Load drive device

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-207793, filed on Oct. 27, 2017, the entire contents of which are incorporated herein by reference.

One or more embodiments of the present invention relate to a structure of a load drive device in which an electric motor and a controller are integrated with each other.

For example, as disclosed in JP-A-2015-60756 and JP-A-2016-34202, an electric power steering system mounted on a vehicle such as an automobile includes a load drive device in which an electric motor for assisting a steering operation of a steering wheel and a controller for controlling the electric motor are integrated with each other. The electric motor-integrated load drive device includes a board on which an electric circuit for driving and controlling the electric motor and an electronic component are mounted, an input/output connector through which an external device inputs or outputs power or a signal to or from the board, and a housing which accommodates the electric motor and the board.

The electric motor includes a coil, a motor terminal for supplying a current to the coil, and a rotor rotated by supplying the current to the coil. According to the load drive device disclosed in JP-A-2015-60756 and JP-A-2016-34202, the electric motor is incorporated in the housing so that the motor terminal and a shaft of the rotor protrude in an axial direction of a rotation axis of the electric motor. A frame (case) is connected to the housing, and the board is fixed to the frame. A cover is attached to the frame so as to cover the board.

According to JP-A-2015-60756, the load drive device includes a first board having a drive circuit mounted for driving the electric motor by supplying the current to the coil and a second board having a control circuit mounted for controlling driving of the electric motor. The first board and the second board are electrically connected to each other by an external connection terminal such as a bus bar. One end portion of the motor terminal of the electric motor is connected to the coil, and the other end portion of the motor terminal is electrically connected to the board by penetrating the frame.

Incidentally, various electronic devices are mounted on the vehicle in addition to a driving system such as an engine. In order to achieve weight reduction and miniaturization of the vehicle, the respective electronic devices also need miniaturization. The electric motor and the controller are integrated with each other in the electric power steering system. Accordingly, an occupied space of the electric power steering system inside the vehicle is reduced to a certain extent. However, even in a case where the integrated device is mounted on the vehicle, the vehicle needs further miniaturization. The controller includes a heat-generating electronic component having a high calorific value, such as a semiconductor switching element. Heat generated by the heat-generating electronic component causes a possibility that a malfunction or a failure may occur in the controller. Therefore, a countermeasure has been needed to radiate the heat generated by the heat-generating electronic component.

Therefore, according to JP-A-2015-60756 and JP-A-2016-34202, the frame (case) is connected to the housing on one side in the axial direction of the electric motor, and the board is fixed to the metal frame and the cover so that the board is perpendicular to the axial direction of the electric motor. The board is formed so as to have a size approximately the same as a diameter of the electric motor. In this manner, the electronic component configuring the electric circuit for driving and controlling the electric motor is mounted on a region where the board and the electric motor overlap with each other in the axial direction. The input/output connector whose outer shape is larger than that of other electronic components is mounted at a position where the board and the electric motor do not overlap with each other in the axial direction. According to JP-A-2016-34202, only one board is provided, and a drive circuit and a control circuit for the electric motor are mounted on the board. Furthermore, a heat conduction rate is improved as follows. The frame is used to serve as a heat sink, and an insulating heat radiation material is disposed between the electronic component mounted on a rear surface of the board and the frame.

According to the load drive device as described above, in a case where the drive circuit for driving the electric motor and the control circuit for controlling the driving of the electric motor are disposed on one board, there is a possibility that the device may malfunction due to noise of a signal generated in the drive circuit or the control circuit.

Multiple electronic devices are mounted on the vehicle. Accordingly, electromagnetic waves are generated from the electric circuit included in each of the electronic device, thereby causing a possibility that the electromagnetic waves may generate electromagnetic wave noise which adversely affects other electronic devices to suffer the malfunction and the failure. Therefore, the load drive device needs to have resistance to the electromagnetic wave noise generated from the electric circuit incorporated therein or the electromagnetic wave noise generated by other external devices.

An object of one or more embodiments of the invention is to realize miniaturization, to prevent a device malfunction, and to improve heat radiating performance and resistance to electromagnetic wave noise in a load drive device in which an electric motor and a controller are integrated with each other.

According to one or more embodiments of the invention, there is provided a load drive device including: an electric motor that drives a load; a controller that includes a board provided with electronic components mounted thereon and configured to drive and control the electric motor; a housing in which the electric motor is incorporated; a frame that is connected to the housing and serves as a heat sink; and a cover that is attached to the frame so as to cover the board, wherein the board is fixed to the frame so as to be electrically connected to a motor terminal configured to supply a current to the electric motor and perpendicular to an axial direction of a rotation axis of the electric motor, wherein the board is one multilayer printed board including: wiring layers including wiring patterns and provided on a front surface and a rear surface of the multilayer printed board, respectively; at least one wiring layer including a wiring pattern and provided inside the multilayer printed board; and at least two ground layers including ground patterns, respectively, and provided inside the multilayer printed board, and the board includes an interlayer connection wire that electrically connects the patterns of the different layers, wherein the wiring pattern of each of the wiring layers configures a part of an electric circuit of the controller, wherein the electronic components included in the electric circuit are mounted on the front surface and the rear surface of the board, respectively, wherein the at least two ground layers include: a first ground layer including a first ground pattern for a circuit which is electrically connected to the wiring pattern of each of the wiring layers; and a second ground layer including a second ground pattern for electromagnetic wave noise resistance which is electrically connected to the frame, wherein the electric circuit of the controller includes: a drive circuit that drives the electric motor; and a control circuit that controls the electric motor, wherein each of the wiring layers is divided into: a first region in which the drive circuit is provided, and a second region in which the control circuit is provided, and wherein the first ground layer is divided into: a third region which overlaps with the first region in a thickness direction of the board, and in which the first ground pattern for a power system electrically connected to the drive circuit is provided, and a fourth region which overlaps with the second region in the thickness direction of the board, and in which the first ground pattern for a control system electrically connected to the control circuit is provided.

According to the above-described configuration, in the load drive device in which the controller and the electric motor are integrated with each other, the controller is configured to include one multilayer printed board having the electronic component mounted thereon so as to drive and control the electric motor. The board is accommodated in an internal space surrounded by the frame and the cover. Accordingly, the drive circuit and the control circuit of the electric motor do not need to be electrically connected to each other by using an external connection terminal such as a bus bar. The drive circuit and the control circuit of the electric motor may be electrically connected to each other by using the wiring pattern disposed in the board. Therefore, the load drive device can be miniaturized in the axial direction of the electric motor.

Three or more wiring layers are respectively disposed inside of the front surface and the rear surface of the board. The wiring patterns of the respective wiring layers are electrically connected to each other by using the interlayer connection wire. Accordingly, the electric circuit can be more freely designed by increasing current capacity of the wiring pattern for supplying the current to the electric motor. The respective wiring layers are divided into the first region having the drive circuit of the electric motor and the second region having the control circuit of the electric motor. The first ground layer disposed inside the board is divided into the third region overlapping with the first region in the thickness direction of the board and the fourth region overlapping with the second region in the thickness direction of the board. The first ground pattern for the power system electrically connected to the drive circuit is disposed in the third region. The first ground pattern for the control system electrically connected to the control circuit is disposed in the fourth region. Therefore, the controller can be prevented from malfunctioning due to signal noise generated in the drive circuit or the control circuit in the board.

The frame for fixing the board is used as the heat sink. Accordingly, the heat generated from the electronic component mounted on the board can be radiated outward by the frame. The board internally has the second ground layer having the second ground pattern for electromagnetic wave noise resistance which is electrically connected to the frame. Accordingly, the second ground pattern of the second ground layer is electrically insulated from the first ground pattern of the first ground layer or the wiring pattern of the wiring layer, and the frame is grounded to the ground. In this manner, as the electromagnetic wave noise, the electromagnetic waves generated from the electric circuit formed on the board can be restrained from adversely affecting an external electronic device. As the electromagnetic wave noise, the electromagnetic waves generated from the external electronic device can be restrained from adversely affecting the electric circuit formed in the board.

In one or more embodiments of the invention, a rotation sensor configured to detect a rotation state of the electric motor may be mounted at a position facing one end portion of the rotation axis on the rear surface of the board. In the board, the first region and the third region may be disposed on one side which does not include the rotation sensor with respect to a mounting position of the rotation sensor, and the second region and the fourth region may be disposed on the other side which includes the rotation sensor with respect to the mounting position of the rotation sensor.

In one or more embodiments of the invention, the motor terminal may penetrate a portion of the frame overlapping with the electric motor in the axial direction, the motor terminal may be electrically connected to a portion of the board overlapping with the electric motor in the axial direction, and the motor terminal may be electrically insulated from the frame. The motor terminal may include a connector mounted on a portion of the board which does not overlap with the electric motor in the axial direction. The connector may have a first fitting portion to which a first harness configured to supply the current from an external power source is fitted in an axial direction of the electric motor, and a second fitting portion to which a second harness configured to perform signal communication with an external device is fitted in the axial direction of the electric motor. The first fitting portion and the second fitting portion may be exposed to an electric motor side from the frame.

In one or more embodiments of the invention, the third region and the fourth region of the first ground layer may merge with each other in the vicinity of the connector.

In one or more embodiments of the invention, a plurality of semiconductor switching elements configured to switch the current to be supplied to the electric motor may be mounted on a portion of the first region overlapping with the electric motor in the axial direction. An electrolytic capacitor electrically connected to the plurality of semiconductor switching elements may be mounted in the vicinity of one of the semiconductor switching elements which is located at a position farthest away from the connector and which is connected to an upstream side of the current to be supplied from the external power source.

In one or more embodiments of the invention, a heat-generating electronic component may be mounted on a portion of the front surface of the board which overlaps with the electric motor in the axial direction. A heat transfer portion that transfers heat generated by the heat-generating electronic component to the rear surface of the board may be disposed immediately below the heat-generating electronic component in the board. An insulating heat radiation material may be disposed between a portion of the rear surface of the board which overlaps with the electric motor in the axial direction and a portion of the frame.

In one or more embodiments of the invention, the board may have a plurality of through-holes and a conductive portion electrically connected to the second ground pattern of the second ground layer around the through-holes. The frame may have a plurality of screw hole disposed coaxially with the through-holes, respectively. The load drive device may further include a plurality of screws made of a conductor. The screws may be inserted into the respective through-holes from the front surface of the board and screwed into the respective screw holes such that the board is fixed to the frame, and the screws may come into contact with the conductive portion and electrically connect the second ground pattern and the frame.

According to one or more embodiments of the invention, it is possible to realize miniaturization, to prevent a device malfunction, and to improve heat radiating performance and resistance to electromagnetic wave noise in a load drive device in which an electric motor and a controller are integrated with each other.

FIG. 1 is a circuit diagram illustrating an electrical configuration of a load drive device according to an embodiment of the invention;

FIG. 2 is an exploded perspective view of the load drive device;

FIG. 3 is a perspective assembly view of the load drive device;

FIG. 4 is a perspective view illustrating a state where a cover is detached therefrom in FIG. 3 ;

FIG. 5 is a longitudinal sectional view of the load drive device;

FIG. 6 illustrates a front surface of a board illustrated in FIG. 4 ;

FIG. 7 illustrates a rear surface of the board illustrated in FIG. 4 ;

FIG. 8 is a sectional view of the board illustrated in FIG. 4 ;

FIG. 9 is a plan view of a first layer of the board illustrated in FIG. 8 ;

FIG. 10 is a plan view of a second layer of the board illustrated in FIG. 8 ;

FIG. 11 is a plan view of a third layer and a fourth layer of the board illustrated in FIG. 8 ;

FIG. 12 is a plan view of a fifth layer of the board illustrated in FIG. 8 ;

FIG. 13 is a plan view of a sixth layer of the board illustrated in FIG. 8 ;

FIG. 14 is a sectional view illustrating a thermal connection state among FET, the board, and a frame which are illustrated in FIG. 4 ; and

FIG. 15 is a sectional view illustrating an electrical connection state among a screw, the board, and the frame which are illustrated in FIG. 4 .

In embodiments of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to one of ordinary skill in the art that the invention may be practiced without these specific details. In other instances, well-known features have not been described in detail to avoid obscuring the invention.

Hereinafter, one or more embodiments of the invention will be described with reference to the drawings. In each drawing, the same reference numerals will be given to the same elements or elements corresponding thereto.

First, an electrical configuration of a load drive device 100 according to the embodiment of the invention will be described with reference to FIG. 1 .

FIG. 1 is a circuit diagram illustrating an electrical configuration of the load drive device 100 . The load drive device 100 is configured to include a controller 10 and an electric motor 20 , and both of these are mechanically integrated with each other as will be described later. The controller 10 has one board 33 (illustrated in FIG. 2 ) on which an electronic component configuring the drive circuit or the control circuit (to be described later) is mounted. The load drive device 100 is incorporated in an electric power steering system mounted on a vehicle such as a four-wheeled automobile, and causes the electric motor 20 to drive a steering mechanism (steering wheel and gear) which functions as a load, thereby assisting a steering operation. The electric motor 20 has a three-phase brushless motor.

The controller 10 includes a control unit 1 , a constant voltage circuit 2 , an inverter circuit 3 , a predriver circuit 4 , an electrolytic capacitor 9 , a magnetic sensor 5 , choke coils 6 a and 6 b , a power connector 7 p , and an input/output connector 7 s . An electric circuit of the controller 10 includes a drive circuit (such as the inverter circuit 3 ) for driving the electric motor 20 and a control circuit (such as the control unit 1 ) for controlling the electric motor 20 . Details thereof will be described later.

The power connector 7 p includes power terminals 71 and 72 . The controller 10 and an in-vehicle battery 50 are electrically connected to each other via a first harness 51 electrically connected to the power terminals 71 and 72 . Specifically, one power terminal 71 is connected to a cathode of the in-vehicle battery 50 , and the other power terminal 72 is connected to an anode of the in-vehicle battery 50 . The power terminal 72 is grounded to the ground. The in-vehicle battery 50 is an example of an “external power source” according to the embodiment of the invention.

The input/output connector 7 s includes a plurality of signal terminals 73 and 74 . The controller 10 is electrically connected to a torque sensor (not illustrated) or a controller area network (CAN) communication bus (not illustrated) disposed in the vehicle via a second harness 61 electrically connected to the signal terminals 73 and 74 . A steering torque signal is input from the torque sensor to the controller 10 via the signal terminals 73 and 74 and the second harness 61 . A vehicle speed signal of the vehicle is input to the controller 10 from a vehicle speed sensor (not illustrated) connected to the CAN communication bus, or information such as a failure diagnosis result is output from the controller 10 . FIG. 1 illustrates only one each of the terminals 71 to 74 . However, in actual, the plurality of terminals 71 to 74 are respectively provided (refer to FIG. 6 (to be described later)). The power connector 7 p and the input/output connector 7 s are an example of a “connector” according to the embodiment of the invention.

The control unit 1 has a microcomputer, and controls an operation of each portion of the controller 10 . The control unit 1 transmits and receives a signal or information via the signal terminals 73 and 74 and the second harness 61 of the input/output connector 7 s . The constant voltage circuit 2 steps down a voltage of the in-vehicle battery 50 so as to generate a predetermined voltage (for example, 5V), and supplies the predetermined voltage to the control unit 1 .

The inverter circuit 3 is a known electric circuit which drives the electric motor 20 by supplying the current to the electric motor 20 . The electrolytic capacitor 9 for a smoothing purpose is connected in parallel to the inverter circuit 3 . One end of the inverter circuit 3 is connected to the cathode of the in-vehicle battery 50 via the choke coil 6 a and the power terminal 71 of the power connector 7 p . The other end of the inverter circuit 3 is connected to the anode of the in-vehicle battery 50 via the choke coil 6 b , FET Q 7 for preventing reverse connection, and the power terminal 72 of the power connector 7 p . A gate of FET Q 7 is connected to the predriver circuit 4 . In a case where the cathode and the anode of the in-vehicle battery 50 are normally connected to the power terminals 71 and 72 as illustrated in FIG. 1 , FET Q 7 is turned on by a gate signal output from the predriver circuit 4 . However, in a case where the cathode and the anode of the in-vehicle battery 50 are reversely connected to the power terminals 71 and 72 , the gate signal is not output from the predriver circuit 4 , and FET Q 7 is not turned on.

The inverter circuit 3 includes field effect transistors (FETs) Q 1 to Q 6 for supplying the current, FETs Q 8 to Q 10 for blocking the current, and shunt resistors 11 to 13 . FETs Q 1 to Q 6 and Q 8 to Q 10 are the semiconductor switching elements, and are the heat-generating electronic components having a great calorific value when power is supplied.

Each gate of FETs Q 1 to Q 6 and Q 8 to Q 10 is connected to the predriver circuit 4 . The drain of FETs Q 1 , Q 3 , and Q 5 is connected to the cathode of the in-vehicle battery 50 via the choke coil 6 a and the power terminal 71 . Sources of FETs Q 1 , Q 3 , and Q 5 are respectively connected to drains of FETs Q 2 , Q 4 , and Q 6 and sources of FETs Q 8 , Q 9 , and Q 10 . The drains of FETs Q 8 , Q 9 , and Q 10 are respectively connected to a coil 25 u having a U-phase of the electric motor 20 , a coil 25 v having a V-phase, and a coil 25 w having a W-phase via the motor terminals 15 to 17 . The sources of FETs Q 2 , Q 4 , and Q 6 are respectively connected to one end of the shunt resistors 11 , 12 , and 13 . The other end of the shunt resistors 11 , 12 , and 13 is connected to the anode of the in-vehicle battery 50 via a power system ground line 19 , the choke coil 6 b , FET Q 7 , and the power terminal 72 . Although not illustrated, a connection point of FETs Q 2 , Q 4 , and Q 6 and the shunt resistors 11 , 12 , and 13 is connected to the control unit 1 , and the control unit 1 detects a voltage of the connection point. The control unit 1 controls the predriver circuit 4 so as to turn on and off FETs Q 1 to Q 6 for supplying the current by using pulse width modulation (PWM). In this manner, the current is supplied to the respective coils 25 u , 25 v , and 25 w of the electric motor 20 , or a flowing direction of the current is changed so as to control the driving of the electric motor 20 . FETs Q 8 , Q 9 , and Q 10 for blocking the current are normally turned on by the predriver circuit 4 . However, when the current flowing to the respective coils 25 u , 25 v , and 25 w of the electric motor 20 is urgently blocked, FETs Q 8 , Q 9 , and Q 10 are turned off by the predriver circuit 4 , based on a command of the control unit 1 . A boost circuit is incorporated in the predriver circuit 4 , and the voltage of the in-vehicle battery 50 is boosted so as to generate the voltage needed to drive each of FETs Q 1 to Q 6 and Q 8 to Q 10 of the inverter circuit 3 .

As will be described later, the magnetic sensor 5 detects a change in a magnetic force of a magnet 22 g disposed in a shaft 22 a ( FIG. 5 ) of a rotor 22 of the electric motor 20 . The control unit 1 detects a rotation state of the rotor 22 of the electric motor 20 , based on a detection signal output from the magnetic sensor 5 .

The control unit 1 , the constant voltage circuit 2 , and the predriver circuit 4 are connected to a control system ground line 18 . The inverter circuit 3 is connected to a power system ground line 19 . The inverter circuit 3 and a wire thereof (thick solid line in FIG. 1 ) for driving the electric motor 20 by supplying the current to the electric motor 20 are an example of a drive system of the electric motor 20 , that is, a “drive circuit” according to the embodiment of the invention. Specifically, the thick solid line in FIG. 1 indicates a path of a high current flowing in the electric motor 20 , and indicates a wire forming a path through which the high current supplied from the power terminal 71 to the electric motor 20 via the choke coil 6 a and the inverter circuit 3 is returns to the power terminal 72 . In contrast, the control unit 1 , the constant voltage circuit 2 , the predriver circuit 4 , the magnetic sensor 5 , and wires thereof (thin solid line in FIG. 1 ) for controlling the driving of the electric motor 20 are an example of a control system of the electric motor 20 , that is, a “control circuit” according to the embodiment of the invention. The current flowing in the drive system of the electric motor 20 is higher than the current flowing in the control system of the electric motor 20 .

The control system ground line 18 and the power system ground line 19 are connected to each other so as to merge at a connection point X, are connected via the choke coil 6 b , FET Q 7 , and the power terminal 72 to the anode of the in-vehicle battery 50 , and are grounded to the ground. In this way, the control system ground line 18 and the power system ground line 19 merge only at one point X in the vicinity of the power terminal 72 . This restrains a potential difference from occurring in various ground lines present in the control system of the electric motor 20 . Accordingly, it is possible to prevent the control system from malfunctioning. In FIG. 1 , the choke coil 6 b and FET Q 7 are disposed between the connection point X and the power terminal 72 . However, as an alternative example, for example, the choke coil 6 b and FET Q 7 may be disposed between the connection point X and the inverter circuit 3 , and the connection point X for connecting the control system ground line 18 and the power system ground line 19 to each other may be disposed closer to the power terminal 72 . In this manner, the wire from the connection point X to the power terminal 72 is shortened, thereby reducing distribution line resistance thereof. Therefore, it is possible to minimize voltage drop which occurs when the high current flows in the wire.

Next, a mechanical configuration of the load drive device 100 will be described with reference to FIGS. 2 to 15 .

FIG. 2 is an exploded perspective view of the load drive device 100 . FIG. 3 is a perspective assembly view of the load drive device 100 . FIG. 4 is a perspective view illustrating a state in which the cover 32 is detached therefrom in FIG. 3 . FIG. 5 is a longitudinal sectional view of the load drive device 100 .

As illustrated in FIG. 3 , the load drive device 100 includes a housing 21 , a frame 31 , and a cover 32 .

The housing 21 is formed in a cylindrical shape, for example, by means of aluminum die casting, and is internally equipped with the electric motor 20 as illustrated in FIG. 5 . A lower end portion of the housing 21 is closed by a bracket 24 . The electric motor 20 has a stator 26 , coils 25 u , 25 v , and 25 w , a rotor 22 , a bearing 23 a , 23 b , and motor terminals 15 to 17 ( FIGS. 1, 2, and 4 ).

The stator 26 is formed in a cylindrical shape, and is attached to an inner surface of the housing 21 . The coils 25 u , 25 v , and 25 w are wound around the stator 26 . A lower end portion of the motor terminals 15 to 17 is connected to each of the coils 25 u , 25 v , and 25 w (not illustrated). FIGS. 2 and 4 illustrate each upper end portion of the motor terminals 15 to 17 . The rotor 22 is disposed inside the stator 26 . The rotor 22 includes the shaft 22 a.

As the current flows into the coils 25 u , 25 v , and 25 w via the motor terminals 15 to 17 , the rotor 22 is rotated around a rotation axis J. Hereinafter, a direction parallel to the rotation axis J (vertical direction in FIG. 5 ) will be referred to as an “axial direction”. Both end portions of the shaft 22 a protrude from the housing 21 in the axial direction of the electric motor 20 . The upper end portion of the motor terminals 15 to 17 also protrudes from the housing 21 in the axial direction of the electric motor 20 .

The bearing 23 b located below is fixed to the inside of the bracket 24 , and rotatably holds the vicinity of the lower end portion of the shaft 22 a . The bearing 23 a above located above is fixed to the inside of the upper end portion of the housing 21 , and rotatably holds the vicinity of the upper end portion of the shaft 22 a.

The frame 31 is connected to the housing 21 on one side (upper side in FIG. 5 ) in the axial direction of the electric motor 20 . The frame 31 is made of metal such as aluminum, and is also used as a heat sink. As an alternative example, the frame made of a synthetic resin which can also be used as the heat sink may be used. An upper end portion of the shaft 22 a is inserted into a through-hole 31 a formed at the center of the frame 31 . The shaft 22 a is separated from the frame 31 .

The board 33 is fixed to an upper surface (surface on a side opposite to the electric motor 20 ) of the frame 31 by using a screw 39 so that the board 33 is perpendicular to the axial direction of the electric motor 20 . As described above, the electronic component for driving and controlling the electric motor 20 is mounted on the board 33 configuring the controller 10 of FIG. 1 .

FIG. 6 illustrates a front surface (surface facing upward in FIGS. 2 and 4 ) 3 u of the board 33 . FIG. 7 illustrates a rear surface (surface facing downward in FIGS. 2 and 4 ) 3 b of the board 33 .

The board 33 has a circular portion 33 x and a rectangular portion 33 y protruding to one side in a radial direction of the circular portion 33 x . In accordance with a shape of the board 33 , the frame 31 and the cover 32 also respectively have circular portions 31 x and 32 x and rectangular portions 31 y and 32 y as illustrated in FIG. 2 . An outer shape of the board 33 is smaller than an outer shape of the frame 31 and the cover 32 .

The circular portions 31 x and 32 x of the frame 31 and the cover 32 have a diameter approximately equal to a diameter of the electric motor 20 (diameter perpendicular to the rotation axis J), and overlap with the electric motor 20 in the axial direction. The circular portion 33 x of the board 33 has the diameter smaller than the diameter of the housing 21 , and overlaps with the electric motor 20 in the axial direction. The rectangular portions 31 y , 32 y , and 33 y of the frame 31 , the cover 32 , and the board 33 do not overlap with the electric motor 20 in the axial direction.

The cover 32 is attached to the upper portion of the frame 31 so as to cover the board 33 (refer to FIGS. 3 and 5 ). An internal space surrounded by the frame 31 and the cover 32 accommodates only one board 33 having the electronic component mounted thereon.

As illustrated in FIG. 2 , the upper end portion of the motor terminals 15 to 17 penetrates a through-hole 31 e disposed in the circular portion 31 x of the frame 31 . As illustrated in FIG. 4 , the upper end portion of the motor terminals 15 to 17 is electrically connected to the circular portion 33 x of the board 33 . Specifically, the respective upper end portions of the motor terminals 15 to 17 are inserted into the respective through-holes 3 h 1 , 3 h 2 , and 3 h 3 formed in the circular portion 33 x of the board 33 , and are electrically connected by means of soldering. The motor terminals 15 to 17 and the frame 31 are electrically insulated from each other.

As illustrated in FIGS. 2, 4 and 6 , the electronic components such as FETs Q 1 to Q 7 , the electrolytic capacitor 9 , and the control unit 1 (microcomputer chip) are mounted on a front surface 3 u of the board 33 . Out of these electronic components, at least FET Q 1 to Q 7 , the electrolytic capacitor 9 , and the control unit 1 (microcomputer chip) are arranged in the circular portion 33 x . FETs Q 8 to Q 10 and FETs Q 8 to Q 10 are also mounted on the front surface 3 u of the board 33 . However, in FIGS. 2, 4, 6, and 9 to 14 , FET Q 8 to Q 10 and a mounting position thereof are omitted in the illustration for the sake of convenience.

As illustrated in FIGS. 5 and 7 , the electronic components such as the magnetic sensor 5 , the power connector 7 p , and the input/output connector 7 s are mounted on a rear surface 3 b of the board 33 . The magnetic sensor 5 is located at a position facing the upper end portion of the shaft 22 a of the electric motor 20 , which is the center of the circular portion 33 x of the rear surface 3 b of the board 33 . A magnet 22 g is embedded in the upper end portion of the shaft 22 a . In order to detect a rotation state of the rotor 22 , the magnetic sensor 5 detects a change in the magnetic force of the magnet 22 g . The magnetic sensor 5 is an example of a “rotation sensor” according the embodiment of invention.

The power connector 7 p and the housing 77 of the input/output connector 7 s are integrated with each other, and are arranged in the rectangular portion 33 y of the rear surface 3 b of the board 33 . As illustrated in FIGS. 2 and 4 , the upper end portions of the power connector 7 p and the terminals 71 to 74 of the input/output connector 7 s are respectively inserted into the plurality of through-holes 3 h 4 , 3 h 5 , and 3 h 6 formed on the board 33 , and are electrically connected by means of soldering.

As illustrated in FIG. 7 , the housing 77 has fitting portions 7 a , 7 b , and 7 c . Among these, the lower end portion of the power terminals 71 and 72 protrudes into the fitting portion 7 a . The lower end portion of the signal terminal 73 protrudes into the fitting portion 7 b . The lower end portion of the signal terminal 74 protrudes into the fitting portion 7 c . That is, the fitting portion 7 a is the fitting portion of the power connector 7 p , and the fitting portions 7 b and 7 c are the fitting portions of the input/output connector 7 s.

As illustrated in FIG. 5 , the housing 77 and the respective fitting portions 7 a to 7 c penetrate a through-hole 31 k disposed in the rectangular portion 31 y of the frame 31 so as to be exposed to the electric motor 20 side (lower side in FIG. 5 ). The first harness 51 ( FIG. 1 ) for supplying the current from the in-vehicle battery 50 is fitted to the fitting portion 7 a in the axial direction of the electric motor 20 . The second harness 61 for communicating with an external device is fitted to the fitting portions 7 b and 7 c in the axial direction of the electric motor 20 . The external device includes the above-described torque sensor or vehicle speed sensor. The fitting portion 7 a is an example of a “first fitting portion” according to the embodiment of the invention, and the fitting portions 7 b and 7 c are an example of a “second fitting portion” according to the embodiment of the invention.

As illustrated in FIG. 2 , on the front surface 3 u of the board 33 , the electrolytic capacitor 9 is mounted in the vicinity of FET Q 1 located at a position farthest away from the power connector 7 p among the plurality of FETs Q 1 to Q 7 . The electrolytic capacitor 9 is connected in parallel with the inverter circuit 3 as illustrated in FIG. 1 . Specifically, the electrolytic capacitor 9 and FETs Q 1 to Q 6 of the inverter circuit 3 are electrically connected by a wiring pattern (not illustrated) formed on the front surface 3 u of the board 33 . As described above, the inverter circuit 3 is driven using PWM by the predriver circuit 2 . Accordingly, the current is greatly and transiently changed when FETs Q 1 to Q 6 are switched. Therefore, in FET Q 1 which is located farthest away from the power terminal 71 of the power connector 7 p and connected to the upstream side of the current supplied from the in-vehicle battery 50 , the wiring pattern for being connected to the power terminal 71 is lengthened. Impedance and inductance of the wiring pattern increase, and the current is not sufficiently supplied from the in-vehicle battery 50 during the switching. However, the electrolytic capacitor 9 is located in the vicinity of FET Q 1 . In this manner, it is possible to sufficiently supply the current to FET Q 1 during the switching. The same advantageous effect may be obtained by disposing the electrolytic capacitor in the vicinity of FET Q 3 or FET Q 5 on the upstream side, which is located closer to the power terminal 71 than FET Q 1 .

FIG. 8 is a simplified view illustrating a cross-sectional structure of the board 33 . The board 33 is a six-layer printed board in which six conductor layers L 1 to L 6 are stacked one on another via an insulation layer. In general, a printed board having four or more layers is called a multilayer printed board. The insulation layer is formed of an insulation base material 3 j or a prepreg 3 k.

Out of the six conductor layers, a first layer L 1 disposed on the rear surface 3 b of the board 33 , a sixth layer L 6 disposed on the front surface 3 u , and a third layer L 3 disposed and a fourth layer L 4 which are disposed inside the board 33 are the wiring layers respectively having a wiring pattern (conductor) 3 p . The second layer L 2 disposed inside the board 33 is a ground layer having a ground pattern (conductor) 3 g . The fifth layer L 5 disposed inside the board 33 is also a ground layer having a ground pattern (conductor) 3 q . However, as will be described later, the ground pattern 3 q has a function different from that of the ground pattern 3 g . Accordingly, for the sake of convenience, hereinafter, the fifth layer L 5 will be referred to as a case ground layer. The respective layers L 1 , L 2 , L 3 , L 4 , L 5 , and L 6 are arranged in this order from the rear surface 3 b of the board 33 toward the front surface 3 u.

Each portion of the board 33 has a plurality of through-holes 3 h and vias 3 v for electrically connecting patterns having different layers. The via 3 v has a diameter smaller than that of the through-hole 3 h , and is also called a through-hole via. Through-holes 3 h 1 to 3 h 3 described above and through-holes 3 h 4 to 3 h 6 to be described later are examples of the through-hole 3 h . A thermal via group 3 v t and a through-hole via 3 v s to be described later are examples of the via 3 v . The through-hole 3 h and the via 3 v are examples of an “interlayer connection wire” according to the embodiment of the invention. As an alternative example, for example, a metal columnar body may be embedded in the board 33 as the interlayer connection wire.

The electric circuit of the controller 10 ( FIG. 1 ) is configured to include the wiring patterns 3 p disposed in the wiring layers L 1 , L 3 , L 4 , and L 6 , the electronic component ( FIGS. 6 and 7 ) mounted on the front surface 3 u and the rear surface 3 b of the board 33 , and the through-hole 3 h and the via 3 v for electrically connecting the wiring patterns 3 p having different layers to each other.

The ground pattern 3 g disposed in the second layer L 2 is a ground pattern for a circuit which is electrically connected to the wiring pattern 3 p of a portion of the respective wiring layers L 1 , L 3 , L 4 , and L 6 . FIG. 8 illustrates an example in which the ground pattern 3 g of the second layer L 2 and the wiring pattern 3 p of the first layer L 1 and the sixth layer L 6 are electrically connected to each other by the via 3 v . The second layer L 2 is an example of a “first ground layer” according to the embodiment of the invention. The ground pattern 3 g is an example of the “first ground pattern” according to the embodiment of the invention. The ground pattern 3 g for the circuit may also be disposed in the wiring layers L 1 , L 3 , L 4 , and L 6 .

The ground pattern 3 q disposed in the fifth layer L 5 is a ground pattern for electromagnetic wave noise resistance which is electrically connected to the frame 31 , and is electrically insulated from the patterns 3 p and 3 g formed in the other layers L 1 to L 4 , and L 6 . The fifth layer L 5 is an example of a “second ground layer” according to the embodiment of the invention. The ground pattern 3 q is an example of the “second ground pattern” according to the embodiment of the invention.

FIG. 9 is a plan view of the first layer L 1 of the board 33 . FIG. 10 is a plan view of the second layer L 2 of the board 33 . FIG. 11 is a plan view of the third layer L 3 and the fourth layer L 4 of the board 33 . FIG. 12 is a plan view of the fifth layer L 5 of the board 33 . FIG. 13 is a plan view of the sixth layer L 6 of the board 33 . For the sake of convenience, FIGS. 9 to 13 illustrate a state where the respective layers L 1 to L 6 are viewed from above. FIGS. 9 to 13 illustrate only a main portion of the respective layers L 1 to L 6 , and details of the patterns 3 p , 3 g , and 3 q in FIG. 8 are omitted in the illustration.

As illustrated in FIG. 9 , in the first layer L 1 disposed on the rear surface 3 b of the board 33 , the magnetic sensor 5 is mounted on a center position S 5 of the circular portion 33 x (refer to FIG. 7 ). Based on the center position S 5 , a first region R 1 surrounded by a one-dot chain line on one side (upper side in FIG. 9 ) which does not include the magnetic sensor 5 and a second region R 2 surrounded by a two-dot chain line on the other side (lower side in FIG. 9 ) including the magnetic sensor 5 are divided by widening an interval of the wiring patterns. A dotted line Y is a dividing line between the first region R 1 and the second region R 2 . The first region R 1 has the drive circuit (the inverter circuit 3 and a wire indicated by a thick solid line in FIG. 1 ) of the electric motor 20 . The second region R 2 has the control circuit (the control unit 1 , the constant voltage circuit 2 , the predriver circuit 4 , the magnetic sensor 5 , and a wire indicated by a thin solid line in FIG. 1 ) of the electric motor 20 . The wiring pattern for the drive circuit and the wiring pattern for the control circuit are connected to each other between the first region R 1 and the second region R 2 (not illustrated).

As illustrated in FIGS. 11 and 13 , similar to the first layer L 1 , the third layer L 3 , the fourth layer L 4 , and the sixth layer L 6 which are the other wiring layers are divided into the first region R 1 having the drive circuit of the electric motor 20 and the second region R 2 having the control circuit of the electric motor 20 . In a case of being projected in the thickness direction (axial direction of the electric motor 20 ) of the board 33 from above the board 33 , the first regions R 1 of the respective wiring layers L 1 , L 3 , L 4 , and L 6 overlap with one another in the thickness direction of the board 33 , and the second regions R 2 of the respective wiring layers L 1 , L 3 , L 4 , and L 6 also overlap with one another in the thickness direction of the board 33 .

In FIG. 7 , on the rear surface 3 b of the board 33 , the lower side of the dividing line Y is the first region R 1 , and the upper side of the dividing line Y is the second region R 2 . In FIG. 6 , on the front surface 3 u of the board 33 , the upper side of the dividing line Y is the first region R 1 , and the lower side of the dividing line Y is the second region R 2 .

As illustrated in FIG. 10 , the second layer (ground layer) L 2 disposed inside the board 33 is divided into the third region R 3 (region surrounded by the one-dot chain line) overlapping with the first region R 1 of the respective wiring layers L 1 , L 3 , L 4 , L 6 in the thickness direction of the board 33 and the fourth region R 4 (region surrounded by the two-dot chain line) overlapping with the second region R 2 of the respective wiring layers L 1 , L 3 , L 4 , and L 6 in the thickness direction of the board 33 .

The third region R 3 has the ground pattern ( 3 g in FIG. 8 ) for the power system electrically connected to the drive circuit of the first region R 1 . The ground pattern for the power system includes the power system ground line 19 illustrated in FIG. 1 . The fourth region R 4 has the ground pattern ( 3 g in FIG. 8 ) for the control system electrically connected to the control circuit of the second region R 2 . The ground pattern for the control system includes the control system ground line 18 illustrated in FIG. 1 . The interval is widened between the ground pattern for the power system and the ground pattern for the control system. In this manner, the third region R 3 and the fourth region R 4 are divided.

As illustrated in FIG. 12 , the fifth layer (case ground layer) L 5 disposed inside the board 33 is not divided into a plurality of regions. The fifth layer L 5 has the ground pattern ( 3 q in FIG. 8 ) for the electromagnetic wave noise resistance. The ground pattern for the electromagnetic wave noise resistance is formed on substantially the entire surface of the board 33 , except for a portion where the interlayer connection wire and the screw hole are formed.

As illustrated in FIG. 9 , the through-holes 3 h 1 to 3 h 3 for electrically connecting the motor terminal 15 to 17 are disposed in an outer edge portion belonging to the first region R 1 of the circular portion 33 x of the board 33 . The respective through-holes 3 h 1 to 3 h 3 penetrate the board 33 as illustrated in FIG. 9 to FIG. 13 . Each connection state of the respective motor terminals 15 to 17 connected to the respective through-holes 3 h 1 to 3 h 3 is as illustrated in FIG. 4 .

The respective through-holes 3 h 1 to 3 h 3 are electrically connected to at least any one of the wiring patterns 3 p ( FIG. 8 ) disposed in the first region R 1 of the wiring layers L 1 , L 3 , L 4 , and L 6 illustrated in FIGS. 9, 11, and 13 . As illustrated in FIGS. 10 and 12 , in the ground layer L 2 and the case ground layer L 5 , the through-hole 3 h 1 to 3 h 3 are surrounded by an insulation portion 3 z (portion having no conductor such as the ground pattern 3 g ). The respective through-holes 3 h 1 to 3 h 3 are electrically insulated from the ground patterns 3 g and 3 q ( FIG. 8 ) disposed in the ground layer L 2 and the case ground layer L 5 .

As illustrated in FIGS. 9 to 13 , an end portion of the rectangular portion 33 y of the board 33 has the plurality of through-holes 3 h 4 to 3 h 6 for electrically connecting the terminals 71 to 74 of the connectors 7 p and 7 s . The respective through-holes 3 h 4 to 3 h 6 penetrate the board 33 . Each connection state of the terminals 71 to 74 connected to the respective through-holes 3 h 4 to 3 h 6 is as illustrated in FIG. 2 and FIG. 4 .

The respective through-holes 3 h 4 to 3 h 6 are electrically connected to at least any one of the wiring patterns 3 p ( FIG. 8 ) disposed in the first region R 1 of the wiring layers L 1 , L 3 , L 4 , and L 6 illustrated in FIGS. 9, 11, and 13 . As illustrated in FIGS. 10 and 12 , in the ground layer L 2 and the case ground layer L 5 , the through-holes 3 h 4 to 3 h 6 are surrounded by the insulation portion 3 z . The respective through-holes 3 h 4 to 3 h 6 are electrically insulated from the ground patterns 3 g and 3 q ( FIG. 8 ) disposed in the ground layer L 2 and the case ground layer L 5 . As an alternative example, at least any one of the through-holes 3 h 4 to 3116 may be electrically connected to the ground pattern of the second layer L 2 .

As illustrated in FIG. 10 , in the second layer L 2 , the connection point X connecting the ground pattern for the power system disposed in the third region R 3 and the ground pattern for the control system disposed in the fourth region R 4 is disposed between the through-hole 3 h 4 and the through-hole 3 h 5 connecting the terminals 71 to 73 . At the connection point X, the power system ground line 19 (ground pattern for the power system) and the control system ground line 18 (ground pattern for the control system) which are illustrated in FIG. 1 merge, thereby electrically connecting both of these to each other.

As illustrated in FIG. 6 , the plurality of electronic components are mounted on the front surface 3 u of the board 33 . Out of the electronic components, FETs Q 1 to Q 10 and the control unit (microcomputer chip) 1 are present as the above-described heat-generating electronic component having the great calorific value when the power is supplied thereto. As illustrated in FIG. 13 , the thermal via group 3 v t is disposed at positions S 1 to S 3 where the heat-generating electronic component is mounted on the front surface 3 u of the board 33 . In the thermal via group 3 v t , multiple vias 3 v disposed so as to penetrate the board 33 are intensively disposed. FETs Q 1 to Q 7 are mounted at the mounting position S 1 in FIG. 13 . The control unit 1 is mounted at the mounting position S 2 , and the other heat-generating electronic component is mounted at the mounting position S 3 . The above-described FETs Q 8 to Q 10 are mounted in the vicinity of FETs Q 1 to Q 7 on the front surface 3 u of the board 33 .

That is, the thermal via group 3 v t is disposed in the board 33 immediately below the heat-generating electronic components. The thermal via group 3 v 1 transfers the heat generated from the heat-generating electronic components located immediately above from the front surface 3 u side to the rear surface 3 b side of the board 33 . The heat transferred to the rear surface 3 b side of the board 33 by the thermal via group 3 v t is radiated outward by the frame 31 ( FIG. 2 ) which also serves as the heat sink. The thermal via group 3 v t is an example of a “heat transfer portion” according to the embodiment of the invention.

The respective thermal via groups 3 v t are electrically connected to at least one of the wiring patterns 3 p ( FIG. 8 ) disposed in the wiring layers L 1 , L 3 , L 4 , and L 6 illustrated in FIGS. 9, 11, and 13 . As illustrated in FIGS. 10 and 12 , in the ground layer L 2 and the case ground layer L 5 , the respective thermal via groups 3 v 1 are surrounded by the insulation portion 3 z . The respective thermal via groups 3 v t are electrically insulated from the ground patterns 3 g and 3 q ( FIG. 8 ) disposed in the ground layer L 2 and the case ground layer L 5 .

Out of the heat-generating electronic components, FETs Q 1 to Q 10 particularly have the greater calorific value. Among FETs Q 1 to Q 10 , FETs Q 1 to Q 7 are mounted in the first region R 1 of the circular portion 33 x on the front surface 3 u of the board 33 as illustrated in FIG. 6 . A protrusion 31 t is formed in the circular portion 31 x of the frame 31 so as to overlap with the first region R 1 of the circular portion 33 x of the board 33 in the axial direction of the electric motor 20 (refer to FIGS. 2, 5, and 6 ). The protrusion 31 t is formed in a fan shape in a plan view. The upper surface of the protrusion 31 t is parallel to the board 33 . FETs Q 1 to Q 7 , the thermal via group 3 v t located immediately below FETs Q 1 to Q 7 , the first region R 1 of the circular portion 33 x of the board 33 , the protrusion 31 t of the frame 31 and the electric motor 20 are arranged so as to overlap with each other in the axial direction of the electric motor 20 .

FIG. 14 is a sectional view illustrating a thermal connection state of FETs Q 1 to Q 7 , the board 33 , and the frame 31 . FETs Q 1 to Q 7 include a main body portion 41 , a terminal 42 laterally protruding from the main body portion 41 , and a heat radiation plate 43 connected to a bottom surface of the main body portion 41 . The terminal 42 is electrically connected to the wiring pattern 3 p disposed on the front surface 3 u (sixth layer L 6 ) of the board 33 by means of soldering. The heat radiation plate 43 is electrically connected to the other wiring pattern 3 p disposed on the front surface 3 u of the board 33 by means of soldering. The thermal via group 3 v t is disposed below the main body portion 41 and the heat radiation plate 43 so as to penetrate the board 33 .

The thermal via group 3 v t is electrically connected to the wiring pattern 3 p disposed in the wiring layers L 1 , L 3 , L 4 , and L 6 , and is electrically insulated from the ground patterns 3 g and 3 q disposed in the ground layer L 2 and the case ground layer L 5 . A portion of the rear surface 3 b of the board 33 and the protrusion 31 t of the frame 31 are located below FETs Q 1 to Q 7 and the thermal via group 3 v t . An insulating heat radiation material 38 is interposed between the portion of the rear surface 3 b and the protrusion 31 t . The insulating heat radiation material 38 is formed of thermal grease or a heat radiation/insulation sheet. The insulating heat radiation material 38 thermally connects the portion of the rear surface 3 b of the board 33 and the protrusion 31 t of the frame 31 to each other, and electrically insulates both of these from each other.

Therefore, the heat generated from FETs Q 1 to Q 7 mounted on the front surface 3 u of the board 33 is efficiently transferred to the protrusion 31 t of the frame 31 via the heat radiation plate 43 , the wiring pattern 3 p of the sixth layer L 6 , the thermal via group 3 v t , and the insulating heat radiation material 38 . The heat generated in FETs Q 8 to Q 10 is also radiated by a heat radiation structure which is the same as that of FETs Q 1 to Q 7 described above.

The other through-hole 3 h and the via 3 v (excluding the through-hole via 3 v 5 (to be described later)) which electrically connect the patterns 3 p and 3 g disposed in the different layers L 1 to L 4 , and L 6 other than the above-described fifth layer L 5 are also electrically insulated from the ground pattern 3 q of the fifth layer L 5 .

As illustrated in FIGS. 2 and 9 to 13 , a plurality of through-holes 3 f are disposed at a predetermined interval in an end portion of the board 33 . The screw 39 ( FIGS. 2 and 5 ) for fixing the board 33 to the frame 31 is inserted into each of the through-holes 3 f . As illustrated in FIGS. 2 and 5 , a plurality of screw holes 31 f for being screwed to the screws 39 are disposed coaxially with the through-holes 3 f at a predetermined intervals in an end portion of the frame 31 . The screw 39 is formed using the conductor. As illustrated in FIGS. 9 to 13 , the plurality of through-hole vias 3 v 5 are disposed around each of the through-holes 3 f . Each of the through-hole vias 3 v 5 penetrates the board 33 .

FIG. 15 is a sectional view illustrating an electrical connection state of the screw 39 , the board 33 , and the frame 31 . As illustrated in FIGS. 9, 11, 13, and 15 , a land (conductor) 3 L is disposed around the through-hole 3 f in the respective wiring layers L 1 , L 3 , L 4 , and L 6 . The land 3 L is surrounded by the insulation portion 3 z . The through-hole via 3 v s is electrically connected to the land 3 L, but is electrically insulated from the wiring pattern 3 p.

As illustrated in FIG. 15 , in the second layer L 2 , the through-hole via 3 v , is electrically insulated from the ground pattern 3 g . The land 3 L of the respective wiring layers L 1 , L 3 , L 4 , and L 6 are also electrically insulated from the ground pattern 3 g.

In the fifth layer L 5 , the through-hole via 3 v s is electrically connected to the ground pattern 3 q . That is, the ground pattern 3 q of the fifth layer L 5 is electrically connected to the land 3 L of the respective wiring layers L 1 , L 3 , L 4 , and L 6 via the through-hole via 3 v s , but is not electrically connected to the wiring pattern 3 p . The ground pattern 3 q is not electrically connected to other patterns or the electric circuit inside the board 33 . The through-hole via 3 v s is an example of a “conductive portion” according to the embodiment of the invention.

A shaft portion 39 b of the screw 39 is inserted into the through-hole 3 f from the front surface 3 u side of the board 33 , and the shaft portion 39 b is screwed into the screw hole 31 f of the frame 31 , thereby fixing the board 33 to the frame 31 as illustrated in FIG. 15 . The insulating heat radiation material 38 is disposed among the rear surface 3 b of the board 33 , the upper surface of the frame 31 , and the shaft portion 39 b of the screw 39 . In this manner, a head portion 39 a of the screw 39 come into contact with the land 3 L and the through-hole via 3 v s on the front surface 3 u of the board 33 , and the ground pattern 3 q for the electromagnetic wave noise resistance which is disposed in the fifth layer L 5 is electrically connected to the frame 31 via the through-hole via 3 v s , the screw 39 , and the land 3 L. The frame 31 is electrically connected to a body earth of a vehicle (not illustrated).

According to the above-described embodiment, in the load drive device 100 in which the controller 10 and the electric motor 20 are integrated with each other, the controller 10 is configured to include one six-layer printed board 33 having the electronic components mounted thereon for driving and controlling the electric motor 20 , and the board 33 is accommodated in the internal space surrounded by the frame 31 and the cover 32 . Accordingly, the drive circuit and the control circuit of the electric motor 20 do not need to be electrically connected to each other by using an external connection terminal such as a bus bar. The drive circuit and the control circuit may be electrically connected to each other by using the wiring pattern 3 p disposed in the board 33 . In this manner, the load drive device 100 can be miniaturized in the axial direction of the electric motor 20 .

The wiring layers L 1 , L 3 , L 4 , and L 6 having three or more layers are disposed inside the front surface 3 u and the rear surface 3 b of the board 33 , and the wiring patterns 3 p of the respective wiring layers L 1 , L 3 , L 4 , and L 6 are electrically connected to each other by using the through-hole 3 h and the via 3 v . Therefore, the electric circuit can be more freely designed by increasing current capacity of the wiring pattern 3 p for supplying the current to the electric motor 20 . The respective wiring layers L 1 , L 3 , L 4 , and L 6 are divided into the first region R 1 having the drive circuit of the electric motor 20 and the second region R 2 having the control circuit of the electric motor 20 . The ground layer L 2 disposed inside the board 33 is divided into the third region R 3 overlapping with the first region R 1 in the thickness direction of the board 33 and the fourth region R 4 overlapping with the second region R 2 in the thickness direction of the board 33 . The ground pattern 3 g (power system ground line 19 ) for the power system electrically connected to the drive circuit of the electric motor 20 is disposed in the third region R 3 , and the ground pattern 3 g (control system ground line 18 ) for the control system electrically connected to the control circuit of the electric motor 20 is disposed in the fourth region R 4 . Therefore, the controller 10 can be prevented from malfunctioning due to signal noise generated in the drive circuit or the control circuit in the board 33 .

The frame 31 for fixing the board 33 is also used as the heat sink. Accordingly, the heat generated from the electronic components mounted on the board 33 can be radiated outward by the frame 31 . The case ground layer L 5 having the ground pattern 3 q for the electromagnetic wave noise resistance which is electrically connected to the frame 31 is formed inside the board 33 . The ground pattern 3 q of the case ground layer L 5 is electrically insulated from the ground pattern 3 g of the ground layer L 2 and the wiring pattern 3 p of the wiring layers L 1 , L 3 , L 4 , and L 6 , and the frame 31 is connected to the body earth of the vehicle so as to be grounded. Therefore, the electromagnetic wave generated from the electric circuit formed in the board 33 can be restrained from adversely affecting other electronic devices mounted on the vehicle as the electromagnetic wave noise. In addition, the electromagnetic wave generated in other electronic devices can be restrained from adversely affecting the electric circuit formed in the board 33 as the electromagnetic wave noise.

Therefore, in the load drive device 100 integrated with the electric motor, it is possible to realize miniaturization, to prevent the malfunction of the controller 10 , and to improve the heat radiating performance and the resistance to the electromagnetic wave noise.

In the above-described embodiment, the magnetic sensor 5 for detecting the rotation state of the rotor 22 of the electric motor 20 is mounted at the center of the circular portion 33 x on the rear surface 3 b of the board 33 . In the board 33 , the first region R 1 having the drive circuit of the electric motor 20 and the third region R 3 having the ground pattern 3 g for the power system electrically connected to the drive circuit are formed on one side which does not include the magnetic sensor 5 with respect to the mounting position (center position S 5 ) of the magnetic sensor 5 . In addition, the second region R 2 having the control circuit of the electric motor 20 and the fourth region R 4 having the ground pattern 3 g for the control system electrically connected to the control circuit are formed on the other side including the magnetic sensor 5 with respect to the mounting position (center position S 5 ) of the magnetic sensor 5 . In this manner, each space is secured while the drive circuit and the control circuit of the electric motor 20 are divided in the board 33 . Therefore, each circuit can be easily formed.

In the above-described embodiment, the motor terminals 15 to 17 are electrically connected to the board 33 by arranging the motor terminals 15 to 17 in the portion overlapping with the electric motor 20 in the axial direction. Therefore, the load drive device 100 can also be miniaturized in the radial direction (direction perpendicular to the rotation axis J) of the electric motor 20 . The connectors 7 p and 7 s are mounted on the rectangular portion 33 y which does not overlap with the electric motor 20 in the board 33 in the axial direction, and the fitting portions 7 a to 7 c of the connectors 7 p and 7 s are arranged toward the electric motor 20 side. Therefore, even in a state where the harnesses 51 and 61 for connecting the in-vehicle battery 50 or the external device are fitted to the fitting portions 7 a to 7 c , the load drive device 100 can be miniaturized in the axial direction or the radial direction of the electric motor 20 . Furthermore, the diameter of the circular portion 33 x where the connectors 7 p and 7 s of the board 33 are not mounted is substantially equal to the diameter of the electric motor 20 . Accordingly, the load drive device 100 can be further miniaturized in the radial direction.

In the above-described embodiment, the first region R 1 and the second region R 2 do not merge in the respective wiring layers L 1 , L 3 , L 4 , and L 6 of the board 33 . Therefore, the drive circuit of the electric motor 20 formed in the first region R 1 and the control circuit of the electric motor 20 formed in the second region R 2 can be easily formed in a separated state. In this manner, the respective circuits can be prevented from adversely affecting each other due to the noise. The third region R 3 and the fourth region R 4 of the ground layer L 2 of the board 33 merge only in the vicinity of the connectors 7 p and 7 s (connection point X in FIG. 10 ). Therefore, the ground pattern 3 g for the power system formed in the third region R 3 and the ground pattern 3 g for the control system formed in the fourth region R 4 can be easily formed in a separated state in the portions other than the connectors 7 p and 7 s . In this manner, the respective circuits can be prevented from adversely affecting each other due to the noise.

On the other hand, as FETs Q 1 to Q 6 for switching the current flowing to the coils 25 u , 25 v , and 25 w of the electric motor 20 are located farther from the power connector 7 p , the wire length of the current path from the in-vehicle battery 50 to FETs Q 1 to Q 6 is lengthened, and the waveform of the current is deformed, thereby causing a possibility that the driving of the electric motor 20 may be hindered. However, in the present embodiment, FETs Q 1 to Q 6 and the electrolytic capacitor 9 for the smoothing purpose are mounted on the circular portion 33 x on the front surface 3 u of the board 33 , and the electrolytic capacitor 9 is electrically connected to FETs Q 1 to Q 6 . Therefore, the electrolytic capacitor 9 can prevent the deformation of the waveform of the current supplied from the in-vehicle battery 50 to the respective FETs Q 1 to Q 6 via the connectors 7 p and 7 s . As described above, even during the switching where the current is greatly and transiently changed, the current is sufficiently supplied from the electrolytic capacitor 9 to FET Q 1 located farthest away from the power connector 7 p and connected to the current upstream side of the current supplied from the in-vehicle battery 50 . As a result, the electric motor 20 can be stably driven by the inverter circuit 3 including FETs Q 1 to Q 6 .

In the above-described embodiment, the heat-generating electronic components such as FETs Q 1 to Q 7 and the control unit 1 are mounted on the portion overlapping with the electric motor 20 in the axial direction on the front surface 3 u of the board 33 , and the thermal via group 3 v t for transferring the heat generated by the heat-generating electronic components to the rear surface of the board 33 is disposed in the board 33 immediately below the heat-generating electronic components. Therefore, the heat generated by the heat-generating electronic components mounted on the front surface 3 u of the board 33 is transferred to the rear surface 3 b side of the board 33 by the thermal via group 3 v t . In this manner, the heat is cooled by the air, or the heat is radiated by the frame 31 serving as the heat sink located on the rear surface 3 b side.

In the above-described embodiment, in particular, the protrusion 31 t is disposed at the position of the frame 31 overlapping with FETs Q 1 to Q 7 , the thermal via group 3 v t , and the electric motor 20 which have particularly the greater calorific value in the axial direction, and the upper surface of the protrusion 31 t is formed parallel to the board 33 . The insulating heat radiation material 38 is interposed between a portion on the rear surface 3 b of the board 33 overlapping with the electric motor 20 in the axial direction and the protrusion 31 t of the frame 31 . Therefore, the heat generated by FETs Q 1 to Q 7 mounted on the front surface 3 u of the board 33 is efficiently transferred to the frame 31 via the thermal via group 3 v t and the insulating heat radiation material 38 of the board 33 . In this manner, the heat can be easily radiated outward from the frame 31 .

Furthermore, in the above-described embodiment, the plurality of through-holes 3 f and the through-hole via 3 v s for surrounding the respective through-holes 3 f are disposed in the board 33 , and the plurality of the screw holes 31 f are disposed coaxially with the respective through-holes 3 f in the frame 31 . The screw 39 having the conductor is inserted into the respective through-holes 3 f from the front surface 3 u side of the board 33 , and is screwed into the respective screw holes 31 f . In this manner, the board 33 is fixed to the frame 31 , and the head portion 39 a of the screw 39 is brought into contact with the through-hole via 3 v s . Therefore, while the board 33 is fixed to the frame 31 by using the screw 39 , the ground pattern 3 q for the electromagnetic wave noise resistance of the case ground layer L 5 is electrically connected to the frame 31 . In this manner, the resistance to the electromagnetic wave noise can be improved.

The invention can adopt various embodiments other than the above-described embodiment. For example, in the above-described embodiment, an example has been described in which the housing 21 and the frame 31 are separately formed. However, the invention is not limited only to this example. The housing having the electric motor incorporated therein and the frame may be integrally formed. A fin may be formed in the frame or the housing so as to be used as the heat sink.

In the above-described embodiment, an example has been described in which the electric motor 20 has the three-phase brushless motor. However, the invention is not limited only to this example. The invention is also applicable to the load drive device having the other electric motor.

In the above-described embodiment, the six-layer printed board 33 has been described as an example. However, the invention is not limited only to this example. For example, a multilayer board having five, seven, or more conductor layers may be used. Not only the board 33 having the circular portion 33 x and the rectangular portion 33 y but also the board having only the circular portion, only the rectangular portion, or other shapes may be used. That is, the board may be formed depending on a shape of the electric motor, a shape of the input/output connector, or a configuration of the electric circuit. The housing 21 , the frame 31 , and the cover 32 may also be formed in the similar manner.

In the above-described embodiment, an example has been described as follows. In order to detect the rotation state of the rotor 22 of the electric motor 20 , the magnet 22 g is disposed in the upper end portion of the shaft 22 a of the rotor 22 , and the magnetic sensor 5 is disposed on the rear surface of the board 33 . However, the invention is not limited only to this example. The other detection target may be disposed in the rotor 22 , and the other rotation sensor may be disposed in the board 33 so as to detect a physical change in the detection target which is caused by the rotation of the rotor 22 .

In the above-described embodiment, an example has been described as follows. The thermal via group 3 v t is disposed immediately below the heat-generating electronic components such as FETs Q 1 to Q 7 in the board 33 , and the heat generated from the heat-generating electronic components is transferred to the thermal via group 3 v t to the rear surface 3 b side of the board 33 . However, the invention is not limited only to this example. Alternatively, for example, as the heat transfer portion, a copper pin, a through-hole, a highly conductive resin may be disposed in the board immediately below the heat-generating electronic components. The heat transfer portion may be disposed so as to penetrate the board, or may be embedded so as not to penetrate the board.

In the above-described embodiment, an example has been described as follows. The ground pattern 3 q for the electromagnetic wave noise resistance of the fifth layer L 5 is electrically connected to the frame 31 by using the through-hole via 3 v s and the screw 39 . However, the invention is not limited only to this example. Alternatively, for example, in the board 33 , the conductor may be disposed on the peripheral surface of the through-hole 3 f penetrating the screw 39 or in the upper and lower end portions so as to form the through-hole through which the screw 39 can penetrate. In this manner, the ground pattern 3 q for the electromagnetic wave noise resistance of the fifth layer L 5 may be electrically connected to the frame 31 via the through-hole and the screw 39 . In addition, a conductive portion other than the above-described through-hole or the through-hole via 3 v s may be disposed in the board.

Furthermore, in the above-described embodiment, an example has been described in which the invention is applied to the load drive device 100 used in the electric power steering system. However, the invention is also applicable to the load drive device for other uses.

While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. According, the scope of the invention should be limited only by the attached claims.