodiments, the optical element driving mechanism further includes a position sensor, wherein the driving assembly and the position sensor are positioned on opposite sides of the circuit board. In some embodiments, the fixed portion includes a base, the base has an opening, and the position sensor is disposed in the opening. In some embodiments, the thickness of the position sensor is less than the thickness of the base along the main axis. In some embodiments, the circuit board includes magnetic permeable material. In some embodiments, the optical element driving mechanism further includes a resilient element, wherein the circuit board and the resilient element are disposed on different sides of the fixed portion. In some embodiments, the resilient element is positioned on a plane, and the normal vector of the plane is parallel to the main axis.

In some embodiments, the optical element driving mechanism further includes a magnetic permeable element, wherein the fixed portion includes a base, and the magnetic permeable element is embedded in the base. In some embodiments, the optical element driving mechanism further includes a circuit electrically connected to the driving assembly, wherein the fixed portion includes a base, and the circuit is embedded in the base. In some embodiments, the material of the support element includes ceramic or resin. In some embodiments, the fixed portion includes a base, wherein the base includes a convex portion extending to the movable portion, the support element has a spherical shape, and the minimum distance between the convex portion and the fixed portion is less than the diameter of the support element along the main axis.

In some embodiments, fixed portion includes a base having a rectangular shape, and a stopping portion extending to the movable portion. The stopping portion is positioned at a corner of the base. In some embodiments, the driving assembly includes a first magnetic element and a second magnetic element, wherein the minimum distance between the stopping portion and the movable portion is less than the minimum distance between the first magnetic element and the second magnetic element along the main axis. In some embodiments, the optical element driving mechanism has a rectangular shape, and the driving assembly is disposed at a side of the optical element driving mechanism. In some embodiments, the fixed portion includes a base having a rectangular shape, and a stopping portion extending to the movable portion. The stopping portion is positioned at a corner of the base or the side of the base. In some embodiments, the optical element driving mechanism has a rectangular shape, and the driving assembly is disposed at a corner of the optical element driving mechanism. In some embodiments the fixed portion includes a base having a rectangular shape, and a stopping portion extending to the movable portion. The stopping portion is positioned at the corner of the base or a side of the base.

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a perspective view of an optical element driving mechanism according to some embodiments of the present disclosure.

FIG. 2 is an exploded view of the optical element driving mechanism.

FIG. 3 is a cross-sectional view of the optical element driving mechanism.

FIG. 4 is a schematic view of some elements of the optical element driving mechanism.

FIG. 5 is a side view of the optical element driving mechanism.

FIG. 6 is a schematic view of the base.

FIG. 7 is an enlarged view of the portion R 4 in FIG. 5 .

FIG. 8 is a schematic view when the optical element driving mechanism is operating.

FIG. 9 is a schematic view of some elements of the optical element driving mechanism in some embodiments of the present disclosure.

FIG. 10 is an exploded view of the optical element driving mechanism.

FIG. 11 is a cross-sectional view of the optical element driving mechanism.

FIG. 12 is a side view of the optical element driving mechanism.

FIG. 13 is a schematic view of the base.

FIG. 14 is a bottom view of some elements of the optical element driving mechanism.

FIG. 15 is a schematic view of some elements of the optical element driving mechanism in some embodiments of the present disclosure.

FIG. 16 is an exploded view of the optical element driving mechanism.

FIG. 17 is a cross-sectional view of the optical element driving mechanism.

FIG. 18 is a side view of the optical element driving mechanism.

FIG. 19 is a schematic view of a resilient element.

FIG. 20 is a schematic view of some elements of the optical element driving mechanism in some embodiments of the present disclosure.

FIG. 21 is an exploded view of the optical element driving mechanism.

FIG. 22 is a side view of the optical element driving mechanism.

FIG. 23 is a top view of the optical element driving mechanism.

The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are in direct contact, and may also include embodiments in which additional features may be disposed between the first and second features, such that the first and second features may not be in direct contact.

In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Moreover, the formation of a feature on, connected to, and/or coupled to another feature in the present disclosure that follows may include embodiments in which the features are in direct contact, and may also include embodiments in which additional features may be disposed interposing the features, such that the features may not be in direct contact. In addition, spatially relative terms, for example, “vertical,” “above,” “over,” “below,”, “bottom,” etc. as well as derivatives thereof (e.g., “downwardly,” “upwardly,” etc.) are used in the present disclosure for ease of description of one feature's relationship to another feature. The spatially relative terms are intended to cover different orientations of the device, including the features.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It should be appreciated that each term, which is defined in a commonly used dictionary, should be interpreted as having a meaning conforming to the relative skills and the background or the context of the present disclosure, and should not be interpreted in an idealized or overly formal manner unless defined otherwise.

Use of ordinal terms such as “first”, “second”, etc., in the claims to modify a claim element does not by itself connote any priority, precedence, or order of one claim element over another or the temporal order in which acts of a method are performed, but are used merely as labels to distinguish one claim element having a certain name from another element having the same name (but for use of the ordinal term) to distinguish the claim elements.

In addition, in some embodiments of the present disclosure, terms concerning attachments, coupling and the like, such as “connected” and “interconnected”, refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.

In some embodiments of the present disclosure, FIG. 1 to FIG. 5 are a perspective view and an exploded view of an optical element driving mechanism 4101 , and a cross-sectional view illustrated along a line A 4 -A 4 in FIG. 1 , a schematic view and a side view of some elements of the optical element driving mechanism 4101 , respectively. In FIG. 2 , the optical element driving mechanism 4101 mainly includes, a base 4211 (or called as a fixed portion F 14 ), a movable portion 4301 , a first magnetic element 4411 , a second magnetic element 4421 , a position sensor 4431 , a circuit board 4601 , a support element 4701 , a magnetic permeable element 4801 , and a resilient element 4811 . The optical element driving mechanism 4101 may be used for driving an optical module 4990 , or it may be used for driving various optical elements, such as a lens, a mirror, a prism, a beam splitter, or an aperture.

In some embodiments, the first magnetic element 4411 and the second magnetic element 4421 may be called as a driving assembly D 14 to drive the movable portion 4301 moving relative to the fixed portion F 14 . For example, the first magnetic element 4411 and the second magnetic element 4421 may include a combination of a driving coil and a driving magnet. For example, the first magnetic element 4411 may be a driving magnet, and the second magnetic element 4421 may be a driving coil. In another example, the first magnetic element 4411 may be a coil, and the second magnetic element 4421 may be a driving magnet, and is not limited thereto. The first magnetic element 4411 and the second magnetic element 4421 may be positioned on the fixed portion F 14 and the movable portion 4301 , respectively. In some embodiments, the positions of the fixed portion F 14 and the movable portion 4301 may be interchanged. As a result, the movable portion 4301 may be driven by the driving assembly D 14 to move relative to the fixed portion F 14 , and the optical module 4990 disposed on the movable portion 4301 may move with the movable portion 4301 to achieve auto focus (AF) or optical image stabilization (OIS). In some embodiments, the optical element driving mechanism 4101 may has a rectangular shape, and the driving assembly D 14 may be disposed on the sides or the corners of the optical element driving mechanism 4101 . In some embodiments, the driving assembly D 14 may include other driving elements, such as piezoelectric elements, shape memory alloys, etc.

In some embodiments, the first magnetic element 4411 may extend in a direction that is perpendicular to the main axis O 14 , such as along X axis or Y axis, to allow the movable portion 4301 rotate relative to X axis or Y axis. In some embodiments, as shown in FIG. 3 , the driving assembly D 14 and the optical module 4990 does not overlap each other in a direction that is perpendicular to the main axis O 14 to achieve miniaturization. It should be noted that the interaction between the first magnetic element 4411 and the second magnetic element 4421 may create a magnetic force to move the optical module 4990 relative to the fixed portion F 14 , so auto focus (AF) or optical image stabilization (OIS) may be achieved.

Furthermore, the circuit board 4601 may be, for example, a flexible printed circuit, which may be affixed on the fixed portion F 14 by adhesion. In some embodiments, the circuit board 4601 is electrically connected to other electronic elements disposed inside or outside the optical element driving mechanism 4101 . For example, the circuit board 4601 may send electric signal to the driving assembly D 14 to control the movement of the movable portion 4301 . In some embodiments, the circuit board 4601 may position between the base 4211 and the movable portion 4301 in Z direction. In some embodiments, the circuit board 4601 may include magnetic permeable material to increase the electromagnetic force generated by the driving assembly D 14 .

In some embodiments, a position sensor 4431 may be disposed in the optical element driving mechanism 4101 to detect the position of the movable portion 4301 relative to the fixed portion F 14 . The position sensor 43431 may include Hall sensor, magnetoresistance effect sensor (MR Sensor), giant magnetoresistance effect sensor (GMR sensor), tunneling magnetoresistance effect sensor (TMR sensor), or fluxgate sensor. For example, a plurality of convex portions 4211 F may be positioned on the base 4211 ( FIG. 6 ), the position sensor 4431 may be positioned between two convex portions 4211 F, and the second magnetic element 4421 may surround the two convex portions 4211 F and the position sensor 4431 to protect the position sensor 4431 .

The support element 4700 may have a spherical shape for connecting the movable portion 4301 and the fixed portion F 14 to allow the movable portion 4301 may be moved relative to the fixed portion F 14 through the support element 4700 . In detail, the movable portion 4301 includes a recess 4301 A, the base 4211 includes a convex portion 4211 A extending to the movable portion 4301 , and a concave portion 4211 B positioned in the convex portion 4211 A. The support element 4700 is partially disposed in the recess 4301 A of the movable portion 4301 and the concave portion 4211 B of the base 4211 to limit the position of the support element 4700 . As shown in FIG. 3 , the recess 4301 A and the concave portion 4211 B has half-spherical shapes, so the spherical support element 4700 may roll in the recess 4301 A and the concave portion 4211 B, and the friction between the movable portion 4301 and the fixed portion F 14 may be reduced. As a result, the movable portion 4301 may rotate relative to the fixed portion F 14 . In some embodiments, the material of the support element 4700 may include ceramic or resin to prevent magnetic interference from occurring between the support element 4700 and the driving assembly D 14 . Furthermore, the minimum distance G 24 between the concave portion 4211 A and the movable portion 4301 is less than the distance DM 4 of the support element 4700 along the main axis O 14 , so the support element 4700 may be prevented from falling out from the recess 4301 A of the movable portion 4301 and the concave portion 4211 B of the base 4211 when the movable portion 4301 moving relative to the fixed portion F 14 .

As shown in FIG. 3 , the distance between the second magnetic element 4421 and the movable portion 4301 is G 14 , the distance between the convex portion 4211 A and a bottom surface 4301 B of the movable portion 4301 is G 24 , and the distance G 14 is less than the distance G 24 . As a result, the electromagnetic force between the first magnetic element 4411 disposed on the movable portion 4301 and the second magnetic element 4421 disposed on the base 4211 . Furthermore, the base 4211 includes a top surface 4211 C and a bottom surface 4211 D, the distance G 34 between the top surface 4211 C and the movable portion 4301 may be less than the distance G 44 between the bottom surface 4211 D and the movable portion 4301 , and the minimum distance G 54 between the resilient element 4810 and the bottom surface 4211 D may be less than the distance G 44 between the bottom surface 4211 D and the movable portion 4301 . As a result, the size of the optical element driving mechanism 4101 along the main axis O 14 may be reduced to achieve miniaturization.

The resilient elements 4810 may be disposed on the sides of the optical element driving mechanism 4101 , such as disposed on opposite sides of the optical element driving mechanism 4101 , and the main axis O 14 is positioned between two resilient elements 4810 . Furthermore, the resilient elements 4810 may be disposed on a plane that is perpendicular to the main axis O 14 . Furthermore, the resilient element 4810 may be S-shaped. The resilient element 4810 may connect the fixed portion F 14 (the base 4211 ) and the movable portion 4301 to restrict the movable range of the movable portion 4301 relative to the fixed portion F 14 . Moreover, as shown in FIG. 3 , FIG. 4 , and FIG. 5 , the base 4211 may has a recess 4211 E at its side, and the resilient element 4810 may be partially disposed in the recess 4211 E to protect the resilient element 4810 from being damaged. The resilient elements 4810 does not overlap the driving assembly D 14 when viewed along the main axis O 14 , so the size of the optical element driving mechanism 4101 in Z axis may be reduced.

As shown in FIG. 3 , the magnetic permeable element 4801 may be disposed in the base 4211 —for example, it may be embedded in the base 4211 —and is not exposed from the base 4211 . The magnetic permeable element 4801 , the first magnetic element 4411 and the second magnetic element 4421 may at least partially overlap each other along the main axis O 14 , and the material of the magnetic permeable element 4801 may include metal. As a result, the magnetic field of the first magnetic element 4411 and the second magnetic element 4421 may be adjusted, and miniaturization may be achieved. Furthermore, a magnetic force may be generated between the first magnetic element 4411 or the second magnetic element 4421 and the magnetic permeable element 4801 , so the elements disposed between the first magnetic element 4411 , the second magnetic element 4421 and the magnetic permeable element 4801 may be fixed.

FIG. 6 is a schematic view of the base 4211 . The base 4211 may include convex portions 4211 F that extend pair by pair in Z direction. The second magnetic element 4421 may surround two convex portions 4211 F, the position sensor 4431 may be positioned between two convex portions 4211 F, and the second magnetic element 4421 may surround the position sensor 4431 . Furthermore, the base 4211 may include stopping portions 4211 G to limit the movable range of the movable portion 4301 relative to the base 4211 . In some embodiments, the circuit may be provided in the base 4211 —for example, it may be embedded in the base 4211 (not shown)—and it may be electrically connected to the driving assembly D 14 to provide an electrical signal. In some embodiments, the stopping portions 4211 G may be positioned at the corners of the base 4211 to further utilize the space at the corners. However, the present disclosure is not limited thereto. For example, stopping portions that extends to the movable portion 4301 may be disposed on the sides of the base 4211 (not shown).

FIG. 7 is an enlarged view of the portion R 4 in FIG. 5 . As shown in FIG. 7 , the distance G 64 between the first magnetic element 4411 and the second magnetic element 4421 is greater than the distance G 74 between the stopping portion 4211 G and the movable portion 4301 . As a result, the first magnetic element 4411 and the second magnetic element 4421 may be prevented from colliding with each other.

FIG. 8 is a cross-sectional view of the movable portion 4301 of the optical element driving mechanism 4101 and other elements disposed on the movable portion 4301 when these elements rotate in Y axis relative to the fixed portion F 14 . As shown in FIG. 8 , the movable portion 4301 and the optical module 4990 disposed on the movable portion 4301 may use the spherical support element 4700 as a fulcrum to rotate in different directions by the force generated from the driving assembly D 14 . Although the embodiment in FIG. 8 only shows the movable portion 4301 rotating in a single axis, but it should be noted that the movable portion 4301 may rotate in more than one axes, such as X, Y, and Z axes, to achieve optical image stabilization (OIS).

Although the second magnetic element 4421 in aforementioned embodiments surrounds the convex portions 4211 F of the base 4211 , the present disclosure is not limited thereto. For example, FIG. 9 to FIG. 12 are a schematic view, an exploded view of the optical element driving mechanism 4102 in another embodiments of the present disclosure, a cross-sectional view illustrated along the line B 4 -B 4 in FIG. 9 , and a side view of the optical element driving mechanism 4102 , respectively. It should be noted that some elements are omitted in FIG. 9 for clarity.

In FIG. 10 , the optical element driving mechanism 4102 mainly includes a base 4212 (or called as a fixed portion F 24 ), a movable portion 4302 , a first magnetic element 4412 and a second magnetic element 4422 (may be called as a driving assembly D 24 ), a position sensor 4432 , a circuit board 4602 , a support element 4700 , a magnetic permeable element 4802 , and a resilient element 4810 . The optical element driving mechanism 4102 may be used to drive the optical module 4990 or other optical elements. Identical or similar elements are not described again.

In this embodiment, as shown in FIG. 9 and FIG. 11 , the first magnetic element 4412 may be disposed in the second magnetic element 4422 . In other words, as shown in FIG. 12 , the first magnetic element 4412 and the second magnetic element 4422 are at least partially overlap each other to reduce the required space in a direction that is perpendicular to the main axis O 24 . In some embodiments, the second magnetic element 4422 may be disposed on the circuit board 4602 , and the first magnetic element 4412 may be disposed on the movable portion 4302 and may be separated from the circuit board 4602 by a distance. In some embodiments, the first magnetic element 4412 may be disposed in the movable portion 4302 to fix the first magnetic element 4412 . In some embodiments, the positions of the first magnetic element 4412 and the second magnetic element 4422 may be interchanged. As a result, the electromagnetic force generated between the first magnetic element 4412 and the second magnetic element 4422 may drive the movable portion 4302 to move relative to the fixed portion F 24 .

FIG. 13 is a schematic view of the base 4212 , and FIG. 14 is a bottom view of the base 4212 and the position sensor 4432 . An opening 4212 A may be formed on the base 4212 , and the position sensor 4432 may be positioned in the opening 4212 A to protect the position sensor 4432 and achieving miniaturization. In other words, the position sensor 4432 and the driving assembly D 24 may be disposed on the same side ( FIG. 9 ) or they may be disposed on opposite sides ( FIG. 14 ) of the circuit board 4602 . Furthermore, the thickness of the position sensor 4432 may be less than the thickness of the base 4212 along the main axis O 24 , so the position sensor 4432 may be protected by the base 4212 . In some embodiments, the opening 4212 A may be replaced by a recess to increase the mechanical strength of the base 4212 . In some embodiments, the first magnetic element 4412 or the second magnetic element 4422 may at least partially overlap the position sensor 4432 along the main axis O 24 to detect the magnetic field variation of the first magnetic element 4412 or the second magnetic element 4422 .

In the aforementioned embodiments, the movable portion and the fixed portion are connected by the resilient elements 4810 disposed on the sides of the optical element driving mechanism, but the present disclosure is not limited thereto. For example, FIG. 15 to FIG. 15 are a schematic view, an exploded view, a cross-sectional view, and a side view of an optical element driving mechanism 4103 , respectively. It should be noted that some elements are omitted in FIG. 15 for clarity.

In FIG. 16 , the optical element driving mechanism 4103 mainly includes a base 4213 (or called as a fixed portion F 34 ), a movable portion 4303 , a first magnetic element 4413 and a second magnetic element 4423 (may be called as a driving assembly D 34 ), a position sensor 4433 , a circuit board 4603 , a support element 4700 , a magnetic permeable element 4803 , and a resilient element 4820 . The optical element driving mechanism 4103 may be used to drive the optical module 4990 or other optical elements. Identical or similar elements are not described again.

In the optical element driving mechanism 4103 , the movable portion 4303 and the fixed portion F 34 are connected by the resilient element 4802 rather than the resilient element 4810 in previous embodiments. FIG. 19 is a schematic view of the resilient element 4820 . The resilient element 4820 includes an inner portion 4821 , an extension portion 4822 , a connecting portion 4834 connecting the inner portion 4821 and the extension portion 4822 , a contact portion 4824 positioned at an end of the extension portion 4822 , and a contact portion 4825 positioned on the inner portion 4821 . As shown in FIG. 15 , the contact portion 4824 may be directly disposed on the base 4213 and connect to the base 4213 , such as affixed on the base 4213 by gluing. The contact portion 4825 may be disposed on the movable portion 4303 (not shown in FIG. 15 ). As a result, the movable portion 4304 and the fixed portion F 34 may be connected by a single resilient element 4820 . In some embodiments, the circuit board 4303 and the resilient element 4820 may be disposed on different sides of the fixed portion F 34 to reduce required space. In some embodiments, the resilient element 4820 is disposed on a plane having a normal vector that is parallel to the main axis O 34 .

It should be noted that the contact portion 4824 and/or the contact portion 4825 of the resilient element 4820 may be disposed on opposite sides of the optical element driving mechanism 4103 (opposite sides relative to the main axis O 34 ) to balance the forces of the optical element driving mechanism 4103 in different directions. Furthermore, the contact portion 4824 and the contact portion 4825 may be positioned at different sides of the inner portion 4821 . For example, as shown in FIG. 19 , the contact portion 4824 is disposed on the outer side of the inner portion 4821 , and the contact portion 4825 is disposed at the inner side of the inner portion 4821 . However, the positions of the contact portion 4824 and the contact portion 4825 may be interchanged. As a result, required space may be reduced to achieve miniaturization. The resilient element 4820 may be disposed on a plate that is substantially perpendicular to the main axis O 34 . As a result, the rotation of the movable portion 4303 relative to the main axis O 34 may be restricted.

In some embodiments, the resilient element 4810 and the resilient element that is disposed on the XY plane may be provided at the same time. For example, FIG. 20 to FIG. 22 are a schematic view, an exploded view, and a side view of an optical element driving mechanism 4104 in another embodiments of the present disclosure.

In FIG. 21 , the optical element driving mechanism 4104 mainly includes a base 4214 (or called as a fixed portion F 44 ), a movable portion 4304 , a first magnetic element 4414 and a second magnetic element 4424 (may be called as a driving assembly D 44 ), a position sensor 4434 , a circuit board 4604 , a support element 4700 , a magnetic permeable element 4804 , resilient elements 4810 , and resilient elements 4811 . The optical element driving mechanism 4104 may be used to drive the optical module 4990 or other optical elements. Identical or similar elements are not described again.

As shown in FIG. 22 , the resilient elements 4810 and the resilient elements 4811 may connect to the movable portion 4304 and the fixed portion 4214 , wherein the two resilient elements 4810 are disposed on two sides of the optical element driving mechanism 4104 , and the resilient elements 4811 are disposed on another two sides of the optical element driving mechanism 4104 . Furthermore, the resilient elements 4810 and the resilient elements 4811 are disposed on different sides of the optical element driving mechanism 4104 . As a result, the maximum movable range of the movable portion 4304 indifferent directions relative to the fixed portion F 44 may be restricted. The required space in a single side of the optical element driving mechanism 4104 may be reduced by letting the resilient elements 4810 and the resilient elements 4811 disposed on different sides of the optical element driving mechanism 4104 , and miniaturization may be achieved.

FIG. 23 is a top view of the optical element driving mechanism 4104 . As shown in FIG. 23 , the optical element driving mechanism 4104 has a rectangular shape, wherein the length is L 4 , the width is W 4 , and the length L 4 is greater than the width W 4 . As a result, the size of the optical element driving mechanism 4104 in X axis may be reduced to achieve miniaturization.

In summary, an optical element driving mechanism is provided. The design of the present disclosure provides the optical element with additional directions of motion, so the performance of the optical module is improved, and miniaturization can be achieved.

Although embodiments of the present disclosure and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are intended to include within their scope of such processes, machines, manufacture, and compositions of matter, means, methods, or steps. In addition, each claim constitutes a separate embodiment, and the combination of various claims and embodiments are within the scope of the disclosure.