Display device and a method for manufacturing the same

This U.S. non-provisional patent application claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2018-0145368, filed on Nov. 22, 2018, the disclosure of which is incorporated by reference herein in its entirety.

The present inventive concept relates to a display device and a method for manufacturing the same.

In general, electronic devices, such as smartphones, digital cameras, laptop computers, navigation units, and smart televisions, include a display device for displaying images to a user. The display device generates an image and provides a user with the generated image through a display screen.

The display device includes a display panel for generating an image and functional elements for providing the user with various functions. The functional elements include a speaker, a camera, and a functional button, etc. A plurality of holes are provided on the display panel, and the functional elements are disposed in the holes. The holes are made by removing cut regions from the display panel while manufacturing the display device.

A laser having a predetermined wavelength is irradiated to a boundary (hereinafter referred to as a cut line) of each of the cut regions to cut the cut regions. However, if the laser vibrates, the cut line may not be accurately cut.

An exemplary embodiment of the inventive concept provides a display device including a display panel; a polarization film disposed on the display panel; and a reflective layer disposed on the polarization film, wherein the reflective layer is disposed between a first hole and a first groove, wherein the first hole passes through the display panel and the polarization film, and the first groove is provided in the display panel around the first hole.

In an exemplary embodiment of the inventive concept, a method for manufacturing a display device includes: receiving a display panel which comprises a closed-curve cut line and a groove around the cut line; disposing a polarization film on the display panel to cover the groove; disposing a reflective layer on the polarization film between the cut line and the groove; and irradiating a laser toward the cut line to cut a region of the display panel.

In an exemplary embodiment of the inventive concept, a display device includes: a display panel; a polarization film disposed on the display panel; a functional element disposed in a hole passing through the display panel and the polarization film; and a light absorbing layer disposed on the polarization film between the hole and a groove in the display panel, wherein the polarization film covers the groove and the groove surrounds the hole.

In an exemplary embodiment of the inventive concept, a display device includes: a display panel; a polarization film disposed on the display panel; a functional element disposed in a hole formed in the display panel and the polarization film; and a reflective layer disposed on the polarization film, wherein the reflective layer is disposed between the functional element and a groove formed in the display panel.

Exemplary embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. In the drawings:

FIG. 1 is a plan view of a display device according to an exemplary embodiment of the inventive concept;

FIG. 2 is a block diagram of the display device illustrated in FIG. 1 ;

FIG. 3 is an equivalent circuit diagram of a pixel illustrated in FIG. 2 ;

FIG. 4 is a schematic view illustrating a cross-sectional configuration of the pixel illustrated in FIG. 3 ;

FIG. 5 is an enlarged view of a planar configuration in the vicinity of holes in which a camera illustrated in FIG. 1 is disposed;

FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 5 ;

FIG. 7 is a view illustrating a laminated structure of a reflective layer illustrated in FIG. 6 ;

FIGS. 8, 9, 10 and 11 are views for describing a method for manufacturing a display device according to an exemplary embodiment of the inventive concept;

FIG. 12 is a view illustrating a reflective layer of a display device according to another exemplary embodiment of the inventive concept;

FIG. 13 is a view of a planar configuration of a reflective layer of a display device according to another exemplary embodiment of the inventive concept;

FIG. 14 is a cross-sectional view taken along line II-II′ of FIG. 13 ;

FIG. 15 is a cross-sectional view taken along line III-III′ of FIG. 13 ;

FIG. 16 is a view of a planar configuration in the vicinity of a hole in a display device according to another exemplary embodiment of the inventive concept;

FIG. 17 is a cross-sectional view taken along line IV-IV′ of FIG. 16 ;

FIG. 18 is a cross-sectional view taken along line V-V′ of FIG. 16 ;

FIG. 19 is a view for describing functions of a recess part and a protruding part illustrated in FIG. 18 ;

FIG. 20 is a view illustrating a cross-sectional configuration of a display device according to another exemplary embodiment of the inventive concept;

FIG. 21 is a plan view illustrating a touch sensing part of a display device according to another exemplary embodiment of the inventive concept;

FIG. 22 is a view illustrating a cross-sectional surface of a first connection part which connects first sensor parts illustrated in FIG. 21 ;

FIG. 23 is an enlarged view of a first region A 1 illustrated in FIG. 21 ;

FIG. 24 is a view of a cross-sectional configuration of a display device according to another exemplary embodiment of the inventive concept; and

FIG. 25 is a view of a cross-sectional configuration of a display device according to another exemplary embodiment of the inventive concept.

In this specification, when an element (or region, layer, portion, etc.) is referred to as being “on”, “connected to” or “coupled to” another element, it may be directly on, connected or coupled to the other element or a third element may be interposed therebetween.

In the figures, like reference numbers may refer to like elements. In addition, in the figures, the dimensions of layers and regions may be exaggerated for clarity of illustration.

Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view illustrating a display device according to an exemplary embodiment of the inventive concept.

Referring to FIG. 1 , a display device DD may include a display region DA and an edge part EG which surrounds the display region DA and forms a boundary of the display device DD. The display region DA may have a plane extended in a first direction DR 1 and a second direction DR 2 crossing the first direction DR 1 .

The display device DD may include functional elements SPK and CAM which are disposed in a plurality of holes H in the display device DD. The functional elements SPK and CAM may include a speaker SPK and a camera CAM. However, the inventive concept is not limited thereto, and various functional elements (for example, sensors and functional buttons) may be disposed in additional holes H.

FIG. 1 illustrates that the display device DD is a mobile phone. However, the display device DD may be used for large-sized electronic devices such as televisions, and external advertisement boards, and also for small and medium-sized electronic devices such as personal computers, laptop computers, car navigation systems, game machines, and tablets. It is to be understood that these electronic devices are provided merely as examples, and thus, the display device DD may also be used for other electronic devices.

FIG. 2 is a block diagram of the display device DD illustrated in FIG. 1 .

Referring to FIG. 2 , the display device DD may include a display panel DP, a scan driver SDV, a data driver DDV, an emission driver EDV, and a timing controller TC. The display panel DP may be an organic light-emitting display panel, but the inventive concept is not limited thereto, and various display panels, such as a liquid crystal display panel, an electrowetting display panel, and an electrophoresis display panel may be used as the display panel DP.

The display panel DP may be a flexible display panel. The display panel DP may have a plane extended in the first direction DR and the second direction DR 2 . The display panel DP may overlap the display region DA illustrated in FIG. 1 . The display region DA may be a display region of the display panel DP. The edge part EG illustrated in FIG. 1 may be disposed on a periphery of the display panel DP.

The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL 1 to SLm, a plurality of data lines DL 1 to DLn, and a plurality of emission lines EL 1 to Elm. m and n are natural numbers. The pixels PX may be connected to the scan lines SL 1 to SLm, the data lines DL 1 to DLn, and the emission lines EL 1 to Elm.

The scan lines SL 1 to SLm may extend in the first direction DR 1 and be connected to the scan driver SDV and the pixels PX. The data lines DL 1 to DLn may extend in the second direction DR 2 and be connected to the data driver DDV and the pixels PX. The emission lines EL 1 to ELm may extend in the first direction DR 1 and be connected to the emission driver EDV.

The scan driver SDV may generate a plurality of scan signals and the scan signals may be applied to the pixels PX through the scan lines SL 1 to SLm. The scan signals may be sequentially applied to the pixels PX.

The data driver DDV may generate a plurality of data voltages and the data voltages may be applied to the pixels PX through the data lines DL 1 to DLn. The emission driver EDV may generate a plurality of light-emitting signals and the light-emitting signals may be applied to the pixels PX through the emission lines EL 1 to ELm.

The timing controller TC may control the operation timings of the scan driver SDV, the data driver DDV, and the emission driver EDV. The timing controller TC may respond to a control signal CS received from the outside and generate a scan control signal SCS, a data control signal DCS, and an emission control signal ECS.

The timing controller TC may receive image signals RGB from the outside, and convert the data format of the image signals to conform to the interface specification of the display device DD with the data driver DDV. The timing controller TC may provide the data driver DDV with the converted image signals R′G′B′.

The scan driver SDV may respond to the scan control signal SCS and generate the scan signals. The data driver DDV may receive the converted image signals R′G′B′ and respond to the data control signal DCS to generate data voltages corresponding to the converted image signals R′G′B′. The emission driver EDV may respond to the emission control signal ECS to generate emission signals.

A first power supply voltage ELVDD and a second power supply voltage ELVSS may be provided to the pixels PX. The pixels PX may respond to the scan signals and receive the data voltages. The pixels PX may respond to the emission signals and generate light with brightness corresponding to the data voltages to display an image. The light-emitting time of the pixels PX may be controlled by the emission signals.

Each of the pixels PX may express one of the primary colors or one of mixed colors. The primary colors may include red, green, and blue, and the mixed colors may include various colors such as yellow, cyan, magenta, and white. However, the colors displayed by the pixels PX are not limited thereto.

FIG. 3 is an equivalent circuit diagram of one of the pixels PX illustrated in FIG. 2 .

Although FIG. 3 illustrates the configuration of only one pixel PX, all of the pixels PX may have the same configuration as the pixel PX illustrated in FIG. 3 .

Referring to FIG. 3 , the pixel PX may be connected to a corresponding scan line SLi among the scan lines SL 1 to SLm, a corresponding data line DLj among the data lines DL 1 to DLn, and a corresponding emission line Eli among the emission lines EL 1 to Elm. i is a natural number equal to or smaller than m, and j is a natural number equal to or smaller than n.

The pixel PX may include a light-emitting element OLED, a drive transistor T 1 , a capacitive element Cst, a switching transistor T 2 , and an emission control transistor T 3 . The light-emitting element OLED may be an organic light-emitting diode.

The source terminal of the drive transistor T 1 may receive a first power supply voltage ELVDD, and the drain terminal of the drive transistor T 1 may be connected to the source terminal of the emission control transistor T 3 . The gate terminal of the drive transistor T 1 may be connected to the drain terminal of the switching transistor T 2 .

The gate terminal of the switching transistor T 2 may be connected to the scan line SLi, and the source terminal of the switching transistor T 2 may be connected to the data line DLj. The first electrode of the capacitive element Cst may be connected to the source terminal of the drive transistor T 1 , and the second electrode of the capacitive element Cst may be connected to the gate terminal of the drive transistor T 1 .

The gate terminal of the emission control transistor T 3 may be connected to the emission line Eli, and the drain terminal of the emission control transistor T 3 may be connected the anode electrode of the light-emitting element OLED. The cathode electrode of the light-emitting element OLED may receive a second power supply voltage ELVSS. The second power supply voltage ELVSS may have lower voltage level than the first power supply voltage ELVDD.

The switching transistor T 2 may be turned on by responding to a scan signal SCAN received through the scan line SLi. The turned-on switching transistor T 2 may provide the gate terminal of the drive transistor T 1 with a data voltage DATA received through the data line DLj. The capacitive element Cst may be charged with the data voltage DATA applied to the gate terminal of the drive transistor T 1 , and may maintain the data voltage after the switching transistor T 2 is turned off.

The gate terminal of the emission control transistor T 3 may be turned on by responding to an emission signal EM received through the emission line ELi. The turned-on emission control transistor T 3 may provide the light-emitting element OLED with current Ioled flowing through the drive transistor T 1 . The pixel PX may emit light during an application time of the emission signal EM. The light-emitting element OLED may emit light with different light intensities according to the quantity of the provided current Ioled.

For example, the transistors T 1 to T 3 of the pixel PX may be p-channel metal oxide semiconductor (PMOS) transistors, but the inventive concept is not limited thereto, and the transistors T 1 to T 3 of the pixel PX may be n-channel metal oxide semiconductor (NMOS) transistors.

FIG. 4 is a schematic view illustrating a cross-sectional configuration of the pixel PX illustrated in FIG. 3 . In FIG. 4 , PA refers to a pixel region and NPA refers to a non-pixel region, for example.

Referring to FIG. 4 , a pixel PX may include a transistor TR disposed on a first base substrate BS 1 and a light-emitting element OLED connected to the transistor TR. The transistor TR may be an emission control transistor T 3 . The first base substrate BS 1 may be a flexible substrate. For example, the first base substrate BS 1 may contain polyimide (PI).

A second base substrate BS 2 may be disposed under the first base substrate BS 1 . The second base substrate BS 2 may be a protective substrate which protects the lower surface of the first base substrate BS 1 . The second base substrate BS 2 may be a flexible substrate. For example, the second base substrate BS 2 may contain polyimide or polyethylene terephthalate (PET).

An inorganic insulating layer may be disposed between the first base substrate BS 1 and the second base substrate BS 2 . For example, the inorganic insulating layer may contain, but is not limited to, silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide.

A buffer layer BFL is disposed on the first base substrate BS 1 , and the buffer layer BFL may include an inorganic material. For example, the buffer layer BFL may contain, but is not limited to, silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide.

An inorganic insulating layer may be disposed between the first base substrate BS 1 and the buffer layer BFL. For example, the inorganic insulating layer may contain, but is not limited to, silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide.

The transistor TR may be disposed on the buffer layer BFL. The transistor TR may include a gate electrode GE, a source electrode SE, a drain electrode DE, and a semiconductor layer SM. The transistor TR may be disposed on layers on which first, second, third and fourth insulating layers IL 1 , IL 2 , IL 3 and IL 4 are disposed.

The semiconductor layer SM may be disposed on the buffer layer BFL. The semiconductor layer SM may include a semiconductor composed of an inorganic material, such as amorphous silicon or polysilicon, or an organic semiconductor. In addition, the semiconductor layer SM may include an oxide semiconductor. The semiconductor layer SM may include a source region, a drain region, and a channel region between the source region and the drain region.

The buffer layer BFL may provide the semiconductor layer SM with a modified surface. In this case, the semiconductor layer SM may have a higher adhesiveness to the buffer layer BFL than when it is directly disposed on the first base substrate BS 1 . The buffer layer BFL may be a barrier layer which protects the lower surface of the semiconductor layer SM. In this case, the buffer layer BFL may prevent contaminants, moisture, and the like which are introduced into the first and second base substrates BS 1 and BS 2 or into the semiconductor layer SM through the first and second base substrates BS 1 and BS 2 .

The first insulating layer IL 1 may be disposed on the buffer layer BFL to cover the semiconductor SM. The first insulating layer L 1 may contain an inorganic material. For example, the first insulating layer IL 1 may contain, but is not limited to, silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, or aluminum oxide.

The gate electrode GE overlapping the semiconductor layer SM may be disposed on the first insulating layer IL 1 . The gate electrode GE may be disposed to overlap the channel region of the semiconductor layer SM. The second insulating layer IL 2 may be disposed on the first insulating layer IL 1 to cover the gate electrode GE. The second insulating layer IL 2 may include an inorganic material. The third insulating layer IL 3 may be disposed on the second insulating layer IL 2 . The third insulating layer IL 3 may contain an organic and/or an inorganic material.

The source electrode SE and the drain electrode DE may be disposed on the third insulating layer IL 3 and spaced apart from each other. The source electrode SE may be connected to the source region of the semiconductor layer SM through a first contact hole CH 1 passing through the first, second and third insulating layers IL 1 , IL 2 , and IL 3 . The drain electrode DE may be connected to the drain region of the semiconductor layer SM through a second contact hole CH 2 passing through the first, second and third insulating layers IL 1 , IL 2 , and IL 3 .

The fourth insulating layer IL 4 may be disposed on the third insulating layer IL 3 to cover the source electrode SE and the drain electrode DE. The fourth insulating layer IL 4 may be a flattened film, which provides a flat upper surface, and may contain an organic material.

The organic light-emitting element OLED may include a first electrode E 1 , an organic light-emitting layer OEL and a second electrode E 2 . The first electrode E 1 may be disposed on the fourth insulating layer IL 4 . The first electrode E 1 may be connected to the drain electrode DE through a third contact hole CH 3 passing through the fourth insulating layer IL 4 .

The first electrode E 1 may be a pixel electrode or an anode electrode. The first electrode E 1 may be a positive electrode which is a hole injected electrode. The first electrode E 1 may include a transparent electrode or a reflective electrode.

A pixel defining layer PDL which exposes a predetermined portion of the first electrode E 1 may be disposed on the fourth insulating layer IL 4 . A pixel opening PX_OP to expose the predetermined portion of the first electrode E 1 may be in the pixel defining layer PDL.

The organic light-emitting layer OEL may be disposed on the first electrode E 1 inside the pixel opening PX_OP. The organic light-emitting layer OEL may generate light having any one color among red, green or blue. However, the inventive concept is not limited thereto, and the organic light-emitting layer OEL may generate a mixed color by a combination of organic materials which generate red, green, or blue colors.

The second electrode E 2 may be disposed on the pixel defining layer PDL and the organic light-emitting layer OEL. The second electrode E 2 may be a common electrode or a cathode electrode. The second electrode E 2 may be a negative electrode which is an electron injected electrode. The second electrode E 2 may include a transparent electrode or a reflective electrode.

When the display panel DP is a top emission-type organic light-emitting display panel, the first electrode E 1 may include a reflective electrode, and the second electrode E 2 may include a transparent electrode. When the display panel DP is a bottom emission-type organic light-emitting display panel, the first electrode E 1 may include a transparent electrode, and the second electrode E 2 may include a reflective electrode.

An encapsulation layer TFE may be disposed on the second electrode E 2 . The encapsulation layer TFE may be a thin film encapsulation layer. The encapsulation layer TFE may include at least two inorganic layers and an organic layer disposed between the two inorganic layers. The inorganic layers may contain an inorganic material and may protect the light-emitting element OLED from moisture/oxygen. The organic layer may contain an organic material and may protect the light-emitting element OLED from foreign substances such as dust particles.

The first power supply voltage ELVDD to allow the organic light-emitting layer OEL to emit light may be applied to the first electrode E 1 through the transistor TR, and the second power supply voltage ELVSS may be applied to the second electrode E 2 . Holes and electrons which are injected into the organic light-emitting layer OEL are coupled, so that excitons may be formed, and while the excitons are transited to a ground state, the light-emitting element OLED may emit light.

FIG. 5 is an enlarged view of a planar configuration in the vicinity of holes in which the camera CAM illustrated in FIG. 1 is disposed. FIG. 6 is a cross-sectional view taken along line I-I′ of FIG. 5 .

The configuration in the vicinity of a hole H in which a camera CAM is disposed and the configuration in the vicinity of a hole H in which a speaker SPK is disposed may be substantially the same. Thus, hereinafter referring to FIGS. 5 and 6 , just the configuration in the vicinity of the hole H in which the camera CAM is disposed will be described in detail.

Referring to FIGS. 5 and 6 , a display device DD may include a polarization film POL disposed on a display panel DP. The display panel DP may include first and second base substrates BS 1 and BS 2 , first to fourth insulating layers IL 1 to IL 4 , a pixel defining layer PDL, and an encapsulation layer TFE. The polarization film POL may be disposed on the encapsulation layer TFE.

The polarization film POL may be adhered to the display panel DP through an adhesive. The adhesive may include an optical clear adhesive. The polarization film POL may be a reflection prevention film.

A touch detection unit may be disposed between the encapsulation layer TFE and the polarization film POL. The touch detection unit may detect an external touch.

The polarization film POL may reduce the reflectivity of external light incident to the display panel DP from above the display panel DP. For example, the polarization film POL may include a retarder and/or a polarizer.

The hole H may pass though the display panel DP and the polarization film POL. The camera CAM may be disposed in the hole H.

In the display panel DP, a plurality of grooves G 1 and G 2 surrounding the hole H may be provided. The two grooves G 1 and G 2 are exemplarily shown in the display panel DP, but the number of the grooves G 1 and G 2 is not limited thereto. For example, a single groove may be provided in the display panel DP, or more than two grooves may be provided in the display panel DP. The polarization film POL may cover the first and second grooves G 1 and G 2 .

The grooves G 1 and G 2 may include the first groove G 1 and the second groove G 2 surrounding the first groove G 1 . The first and second grooves G 1 and G 2 may pass through the first to fourth insulating layers IL 1 to IL 4 and a buffer layer BFL and be recessed up to a predetermined depth in the first base substrate BS 1 .

Pixels PX may be disposed in a region of the display panel DP excluding a region in which the hole H and the first and second grooves G 1 and G 2 are disposed. For example, the pixels PX may be disposed on the first base substrate BS 1 between the second groove G 2 and the periphery of the display panel DP.

For example, when viewed in a plan view, the hole H may have a circular shape, and each of the first and second grooves G 1 and G 2 may have a ring-shape, but the shapes of the hole H and the first and second grooves G 1 and G 2 are not limited thereto. The term “when viewed in a plan view” may mean a state in which a plane is viewed from above the plane itself. The plane may be defined by first and second directions DR 1 and DR 2 .

An opening OP which overlaps the first groove G 1 and the second groove G 2 and a region between the first and second grooves G 1 and G 2 may be provided in the pixel defining layer PDL and the encapsulation layer TFE. The polarization film POL may cover the opening OP. The opening OP and the first and second grooves G 1 and G 2 may be an integrated space.

A reflective layer RL may be disposed on the polarization film POL between the hole H and the first groove G 1 . The reflective layer RL may reflect light. For example, the reflective layer RL may reflect a laser having a predetermined wavelength. The wavelength of the laser may be about 355 nm.

The reflective layer RL may include a plurality of layers. A specific configuration of the reflective layer RL will be described in detail below.

The configuration in the vicinity of the hole H, in which the camera CAM is disposed is exemplarily described; however, configurations in the vicinity of each of the holes H in which other functional elements are disposed may be substantially the same as that in the vicinity of the hole H in which the camera CAM is disposed.

FIG. 7 is a view illustrating a laminated structure of the reflective layer illustrated in FIG. 6 .

Referring to FIG. 7 , the reflective layer RL may include a plurality of refractive layers RF 1 , RF 2 and RFk. The refractive layers RF 1 , RF 2 and RFk may be formed by laminating about 13 or more layers, and may be formed by laminating about 13-15 layers, for example. The refractive layers RF 1 , RF 2 and RFk may be inorganic insulating layers containing an inorganic material.

Hereinafter, a thickness may be referred to as the distance between the upper end (or upper surface) and the lower end (or lower surface) of the corresponding configuration. In addition, the thickness may be a numerical value which is measured with respect to a direction perpendicular to the plane defined by first and second directions DR 1 and DR 2 . A width may be the distance between both lateral surfaces of the corresponding configuration, and be a numerical value measured with respect to a horizontal direction.

Each of the refractive layers RF 1 , RF 2 and RFk may have a thickness about 10 nm to about 30 nm. The refractive layers RF 1 , RF 2 and RFk may have at least two refractive indexes different from each other. For example, the refractive layers RF 1 , RF 2 and RFk may include: a plurality of first refractive layers RF 1 ; and a plurality of second refractive layers RF 2 having different refractive indexes from the first refractive layers RF 1 . Each of the second refractive layers RF 2 may have a greater refractive index than each of the first refractive layers RF 1 .

The first refractive layers RF 1 and the second refractive layers RF 2 may be alternately laminated. For example, the first refractive layers RF 1 may be firstly disposed on the polarization film POL, and then, the second refractive layers RF 2 and the first refractive layers RF 1 may alternately be laminated. However, the inventive concept is not limited thereto, and the second refractive layers RF 2 may firstly be disposed on the polarization film POL, and then, the first refractive layers RF 1 and the second refractive layers RF 2 may alternately be laminated.

When the refractive layers RF 1 , RF 2 and RFk include an odd number of layers, the uppermost refractive layer RFk may be the first refractive layer RF 1. When the refractive layers RF 1 , RF 2 and RFk include an even number of layers, the uppermost refractive layer RFk may be the second refractive layer RF 2 .

The first refractive layers RF 1 and the second refractive layers RF 2 may include inorganic materials different from each other. For example, each of the first refractive layers RF 1 may include silicone oxide (SiO 2 ). Each of the second refractive layers RF 2 may include titanium oxide (TiO 2 ).

When the first and second refractive layers RF 1 and RF 2 are formed by laminating 13 or more layers, the reflective layer RL may reflect a laser having a predetermined wavelength.

FIGS. 8 to 11 are views for describing a method for manufacturing a display device according to an exemplary embodiment of the inventive concept.

For convenience of description, FIGS. 8, 10, and 11 are illustrated as cross-sectional views corresponding to FIG. 6 .

Referring to FIG. 8 , a display panel DP including a cut region CA defined by a cut line CL may be prepared. The cut line CL may be a boundary of the hole H illustrated in FIG. 5 . Thus, the cut line CL may be a closed curve.

A polarization film POL may be provided on the display panel DP to cover first and second grooves G 1 and G 2 . A reflective layer RL may be disposed on the polarization film POL between the cut line CL and the first groove G 1 .

A laser unit LU may be disposed above the polarization film POL, and a laser LAR generated by the laser unit LU may be irradiated toward the cut line CL. As described above, the wavelength of the laser LAR may be about 355 nm. The laser LAR may be irradiated to draw a closed curve along the cut line CL.

Referring to FIG. 9 , the laser LAR may be irradiated to the cut line CL while slightly vibrating. Thus, the laser LAR may not accurately be irradiated to the cut line CL and irradiated up to the vicinity of the cut line CL. For example, as illustrated in FIG. 9 , the laser LAR may be irradiated to an outer region of the cut region CA adjacent to the cut line CL. The laser LAR provided to the outer region of the cut region CA may be reflected by a reflective layer RL 1 .

The laser LAR may also be provided to a portion of the cut region CA adjacent to the cut line CL. However, since the cut region CA is a region to be removed, the yield of the display device DD may not be influenced even though the laser LAR is provided to the cut region CA.

However, when the reflective layer RL is not disposed on the polarization film POL, the laser LAR may be provided to the outside of the cut region CA. Due to such a laser cut tolerance, the cut region CA may not accurately be cut. In addition, a cut surface may not be smooth due to the vibration of the laser LAR.

Since the laser LAR may experience inaccuracies when it is provided to the cut region CA, a sufficient process margin should be ensured in consideration of the laser cut tolerance. The process margin is a space that is provided so that the first and second grooves G 1 and G 2 do not get irradiated by the laser LAR in the laser cut process. For example, the process margin may correspond to a space between the first groove G 1 and the cut line CL. For example, since the laser LAR may not be accurately provided to the cut line CL, the space between the first groove G 1 and the cut line CL should be large enough to prevent the first and second grooves G 1 and G 2 from being hit with the laser LAR.

However, in an exemplary embodiment of the inventive concept, the laser LAR may not be provided to the outside of the cut region CA due to the reflective layer RL, and thus, the laser LAR may be more accurately provided to the cut line CL. In this case, the cut region CA may be more accurately cut and the cut surface may be smoother. Due to the possibility of the laser LAR being provided to the outside of the cut region CA, a sufficient process margin (e.g., space) is typically ensured; however, in accordance with an exemplary embodiment of the inventive concept, such a space is not required, and thus, the process margin may be reduced.

Referring to FIGS. 10 and 11 , a laser LAR is irradiated toward a cut line CL, a cut region CA may be cut and the cut region CA may be removed. A hole H may be provided in a display panel DP and a polarization film POL by removing the cut region CA. Since the cut region CA is more accurately cut, the hole H may be more accurately processed. A display device DD may be manufactured with a camera CAM provided in the hole H.

When the cut region CA is cut, external moisture may be introduced into the display panel DP through the hole H and a cut surface. Moisture may be transferred through a pixel defining layer PDL and first to fourth insulating layers IL 1 to IL 4 . However, since first and second grooves G 1 and G 2 are provided in the vicinity of the hole H, moisture is blocked by the first and second grooves G 1 and G 2 and may not be provided to the display panel DP on which pixels PX are disposed.

A process for manufacturing the hole H to dispose the camera CAM is exemplarily described, but a process for manufacturing a hole H to dispose a speaker SPK may be the same as the process for manufacturing the hole H to dispose the camera CAM. In addition, processes for manufacturing holes H to dispose other functional elements are substantially the same as the process for manufacturing the hole H to dispose the camera CAM.

Consequently, in a method for manufacturing a display device DD according to an exemplary embodiment of the inventive concept, the holes H to dispose functional elements such as the speaker SPK and the camera CAM are accurately processed, so that a process margin may be reduced.

FIG. 12 is a view for illustrating a reflective layer of a display device according to another exemplary embodiment of the inventive concept.

Except for a reflective layer RL 1 , other configurations illustrated in FIG. 12 may be the same as the configuration illustrated in FIG. 6 . Thus, hereinafter the configuration of the reflective layer RL 1 will mainly be described. For convenience of description, FIG. 12 is illustrated as a cross-sectional surface corresponding to FIG. 6 .

Referring to FIG. 12 , a display device DD_ 1 includes a reflective layer RL 1 , and the reflective layer RL 1 may be disposed on a polarization layer POL between a hole H and a first groove G 1 . The reflective layer RL 1 may be disposed on the polarization layer POL as a single layer. The reflective layer RL 1 may include a metallic material which reflects light. For example, the reflective layer RL 1 may contain a metallic material such as aluminum (Al), copper (Cu), or silver (Ag).

The thickness of the reflective layer RL 1 may be at least about 50 nm, for example, about 50 nm to about 1 μm. When the thickness of the reflective layer RL 1 is at least 50 nm, the reflective layer RL 1 may reflect a laser LAR having a wavelength of about 355 nm. Thus, when a laser LAR is irradiated to a cut line CL to form a hole H, the laser LAR provided to the outside of a cut region CA may be reflected by the reflective layer RL 1 .

A black layer BL which absorbs light may be disposed on the reflective layer RL 1 . When the black layer BL is not disposed on the reflective layer RL 1 , light reflected by the reflective layer RL 1 may be viewed by a user. In an exemplary embodiment of the inventive concept, since external light is absorbed by the black layer BL, the reflective layer RL 1 may not be viewed. In a manufacturing method according to an exemplary embodiment of the inventive concept, the black layer BL may be provided on the reflective layer RL 1 after the hole H is formed by the laser LAR. FIG. 13 is a view of a planar configuration of a reflective layer of a display device according to another exemplary embodiment of the inventive concept. FIG. 14 is a cross-sectional view taken along line 11 - 11 ′ of FIG. 13 . FIG. 15 is a cross-sectional view taken along line III-III′ of FIG. 13 .

Excluding the configuration of a reflective layer RL 2 , configurations illustrated in FIGS. 13, 14, and 15 may be the same as the configuration illustrated in FIGS. 5 and 6 . Thus, hereinafter the configuration of the reflective layer RL 2 will mainly be described. For convenience of description, FIG. 13 is illustrated as a plan view corresponding to FIG. 5 , and FIG. 14 is illustrated as a cross-sectional surface corresponding to FIG. 6 .

Referring to FIGS. 13 and 14 , a display device DD_ 2 includes a reflective layer RL 2 , and the reflective layer RL 2 may be disposed on a polarization layer POL between a hole H and a first groove G 1 . The reflective layer RL 2 may include a metallic material. A plurality of recess parts RCS may be provided in the reflective layer RL 2 . The recess parts RCS may be disposed along the boundary of the hole H to surround the hole H. The recess parts RCS may be disposed at regular intervals, but the inventive concept is not limited thereto, and the recess parts RCS may be disposed at irregular intervals.

Referring to FIG. 15 , portions of the reflective layer RL 2 between the recess parts RCS may be referred to as protruding parts PT, and portions of the reflective layer RL 2 under the recess parts RCS may be referred to as a bottom part LP. The protruding parts PT may have rectangular shapes.

The width WT of each of the protruding parts PT may be the same as the distance DT between two adjacent protruding parts PT. For example, the width WT of each of the protruding parts PT may be about 50 nm, and the distance DT between two adjacent protruding parts PT may be about 50 nm. However, the inventive concept is not limited thereto, and the width WT of each of the protruding parts PT may be different from the distance DT between two adjacent protruding parts PT. The thickness TH of the bottom part LP may be larger than about 50 nm, and the reflective layer RL 2 including a metallic material may reflect a laser LAR.

After the hole H of FIGS. 13 and 14 is formed by a laser LAR, a black layer BL may be provided on the reflective layer RL 2 .

FIG. 16 is a view of a planar configuration in the vicinity of a hole in a display device according to another exemplary embodiment of the inventive concept. FIG. 17 is a cross-sectional view taken along line IV-IV′ of FIG. 16 . FIG. 18 is a cross-sectional view taken along line V-V′ of FIG. 16 . FIG. 19 is a view for describing functions of a recess part and a protruding part illustrated in FIG. 18 .

Excluding the configuration of a reflective layer RL 3 , configurations illustrated in FIGS. 16, 17, and 18 may be the same as the configuration illustrated in FIGS. 5 and 6 . Thus, hereinafter the configuration of the reflective layer RL 3 will mainly be described. For convenience of description, FIG. 16 is illustrated as a plan view corresponding to FIG. 5 , and FIG. 17 is illustrated as a cross-sectional surface corresponding to FIG. 6 . In addition, FIG. 19 illustrates one recess part RCS 1 and one protruding part PT 1 .

Referring to FIGS. 16 and 17 , a display device DD_ 3 includes a reflective layer RL 3 , and the reflective layer RL 3 may be disposed on a polarization layer POL between a hole H and a first groove G 1 . The reflective layer RL 3 may be an insulating layer. For example, the reflective layer RL 3 may be an inorganic insulating layer including an inorganic material. The reflective layer RL 3 may be disposed on the polarization layer POL as a single layer.

A plurality of recess parts RCS 1 may be provided in the reflective layer RL 3 , and the recess parts RCS 1 may be disposed along the boundary of the hole H to surround the hole H. The recess parts RCS 1 may be disposed at regular intervals, but the inventive concept is not limited thereto, and the recess parts RCS 1 may be disposed at irregular intervals.

Referring to FIG. 18 , the closer to an upper portion of each protruding part PT 1 , the greater the width WT 1 of each of the protruding parts PT 1 . For example, each of the protruding parts PT 1 may have a shape of an inverted trapezoid. The thickness TH 1 of each of the protruding parts PT 1 may be at least about 100 nm and for example, about 100 nm to about 300 nm.

Referring to FIG. 19 , a protruding part PT 1 and a recess part RCS 1 may be divided into a plurality of layers. The protruding part PT 1 and the recess part RCS 1 are divided into six layers L 1 , L 2 , L 3 , L 4 , L 5 and L 6 , but may also be divided into more layers than six. The protruding part PT 1 may have a greater refractive index than the recess part RCS 1 . For example, the recess part RCS 1 may be an air layer and have a refractive index of about 1.0, and the protruding part PT 1 may be an inorganic material and may have a refractive index of about 1.8.

In the first layer L 1 , the recess part RCS 1 may have a first width RW 1 , and the protruding part PT 1 may have a second width PW 1 . In the first layer L 1 , the average refractive index of the recess part RCS 1 and the protruding part PT 1 may be a first refractive index.

The average refractive index may be a value obtained in such a way that: the product of the area of the recess part RCS 1 and the refractive index of the recess part RCS 1 and the product of the area of the protruding part PT 1 and the refractive index of the protruding part PT 1 are added, and the resultant sum is divided by two which is the number of corresponding media (for example, the recess part RCS 1 and the protruding part PT 1 ).

In the second layer L 2 , the recess part RCS 1 may have a third width RW 2 greater than the first width RW 1 , and the protruding part PT 1 may have a fourth width PW 2 smaller than the second width PW 1 . The width of the protruding part PT 1 may be smaller and the width of the recess part RCS 1 may be larger in the second layer L 2 than in the first layer L 1 . Since the area of the protruding part PT 1 , which has a greater refractive index than the recess part RCS 1 , is reduced in the second layer L 2 rather than in the first layer L 1 , the average refractive index of the recess part RCS 1 and the protruding part PT 1 may be a second refractive index smaller than the first refractive index in the second layer L 2 .

In the third layer L 3 , the recess part RCS 1 may have a fifth width RW 3 greater than the third width RW 2 , and the protruding part PT 1 may have a sixth width PW 3 smaller than the fourth width PW 2 . The width of the protruding part PT 1 may be smaller and the width of the recess part RCS 1 may be larger in the third layer L 3 than in the second layer L 2 . Since the area of the protruding part PT 1 , having a greater refractive index than the recess part RCS 1 , is reduced in the third layer L 3 rather than in the second layer L 2 , the average refractive index of the recess part RCS 1 and the protruding part PT 1 may be a third refractive index smaller than the second refractive index in the second layer L 2 .

According to the areas of the protruding part PT 1 and the recess part RCS 1 , the average refractive index of the fourth layer L 4 may be a fourth refractive index smaller than the third refractive index, and the average refractive index of the fifth layer L 5 may be a fifth refractive index smaller than the fourth refractive index. In addition, in the sixth layer L 6 , the average refractive index of the recess part RCS 1 and the protruding part PT 1 may be a sixth refractive index smaller than the fifth refractive index.

Thus, the six layers L 1 to L 6 may have refractive indexes different from each other, and the closer to a lower portion of the protruding part PT 1 the smaller the refractive index may be. The protruding part PT 1 and the recess part RCS 1 are illustrated as being divided into the six layers L 1 to L 6 and the average refractive indexes of the six layers L 1 to L 6 are described; however, the protruding part PT 1 and the recess part RCS 1 can be divided into more than six layers, and the average refractive indexes of the more than six layers may be different.

The reflective layer RL 3 is a single layer, but may function like the refractive layers having substantially different refractive indexes from each other. When light travels from a high refractive index layer to a low refractive index layer, a portion of light may be reflected at an interface between the low refractive index layer and the high refractive index layer or the light may be totally reflected according to an incident angel. Thus, when a laser LAR travels from the first layer L 1 toward the sixth layer L 6 , the laser LAR may be reflected. Consequently, the reflective layer RL 3 may reflect the laser LAR.

A moth-eye structure which can be used for a non-reflective coating technique includes protruding parts protruding upward, and an air layer disposed between the protruding parts. The width of each of the protruding parts of the moth-eye structure may decrease toward the upper portion unlike the protruding part PT 1 illustrated in FIG. 19 . Thus, in a moth-eye structure unlike the reflective layer RL 3 , the closer to a lower portion of the moth-eye structure, the greater the average refractive indexes may be.

When light travels from a low refractive index layer to a high refractive index layer, light may not be reflected from an interface between the low refractive index layer and the high refractive index layer but may be refracted and propagate toward the high refractive index layer. Thus, the moth-eye structure may transmit light rather than reflect light, since there is a greater average refractive index closer to its lower portion. The moth-eye structure is a non-reflective structure, accordingly, the reflective layer RL 3 of the present embodiment inversely uses the moth-eye structure and may reflect light.

For example, when the thickness of the protruding part PT 1 is at least about 100 nm, the laser LAR having a wavelength of about 355 nm may be reflected at the reflective layer RL 3 . When the laser LAR is irradiated to a cut line CL to form a hole H, the laser LAR provided to the outside of a cut region CA may be reflected from the reflective layer RL 3 .

FIG. 20 is a view of a cross-sectional configuration of a display device according to another exemplary embodiment of the inventive concept.

Except for the configuration of a light absorbing layer LAL, configurations illustrated in FIG. 20 are the same as the configurations illustrated in FIG. 6 . Thus, hereinafter the configuration of the light absorbing layer LAL will mainly be described. For convenience of description, FIG. 20 is illustrated as a cross-sectional surface corresponding to FIG. 6 .

Referring to FIG. 20 , a display device DD_ 4 includes a light absorbing layer LAL, and the light absorbing layer LAL may be disposed on a polarization layer POL between a hole H and a first groove G 1 . The light absorbing layer LAL may include a material which reflects light. The light absorbing layer LAL may function like the reflective layer RL 1 . For example, when a laser LAR to form a hole H is irradiated to a cut line CL, the laser LAR provided to the outside of a cut region CA may be absorbed at the light absorbing layer LAL.

FIG. 21 is a plan view illustrating a touch sensing part of a display device according to another exemplary embodiment of the inventive concept. FIG. 22 is a view illustrating a cross-sectional surface of a first connection part which connects first sensor parts illustrated in FIG. 21 . FIG. 23 is an enlarged view of a first region A 1 illustrated in FIG. 21 .

Referring to FIG. 21 , a touch sensing part TS may include a plurality of detection electrodes SE 1 and SE 2 , a plurality of lines SL 1 and SL 2 , and a plurality of pads PAD. The touch sensing part TS may be disposed on a thin film encapsulation layer TFE. For example, the detection electrodes SE 1 and SE 2 , lines SL 1 and SL 2 , and pads PAD may be disposed on the thin film encapsulation layer TFE. A polarization film POL may be disposed on the touch sensing part TS.

The detection electrodes SE 1 and SE 2 and the lines SL 1 and SL 2 may have a single layer structure or an upwardly laminated multilayer structure. A conductive layer with a multilayer structure may include at least two among transparent conductive layers and metal layers. The conductive layer with a multilayer structure may include metal layers containing metals different from each other. The transparent conductive layer may contain indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, graphene, or the like. The metal layer may contain molybdenum, silver, titanium, copper, aluminum, and an alloy thereof.

The touch sensing part TS may include an active region AA and a non-active region NAA surrounding the active region AA. The detection electrodes SE 1 and SE 2 may be disposed on the active region AA, and the pads PAD may be disposed on the non-active region NAA. The lines SL 1 and SL 2 may be connected to the detection electrodes SE 1 and SE 2 , extend to the non-active region NAA, and be connected to the pads PAD. The pads PAD may be connected to a drive part to drive the touch sensing part TS through a flexible printed circuit board.

The detection electrodes SE 1 and SE 2 may include: a plurality of first detection electrodes SE 1 extending in a second direction DR 2 and arranged in a first direction DR 1 ; and a plurality of second detection electrodes SE 2 extending in the first direction DR 1 and arranged in the second direction DR 2 . The lines SL 1 and SL 2 may include: a plurality of first signal lines SL 1 connected to the first detection electrodes SE 1 ; and a plurality of second signal lines SL 2 connected to the second detection electrodes SE 2 .

The first detection electrodes SE 1 and the second detection electrodes SE 2 may extend to be insulated from and cross each other. The first detection electrodes SE 1 and the second detection electrodes SE 2 may have mesh shapes. Electrostatic capacitances may be formed by the first detection electrodes SE 1 and the second detection electrodes SE 2 .

Each of the first detection electrodes SE 1 may include: a plurality of first sensor parts SP 1 arranged in the second direction DR 2 ; and a plurality of first connection parts CP 1 which connect the first sensor parts SP 1 . The first sensor parts SP 1 may have mesh shapes. Each of the first connection parts CP 1 may be disposed between two adjacent first sensor parts SP 1 and electrically connect the two adjacent first sensor parts SP 1 .

Each of the second detection electrodes SE 2 may include: a plurality of second sensor parts SP 2 arranged in the first direction DR 1 ; and a plurality of second connection parts CP 2 which connect the second sensor parts SP 2 . The second sensor parts SP 2 may have mesh shapes. Each of the second connection parts CP 2 may be disposed between two adjacent second sensor parts SP 2 and electrically connect the two adjacent second sensor parts SP 2 .

The first sensor parts SP 1 and the second sensor parts SP 2 may not overlap each other, may be spaced apart from each other, and may be disposed alternately with each other. The second connection parts CP 2 and the first connection parts CP 1 may extend to be mutually insulated from and cross each other. The first and second sensor parts SP 1 and SP 2 and the second connection parts CP 2 may be disposed on the same layer. The first connection parts CP 1 may be disposed on a layer different from the first and second sensor parts SP 1 and SP 2 and the second connection parts CP 2 .

The first and second sensor parts SP 1 and SP 2 and the second connection parts CP 2 may be formed by being simultaneously patterned with a first conductive material. The first connection parts CP 1 may be formed by being patterned with a second conductive material.

Referring to FIG. 22 , the first sensor parts SP 1 and the second connection part CP 2 may be disposed on a thin film encapsulation layer TFE. The second sensor parts SP 2 may also be disposed on the thin film encapsulation layer TFE. The second sensor parts SP 2 and the second connection parts CP 2 of the second detection electrode SE 2 which are substantially the same may be integrally formed. Thus, the second connection parts CP 2 may extend from the second sensor parts SP 2 .

A first touch insulating layer TS-IL 1 may be disposed on the thin film encapsulation layer TFE to cover the first sensor parts SP 1 and the second connection part CP 2 . The first touch insulating layer TS-IL 1 may contain an inorganic material. The first connection part CP 1 may be disposed on the first touch insulating layer TS-IL 1 . A second touch insulating layer TS-IL 2 may be disposed on the first touch insulating layer TS-IL 1 to cover the first connection part CP 1 .

The first connection part CP 1 may be connected to the first sensor parts SP 1 through a plurality of contact holes TS-CH in the first touch insulating layer TS-IL 1 . Both sides of the first connection part CP 1 may be connected to the first sensor parts SP 1 through the contact holes TS-CH.

The first connection part CP 1 may be disposed higher than the first sensor parts SP 1 and the second connection part CP 2 , but the laminated structure is not limited thereto. For example, the first connection part CP 1 may be disposed on the thin film encapsulation layer TFE, and the first sensor parts SP 1 and the second connection part CP 2 may be disposed on the first touch insulating layer TS-IL 1 .

Referring to FIG. 23 , pixels PX may include a plurality of pixel regions PA and a non-pixel region NPA around the pixel regions PA. Each of the pixel regions PA may be the pixel region PA illustrated in FIG. 4 . The pixel regions PA may display a red color, a green color, or a blue color. However, the inventive concept is not limited thereto, and the pixel regions PA may further include pixels to display a magenta, cyan, or white color.

The pixel regions PA may have sizes different from each other according to a color to display. For example, a blue pixel region PAB is larger than a red pixel region PAR, and the red pixel region PAR may be larger than a green pixel region PAG.

The pixel regions PA may have diamond shapes, but the inventive concept is not limited thereto, and the pixel regions PA may have various shapes such as circles or polygons. The pixel regions PA may be arranged in a first diagonal direction DDR 1 and a second diagonal direction DDR 2 .

The first diagonal direction DDR 1 may be a direction crossing the first and second directions DR 1 and DR 2 on a plane defined by the first and second directions DR 1 and DR 2 . The second diagonal direction DDR 2 may be a direction crossing the first diagonal direction DDR 1 on a plane defined by the first and second directions DR 1 and DR 2 . For example, the first direction DR 1 and the second direction DR 2 may cross each other to be perpendicular to each other, and the first diagonal direction DDR 1 and the second diagonal direction DDR 2 may cross each other to be perpendicular to each other.

The first and second sensor parts SP 1 and SP 2 having mesh shapes may overlap the non-pixel region NPA. Openings TOP in the mesh structure may have diamond shapes corresponding to the shapes of the pixel regions PA and sizes corresponding to the pixel regions PA.

The pixel regions PA may be light-emitting regions, and the non-pixel region NPA may be a non-light-emitting region. Since the first and second sensor parts SP 1 and SP 2 are disposed in the non-pixel region NPA, light generated in the pixel regions PA may be normally emitted without being affected by the first and second sensor parts SP 1 and SP 2 .

FIG. 24 is a view of a cross-sectional configuration of a display device according to another exemplary embodiment of the inventive concept.

Except for a conductive layer CTL, the configurations illustrated in FIG. 24 may be the same as the configuration illustrated in FIG. 6 . Thus, hereinafter the configuration of the conductive layer CTL will mainly be described. For convenience of description, FIG. 24 is illustrated as a cross-sectional surface corresponding to FIG. 6 .

Referring to FIG. 24 , a display device DD_ 5 may include a conductive layer CTL, and the conductive layer CTL may be disposed between a hole H and a first groove G 1 . The conductive layer CTL may be disposed between a thin film encapsulation layer TFE and a polarization film POL. The conductive layer CTL may be formed by being simultaneously patterned with the same material as the first sensor part SP 1 and the second sensor part SP 2 which are disposed between the thin film encapsulation layer TFE and the polarization film POL. For example, the conductive layer CTL may include a metal which forms the first and second sensor parts SP 1 and SP 2 and may reflect light. Thus, a laser LAR may be reflected at the conductive layer CTL.

Any one among the reflective layers RL, RL 1 , RL 2 , and RL 3 which are described above or the light absorbing layer LAL may further be disposed on the polarization film POL.

FIG. 25 is a view for illustrating a cross-sectional configuration of a display device according to another exemplary embodiment of the inventive concept.

Referring to FIG. 25 , a display device DD_ 6 may include a conductive layer CTL, and the conductive layer CTL may be disposed between a hole H and a first groove G 1 . The conductive layer CTL may substantially be the same as the conductive layer CTL illustrated in FIG. 24 . In FIG. 25 , the hole H may not be formed in a polarization film POL′. Other configurations of the display device DD_ 6 may be the same as the display device DD_ 5 illustrated in FIG. 24 .

A display device and a method for manufacturing the same according to an exemplary embodiment of the inventive concept may reduce a process margin by accurately processing holes to dispose functional elements.

While the inventive concept has been shown and described with reference to exemplary embodiments thereof, a person skilled in the art will understand that many modifications and variations may be made thereto without departing from the spirit and scope of the inventive concept as defined in the following claims.