Multilayer capacitor

The present invention relates to a multilayer capacitor.

A conventional multilayer capacitor disclosed in, for example, Patent Literature 1 (Japanese Unexamined Patent Publication No. H7-135124) is known. The multilayer capacitor disclosed in Patent Literature 1 is a multilayered ceramic capacitor in which a plurality of dielectric layers, on surfaces of which electrode patterns are arranged, are laminated, in which a plurality of parallel connected capacitor components are formed therein, and in which some of the electrode patterns arranged on the ceramic dielectric layers are divided into a plurality of sections such that each of the parallel connected capacitor components is configured to connect at least two capacitor components in series.

In the conventional multilayer capacitor, at least two capacitor components are connected in series, and thereby a withstand voltage characteristic is improved. However, in the conventional multilayer capacitor, even if, for example, a failure such as a short circuit occurs at one of the parallel connected capacitor components, it has no effect on the other capacitor components. For this reason, in the conventional multilayer capacitor, even if a failure occurs at the capacitor component, capacitance and a withstand voltage are secured. Thus, even if a failure occurs after mounting, the failure cannot be detected.

An aspect of the present invention is directed to providing a multilayer capacitor capable of detecting that a failure occurs while improving a withstand voltage characteristic.

A multilayer capacitor according to an aspect of the present invention includes: an element configured to have a pair of end faces that face each other and four lateral surfaces that couple the pair of end faces; first and second external electrodes disposed close to the pair of end faces; and a plurality of internal electrodes disposed in the element. The plurality of internal electrodes include first internal electrodes that are electrically connected to the first external electrode, second internal electrodes that are electrically connected to the second external electrode, and a plurality of third internal electrodes. The plurality of third internal electrodes are electrically connected by a connection conductor. First capacity parts are constituted of the first internal electrodes and the third internal electrodes, and second capacity parts are constituted of the second internal electrodes and the third internal electrodes. The first capacity parts and the second capacity parts are electrically connected in series, and the connection conductor is disposed on at least one of the three lateral surfaces other than the lateral surface that is a mounting surface, among the four lateral surfaces.

In the multilayer capacitor according to an aspect of the present invention, the first capacity parts are constituted of the first internal electrodes that are electrically connected to the first external electrode and the third internal electrodes, and the second capacity parts are constituted of the second internal electrodes that are connected to the second external electrode and the third internal electrodes. The plurality of third internal electrodes are electrically connected to one another by the connection conductor. Thus, the multilayer capacitor has a configuration in which two capacitor components are connected in series. Therefore, in the multilayer capacitor, a withstand voltage characteristic can be improved. In the multilayer capacitor, since the first capacity parts and the second capacity parts are electrically connected in series by the plurality of third internal electrodes that are electrically connected by the connection conductor, for example, in a case where a failure occurs at the first capacity parts, changes in a capacitance and a resistance value occur. For this reason, even if a failure occurs at the multilayer capacitor after it is mounted, the failure can be detected.

In the multilayer capacitor, the connection conductor is disposed on at least one of the three lateral surfaces other than the lateral surface that is a mounting surface, among the four lateral surfaces. That is, the connection conductor is not disposed on the lateral surface that is the mounting surface. Therefore, when the multilayer capacitor is mounted, the connection conductor comes into contact with electrodes or the like of a circuit board, and the occurrence of a short circuit between the first external electrode and/or the second external electrode and the connection conductor can be inhibited. Therefore, the multilayer capacitor can have a configuration in which the first capacity parts and the second capacity parts are connected in series.

In an embodiment, the first internal electrodes, the second internal electrodes, and the third internal electrodes may be orthogonal to the mounting surface, and extend in a facing direction of the pair of end faces; and the connection conductor may be disposed on the lateral surface that faces the mounting surface. In this configuration, each of the internal electrodes is disposed to be orthogonal to the mounting surface and extend in the facing direction of the pair of end faces, and thereby the connection conductor can be disposed on the lateral surface that faces the mounting surface. Thus, in the multilayer capacitor, the occurrence of a short circuit between the first external electrode and/or the second external electrode and the connection conductor can be further inhibited. Therefore, the multilayer capacitor can have the configuration in which the first capacity parts and the second capacity parts are connected in series.

In an embodiment, each of the first external electrode and the second external electrode may have a resin electrode layer. The resin electrode layer has durability against a thermal shock. For this reason, in the multilayer capacitor, when the multilayer capacitor is mounted on a circuit board or the like, even in the case where solders are formed, deterioration caused by a thermal shock of bonded portions with the solders can be inhibited. The resin electrode layer has flexibility. For this reason, in the multilayer capacitor, when the multilayer capacitor is mounted on the circuit board, stress received from the circuit board or the like can be relaxed by the resin electrode layer. Therefore, occurrence of cracks or the like at the element of the multilayer capacitor can be inhibited.

In an embodiment, a thickness of the resin electrode layer close to the lateral surface that faces the mounting surface may be smaller than a thickness of the resin electrode layer close to the mounting surface. In this configuration, thicknesses of the first and second external electrodes close to the lateral surface that faces the mounting surface can be reduced. For this reason, in the multilayer capacitor, a distance between the first external electrode and the connection conductor and a distance between the second external electrode and the connection conductor can be secured (lengthened). Thereby, in the multilayer capacitor, the occurrence of a short circuit between the first external electrode and/or the second external electrode and the connection conductor can be inhibited. Therefore, the multilayer capacitor can have a configuration in which the first capacity parts and the second capacity parts are connected in series.

In an embodiment, the resin electrode layer may be partly disposed on each of the first external electrode and the second external electrode. In this configuration, the resin electrode layer is formed in places where the durability against the thermal shock and the flexibility are required for the first external electrode and the second external electrode. For this reason, in the multilayer capacitor, increases in the thicknesses of the first and second external electrodes can be avoided as a whole. Therefore, in the multilayer capacitor, the occurrence of a short circuit between the first external electrode and/or the second external electrode and the connection conductor can be inhibited. As a result, the multilayer capacitor can have a configuration in which the first capacity parts and the second capacity parts are connected in series.

In an embodiment, the resin electrode layer may not be disposed on the lateral surface that faces the mounting surface. The resin electrode layer need only be provided in places where the solder is formed on the first external electrode and the second external electrode and is installed on the circuit board. For this reason, in the multilayer capacitor, the resin electrode layer is not required for the lateral surface that faces the mounting surface. In this configuration, the occurrence of a short circuit between the first external electrode and/or the second external electrode and the connection conductor can be inhibited. Therefore, the multilayer capacitor can have a configuration in which the first capacity parts and the second capacity parts are connected in series.

According to an aspect of the present invention, the occurrence of a failure can be detected while a withstand voltage characteristic is improved.

FIG. 1 is a perspective view of a multilayer capacitor according to an embodiment.

FIG. 2 is a view illustrating a sectional configuration of the multilayer capacitor according to a first embodiment.

FIG. 3 is an exploded perspective view of an element of the multilayer capacitor illustrated in FIG. 1 .

FIG. 4 is a view illustrating a sectional configuration of the multilayer capacitor illustrated in FIG. 1 .

FIG. 5A is a sectional view illustrating a configuration of the multilayer capacitor illustrated in FIG. 1 .

FIG. 5B is a sectional view illustrating a configuration of the multilayer capacitor illustrated in FIG. 1 .

FIG. 5C is a sectional view illustrating a configuration of the multilayer capacitor illustrated in FIG. 1 .

FIG. 6 is an equivalent circuit diagram of the multilayer capacitor illustrated in FIG. 1 .

FIG. 7 is a view illustrating an electronic component device having the multilayer capacitor illustrated in FIG. 1 .

FIG. 8 is a view illustrating a sectional configuration of a multilayer capacitor according to a modification of the first embodiment.

FIG. 9 is a view illustrating a sectional configuration of a multilayer capacitor according to a modification of the first embodiment.

FIG. 10 is a view illustrating a sectional configuration of a multilayer capacitor according to a modification of the first embodiment.

FIG. 11 is a view illustrating a sectional configuration of a multilayer capacitor according to a second embodiment.

FIG. 12 is an exploded perspective view of an element of the multilayer capacitor illustrated in FIG. 11 .

FIG. 13 is an equivalent circuit diagram of the multilayer capacitor illustrated in FIG. 11 .

FIG. 14 is a perspective view of a multilayer capacitor according to a third embodiment.

FIG. 15A is a view illustrating a sectional configuration of the multilayer capacitor illustrated in FIG. 14 .

FIG. 15B is a view illustrating a sectional configuration of the multilayer capacitor illustrated in FIG. 14 .

FIG. 15C is a view illustrating a sectional configuration of the multilayer capacitor illustrated in FIG. 14 .

FIG. 16A is a view illustrating a sectional configuration of a multilayer capacitor according to a fourth embodiment.

FIG. 16B is a view illustrating a sectional configuration of the multilayer capacitor according to the fourth embodiment.

FIG. 17A is a view illustrating a sectional configuration of a multilayer capacitor according to a fifth embodiment.

FIG. 17B is a view illustrating a sectional configuration of the multilayer capacitor according to the fifth embodiment.

FIG. 17C is a view illustrating a sectional configuration of the multilayer capacitor according to the fifth embodiment.

FIG. 18A is a view illustrating a sectional configuration of a multilayer capacitor according to a sixth embodiment.

FIG. 18B is a view illustrating a sectional configuration of the multilayer capacitor according to the sixth embodiment.

FIG. 19 is a view illustrating an exemplary resin layer thickness.

Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings. In the description of the drawings, the same or equivalent elements are given the same reference signs, and duplicate description thereof will be omitted.

First Embodiment

As illustrated in FIGS. 1 and 2 , a multilayer capacitor 1 according to a first embodiment includes an element 2 , and a first external electrode 3 , a second external electrode 4 , and a connection conductor 5 that are disposed on an outer surface of the element 2 .

The element 2 has a cuboid shape. Cuboid shapes include a cuboid shape in which corners and ridge lines are chamfered, and a cuboid shape in which corners and ridge lines are rounded. The element 2 has a pair of end faces 2 a and 2 b that face each other, a pair of main surfaces (lateral surfaces) 2 c and 2 d that face each other, and a pair of lateral surfaces 2 e and 2 f that face each other, all of which are outer surfaces. A facing direction in which the pair of main surfaces 2 c and 2 d face each other is a first direction D 1 . A facing direction in which the pair of end faces 2 a and 2 b face each other is a second direction D 2 . A facing direction in which the pair of lateral surfaces 2 e and 2 f face each other is a third direction D 3 . In the present embodiment, the first direction D 1 is a height direction of the element 2 . The second direction D 2 is a longitudinal direction of the element 2 , and is perpendicular to the first direction D 1 . The third direction D 3 is a width direction of the element 2 , and is perpendicular to the first direction D 1 and the second direction D 2 .

The pair of end faces 2 a and 2 b extend in the first direction D 1 to be coupled between the pair of main surfaces 2 c and 2 d . The pair of end faces 2 a and 2 b also extend in the third direction D 3 (a short side direction of the pair of main surfaces 2 c and 2 d ). The pair of lateral surfaces 2 e and 2 f extend in the first direction D 1 to be coupled between the pair of main surfaces 2 c and 2 d . The pair of lateral surfaces 2 e and 2 f also extend in the second direction D 2 (a long side direction of the pair of end faces 2 a and 2 b ). In the present embodiment, as illustrated in FIG. 7 , when the multilayer capacitor 1 is mounted on another electronic device (for example, a circuit board or an electronic component), the main surface 2 d is provided as a mounting surface that faces the other electronic device.

The element 2 is configured such that a plurality of dielectric layers (insulator layers) 10 are laminated in a direction in which the pair of lateral surfaces 2 e and 2 f face each other. In the element 2 , the laminating direction of the plurality of dielectric layers 10 (hereinafter referred to simply as “laminating direction”) is identical to the third direction D 3 . Each of the dielectric layers 10 is formed of a sintered compact of a ceramic green sheet that includes, for example, a dielectric material (a BaTiO 3 -based, Ba (Ti, Zr)O 3 -based, or (Ba, Ca)TiO 3 -based dielectric ceramic). In the actual element 2 , the dielectric layers 10 are integrated to such an extent that a boundary between the dielectric layers 10 cannot be visually recognized.

As illustrated in FIG. 2 , the multilayer capacitor 1 includes a plurality of first internal electrodes 12 , a plurality of first dummy electrodes 13 , a plurality of second internal electrodes 14 , a plurality of second dummy electrodes 15 , and a plurality of third internal electrodes 16 , all of which are internal conductors disposed in the element 2 . In the present embodiment, the number of the plurality of first internal electrodes 12 (here, three) is the same as that of the plurality of second internal electrodes 14 .

The plurality of first internal electrodes 12 , the plurality of first dummy electrodes 13 , the plurality of second internal electrodes 14 , the plurality of second dummy electrodes 15 , and the plurality of third internal electrodes 16 are formed of a conductive material that is typically used for an internal electrode of a multilayered electric element (for example, Ni or Cu). The plurality of first internal electrodes 12 , the plurality of first dummy electrodes 13 , the plurality of second internal electrodes 14 , the plurality of second dummy electrodes 15 , and the plurality of third internal electrodes 16 are formed as sintered compacts of a conductive paste that contains the conductive material.

The first internal electrodes 12 , the second internal electrodes 14 , and the third internal electrodes 16 are disposed at different positions (layers) in the third direction D 3 of the element 2 . The first internal electrodes 12 and the third internal electrodes 16 are alternately disposed in the element 2 to face each other at an interval in the third direction D 3 . The second internal electrodes 14 and the third internal electrodes 16 are alternately disposed in the element 2 to face each other at an interval in the third direction D 3 . The first internal electrodes 12 and the first dummy electrodes 13 are disposed in the element 2 at the same positions (layers). The second internal electrodes 14 and the second dummy electrodes 15 are disposed in the element 2 at the same positions (layers).

As illustrated in FIG. 2 , the plurality of first internal electrodes 12 are disposed in a region close to the other lateral surface 2 f in the third direction D 3 of the element 2 . In the present embodiment, the plurality of first internal electrodes 12 are disposed in the region closer to the lateral surface 2 f than the middle of the element 2 in the third direction D 3 .

As illustrated in FIG. 3 , each of the first internal electrodes 12 has a rectangular shape in which the second direction D 2 is a long side direction and the first direction D 1 is a short side direction. The first internal electrodes 12 extend in a direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . One ends of the first internal electrodes 12 in a longitudinal direction are exposed at one end face 2 a . The other ends of the first internal electrodes 12 in the longitudinal direction are located closer to the one end face 2 a than the other end face 2 b , and are separated from the other end face 2 b . The first internal electrodes 12 are not exposed at the other end face 2 b , the pair of main surfaces 2 c and 2 d , and the pair of lateral surfaces 2 e and 2 f . The ends of the first internal electrodes 12 which are exposed at the one end face 2 a are electrically connected to the first external electrode 3 .

Each of the first dummy electrodes 13 has a rectangular shape in which the second direction D 2 is a transverse direction and the first direction D 1 is a longitudinal direction. The first dummy electrodes 13 extend in a direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . One ends of the first dummy electrodes 13 in the transverse direction are exposed at the other end face 2 b . The other ends of the first dummy electrodes 13 in the transverse direction are located closer to the other end face 2 b than the one end face 2 a , and are separated from the one end face 2 a . The first internal electrodes 12 and the first dummy electrodes 13 are disposed at a predetermined interval in the second direction D 2 (are electrically insulated). The ends of the first dummy electrodes 13 which are exposed at the other end face 2 b are electrically connected to the second external electrode 4 .

As illustrated in FIG. 2 , the plurality of second internal electrodes 14 are disposed in a region close to one lateral surface 2 e in the third direction D 3 of the element 2 . In the present embodiment, the plurality of second internal electrodes 14 are disposed in the region closer to the one lateral surface 2 e than the middle of the element 2 in the third direction D 3 .

As illustrated in FIG. 3 , each of the second internal electrodes 14 has a rectangular shape in which the second direction D 2 is a long side direction and the first direction D 1 is a short side direction. The second internal electrodes 14 extend in a direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . One ends of the second internal electrodes 14 are exposed at the other end face 2 b . The other ends of the second internal electrodes 14 in a longitudinal direction are located closer to the other end face 2 b than the one end face 2 a , and are separated from the one end face 2 a . The second internal electrodes 14 are not exposed at the one end face 2 a , the pair of main surfaces 2 c and 2 d , and the pair of lateral surfaces 2 e and 2 f . The ends of the second internal electrodes 14 which are exposed at the other end face 2 b are electrically connected to the second external electrode 4 .

Each of the second dummy electrodes 15 has a rectangular shape in which the second direction D 2 is a transverse direction and the first direction D 1 is a longitudinal direction. The second dummy electrodes 15 extend in a direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . One ends of the second dummy electrodes 15 in the transverse direction are exposed at the one end face 2 a . The other ends of the second dummy electrodes 15 in the transverse direction are located closer to the one end face 2 a than the other end face 2 b , and are separated from the other end face 2 b . The second internal electrodes 14 and the second dummy electrodes 15 are disposed at a predetermined interval in the second direction D 2 . The ends of the second dummy electrodes 15 which are exposed at the one end face 2 a are electrically connected to the first external electrode 3 .

Each of the third internal electrodes 16 includes a main electrode part 16 a and a connector part 16 b . The third internal electrodes 16 extend in a direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . The main electrode parts 16 a face the first internal electrodes 12 or the second internal electrodes 14 via a part (the dielectric layers 10 ) of the element 2 in the third direction D 3 . Each of the main electrode parts 16 a has a rectangular shape in which the second direction D 2 is a long side direction and the first direction D 1 is a short side direction. The connector parts 16 b extend from one sides (one long sides) of the main electrode parts 16 a , and are exposed at the one main surface 2 c . The third internal electrodes 16 are exposed at the one main surface 2 c , and are not exposed at the pair of end faces 2 a and 2 b , the other main surface 2 d , and the pair of lateral surfaces 2 e and 2 f . The main electrode part 16 a and the connector part 16 b are integrally formed.

As illustrated in FIG. 1 , the first external electrode 3 is disposed close to the one end face 2 a . The first external electrode 3 has an electrode portion 3 a disposed on the end face 2 a , electrode portions 3 b and 3 c disposed on the pair of main surfaces 2 c and 2 d , respectively, and electrode portions 3 d and 3 e disposed on the pair of lateral surfaces 2 e and 2 f , respectively. The electrode portion 3 a and the electrode portions 3 b , 3 c , 3 d and 3 e are connected at a ridge line part of the element 2 , and are electrically connected to each other. The first external electrode 3 is formed on five surfaces of one end face 2 a , the pair of main surfaces 2 c and 2 d , and the pair of lateral surfaces 2 e and 2 f . As illustrated in FIG. 5A , the electrode portion 3 a is disposed to cover all the portions of the first internal electrodes 12 which are exposed at the end face 2 a , and the first internal electrodes 12 are directly connected to the first external electrode 3 .

As illustrated in FIG. 1 , the second external electrode 4 is disposed close to the other end face 2 b . The second external electrode 4 has an electrode portion 4 a disposed on the end face 2 b , electrode portions 4 b and 4 c disposed on the pair of main surfaces 2 c and 2 d , respectively, and electrode portions 4 d and 4 e disposed on the pair of lateral surfaces 2 e and 2 f , respectively. The electrode portion 4 a and the electrode portion 4 b , 4 c , 4 d and 4 e are connected at a ridge line part of the element 2 , and are electrically connected to each other. The second external electrode 4 is formed on five surfaces of one end face 2 b , the pair of main surfaces 2 c and 2 d , and the pair of lateral surfaces 2 e and 2 f . As illustrated in FIG. 5B , the electrode portion 4 a is disposed to cover all the portions of the second internal electrodes 14 which are exposed at the end face 2 b , and the second internal electrodes 14 are directly connected to the second external electrode 4 .

As illustrated in FIG. 1 , the connection conductor 5 is disposed in the middle of the one main surface 2 c in the second direction D 2 . As illustrated in FIG. 5C , the connection conductor 5 is disposed to cover all the portions of the connector parts 16 b of the third internal electrodes 16 which are exposed at the main surface 2 c , and the connector parts 16 b are directly connected to the connection conductor 5 . That is, the connector parts 16 b connect the main electrode parts 16 a and the connection conductor 5 . Thereby, each of the third internal electrodes 16 is electrically connected to the connection conductor 5 .

As illustrated in FIGS. 4 and 6 , the multilayer capacitor 1 includes first capacity parts C 1 and second capacity parts C 2 . As illustrated in FIG. 4 , the first capacity parts C 1 are constituted of the first internal electrodes 12 and the third internal electrodes 16 that are alternately disposed in the element 2 to face each other at an interval in the third direction D 3 . In the present embodiment, the first capacity parts C 1 are formed in a region closer to the other lateral surface 2 f than the middle of the element 2 in the third direction D 3 . The first capacity parts C 1 constitutes a first capacitor component.

The second capacity parts C 2 are constituted of the second internal electrodes 14 and the third internal electrodes 16 that are alternately disposed in the element 2 to face each other at an interval in third direction D 3 . In the present embodiment, the second capacity parts C 2 are formed in a region closer to the one lateral surface 2 e than the middle of the element 2 in the third direction D 3 . The second capacity parts C 2 constitute a second capacitor component.

As illustrated in FIG. 6 , in the multilayer capacitor 1 having the above configuration, the plurality of first capacity parts C 1 are electrically connected in parallel, and the plurality of second capacity parts C 2 are electrically connected in parallel. In the multilayer capacitor 1 , the first capacity parts C 1 and the second capacity parts C 2 are electrically connected in series. To be specific, the first capacity parts C 1 and the second capacity parts C 2 are electrically connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 . The number of first and second first capacity parts C 1 and C 2 illustrated in FIG. 6 is not necessarily identical to the number of first, second, and third internal electrodes 12 , 14 and 16 illustrated in FIG. 2 .

As illustrated in FIG. 7 , the multilayer capacitor 1 having the above configuration is mounted on, for example, a circuit board 100 having land electrodes L 1 and L 2 . To be specific, an electronic component device 110 in which the multilayer capacitor 1 is mounted on the circuit board 100 includes the multilayer capacitor 1 and the circuit board 100 . The circuit board 100 has a board ST, and the land electrodes L 1 and L 2 mounted on the board ST. The circuit board 100 can further include a wiring (not shown) that is electrically connected to the land electrodes L 1 and L 2 , a power supply, an electronic control unit (ECU), and so on.

In the electronic component device 110 , the main surface (the mounting surface) 2 d of the element 2 of the multilayer capacitor 1 faces downward. The electrode portion 3 c of the first external electrode 3 and the land electrode L 1 are disposed to face each other, and the electrode portion 4 c of the second external electrode 4 and the land electrode L 2 are disposed to face each other. The first external electrode 3 and the land electrode L 1 are bonded by a solder S 1 , and the second external electrode 4 and the land electrode L 2 are bonded by a solder S 2 . Thereby, in the electronic component device, the first external electrode 3 of the multilayer capacitor 1 and the land electrode L 1 are electrically connected, and the second external electrode 4 and the land electrode L 2 are electrically connected. In the electronic component device 110 , the connection conductor 5 is not electrically connected to a conductor of the circuit board 100 .

As described above, in the multilayer capacitor 1 according to the present embodiment, the first capacity parts C 1 are constituted of the first internal electrodes 12 and the third internal electrodes 16 that are electrically connected to the first external electrode 3 , and the second capacity parts C 2 are constituted of the second internal electrodes 14 and the third internal electrodes 16 that are connected to the second external electrode 4 . The plurality of third internal electrodes 16 are electrically connected to one another by the connection conductor 5 . Thereby, the multilayer capacitor 1 has a configuration in which the first capacity parts C 1 and the second capacity parts C 2 (the two capacitor components) are connected in series. Therefore, in the multilayer capacitor 1 , a withstand voltage characteristic can be improved.

In the multilayer capacitor 1 , since the first capacity parts C 1 and the second capacity parts C 2 are connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 , changes in the capacitance and the resistance value occur, for example, in the case where a failure occurs at the first capacity parts C 1 . For this reason, even if a failure occurs at the multilayer capacitor 1 after it is mounted, the failure can be detected.

In the multilayer capacitor 1 according to the present embodiment, the first internal electrodes 12 , the second internal electrodes 14 , and the third internal electrodes 16 are orthogonal to the main surface 2 d of the element 2 , and extend in the second direction D 2 . In this configuration, the connector parts 16 b of the plurality of third internal electrodes 16 can be exposed at the main surface 2 c . Therefore, in the multilayer capacitor 1 , the connection conductor 5 can be disposed on the main surface 2 c of the element 2 (on the surface that faces the mounting surface). Thereby, when the multilayer capacitor 1 is mounted, the connection conductor 5 comes into contact with the electrodes or the like of the circuit board, and occurrence of a short circuit between the first external electrode 3 and/or the second external electrode 4 and the connection conductor 5 can be inhibited. Therefore, the multilayer capacitor 1 can have a configuration in which the first capacity parts C 1 and the second capacity parts C 2 are connected in series.

In the multilayer capacitor 1 according to the present embodiment, the first internal electrodes 12 are disposed in the region close to the other lateral surface 2 f in the element 2 , and the second internal electrodes 14 are disposed in the region close to the one lateral surface 2 e in the element 2 . Thereby, in the multilayer capacitor 1 , the first capacity parts C 1 are formed in the region close to the other lateral surface 2 f , and the second capacity parts C 2 are formed in the region close to the one lateral surface 2 e . For this reason, in the multilayer capacitor 1 , for example, even in the case where cracks occur at the element 2 , breakage occurs at the one internal electrodes, and the one capacity parts does not function, the other capacity parts can be protected. In this way, some of the capacity parts can be protected in the multilayer capacitor 1 even in the case where the cracks occur at the element 2 .

While the first embodiment has been described, the present invention is not necessarily limited to the aforementioned embodiment, and may be modified in various ways without departing from the spirit or teaching thereof.

In the above embodiment, as illustrated in FIG. 4 , the configuration in which the first internal electrodes 12 and the second internal electrodes 14 are disposed to face each other in the middle of the element 2 in the third direction D 3 has been described by way of example. However, as illustrated in FIG. 8 , a pair of third internal electrodes 16 may be disposed between the first internal electrode 12 and the second internal electrode 14 to face each other. In the multilayer capacitor 1 A having this configuration, no capacity parts are formed between the first capacity parts C 1 and the second capacity parts C 2 . Therefore, the configuration in which the first capacity parts C 1 and the second capacity parts C 2 are electrically connected in series can be easily realized.

As illustrated in FIG. 9 , a plurality of third internal electrodes 16 (four third internal electrodes in the present embodiment) may be disposed between the first internal electrode 12 and the second internal electrode 14 . In the multilayer capacitor 1 B having this configuration, for example, even in the case where breakage occurs at the first internal electrodes 12 that constitute the first capacity parts C 1 , this breakage can be inhibited from propagating to the second internal electrodes 14 that constitute the second capacity parts C 2 due to the third internal electrodes 16 . In the multilayer capacitor 1 , even in the case where cracks occur at the element 2 , some of the capacity parts can be protected.

In the above embodiment, the configuration in which the first dummy electrodes 13 are disposed at the same positions as the first internal electrodes 12 and the second dummy electrodes 15 are disposed at the same positions as the second internal electrodes 14 has been described by way of example. However, the dummy electrodes may be disposed at the same positions as at least one of the first internal electrodes 12 and the second internal electrodes 14 . As in a multilayer capacitor 1 C illustrated in FIG. 10 , third dummy electrodes 17 and fourth dummy electrodes 18 may be disposed at the same positions as the third internal electrodes 16 . At least one of the third dummy electrodes 17 and the fourth dummy electrodes 18 may be disposed at the same positions as the third internal electrodes 16 . The dummy electrodes may be disposed at the same positions as the first internal electrodes 12 , the second internal electrodes 14 and the third internal electrodes 16 . In addition, the dummy electrodes may not be disposed.

In the above embodiment, the configuration in which the plurality of first internal electrodes 12 are disposed in the region close to the lateral surface 2 f and the plurality of second internal electrodes 14 are disposed in the region close to the lateral surface 2 e has been described by way of example. That is, the configuration in which the first capacity parts C 1 are formed in the region close to the lateral surface 2 f and the second capacity parts C 2 are formed in the region close to the lateral surface 2 e has been described by way of example. However, the plurality of first internal electrodes 12 may be disposed in the region close to the lateral surface 2 e , and the plurality of second internal electrodes 14 may be disposed in the region close to the lateral surface 2 f.

Second Embodiment

Next, a multilayer capacitor according to a second embodiment will be described. As illustrated in FIG. 11 , the multilayer capacitor 1 D according to the second embodiment includes an element 2 , and a first external electrode 3 , second external electrode 4 , and a connection conductor 5 that are disposed on an outer surface of the element 2 .

The multilayer capacitor 1 D includes a plurality of first internal electrodes 12 A, a plurality of second internal electrodes 14 A, and a plurality of third internal electrodes 16 that act as internal conductors disposed in the element 2 . In the present embodiment, the number of the plurality of first internal electrodes 12 A (here, six) is the same as that of the plurality of second internal electrodes 14 A.

The first internal electrodes 12 A and the second internal electrodes 14 A are disposed at the same positions (layers) in a third direction D 3 of the element 2 . The first internal electrodes 12 A and the second internal electrodes 14 A are disposed alternately with the third internal electrodes 16 in the element 2 to face each other at intervals in a first direction D 1 .

The plurality of first internal electrodes 12 A are disposed in a region close to one end face 2 a in a second direction D 2 of the element 2 . In the present embodiment, the plurality of first internal electrodes 12 A are disposed in the region closer to the one end face 2 a than the middle of the element 2 in the second direction D 2 . The first internal electrodes 12 A extend in a direction perpendicular to a main surface 2 d that is a mounting surface of the element 2 .

As illustrated in FIG. 12 , one ends of the first internal electrodes 12 A are exposed at the one end face 2 a . The other ends of the first internal electrodes 12 A are separated from the second internal electrodes 14 A at a predetermined interval. The first internal electrodes 12 A are not exposed at the other end face 2 b , a pair of main surfaces 2 c and 2 d , and a pair of lateral surfaces 2 e and 2 f . The ends of the first internal electrodes 12 A which are exposed at the one end face 2 a are electrically connected to the first external electrode 3 .

The plurality of second internal electrodes 14 A are disposed in a region close to the other end face 2 b in the second direction D 2 of the element 2 . In the present embodiment, the plurality of second internal electrodes 14 A are disposed in the region closer to the other end face 2 b than the middle of the element 2 in the second direction D 2 . The second internal electrodes 14 A extend in the direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . In the present embodiment, the second internal electrodes 14 A have the same shapes and dimensions as the first internal electrodes 12 A.

One ends of the second internal electrodes 14 A are exposed at the other end face 2 b . The other ends of the second internal electrodes 14 A are separated from the first internal electrodes 12 A at a predetermined interval. The second internal electrodes 14 A are not exposed at the one end face 2 a , the pair of main surfaces 2 c and 2 d , and the pair of lateral surfaces 2 e and 2 f . The ends of the second internal electrodes 14 A which are exposed at the other end face 2 b are electrically connected to the second external electrode 4 .

Each of the third internal electrodes 16 includes a main electrode part 16 a and a connector part 16 b . The main electrode parts 16 a face the first internal electrodes 12 A and the second internal electrodes 14 A via a part (dielectric layers 10 ) of the element 2 in the third direction D 3 .

As illustrated in FIG. 13 , the multilayer capacitor 1 D includes first capacity parts C 11 and second capacity parts C 22 . The first capacity parts C 11 are constituted of the first internal electrodes 12 A and the third internal electrodes 16 that are alternately disposed in the element 2 to face each other at an interval in the third direction D 3 . In the present embodiment, the first capacity parts C 11 are formed in a region closer to the one end face 2 a than the middle of the element 2 in the second direction D 2 . The first capacity parts C 11 constitutes a first capacitor component.

The second capacity parts C 22 are constituted of the second internal electrodes 14 A and the third internal electrodes 16 that are alternately disposed in the element 2 to face each other at an interval in third direction D 3 . In the present embodiment, the second capacity parts C 22 are formed in a region closer to the other end face 2 b than the middle of the element 2 in the second direction D 2 . The second capacity parts C 22 constitute a second capacitor component.

In the multilayer capacitor 1 D, the plurality of first capacity parts C 11 are electrically connected in parallel, and the plurality of second capacity part C 22 are electrically connected in parallel. In the multilayer capacitor 1 D, the first capacity parts C 11 and the second capacity part C 22 are electrically connected in series. To be specific, the first capacity parts C 11 and the second capacity parts C 22 are electrically connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 . The number of first and second first capacity parts C 11 and C 22 illustrated in FIG. 13 is not necessarily identical to the number of first, second, and third internal electrodes 12 A, 14 A and 16 illustrated in FIG. 11 .

As described above, in the multilayer capacitor 1 D according to the present embodiment, the first capacity parts C 11 are constituted of the first internal electrodes 12 A and the third internal electrodes 16 that are electrically connected to the first external electrode 3 , and the second capacity parts C 22 are constituted of the second internal electrodes 14 A and the third internal electrodes 16 that are connected to the second external electrode 4 . The plurality of third internal electrodes 16 are electrically connected to one another by the connection conductor 5 . Thereby, the multilayer capacitor 1 D has a configuration in which the two capacitor components are connected in series. Therefore, in the multilayer capacitor 1 D, a withstand voltage characteristic is improved.

In the multilayer capacitor 1 D, since the first capacity parts C 11 and the second capacity parts C 22 are connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 , changes in a capacitance and a resistance value occur, for example, in the case where a failure occurs at the first capacity parts C 11 . For this reason, even if a failure occurs at the multilayer capacitor 1 D after it is mounted, the failure can be detected.

In the multilayer capacitor 1 D according to the present embodiment, the first internal electrodes 12 A are disposed in the region close to the one end face 2 a in the element 2 , and the second internal electrodes 14 A are disposed in the region close to the other end face 2 b in the element 2 . Thereby, in the multilayer capacitor 1 D, the first capacity parts C 11 are formed in the region close to the one end face 2 a , and the second capacity parts C 22 are formed in the region close to the other end face 2 b . Thus, in the multilayer capacitor 1 D, for example, even in the case where cracks occur at the element 2 and the one internal electrodes are broken, breakage of the other internal electrodes can be avoided. Therefore, in the multilayer capacitor 1 D, even in the case where the cracks occur at the element 2 , some of the capacity parts can be protected.

Third Embodiment

Next, a multilayer capacitor according to a third embodiment will be described. As illustrated in FIG. 14 , the multilayer capacitor 1 E according to the third embodiment includes an element 2 , and a first external electrode 3 A, a second external electrode 4 A, and a connection conductor 5 that are disposed on an outer surface of the element 2 .

As illustrated in FIG. 15A, 15B or 15C , the multilayer capacitor 1 E includes a plurality of first internal electrodes 12 B, a plurality of second internal electrodes 14 B, and a plurality of third internal electrodes 16 that act as internal conductors disposed in the element 2 .

As illustrated in FIG. 15A , each of the first internal electrodes 12 B includes a main electrode part 12 Ba and a connector part 12 Bb. Each of the main electrode parts 12 Ba has a rectangular shape in which a second direction D 2 is a long side direction and a first direction D 1 is a short side direction. The connector parts 12 Bb extend from one sides (one long sides) of the main electrode parts 12 Ba, and are exposed at the other main surface 2 d . The connector parts 12 Bb are disposed close to one end face 2 a at the main electrode parts 12 Ba. The first internal electrodes 12 B are exposed at the other main surface 2 d , and are not exposed at a pair of end faces 2 a and 2 b , one main surface 2 c , and a pair of lateral surfaces 2 e and 2 f . The main electrode part 12 Ba and the connector part 12 Bb are integrally formed. The connector parts 12 Bb of the first internal electrodes 12 B which are exposed at the other main surface 2 d are electrically connected to the first external electrode 3 A.

As illustrated in FIG. 15B , each of the second internal electrodes 14 B includes a main electrode part 14 Ba and a connector part 14 Bb. Each of the main electrode parts 14 Ba has a rectangular shape in which the second direction D 2 is a long side direction and the first direction D 1 is a short side direction. The connector parts 14 Bb extend from one sides (one long sides) of the main electrode parts 14 Ba, and are exposed at the other main surface 2 d . The connector parts 14 Bb are disposed close to the other end face 2 b at the main electrode parts 14 Ba. The second internal electrodes 14 B are exposed at the other main surface 2 d , and are not exposed at the pair of end faces 2 a and 2 b , the one main surface 2 c , and the pair of lateral surfaces 2 e and 2 f . The main electrode part 14 Ba and the connector part 14 Bb are integrally formed. The connector parts 14 Bb of the second internal electrodes 14 B which are exposed at the other main surface 2 d are electrically connected to the second external electrode 4 A.

As illustrated in FIG. 15C , each of the third internal electrodes 16 includes a main electrode part 16 a and a connector part 16 b . The main electrode part 16 a face the first internal electrodes 12 B and the second internal electrodes 14 B via a part (dielectric layers 10 ) of the element 2 in a third direction D 3 .

As illustrated in FIG. 14 , the first external electrode 3 A is disposed on the other main surface 2 d . The first external electrode 3 A is disposed close to the one end face 2 a . To be specific, the first external electrode 3 A is disposed closer to the one end face 2 a than the middle of the element 2 in the second direction D 2 . In the present embodiment, the first external electrode 3 A is continuously disposed from the one lateral surface 2 e to the other lateral surface 2 f . As illustrated in FIG. 15A , the first external electrode 3 A is disposed to cover all the portions of the first internal electrodes 12 B which are exposed at the main surface 2 d , and the first internal electrodes 12 B are directly connected to the first external electrode 3 A.

As illustrated in FIG. 14 , the second external electrode 4 A is disposed on the other main surface 2 d . The second external electrode 4 A is disposed close to the other end face 2 b . To be specific, the second external electrode 4 A is disposed closer to the other end face 2 b than the middle of the element 2 in the second direction D 2 . In the present embodiment, the second external electrode 4 A is continuously disposed from the one lateral surface 2 e to the other lateral surface 2 f . As illustrated in FIG. 15B , the second external electrode 4 A is disposed to cover all the portions of the second internal electrodes 14 B which are exposed at the main surface 2 d , and the second internal electrodes 14 B are directly connected to the second external electrode 4 A.

As illustrated in FIG. 14 , the connection conductor 5 is disposed in the middle of the one main surface 2 c in the second direction D 2 . As illustrated in FIG. 15C , the connection conductor 5 is disposed to cover all the portions of the connector parts 16 b of the third internal electrodes 16 which are exposed at the main surface 2 c , and the connector parts 16 b are directly connected to the connection conductor 5 . That is, the connector parts 16 b connect the main electrode parts 16 a and the connection conductor 5 . Thereby, each of the third internal electrodes 16 is electrically connected to the connection conductor 5 .

Like the multilayer capacitor 1 of the first embodiment, the multilayer capacitor 1 E includes first capacity parts C 1 and second capacity parts C 2 (see FIG. 6 ). In the multilayer capacitor 1 E, the plurality of first capacity parts C 1 are electrically connected in parallel, and the plurality of second capacity parts C 2 are electrically connected in parallel. In the multilayer capacitor 1 E, the first capacity parts C 1 and the second capacity parts C 2 are electrically connected in series. To be specific, the first capacity parts C 1 and the second capacity part C 2 are electrically connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 .

As described above, in the multilayer capacitor 1 E according to the present embodiment, like the multilayer capacitor 1 according to the first embodiment, a failure can be detected while improving a withstand voltage characteristic.

In the multilayer capacitor 1 E according to the present embodiment, the first external electrode 3 A and the second external electrode 4 A are disposed on the main surface 2 d of the element 2 which is a mounting surface, and the connection conductor 5 is disposed on the main surface 2 c that faces the main surface 2 d . Thereby, when the multilayer capacitor 1 E is mounted, the connection conductor 5 comes into contact with electrodes or the like of a circuit board, and occurrence of a short circuit between the first external electrode 3 A and/or the second external electrode 4 A and the connection conductor 5 can be inhibited. Therefore, the multilayer capacitor 1 E can have a configuration in which the first capacity parts C 1 and the second capacity parts C 2 are connected in series.

Fourth Embodiment

Next, a multilayer capacitor according to a fourth embodiment will be described. As illustrated in FIGS. 16A and 16B , the multilayer capacitor 1 F according to the fourth embodiment includes an element 2 , and a first external electrode 3 A, a second external electrode 4 A, and a connection conductor 5 that are disposed on an outer surface of the element 2 .

The multilayer capacitor 1 F includes a plurality of first internal electrodes 12 C, a plurality of second internal electrodes 14 C, and a plurality of third internal electrodes 16 that act as internal conductors disposed in the element 2 .

As illustrated in FIG. 16A , the plurality of first internal electrodes 12 C are disposed in a region close to one end face 2 a in a second direction D 2 of the element 2 . In the present embodiment, the plurality of first internal electrodes 12 C are disposed in the region closer to the one end face 2 a than the middle of the element 2 in the second direction D 2 .

Each of the first internal electrodes 12 C includes a main electrode part 12 Ca and a connector part 12 Cb. The first internal electrodes 12 C extend in a direction perpendicular to a main surface 2 d that is a mounting surface of the element 2 . Each of the main electrode parts 12 Ca has a rectangular shape. The connector parts 12 Cb extend from one sides (one long sides) of the main electrode parts 12 Ca, and are exposed at the other main surface 2 d . The connector parts 12 Cb are disposed close to the one end face 2 a at the main electrode part 12 Ca. The first internal electrodes 12 C are exposed at the other main surface 2 d , and are not exposed at a pair of end faces 2 a and 2 b , one main surface 2 c , and a pair of lateral surfaces 2 e and 2 f . The main electrode part 12 Ca and the connector part 12 Cb are integrally formed. The connector parts 12 Cb of the first internal electrodes 12 C which are exposed at the other main surface 2 d are electrically connected to the first external electrode 3 A.

A plurality of second internal electrodes 14 C are disposed in a region close to the other end face 2 b in a second direction D 2 of the element 2 . In the present embodiment, the plurality of second internal electrodes 14 C are disposed in the region closer to the other end face 2 b than the middle of the element 2 in the second direction D 2 . In the present embodiment, the second internal electrodes 14 C have the same shape and dimensions as the first internal electrodes 12 C.

Each of the second internal electrodes 14 C includes a main electrode part 14 Ca and a connector part 14 Cb. The second internal electrodes 14 C extend in a direction perpendicular to the main surface 2 d that is the mounting surface of the element 2 . Each of the main electrode parts 14 Ca has a rectangular shape. The connector parts 14 Cb extend from one sides (one long sides) of the main electrode parts 14 Ca, and are exposed at the other main surface 2 d . The connector parts 14 Cb are disposed close to the other end face 2 b at the main electrode part 14 Ca. The second internal electrodes 14 C are exposed at the other main surface 2 d , and are not exposed at the pair of end faces 2 a and 2 b , the one main surface 2 c , and the pair of lateral surfaces 2 e and 2 f . The main electrode part 14 Ca and the connector part 14 Cb are integrally formed. The connector parts 14 Cb of the second internal electrodes 14 C which are exposed at the other main surface 2 d are electrically connected to the second external electrode 4 A.

Like the multilayer capacitor 1 D according to the second embodiment, the multilayer capacitor 1 F includes first capacity parts C 11 and second capacity parts C 22 . In the multilayer capacitor 1 F, the plurality of first capacity parts C 11 are electrically connected in parallel, and the plurality of second capacity parts C 22 are electrically connected in parallel. In the multilayer capacitor 1 F, the first capacity parts C 11 and the second capacity parts C 22 are electrically connected in series. To be specific, the first capacity parts C 11 and the second capacity part C 22 are electrically connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 .

As described above, in the multilayer capacitor 1 F according to the present embodiment, like the multilayer capacitor 1 D according to the second embodiment, a failure can be detected while improving a withstand voltage characteristic. In the multilayer capacitor 1 F, the first external electrode 3 A and the second external electrode 4 A are disposed on the main surface 2 d of the element 2 which is the mowing surface, and the connection conductor 5 is disposed on the main surface 2 c that faces the main surface 2 d . Thereby, when the multilayer capacitor 1 F is mounted, the connection conductor 5 comes into contact with electrodes or the like of a circuit board, and occurrence of a short circuit between the first external electrode 3 A and/or the second external electrode 4 A and the connection conductor 5 can be inhibited. Therefore, the multilayer capacitor 1 F can have a configuration in which the first capacity parts C 11 and the second capacity parts C 22 are connected in series.

Fifth Embodiment

Next, a multilayer capacitor according to a fifth embodiment will be described. As illustrated in FIGS. 17A, 17B, and 17C , the multilayer capacitor 1 G according to the fifth embodiment includes an element 2 , and a first external electrode 3 B, a second external electrode 4 B, and a connection conductor 5 that are disposed on an outer surface of the element 2 .

The multilayer capacitor 1 G includes a plurality of first internal electrodes 12 , a plurality of second internal electrodes 14 , and a plurality of third internal electrodes 16 that act as internal conductors disposed in the element 2 .

The first external electrode 3 B has a resin electrode layer 20 . The resin electrode layer 20 is formed as a sintered compact of conductive paste having conductivity. The resin electrode layer 20 is partly disposed on the first external electrode 3 B. To be specific, the resin electrode layer 20 is disposed close to a main surface 2 d of the element 2 which is a mounting surface. In the present embodiment, the resin electrode layer 20 is disposed closer to the main surface 2 d than the middle of the element 2 in a first direction D 1 . The resin electrode layer 20 is disposed, for example, at a part of an electrode portion 3 Ba of the first external electrode 3 B which is close to the main surface 2 d and an electrode portion 3 Bc of the first external electrode 3 B. The resin electrode layer 20 is not disposed at an electrode portion 3 Bb of the first external electrode 3 B. That is, the resin electrode layer 20 is not disposed on a main surface 2 c of the element 2 which faces the main surface 2 d that is the mounting surface. A plating layer may be formed on the resin electrode layer 20 .

The second external electrode 4 B has a resin electrode layer 22 . The resin electrode layer 22 is formed as a sintered compact of conductive paste having conductivity. The resin electrode layer 22 is partly disposed on the second external electrode 4 B. To be specific, the resin electrode layer 22 is disposed close to the main surface 2 d of the element 2 which is the mounting surface. In the present embodiment, the resin electrode layer 22 is disposed closer to the main surface 2 d than the middle of the element 2 in the first direction D 1 . The resin electrode layer 22 is disposed at a part of an electrode portion 4 Ba of the second external electrode 4 B which is close to the main surface 2 d and an electrode portion 4 Bc of the second external electrode 4 B. The resin electrode layer 22 is not disposed at an electrode portion 4 Bb of the second external electrode 4 B. That is, the resin electrode layer 22 is not disposed on the main surface 2 c of the element 2 which faces the main surface 2 d that is the mounting surface. A plating layer may be formed on the resin electrode layer 22 .

Like the multilayer capacitor 1 of the first embodiment, the multilayer capacitor 1 G includes first capacity parts C 1 and second capacity parts C 2 (see FIG. 6 ). In the multilayer capacitor 1 G, the plurality of first capacity parts C 1 are electrically connected in parallel, and the plurality of second capacity parts C 2 are electrically connected in parallel. In the multilayer capacitor 1 G, the first capacity parts C 1 and the second capacity parts C 2 are electrically connected in series. To be specific, the first capacity parts C 1 and the second capacity parts C 2 are electrically connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 .

As described above, in the multilayer capacitor 1 G according to the present embodiment, like the multilayer capacitor 1 according to the first embodiment, the occurrence of a failure can be detected while a withstand voltage characteristic is improved.

In the multilayer capacitor 1 G according to the present embodiment, the first external electrode 3 B and the second external electrode 4 B have the resin electrode layers 20 and 22 . The resin electrode layers 20 and 22 have durability against a thermal shock. For this reason, for example, as illustrated in FIG. 7 , when the multilayer capacitor 1 G is mounted on a circuit board 100 , even in the case where solders S 1 and S 2 are formed, deterioration caused by a thermal shock of bonded portions with the solders S 1 and S 2 can be inhibited. The resin electrode layers 20 and 22 have flexibility. Thus, when the multilayer capacitor 1 G is mounted on the circuit board 100 , stress received from the circuit board 100 or the like can be relaxed by the resin electrode layer 20 . Therefore, occurrence of cracks at the element 2 of the multilayer capacitor 1 G can be inhibited.

In the multilayer capacitor 1 G according to the present embodiment, the resin electrode layers 20 and 22 of the first and second external electrodes 3 B and 4 B are not disposed on the main surface 2 c of the element 2 . Thereby, thicknesses of the first and second external electrodes 3 B and 4 B on the main surfaces 2 c can be reduced. For this reason, a distance between the first external electrode 3 B and the connection conductor 5 and a distance between the second external electrode 4 B and the connection conductor 5 can be secured (lengthened). Thereby, when the multilayer capacitor 1 G is mounted, the connection conductor 5 comes into contact with electrodes or the like of a circuit board, and the occurrence of a short circuit between the first external electrode 3 B and/or the second external electrode 4 B and the connection conductor 5 can be inhibited. Therefore, the first capacity parts C 1 and the second capacity parts C 2 can be configured to be connected in series.

In the multilayer capacitor 1 G according to the present embodiment, the connection conductor 5 is not provided with the resin electrode layer. The connection conductor 5 is not bonded to the circuit board. Therefore, there is no need to have heat resistance and flexibility. Thereby, since an increase in thickness of the connection conductor 5 is inhibited, the distance between the first external electrode 3 B and the connection conductor 5 and the distance between the second external electrode 4 B and the connection conductor 5 can be secured (lengthened). Thereby, when the multilayer capacitor 1 G is mounted, the connection conductor 5 comes into contact with electrodes or the like of a circuit board, and the occurrence of a short circuit between the first external electrode 3 B and/or the second external electrode 4 B and the connection conductor 5 can be inhibited.

In the above embodiment, the configuration in which the resin electrode layers 20 and 22 are partly disposed on the first and second external electrodes 3 B and 4 B has been described by way of example. However, the resin electrode layers 20 A and 22 A may be disposed throughout the first external electrode 3 B and the second external electrode 4 B as illustrated in FIG. 19 . In this case, it is preferable that a thickness W 2 and W 4 of the resin electrode layer 20 A and 22 A close to the main surface 2 c that faces the main surface 2 d be made smaller than a thickness (a width) W 1 and W 3 of the resin electrode layer close to the main surface 2 d of the element 2 which is the mounting surface. Thereby, thicknesses of the first and second external electrodes 3 B and 4 B on the main surface 2 c of the resin electrode layers 20 A and 22 A can be reduced. For this reason, the distance between the first external electrode 3 B and the connection conductor 5 and the distance between the second external electrode 4 B and the connection conductor 5 can be secured (lengthened). Thereby, the occurrence of a short circuit between the first external electrode 3 B and/or the second external electrode 4 B and the connection conductor 5 can be inhibited. Therefore, the first capacity parts C 1 and the second capacity parts C 2 can be configured to be connected in series.

Sixth Embodiment

Next, a multilayer capacitor according to a sixth embodiment will be described. As illustrated in FIGS. 18A and 18B , the multilayer capacitor 1 H according to the sixth embodiment includes an element 2 , and a first external electrode 3 B, a second external electrode 4 B, and a connection conductor 5 that are disposed on an outer surface of the element 2 . The first external electrode 3 B has a resin electrode layer 20 . The second external electrode 4 B has a resin electrode layer 22 .

The multilayer capacitor 1 H includes a plurality of first internal electrodes 12 A, a plurality of second internal electrodes 14 A, and a plurality of third internal electrodes 16 that act as internal conductors disposed in the element 2 .

Like the multilayer capacitor 1 D of the second embodiment, the multilayer capacitor 1 H includes first capacity parts C 11 and second capacity parts C 22 (see FIG. 13 ). In the multilayer capacitor 1 H, the plurality of first capacity parts C 11 are electrically connected in parallel, and the plurality of second capacity parts C 22 are electrically connected in parallel. In the multilayer capacitor 1 H, the first capacity parts C 11 and the second capacity parts C 22 are electrically connected in series. To be specific, the first capacity parts C 11 and the second capacity parts C 22 are electrically connected in series by the plurality of third internal electrodes 16 that are electrically connected by the connection conductor 5 .

As described above, in the multilayer capacitor 1 H according to the present embodiment, like the multilayer capacitor 1 D according to the second embodiment, the occurrence of a failure occurs can be detected while a withstand voltage characteristic is improved.

While embodiments of the present invention have been described, the present invention is not necessarily limited to the aforementioned embodiments, and may be modified in various ways without departing from the spirit or teaching thereof.

In the above embodiments, the configuration in which the connection conductor 5 is disposed on the main surface 2 c of the element 2 has been described by way of example. However, the connection conductor need only be disposed on the surfaces (the main surface 2 c and the lateral surfaces 2 e and 2 f ) other than the main surface 2 d of the element 2 which is the mounting surface.

In the above embodiments, the configuration in which the first internal electrodes 12 ( 12 A, 12 B, 12 C), the second internal electrodes 14 ( 14 A, 14 B, 14 C) and the third internal electrodes 16 are orthogonal to the main surface 2 d of the element 2 which is the mounting surface and extend in the facing direction of the pair of end faces 2 a and 2 b has been described by way of example. However, the first internal electrodes, the second internal electrodes, and the third internal electrodes may be orthogonal to the lateral surfaces 2 e and 2 f of the element 2 , and extend in the facing direction of the pair of end faces 2 a and 2 b.

In the above embodiments, the configuration in which the first external electrode 3 ( 3 A, 3 B) has the electrode portions 3 a to 3 e has been described by way of example. However, the first external electrode 3 ( 3 A, 3 B) need only have at least the electrode portions 3 a and 3 c . Similarly, the second external electrode 4 ( 4 A, 4 B) need only have at least the electrode portions 4 a and 4 c.