USPatent applicationPatented

Erasing method used in flash memory

Granted 3 Mar 2020 · no office action yet

Assignee: Elite Semiconductor Memory Technology Inc.

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Inventors: Chih-Hao Chen · Examiner: Gene N Auduong · AU 2825 · TC 2800

Application· this page
16/281,517
filed 21 Feb 2019
Publication
Not published
not published
Patent
US 10,580,505
granted 3 Mar 2020

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Abstract

An erasing method used in a flash memory having memory blocks is illustrated, each of the memory blocks is divided into a plurality of memory sectors, and steps of the erasing method is illustrated as follows. An erasing and verifying process is performed sequentially on the memory blocks or the memory sectors of the memory block according to a memory sector enable signal. An over-erased correcting and verifying process is performed sequentially on the memory blocks or the memory sectors of the memory block according to the memory sector enable signal, wherein the memory sector enable signal is set to be asserted if an over-erased correction is performed on at least one of the memory blocks or at least one of the memory sectors of the memory block.

Description

9 parts
›FIELD OF THE INVENTION

The present disclosure relates to a flash memory, and in particular to an erasing method used in a flash memory.

›BACKGROUND OF THE INVENTION · 1 of 2

A flash memory includes individual Metal-Oxide-Semiconductor (MOS) field effect transistor memory cells, each of which includes a source, a drain, a floating gate and a control gate. Various voltages are applied to the control gate to program the transistor memory cell with a binary 1 or 0, to erase all of the transistor memory cells as a memory block, to read the transistor memory cell, to verify that the transistor memory cell is erased or to verify that the transistor memory cell is not over-erased.

The undesirable effect of the leakage current from the over-erased transistor memory cells is described as follows. In a typical flash memory, the drains of a large number of transistor memory cells, for example 512 transistor memory cells are connected to each bit line. If a substantial number of transistor memory cells on the bit line are drawing background leakage current, the total leakage current on the bit line may exceed the cell read current. This makes it impossible to read the state of any transistor memory cell on the bit line, and therefore renders the flash memory inoperative.

To overcome the above problems, the over-erased correcting and verifying process and the post over-erased correcting and verifying process are performed on the transistor memory cells, such that the bit line leakage current of the over-erased transistor memory cell can be cured. However, some of the erased transistor memory cell may change to the under-erased transistor memory cell after the over-erased correcting and verifying process and the post over-erased correcting and verifying process are performed.

Referring to FIG. 1 , FIG. 1 is flow chart of a conventional erasing method. The conventional erasing method is used to make the under-erased transistor memory cell be erased by performing step S 15 after the over-erased correcting and verifying process and the post over-erased correcting and verifying process are performed. The conventional erasing method is executed in a flash memory which comprises a memory management apparatus and a memory module, wherein the memory module comprises a plurality of memory blocks, and each of the memory blocks comprises a plurality of transistor memory cells.

In FIG. 1 , at step S 11 , the memory management apparatus verifies and pre-programs all transistor memory cells of the memory module. Next, at step S 12 , the memory management apparatus verifies and erases all of the transistor memory cells as a memory block, and that is, the erasing unit is one memory block. It is noted that, in the conventional erasing method, two erasing and verifying processes are performed, wherein step S 11 is the first erasing and verifying process while step S 15 is the second erasing and verifying process.

Next, to prevent the leakage current of the over-erased transistor memory cell from rendering the flash memory inoperative, at step S 13 , the memory management apparatus verifies all transistor memory cells of the memory module and performs the over-erased correction (OEC) on the over-erased transistor memory cell(s) of the memory module while the verification result shows at least one over-erased transistor memory cell exists in the memory block. Next, at step S 14 , the memory management apparatus performs the post over-erased correcting and verifying process to the transistor memory cells of the memory module.

Then, step S 15 is executed, the memory management apparatus verifies and erases all of the transistor memory cells as a memory block, so as to correct the threshold voltage of the under-erased transistor memory cell(s) after the over-erased correcting and verifying process and the post over-erased correcting and verifying process are performed, and to make the under-erased transistor memory cells be erased. It is noted that, if the verification result of step S 15 shows the memory block should not be erased (i.e. the memory block is not erased), the conventional erasing method is terminated; otherwise (i.e. the memory block is erased), step S 13 through S 15 are executed again.

Though the threshold voltage of the under-erased transistor memory cell(s) can be corrected after the over-erased correcting and verifying process and the post over-erased correcting and verifying process are performed, the do-loop of the conventional erasing method may be required, and erasing time of step S 15 may be required before and after cycling, thus making the conventional erasing method extremely time-consuming.

To reduce the execution time of the conventional erasing method, another one convention erasing method is proposed. Referring to FIG. 2 , FIG. 2 is flow chart of a conventional erasing method. The conventional erasing method of FIG. 2 is executed in a flash memory as mentioned above, in particular, an OEC flag is used to determine whether the erasing and verifying process should be performed again.

At step 521 , the memory management apparatus verifies and pre-programs all transistor memory cells of the memory module. Next, at step S 22 , an erasing and verifying process and an over-erased correcting and verifying process are performed by the memory management apparatus, and the OEC flag is used to determine whether to perform the erasing and verifying process again, such that the threshold voltage of the under-erased transistor memory cell(s) can be corrected after the over-erased correcting and verifying process is performed. Next, at step S 23 , the memory management apparatus performs the post over-erased correcting and verifying process to the transistor memory cells of the memory module, and then the conventional erasing method is terminated.

Step S 22 comprises steps S 221 through S 224 , and details of steps S 221 through S 224 are illustrated as follows. At step S 221 , the memory management apparatus verifies and erases all of the transistor memory cells as a memory block, and specifically, if the verification result shows the memory block should be erased, the memory management apparatus make at least one erase pulse injected to the transistor memory cells of the memory block for the objective of erasing. At step S 221 , if the memory block is erased, the memory management apparatus sets an erasing flag (hereinafter, abbreviated as “ERS flag”) to be logically true (i.e. value of “1”). Next, at step S 222 , the memory management apparatus checks the value of the ERS flag. If the ERS flag is logically true, step S 223 is then executed; otherwise (i.e. ERS flag is logically false or “0”), step S 23 is then executed.

›BACKGROUND OF THE INVENTION · 2 of 2

At step S 223 , the memory management apparatus verifies all transistor memory cells of the memory module and performs the OEC on the over-erased transistor memory cell(s) of the memory module by executing at least one OEC pulse (i.e. injecting the OEC pulse to the transistor memory cells) while the verification result shows at least one over-erased transistor memory cell exists in the memory block. At step S 223 , the memory management apparatus sets the OEC flag to be logically true (i.e. value of “1”) if the OEC is performed on the memory block. Next, at step S 224 , the memory management apparatus checks the value of the OEC flag. If the OEC flag is logically true, step S 221 is then executed again; otherwise (i.e. OEC flag is logically false or “0”), step S 23 is then executed.

By using the OEC flag, the conventional erasing method of FIG. 2 can save erasing time before cycling (i.e. whether to executed step S 221 is determined by the OEC flag). However, the do-loop between the erasing and verifying process (step S 221 ) and the over-erased correcting and verifying process (step S 223 ) may be still required, and the execution time of the conventional erasing method of FIG. 2 is not shortened sufficiently.

›SUMMARY OF THE INVENTION · 1 of 2

One objective of the present disclosure is to provide an erasing method used in a flash memory, and the erasing method has a self-examining algorithm to prevent the existence of the under-erased transistor memory cell after the OEC is performed. Meanwhile, the do-loop between the erasing and verifying process and the over-erased correcting and verifying process can be eliminated under the assumption that the slow and fast transistor memory cell do not allocated in multiple bits (such as 16 bits) on a same bit line of a memory sector.

Another one objective of the present disclosure is to provide a flash memory which executes the above erasing method, and the flash memory has the similar advantages as those of the erasing method.

To achieve at least the above objective, the present disclosure provides an erasing method used in a flash memory comprising at least one memory block divided into a plurality of memory sectors. The erasing method comprises steps of: performing an erasing and verifying process on the memory block, and setting an erasing flag to be logically true if the memory block is erased; performing an over-erased correcting and verifying process on the memory block if the erasing flag is logically true, setting an over-erased correction flag to be logically true and a memory sector enable signal to be asserted if an over-erased correction is performed on the memory block, and then resetting both of the erasing flag and the over-erased correction flag to be logically false; when the memory sector enable signal is asserted, performing the erasing and verifying process sequentially on the memory sectors of the memory block, and setting the erasing flag to be logically true if at least one of the memory sectors is erased; and when the memory sector enable signal is asserted and the erasing flag is logically true, performing the over-erased correcting and verifying process sequentially on the memory sectors of the memory block, setting the over-erased correction flag to be logically true if the over-erased correction is performed on at least one of the memory sectors, and then resetting both of the erasing flag and the over-erased correction flag to be logically false.

In one embodiment of the present disclosure, the at least one memory block comprises a plurality of memory blocks, and the erasing and verifying process is sequentially performed on the memory blocks, wherein an address is used to indicate the memory block or the memory sector, the address is increased with a block offset after a verification result shows the memory block has no under-erased transistor memory cell, and the erasing flag is set to be logically true if at least one of the memory block is erased.

In one embodiment of the present disclosure, the over-erased correcting and verifying process is sequentially performed on the memory blocks if the erasing flag is logically true, the over-erased correction flag is set to be logically true and the memory sector enable signal to be asserted if an over-erased correction is performed on at least one of the memory blocks, and then both of the erasing flag and the over-erased correction flag are reset to be logically false.

In one embodiment of the present disclosure, the erasing and verifying process is performed on the memory sector of the memory block which the address indicates, the address is increased with a sector offset after a verification result shows memory sector of the memory block has no under-erased transistor memory cell, and the erasing flag is set to be logically true if at least one of the memory sectors of the memory block is erased.

In one embodiment of the present disclosure, before the erasing and verifying process on the memory block is performed on the memory block, a pre-programming and verifying process is performed on the memory block.

In one embodiment of the present disclosure, when the memory block or the memory sectors have no under-erased transistor memory cell and the erasing flag is logically false, or the memory block has no over-erased transistor memory cell and the memory sector enable signal is not asserted, or the memory sectors has no over-erased transistor memory cell and the memory sector enable signal is asserted, a post over-erased correcting and verifying process is performed on the memory block.

To achieve at least the above objective, the present disclosure provides an erasing method used in a flash memory comprising at least one memory block divided into a plurality of memory sectors. The erasing method comprises steps of: performing an erasing and verifying process sequentially on the memory blocks or the memory sectors of the memory block according to a memory sector enable signal, and setting an erasing flag to be logically true if at least one of the memory blocks or at least one of the memory sectors is erased; and performing an over-erased correcting and verifying process sequentially on the memory blocks or the memory sectors of the memory block according to the memory sector enable signal if the erasing flag is logically true, setting an over-erased correction flag to be logically true and the memory sector enable signal to be asserted if an over-erased correction is performed on at least one of the memory blocks or at least one of the memory sectors of the memory block, and then resetting both of the erasing flag and the over-erased correction flag to be logically false.

In one embodiment of the present disclosure, when the memory sector enable signal is not asserted, the erasing and verifying process is performed sequentially on the memory blocks, and the over-erased correcting and verifying process is performed sequentially on the memory blocks; when the memory sector enable signal is asserted, the erasing and verifying process is performed sequentially on the memory sectors, and the over-erased correcting and verifying process is performed sequentially on the memory sectors.

To achieve at least the above objective, the present disclosure provides a flash memory comprising a memory module and a memory management apparatus electrically connected to the memory module, wherein the memory module comprises at least one memory block divided into a plurality of memory sectors. The memory management apparatus is used to execute the above erasing method.

›SUMMARY OF THE INVENTION · 2 of 2

To sum up, the erasing method the flash memory provided according to the embodiments of the present disclosure can check whether the memory sector has at least one under-erased transistor memory cell after the OEC is performed, and erase the memory sector if the memory sector has at least one under-erased transistor memory cell after the OEC is performed, such that a self-examining algorithm is executed to prevent the transistor memory cell from being under-erased after the OEC is performed. Moreover, since the self-examining algorithm verifies and erases the memory

›BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 (related art) is a flow chart of a conventional erasing method;

FIG. 2 (related art) is a flow chart of another one conventional erasing method; and

FIG. 3 is a flow chart of an erasing method used in a flash memory according to one embodiment of the present disclosure.

›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 1 of 3

To make it easier for the examiner to understand the objects, characteristics and effects of this present disclosure, embodiments together with the attached drawings for the detailed description of the present disclosure are provided.

An embodiment of the present disclosure provides an erasing method used in a flash memory to prevent the do-loop between the erasing and verifying process and the over-erased correcting and verifying process. Specifically, a self-examining algorithm is executed to prevent the existence of the under-erased transistor and to eliminate the do-loop between the erasing and verifying process and the over-erased correcting and verifying process memory after the OEC is performed.

In the self-examining algorithm, all of the transistor memory cells are erased and over-erased corrected as a memory sector, and that is, the erasing unit and the over-erased correcting unit are one memory sector, wherein a memory block is divided to a plurality of memory sectors. For example, the memory block has 64K bytes (64K*8 bits), the memory sector has 4K bytes (4K*8 bits), and the present disclosure is not limited thereto.

Usually, the fast bit and the slow bit are not allocated at on a same bit line of the memory sector, and thus the erasing method makes the under-erased transistor not exist in the memory sector after the memory sector is erased and over-erased corrected. Furthermore, since whether the memory sector has the over-erased transistor memory cell is also checked and the same bit line of the memory sector usually does not have the fast bit an slow bit thereon, the self-examining algorithm can further eliminate the do-loop between the erasing and verifying process and the over-erased correcting and verifying process memory after the OEC is performed. The details of the erasing method having such self-examining algorithm are illustrated as follows.

Referring to FIG. 3 , FIG. 3 is a flow chart of an erasing method used in a flash memory according to one embodiment of the present disclosure. The erasing method is used in a flash memory comprising a memory management apparatus and a memory module, wherein the memory module can have a plurality of memory banks, each of the memory banks comprises a plurality of memory blocks, and each of the memory blocks can be divided into a plurality of memory sectors. For example, the memory block has 64K bytes (i.e. 64K*8 transistor memory cells), the memory sector has 4K bytes (i.e. 4K*8 transistor memory cells), and the present disclosure is not limited thereto. The memory management apparatus is used to execute the erasing method.

At step S 31 , the memory management apparatus performs the pre-programming and verifying process on the transistor memory cells of the memory module. Then, at step S 32 , the erasing and verifying process is sequentially performed on all of the memory blocks to erase the transistor memory cells of the memory blocks, and then the over-erased correcting and verifying process is sequentially performed on the memory blocks. At step S 32 , if the memory blocks has at least one over-erased transistor memory cell, the OEC is performed on the memory block(s) which has the least one over-erased transistor memory cell (i.e. the memory management apparatus injects the OEC shot to the memory block(s) having the at least one over-erased transistor memory cell), and the memory sector enable signal is set to be asserted (i.e. the 4K_ERS flag is 1 or logically true).

Next, at step S 32 , the erasing unit and over-erased correcting unit become the memory sector when the memory sector enable signal is set to be asserted (i.e. the 4K_ERS flag is 1 or logically true). Then, at step S 32 , for each memory block, the erasing and verifying process is sequentially performed on the memory sectors of the memory block, and then the verifying and the over-erased correcting process is sequentially performed on the memory sectors of the memory block. That is, while the memory block(s) has the at least one over-erased transistor memory cell, the erasing and over-erased correcting units become the memory sector from the memory block.

After the over-erased correcting and verifying process has been performed on the all memory sectors of each memory block (if the 4K_ERS flag is 1) or all memory blocks (if the 4K_ERS flag is 0), step S 33 will be executed. At step S 33 , the verifying and post over-erased correcting process is sequentially performed on the memory blocks. Next, the erasing method is terminated.

In the embodiment, step S 32 comprises steps S 3211 through S 3223 , and the details of steps S 3211 through S 3223 are illustrated as follows. However, the implementation of step S 32 of such embodiment is not used to limit the present disclosure.

At step S 3211 , the erasure verifying of the erasing and verifying process is performed on the memory block (if the 4K_ERS flag is 0) or the memory sector (if the 4K_ERS flag is 1) which an address indicates by the memory management apparatus, wherein whether the memory block or the memory sector is verified is determined according to the memory sector enable signal, and the memory sector enable signal is asserted when the OEC is performed on one of the memory blocks. Next, at step S 3212 , the memory management apparatus checks the verification result of step S 3211 . If the verification result shows the existence of the under-erased transistor memory cells in the memory block or the memory sector (i.e. verification fail), steps S 3213 is then executed; otherwise, step S 3212 is executed.

At steps S 3213 , the memory management apparatus erases the transistor memory cells of the memory block (if the 4K_ERS flag is 0) or the memory cell (if the 4K_ERS flag is 1) by injecting the erasing shot to the transistor memory cells of the memory block or the memory sector, wherein whether the memory block or the memory sector is erased is determined according to the memory sector enable signal. Next, at step S 3214 , the memory management apparatus sets the ERS flag to be 1 (i.e. logically true), and then step S 3211 is executed again.

›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 2 of 3

At step S 3215 , the memory management apparatus checks whether the address is equal to the maximum memory block address (i.e. MAX_64K) or the maximum memory sector address (i.e. MAX_4K), wherein whether the maximum memory block address (i.e. MAX_64K) or the maximum memory sector address (i.e. MAX_4K) is selected as the maximum address is determined according to the memory sector enable signal. If the address is not equal to the maximum memory block address (i.e. MAX_64K) when the memory sector enable signal is not asserted (i.e. the 4K_ERS flag is 0 or logically false), or equal to the maximum memory sector address (i.e. MAX_4K) when the memory sector enable signal is asserted (i.e. the 4K_ERS flag is 1 or logically true), step S 3223 is executed; otherwise, step S 3216 is executed.

At step S 3223 , the memory management apparatus adds the address with an increment, wherein the increment is determined according to the memory sector enable signal. That is, whether the increment is a sector offset or a block offset is determined according to the memory sector enable signal. After step S 3223 is executed, step S 3211 is executed again.

At step S 3216 , the memory management apparatus checks whether the ERS flag is equal to 1, so as to determine whether the erasing is performed on the memory blocks (if the 4K_ERS flag is 0) or the memory sectors (if the 4K_ERS flag is 1). If the ERS flag is equal to 1, step S 3217 is executed; otherwise step S 3222 is executed. When the ERS flag is equal to 0, it means no erasing is performed on memory blocks, or all memory sectors of the memory block have no under-erased transistor memory cell and no over-erased transistor memory cell.

At step S 3217 , the memory management apparatus performs the over-erased correcting and verifying process sequentially on the memory blocks (if the 4K_ERS flag is 0) or the memory sectors of the memory block (if the 4K_ERS flag is 1), wherein whether the over-erased correcting and verifying process is sequentially performed on the memory blocks or the memory sectors of the memory block is determined according to the memory sector enable signal. At step S 3217 , when the verification result shows the memory blocks (if the 4K_ERS flag is 0) or the memory sectors (if the 4K_ERS flag is 1) of the memory block have at least one over-erased memory cell, the OEC is performed on the memory block(s) (if the 4K_ERS flag is 0) or the memory sector(s) of the memory block (if the 4K_ERS flag is 1) which has the over-erased transistor memory cell(s) by injecting the OEC pulse (or OEC shot) to the transistor memory cells of the memory block(s) or the memory sector(s), and the OEC flag is set to be 1.

Next, at step S 3218 , the memory management apparatus checks the OEC flag to determine whether the OEC is performed on the memory block(s) or the memory sector(s). If the OEC flag is equal to 1, step S 3219 is executed; otherwise, step S 3218 is executed. At step S 3219 , the memory sector enable signal is set to be asserted (i.e. the 4K_ERS flag is 1), and step S 3221 is next executed.

At step S 3220 , the memory management apparatus checks whether the address is the last sector address of the final memory block (i.e. LAST 4K) or the memory sector enable signal is not asserted (i.e. the 4K_ERS flag is 0). If the address is the last sector address of the final memory block (i.e. LAST 4K) or the memory sector enable signal is not asserted (i.e. the 4K_ERS flag is 0), step S 33 is executed; otherwise, step S 3221 is executed. In one case, after the over-erased correcting and verifying process is sequentially performed on the memory blocks, if no OEC is performed when the memory block have no over-erased transistor memory cell, the OEC flag is 0, the memory sector enable signal is not asserted (i.e. the 4K_ERS flag is 0), and step S 33 is next executed. In other one case, the OEC was performed on at least one memory block and at least one memory sector in the past, no OEC is performed on the memory sectors of final the memory block now (i.e. OEC flag is 0 and the address is LAST 4K), and step S 33 is next executed.

At step S 3221 , the memory management apparatus resets the ERS flag to be 0 and the OEC flag to be 0, and step S 3211 is executed for performing the erasure verifying on the memory sector of the memory block (i.e. the 4K_ERS flag now is 1). At step S 3222 , the memory management apparatus check the address is equal to the maximum memory block address (i.e. MAX_64K). If the address is equal to the maximum memory block address (i.e. MAX_64K), step S 33 is then executed; otherwise, step S 3223 is executed for adds the address with block offset. Step S 3223 is executed when the memory sector signal is asserted (i.e. the 4K_ERS flag is 1) and all memory sectors of the memory block has no under-erased transistor memory cell and no over-erased transistor memory cell (i.e. ERS flag=0 and OEC flag=0). If the memory block is not the final memory block, step S 3223 is then executed, such that the address can indicate the next memory block, and the memory sectors of the memory block are sequentially performed with the verifying and the erasing process and the verifying and the over-erased correcting process.

Initially, the memory sector enable signal is not asserted, and generally, steps S 3211 through S 3215 and S 3223 are executed for the memory blocks (assuming the memory blocks have the under-erased transistor memory cells initially), such that the erasing and verifying process is sequentially performed on the memory blocks. Then, steps S 3216 through S 3218 are executed for the memory blocks, such that the over-erased correcting and verifying process is sequentially performed on the memory blocks. Generally, the OEC is performed on at least one memory block (assuming the existence of over-erased transistor memory cell the in the at least one memory block), and step S 3219 is executed to set the 4K_ERS flag to be 1.

Next, for each memory block, steps S 3211 through S 3222 are executed for performing the erasing and verifying process and the over-erased correcting and verifying process sequentially on the memory sectors of the memory block. Once, the erasing is performed on the at least one memory sector of the memory block, the over-erased correcting and verifying process is then sequentially performed on the memory sectors of the memory block. When no erasing is performed on the memory sectors of the memory block, the memory sectors of the next memory block are selected, and the erasing and verifying process and the over-erased correcting and verifying process are performed sequentially on the memory sectors of the next memory block. That is, the self-examining algorithm is formed.

›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 3 of 3

Accordingly, by using the erasing method in the flash memory provided by the present disclosure, the do-loop between the erasing and verifying process and the over-erased correcting and verifying process can be eliminated under the assumption that the slow and fast transistor memory cell do not allocated in multiple bits (such as 16 bits) on a same bit line of a memory sector, and the existence of the under-erased transistor memory cell is prevented after the OEC is performed.

While the present disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the present disclosure set forth in the claims.

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IPC · International Patent Classification
Section G — Physics
  • G11C16/34

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