Optical device, optical module using the same, and test method for optical device

This application is based upon and claims priority to earlier filed Japanese Patent Application No. 2019-048904 filed Mar. 15, 2019, which is incorporated herein by reference in its entirety.

The present invention relates to an optical device used in optical communications, an optical module using the same, and a test method for an optical device.

To reduce the size of optical transceivers used in optical communications, photonic integrated circuits (ICs) that integrate various optical elements such as an optical modulator, a light receiving element, and an optical multiplexer demultiplexer on a silicon substrate have been developed.

In the mass production process of photonic ICs, individual chips are tested and inspected. It is efficient to test individual chips on a wafer before the wafer is cut into dice. When a test is performed in a wafer state (which may be referred to as “wafer-level testing”), a probe is pressed against an electrode pad formed in a chip area on a wafer in order for inputting and outputting electric signals, while light is input and output to and from the wafer surface in a scribe region using an optical fiber.

As illustrated in FIG. 1 , grating couplers (denoted as “GC”s in the figure) are provided in the scribe region in order to input and output light to and from the wafer surface. Such grating couplers include a received signal input GC (denoted as “Rx-Sig input” in the figure), transmission light and reference light input GC (denoted as “Tx input, Rx-LO input” in the figure), and signal transmission GC (denoted as “Tx-output” in the figure). The end faces of optical fibers are brought to be close to these GCs to input and extract light beams.

Photonic waveguides extending from the GCs to the chip area are connected to the signal output port P out of the transmission circuit, the signal input port P in of the receiver circuit, and the optical input port P com used common to transmission and reception, respectively. With this configuration, light can be input to the transmission circuit and the receiver circuit from the wafer surface, and testing or inspection of a chip can be carried out in a wafer state. After the testing, the wafer is cut along the dicing line and separated into individual photonic IC chips. The GCs used for the testing are cut out from the photonic IC chip and do not remain on the chip.

Patent Document 1: Japanese Patent Application. Laid-open Publication No. 2005-286803A

Patent Document 2: U.S. Patent Application Publication No. 2018/0292680

According to one aspect of the invention, an optical device has

an optical transmitter circuit formed in a substrate,

a first port configured to output an optical signal generated by the optical transmitter circuit from an edge of the substrate during services and to input a test light from the edge of the substrate during a test, and

a photodetector configured to detect the test light input from the first port.

The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive to the invention as claimed.

FIG. 1 is a schematic diagram illustrating conventional wafer-level testing;

FIG. 2 illustrates a structure conceivable for testing at a chip edge;

FIG. 3 is a schematic diagram of an optical device according to the first embodiment;

FIG. 4 is a schematic diagram of an optical device according to the second embodiment;

FIG. 5 is a schematic diagram of an optical device according to the third embodiment;

FIG. 6 is a schematic diagram of an optical device according to the fourth embodiment; and

FIG. 7 illustrates an example of an optical module using an optical device of an embodiment.

The configuration of FIG. 1 is incapable of evaluating connection loss between the optical fiber and the photonic waveguide at the edge of the chip. It may be conceivable to, after dicing, press an optical fiber array against the edge of the chip to input a light beam directly to the photonic waveguide formed in the chip substrate. However, this method requires precise alignment between optical axes in order for bringing the optical axes of multiple optical fibers into alignment with the photonic waveguide cores. The photonic waveguides fabricated in a photonic IC by silicon photonics technology is small in size, and it takes time to complete the alignment between the optical fiber and the photonic waveguide. It is desirable to provide a configuration and a method that enable testing or inspection of an optical device in a short time.

In the embodiment, a configuration in which connection loss between a photonic waveguide and an external optical fiber can be measured in a short time at an edge of the substrate of an optical device is achieved. Prior to describing a specific structure of the embodiment, a configuration conceivable during a process leading to the embodiment and a problem arising therefrom will be explained.

FIG. 2 illustrates a configuration of an optical device conceivable for testing a fiber connection loss. A photonic IC 10 , which is an example of an optical device, includes an optical transmitter circuit Tx having optical modulators (modXI, modXQ, modYI, modYQ) and an optical receiver circuit Rx having photodetectors (PDXI, PDXQ, PDYI, PDYQ).

The optical receiver circuit Rx also has a variable optical attenuator VOA 1 , monitor detectors mPD 1 and mPD 2 , a polarization beam splitter PBS, a polarization rotator PR 1 , and a 90-degree hybrid optical mixer (90Hybrid), in addition to the photodetectors.

The optical transmitter circuit Tx also has variable optical attenuators VOA 2 and VOA 3 , monitor detectors mPD 3 and mPD 4 , a polarization rotator PR 2 , and a polarization beam combiner PBC, in addition to the optical modulator.

A fiber array 140 is abutted against the first edge Ed 1 of the substrate 101 of the photonic IC 10 , and optical fibers are connected to the signal input port P in of the optical receiver circuit Rx, the signal output port P out of the optical transmitter circuit Tx, and the common input port P com , respectively. The common input port P com is used in common by the optical transmitter circuit Tx and the optical receiver circuit Rx, and the light incident from the common input port P com is split by a 1:N optical coupler 125 . One of the split light components is supplied to the optical transmitter circuit Tx to generate a modulated optical signal. The other of the split light components is supplied to the optical receiver circuit Rx and used as local oscillating (LO) light for detecting the received signal.

The fiber connection loss of the signal input port P in at the receiver side can be evaluated by inputting test light to the signal input port P in and measuring the photocurrent detected by the monitor detector mPD 1 provided on a path branched from the photonic input waveguide 111 . The photocurrent output from the monitor detector mPD 1 may be measured by bringing a direct-current (DC) probe 30 b into physical contact with an electrode pad connected to the monitor detector mPD 1 within the electrode pad array 31 - 2 provided along the second edge Ed 2 of the photonic IC 10 .

The fiber connection loss at the common input port P com can be evaluated by inputting test light to the common input port P com and measuring the photocurrent in any one of the photodetectors (for example, at PDXI). The photocurrent output from the photodetector PDXI may be measured by bringing the DC probe 30 c into physical contact with an electrode pad group connected to the PDXI within the electrode pad array 31 - 3 provided along the third edge Ed 3 of the photonic IC 10 .

To evaluate the fiber connection loss of the signal output port P out at the transmitter side, light is input to the common input port P com , and a portion of the input light is supplied to the Tx site. Then, the light output from the signal output port P out is extracted by the optical fiber to measure the output level. To do this measurement, at least a two-core optical fiber array is used and the optical axes of the optical fibers have to be aligned simultaneously at the common input port P com and the signal output port P out .

In the photonic IC 10 using a silicon photonics technology, the size of the photonic waveguide is small. Even when a typical six-axis fiber alignment unit is used, it takes time to align the optical axis of an optical fiber. When the optical axis alignment is carried out at different port positions simultaneously using a two-core optical fiber array, the alignment time is further increased.

Besides, to evaluate the loss of the optical transmitter circuit Tx, the electric current and the voltage to be applied to each of the optical modulators (modXI, modXQ, modYI, and modYQ) are regulated to adjust the phase of light, and the output power levels of the variable optical attenuators VOA 2 and VOA 3 are adjusted. For these adjustments, the DC probe 30 a is brought into contact with the electrode pad array 31 - 1 provided along the first edge Ed 1 of the photonic IC 10 to monitor the modulated light signal. Due to the adjustment of the electric current or voltage level for optical modulation, the time required for preparation for the testing is further increased.

A novel configuration that enables measurement of the fiber connection loss at the edge of the substrate in a short time, while suppressing increase in the time required for preparation of the testing, is desired.

First Embodiment

FIG. 3 is a schematic diagram of a photonic IC 10 A according to the first embodiment. The photonic IC 10 is used as a front-end circuit of optical communication to perform optical-to-electric conversion and electric-to-optical conversion. In this embodiment, the fiber connection loss is measured at the edge of the substrate 101 using a single optical fiber.

The photonic IC 10 A includes an optical transmitter circuit Tx having a modulator block 12 and an optical receiver circuit Rx having a photodetector block 11 . During actual services, light emitted from a light source such as a laser diode (ID) is input to the common input port P com , and the input light is split at a 1:N optical coupler 125 . One of the split light components is guided to the optical transmitter circuit Tx, and the other is guided to the optical receiver circuit Rx.

In the optical transmitter circuit Tx, a high-frequency (RE) electric signal and a light beam output from the light source are input to each of the optical modulators 12 a to 12 d . In this example, the photonic IC 10 A operates in a dual polarization-Quadrature Phase Shift Keying (DP-QPSK) scheme to produce four logical values using mutually orthogonal two polarizations and two phase components with a 90-degree phase difference; however, the invention is not limited to this example.

The optical phases of the light beams modulated by the RF signals at the respective optical modulators 12 a to 12 b are adjusted by DC biases, and the in-phase (I) component and the quadrature (Q) component are multiplexed at each of the polarization branches. The light multiplexed at each of the polarization branches is power-adjusted by one of the variable optical attenuators VOA 2 and VOA 3 , and then subjected to polarization-multiplexing through the polarization rotator PR 2 and the polarization beam combiner PBC. The polarization-multiplexed optical signal is output from the signal output port P out .

A tap waveguide 141 is provided to a photonic waveguide 133 extending from the output of the VOA 2 , and a monitor detector mPD 3 is connected to the tap waveguide 141 . During actual services, the monitor detector mPD 3 monitors a portion of the I-Q multiplexed optical signal at one of the polarization branches. Similarly, a tap waveguide 142 is provided to a photonic waveguide 134 extending from the output of the VOA 3 , and a monitor detector mPD 4 is connected to the tap waveguide 142 . During actual services, the monitor detector mPD 4 monitors a portion of the I-Q multiplexed optical signal at the other polarization branch.

The outputs of the monitor detectors mPD 3 and mPD 4 are electrically connected to a part of the electrode pad array 31 - 1 . During services, the monitoring results are extracted through electrical wiring; however, in the connection loss testing, it is unnecessary to use the monitor detectors mPD 3 and mPD 4 .

One of the features of the embodiment is that, for the testing of the fiber connection loss of the photonic IC 10 A, test light is input to the signal output port P out using a single-core spherical lensed fiber 40 . In addition, a tap waveguide 132 is provided to a photonic waveguide 131 connected to the signal output port P out , and a portion of the input test light is detected by the PD 15 , The PD 15 is electrically connected to a test pad 31 - 9 . By bringing a DC probe 30 d into contact with the test pad 31 - 9 , photocurrent of the test light is measured. The test light is input from the signal output port P out on the transmitter side, and is monitored adjacent to or in the vicinity of the signal output port P out to evaluate the fiber connection loss at the transmission frontend.

With this configuration, the connection loss at the edge of the transmitter side can be measured using a single optical fiber and a single DC probe 30 d , and time-consuming core-alignment of a two-core fiber array is unnecessary. Besides, phase adjustment of the respective optical modulators 12 a to 12 d and power adjustment of the VOA 2 and VOA 3 are also unnecessary for the measurement of the connection loss. As a result, testing time for the fiber connection loss can be reduced.

For connection loss test at the signal input port P in of the receiver side of the photonic IC 10 A, a part of the electrode pad array 31 - 2 is used. In this case, test light is input to the signal input port P in using a spherical lensed fiber 40 , and photocurrent is measured at, the electrode pad connected to the mPD 1 . During actual services, the electrode pad array 31 - 2 is used for power monitoring of the received light.

For connection loss test at the common input port P com , a part of the electrode pad array 31 - 3 is used. In this case, test light is input to the common input port P com using a spherical lensed fiber 40 , while applying a probe onto an electrode pad connected to one of the PDs of the photodiode block 11 to measure the output current. In actual services, the electrode pad array 31 - 3 is used for extracting differential signals from the received light signal.

An electrode pad array 31 - 4 is not used during the connection loss test, but is used to input differential RE signals during actual services.

With the configuration of FIG. 3 , optical axis alignment time of an optical fiber array, phase adjustment time of optical modulators, and power adjustment time of VOAs become unnecessary, and consequently, test time can be reduced.

Second Embodiment

FIG. 4 is a schematic diagram of a photonic IC 10 B according to the second embodiment. In the second embodiment, fiber connection loss is tested at the edge of the substrate 101 using a single optical fiber. In the above-described first embodiment, the fiber connection loss is measured in a time-efficient manner by making use of the signal output port P out of the transmitter side as a test light input port. However, insertion loss may be caused by a tap waveguide 132 provided near the signal output port P out for monitoring the input test light.

In the second embodiment, in order to suppress the insertion loss, optical couplers provided in the photonic waveguides 133 and 134 extending between the modulator block 12 and the polarization beam combiner PBC are designed as directional couplers 151 and 152 for extracting the test light. The directional couplers 151 and 152 are, for example, 2-input 2-output (2×2) directional couplers. PD 16 and PD 17 are connected to the directional couplers 151 and 152 , respectively, to measure the inputted test light.

A monitor detector mPD 3 is connected to one of the ports provided on one side of the directional coupler 151 in the optical axis direction, and a PD 16 is connected to one of the ports provided on the other side of the directional coupler 151 . In actual services, a portion of the modulated optical signal output from one of the polarization branches is monitored by the monitor detector mPD 3 . In this case, the port connected to the monitor detector mPD 3 becomes an output port of the directional coupler 151 .

In the testing, test light is input from the signal output port P out and split into two by the polarization beam combiner “PBC”. One of the split components of the test light is detected by PD 16 . The port connected to the PD 16 becomes an output port of the directional coupler 151 for the test light. The PD 16 is electrically connected to a test pad 31 - 5 .

A monitor detector mPD 4 is connected to one of the ports provided on one side of the directional coupler 152 in the optical axis direction, and a PD 17 is connected to one of the ports provided on the other side of the directional coupler 151 . In actual services, a portion of the modulated optical signal output from the other of the polarization branches is monitored by the monitor detector mPD 4 . In this case, the port connected to the monitor detector mPD 4 becomes an output port of the directional coupler 152 .

In the testing, test light is input from the signal output port P out , and split into two by the polarization beam combiner “PBC”. One of the split components of the test light is subjected to polarization rotation by a polarization rotator PR 2 , and detected by PD 17 . The port connected to the PD 17 becomes an output port of the directional coupler 151 for the test light. The PD 17 is electrically connected to a test pad 31 - 6 .

The output of the PD 16 and the output of the PD 17 are measured at the test pad 31 - 5 and the test pad 31 - 6 , respectively, using a DC probe 30 e.

In actual services, a light beam is input from the common input port P com and split by the 1: N optical coupler 125 . One of the split components is input to the modulator block 12 through the photonic waveguide 123 and subjected to optical modulation. A portion of the modulated light output from one of the polarization branches is guided through the directional coupler 151 to the monitor detector mPD 3 for monitoring the output power. A portion of the modulated light output from the other of the polarization branches is guided through the directional coupler 152 to the monitor detector mPD 4 for monitoring the output power.

During the testing of the fiber connection loss of the signal input port P in at the receiver side, test light is input to the signal input port P in by the spherical lensed fiber 40 . The test light is measured using the monitor detector mPD 1 and a pad of the electrode pad array 31 - 2 . In actual services, the electrode pad array 31 - 2 is used for power monitoring of the received light.

During the testing of the fiber connection loss of the common input port P com , test light is input to the common input port P com by the spherical lensed fiber 40 . The test light is measured using any one of the photodetectors in the photodetector block 11 and a part of electrode pad array 31 - 3 . In actual services, the electrode pad array 31 - 3 is used for extracting differential photocurrents from the photodetector block 11 .

The electrode pad array 31 - 4 is not used during the connection loss test, but is used for inputting differential RF signals in actual services.

With the configuration of FIG. 4 , optical axis alignment time of an optical fiber array, phase adjustment time of optical modulators, and power adjustment time for VOA 2 and VOA 3 becomes unnecessary, and test time can be reduced. Because the directional couplers 151 and 152 connected to the monitor detectors mPD 3 and mPD 4 used in actual services can be utilized as test taps, increase in insertion loss due to adding extra tap waveguide is substantially reduced to almost zero.

Besides, fiber connection loss of the signal output port P out at the transmitter side can be evaluated for both polarizations of TE light and TM light, and the test performance is improved.

Third Embodiment

FIG. 5 is a schematic diagram of a photonic IC 10 C according to the third embodiment. Also in the third embodiment, fiber connection loss is tested at the edge of the substrate 101 using a single optical fiber. In the second embodiment, the signal output port P out on the transmitter side is used as an input port for test light, and the test light is extracted and measured using the directional couplers 151 and 152 , thereby achieving time-efficient measurement of fiber connection loss for TE light and TM light.

In the second embodiment, a group of electrode pads used in services and the test pads 31 - 5 and 31 - 6 co-exist at the first edge Ed 1 of the photonic IC 10 B, which may be an obstacle during the probe test or when providing the electrode pads.

In the third embodiment, the test pads for evaluating the connection loss of the signal output port P out are provided separately from the electrode pad array used in services. For example, the test pads are provided to or near the third edge Ed 3 opposite to the first edge Ed 1 so as to avoid interference in operation due to mixing up of pads.

At the transmitter (Tx) side of the photonic IC 10 C, directional couplers 151 and 152 are provided in the photonic waveguides 133 and 134 , respectively, between the modulator block 12 and the polarization beam combiner PBC. The monitor detector mPD 3 is connected to one of the ports at one side of the directional coupler 151 in the optical axis direction, and the PD 16 is connected to one of the ports at the other side of the directional coupler 151 . The monitor detector mPD 4 is connected to one of the ports at one side of the directional coupler 152 in the optical axis direction, and the PD 17 is connected to one of the ports at the other side of the directional coupler 152 .

In the testing, test light is input from the signal output port P out , and split into two by the polarization beam combiner “PBC”. One of the split components of the test light is guided to the PD 16 by the directional coupler 151 . The direction of polarization of the other split component of the test light is rotated by 90 degrees at the polarization rotator PR 2 , and then guided to the PD 17 by the directional coupler 152 .

The PD 16 is connected to a test pad 31 - 7 provided near the third edge Ed 1 of the photonic IC 10 C. The PD 17 is connected to a test pad 31 - 8 provided near the third edge Ed 1 , A DC probe 30 f is brought into contact with the test pads 31 - 7 and 31 - 8 to measure the test light input from the signal output port P out .

In actual services, a light beam is input from the common input port P com and split by the 1: N optical coupler 125 . One of the split components is input to the respective optical modulators 12 a to 12 d of the modulator block 12 , and modulated by RF signals input from electrode pad array 31 - 4 .

Light components modulated at one of the polarization branches are combined and power-adjusted by VOA 2 , and further propagate through the photonic waveguide 133 . A portion of the combined modulated light is branched at the directional coupler 151 , and monitored by the monitor detector mPD 3 .

Light components modulated at the other of the polarization branches are combined and power-adjusted by VOA 3 , and further propagate through the photonic waveguide 134 . A portion of the combined modulated light is branched at the directional coupler 152 , and monitored by the monitor detector mPD 4 .

The configurations and operations, other than the positions of the test pads 31 - 7 and 31 - 8 , of the crotonic IC 10 C are the same as those of the photonic IC 10 B of the second embodiment. The same elements are denoted by the same symbols, and redundant explanation will be omitted.

In the third embodiment, fiber connection loss arising at the edge of the substrate 101 can be evaluated in a short time for both TB light and TM light. Because the test pads 31 - 7 and 31 - 8 are provided separately from other electrode pad arrays, interference between the spherical lensed fiber 40 and the DC probe 30 f is prevented, and implementation of the electrode pad array is facilitated.

Fourth Embodiment

FIG. 6 is a schematic diagram of a photonic IC 10 D according to the fourth embodiment. Also in the fourth embodiment, fiber connection loss is tested at the edge of the substrate 101 using a single optical fiber. In the second and third embodiments, fiber connection loss can be tested in a time-efficient manner for both the TE light and the TM light by providing a specific area for arranging test pads on the chip.

In the fourth embodiment, fiber connection loss is tested at the edge of the substrate 101 using directional couplers, and by making use of the monitor detectors mod's and electrode pads that are actually used in services.

At the transmitter side of the photonic IC 10 D, directional couplers 151 and 152 are provided in the photonic waveguides 133 and 134 , respectively, between the modulator block 12 and the polarization beam combiner “PBC”. The directional couplers 151 and 152 are 2×2 optical couplers in this example.

In the directional coupler 151 , one end of a photonic waveguide 153 arranged in parallel with the photonic waveguide 133 is connected to one terminal of the monitor detector mPD 3 , and the other end of the photonic waveguide 153 is connected to the other terminal of the monitor detector mPD 3 . A closed optical path is formed by the photonic waveguide 153 and the monitor detector mPD 3 .

In the directional coupler 152 , one end of a photonic waveguide 154 arranged in parallel with the photonic waveguide 134 is connected to one terminal of the monitor detector mPD 4 , and the other end of the photonic waveguide 154 is connected to the other terminal of the monitor detector mPD 4 . A closed optical path is formed by the photonic waveguide 154 and the monitor detector mPD 4 .

During the test, the test light input from the signal output port P out is split by the polarization beam combiner “PBC”. One of the split components of the test light is incident on the mPD 3 through the directional coupler 151 . The polarization direction of the other split component, of the test light is rotated by 90 degrees by the polarization rotator PR 2 , and then guided to the mPD 4 by the directional, coupler 152 .

The monitor detector mPD 3 is connected to the electrode pad 31 - 1 a in the electrode pad array 31 - 1 provided to the first edge Ed 1 of the photonic IC 10 D. The monitor detector mPD 4 is connected to the electrode pad 31 - 1 b in the electrode pad array 31 - 1 .

While the test light is input to the signal output port P out using a spherical lensed fiber 40 , the DC probe 30 g is brought into contact with the electrode pads 31 - 1 a and 31 - 1 b to measure the test light.

In actual services, light input from the common input port P com is split by the 1: N optical coupler 125 , and one of the split light components is guided to the transmitter (Tx) side. The light supplied to the transmitter (Tx) side is further branched and input to the respective optical modulators 12 a to 12 d and modulated by RF signals input from the electrode pad array 31 - 4 . The light components modulated at one of the polarization branches are combined and power-adjusted by the VOA 2 . The power-adjusted light signal further propagates through the photonic waveguide 133 . A portion of the light signal is branched by the directional coupler 151 and monitored by the monitor detector mPD 3 .

The light components modulated at the other polarization branch are combined and power-adjusted by the VOA 3 . The power-adjusted light signal further propagates through the photonic waveguide 134 . A portion of the light signal is branched by the directional coupler 152 and monitored by the monitor detector mPD 4 .

In the fourth embodiment, fiber connection loss at the edge of the substrate 101 can be tested in a short time for both TE light and TM light. By making use the monitor detectors mPD 3 and mPD 4 used in actual services for the testing of the fiber connection loss, the area size required for the testing on the chip can be reduced. This results in downsizing of the photonic IC 10 D itself. Because there is no need to pay attention to the layout of the test pads, design of the photonic IC 10 D is facilitated.

<Application of Optical Module>

FIG. 7 is a schematic diagram of an application of photonic ICs 10 A to 10 D (which may be comprehensively referred to as “optical device 10 ”). The optical device 10 of an embodiment may be housed in a single package together with an electric circuit chip 20 to form an optical transceiver package 210 . The optical transceiver package 210 is an example of an optical module.

The electric circuit chip 20 includes, for example, a driver circuit for driving the optical modulators 12 a to 12 d at high frequency, and a transimpedance amplifier for converting the photocurrent output from each PD of the photodetector block 11 into a voltage signal.

The optical transceiver package 210 may be housed in a package 230 together with a ID 201 and a DSP 220 to assemble an optical transceiver 200 . The optical transceiver 200 is also an example of the optical module.

In the optical device 10 , fiber connection loss has already been tested at each of the signal input port P in of the receiver side, the signal output port P out of the transmitter side, and the common input port P com , and the performance is guaranteed. Because the time required for testing the fiber connection loss is shortened, the production efficiency of the optical transceiver package 210 or the optical transceiver 200 is improved.

The above-described embodiments are just examples, and various modifications and substitutions are possible. The configuration of the modulator block 12 of the optical device 10 is applicable not only to the DP-QPSK modulation scheme, but also to a configuration in which multiple signal paths or channels are formed by photonic waveguides for 16 quadrature amplitude modulation (16 QAM), quadrature phase shift keying (QPSK), or other modulation schemes. In such cases, time required for testing fiber connection is reduced at signal input port P in of the receiver side, the signal output port P out of the transmitter side, or the common input port P com .

In the first embodiment ( FIG. 3 ), the positions of the tap waveguide 132 , the PD 15 , and the test pad 31 - 9 are not limited to those between the signal output port P out and the common input port P com . The tap waveguide 132 , the PD 15 , and the test pad 31 - 9 may be provided at other positions on the chip as long as the test light input from the signal output port P out can be monitored. In the third embodiment ( FIG. 5 ), the test pads 31 - 7 and 31 - 8 may not always be provided near the third edge Ed 3 . The test pads 31 - 7 and 31 - 8 may be provided near the second edge Ed 2 or the fourth edge Ed 4 as long as there is no adverse influence to other optical elements.

In either case, the optical device 10 is effectively used for a compact package in which an optical transmitter function and an optical receiver function are integrated on one chip. Because the time required for testing fiber connection loss at the edge of the chip is reduced, the device performance and the production efficiency are improved.

All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of superiority or inferiority of the invention. Although the embodiments of the present inventions have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.