Laminated coil component

This is a Divisional of U.S. patent application Ser. No. 14/131,948 filed Jan. 10, 2014, which in turn is a 35 U.S.C. § 371 filing of International Application No. PCT/JP2012/070995, filed Aug. 20, 2012, which claims priority from Japanese Patent Application No. 2012-045635, filed Mar. 1, 2012, Japanese Patent Application No. 2012-045631, filed Mar. 1, 2012, and Japanese Patent Application No. 2011-194911, filed Sep. 7, 2011. The disclosure of the prior applications is hereby incorporated by reference herein in their entirety.

The present invention relates to a laminated coil component.

A laminated coil component in the related art is disclosed, for example, in Patent Literature 1. In the laminated coil component, a conductive pattern of a coil conductor is formed on a glass-ceramic sheet, each of the sheets is laminated, the coil conductors in the sheets are electrically connected with each other, the resultant body is baked, and thus an element assembly is formed to have a coil unit arranged therein. In addition, external electrodes are formed on both end surfaces of the element assembly to be electrically connected with end portions of the coil unit.

Patent Literature

[Patent Literature 1] Japanese Unexamined Patent Application Publication No. 11-297533

Technical Problem

Herein, a laminated coil component has a lower Q (quality factor) value compared to a wound coil obtained by winding wires due to reasons such as the structure of the laminated coil component or a method of manufacturing the laminated coil component. However, as a component is required in recent years which can particularly cope with a high frequency, a high Q value is required even for a laminated coil component. A laminated coil component in the related art cannot achieve a Q value high enough to satisfy such a demand.

The present invention is made to solve such a problem, and an object of the present invention is to provide a laminated coil component which can have a high Q value.

Solution to Problem

Smoothness of the surface of a coil conductor is preferably improved to increase a Q value of a coil. The inventors find it effective to make a ceramic of an element assembly amorphous to improve smoothness of the surface of a coil conductor. When an element assembly is crystalline, concavity and convexity of the surface of a coil conductor become large due to concavity and convexity of the surface of the element assembly in contact therewith, and thus smoothness is deteriorated (for example, refer to FIG. 3( a ) ). On the other hand, when an element assembly is amorphous, the surface of a coil conductor becomes smooth due to a smooth surface of the element assembly in contact therewith, and thus smoothness is improved (for example, refer to FIG. 3( b ) ).

Herein, when a softening point is lowered to make an element assembly amorphous, the inventors find a problem that the entirety of the element assembly is softened, and thus a shape of the element assembly becomes round (for example, refer to FIG. 4( b ) ) and is not retained. As a result of intensive research, the inventors come to find the following configuration of a laminated coil component.

A laminated coil component according to an aspect of the present invention includes an element assembly formed by laminating a plurality of insulation layers, and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes a coil unit arrangement layer which has the coil unit arranged therein, and at least a pair of shape retention layers which is provided to have the coil unit arrangement layer interposed therebetween to retain a shape of the coil unit arrangement layer. The shape retention layer is made from glass-ceramic containing SrO, and, in the coil unit arrangement layer, a softening point of the coil unit arrangement layer is lower than a softening point or a melting point of the shape retention layer.

In the laminated coil component, the element assembly includes the coil unit arrangement layer which has the coil unit arranged therein, and the shape retention layer which has the coil unit arrangement layer interposed therebetween. Since the shape retention layer is made from glass-ceramic containing SrO, a softening point or a melting point is high. On the other hand, a softening point of the coil unit arrangement layer is set to be lower than a softening point or a melting point of the shape retention layer to make the coil unit arrangement layer amorphous. Since the coil unit arrangement layer of which a softening point is lowered in this way is interposed between the shape retention layers, a shape of the coil unit arrangement layer does not become round and is retained during baking. Herein, when material for increasing a softening point diffuses from the shape retention layer to the coil unit arrangement layer during baking, a softening point of the coil unit arrangement layer cannot be lowered and the coil unit arrangement layer cannot become amorphous. However, since SrO has no characteristics of diffusion, it can be prevented that a softening point of the coil unit arrangement layer is raised by the diffusion of SrO from the shape retention layer during baking. Accordingly, the coil unit arrangement layer can reliably become amorphous. As described above, when the coil unit arrangement layer becomes amorphous, smoothness of the surface of the coil conductor can be improved, and thus a Q value of the laminated coil component can be increased.

In addition, in the laminated coil component, the coil unit arrangement layer may contain 86.7 weight % to 92.5 weight % of SiO 2 . Accordingly, dielectric constant of the coil unit arrangement layer can be decreased.

In addition, in the laminated coil component, the coil unit arrangement layer may contain 0.5 weight % to 2.4 weight % of Al 2 O 3 . Accordingly, crystal transition of the coil unit arrangement layer can be prevented.

A laminated coil component according to another aspect of the present invention includes an element assembly formed by laminating a plurality of insulation layers, and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes an amorphous coil unit arrangement layer which has the coil unit arranged therein and is made from glass-ceramic, and a crystalline shape retention layer which retains a shape of the coil unit arrangement layer and is made from glass-ceramic.

In the laminated coil component, the element assembly includes the coil unit arrangement layer which has the coil unit arranged therein and the shape retention layer which retains a shape of the coil unit arrangement layer. Since the shape retention layer is a crystalline layer which is made from glass-ceramic, the shape retention layer is not softened during baking process. Accordingly, the shape retention layer can retain a shape even during baking. On the other hand, since the coil unit arrangement layer is an amorphous layer which is made from glass-ceramic, the coil unit arrangement layer is prone to be softened during baking. However, since the element assembly has not only the coil unit arrangement layer but also the shape retention layer, the coil unit arrangement layer is supported by the shape retention layer during baking, and thus a shape of the coil unit arrangement layer does not become round and is retained during baking. As described above, when the coil unit arrangement layer becomes amorphous while a shape is retained during baking, smoothness of the surface of the coil conductor can be improved, and thus a Q value of the laminated coil component can be increased.

In addition, in the laminated coil component, the shape retention layer may contain 20 weight % to 80 weight % of Al 2 O 3 . Accordingly, the shape retention layer can be kept crystalline.

In addition, in the laminated coil component, the shape retention layer may contain SrO or BaO. Accordingly, the shape retention layer can be baked at a low temperature.

In addition, in the laminated coil component, a pair of shape retention layers may have the coil unit arrangement layer interposed therebetween. Accordingly, a shape retention effect can be increased by the shape retention layer.

Herein, the inventors find a possibility that, when the element assembly becomes amorphous, strength of the element assembly becomes weak, and thus cracking or chipping is caused by external stress or impact. As a result of intensive research, the inventors come to find the following configuration of a laminated coil component.

A laminated coil component according to still another aspect of the present invention includes an element assembly formed by laminating a plurality of insulation layers, and a coil unit formed inside the element assembly by a plurality of coil conductors. The element assembly includes an amorphous coil unit arrangement layer which has the coil unit arranged therein and is made from glass-ceramic; a crystalline reinforcement layer which reinforces the coil unit arrangement layer and is made from glass-ceramic; and a stress relaxation layer which is formed between the coil unit arrangement layer and the reinforcement layer, and has a higher porosity than other portions.

In the laminated coil component, the element assembly includes the coil unit arrangement layer which has the coil unit arranged therein, and the reinforcement layer which reinforces the coil unit arrangement layer. Since the coil unit arrangement layer is an amorphous layer which is made from glass-ceramic, smoothness of the surface of the coil conductor arranged therein can be improved, and thus a Q value of the laminated coil component can be increased. In addition, since the reinforcement layer is a crystalline layer which is made from glass-ceramic, the amorphous coil unit arrangement layer can be reinforced. Furthermore, the element assembly includes the stress relaxation layer between the coil unit arrangement layer and the reinforcement layer. Since the stress relaxation layer has a higher porosity than other portions, the stress relaxation layer can mitigate stress exerted on the element assembly with being interposed between the coil unit arrangement layer and the reinforcement layer. Accordingly, a Q value of the laminated coil component can be improved and resistance to stress can be increased.

In addition, in the laminated coil component, porosity of the stress relaxation layer may be 8% to 30%. When porosity of the stress relaxation layer is within this range, a stress relaxation performance can be sufficiently ensured. In addition, when porosity is excessively large, deterioration over time or insufficient strength is caused by absorption of moisture. However, when porosity of the stress relaxation layer is equal to or less than 30%, deterioration over time or insufficient strength can be restrained.

In addition, in the laminated coil component, the coil unit arrangement layer may contain 0.7 weight % to 1.2 weight % of K 2 O. Accordingly, a sintering can be carried out at a low temperature and the coil unit arrangement layer can become amorphous.

In addition, in the laminated coil component, a percentage of K 2 O content of the reinforcement layer may be less than a percentage of K 2 O content of the coil unit arrangement layer. Accordingly, when K diffuses from the coil unit arrangement layer to the reinforcement layer, the stress relaxation layer can be formed near the boundary portion of the coil unit arrangement layer.

Advantageous Effects of Invention

According to the present invention, a Q value of a laminated coil component can be increased.

FIG. 1 is a cross-sectional view illustrating a laminated coil component according to a first embodiment and a second embodiment of the present invention.

FIG. 2 is a schematic diagram illustrating a relation between smoothness and surface resistance of the surface of a coil conductor.

FIG. 3 is a schematic diagram illustrating a relation between a state of an element assembly and smoothness of the surface of the coil conductor.

FIG. 4 is a schematic diagram illustrating states of the element assembly during baking when a shape retention layer is included and not included therein.

FIG. 5 shows enlarged photographs illustrating phases of the coil conductor of the laminated coil conductor and the element assembly according to an example and a comparative example of the first embodiment.

FIG. 6 is a cross-sectional view illustrating a laminated coil component according to a third embodiment of the present invention.

FIG. 7 is a schematic diagram illustrating a phase in which a stress relaxation layer is formed, and an enlarged view illustrating a phase of each layer.

Hereinafter, preferred embodiments of a laminated coil component according to the present invention will be described with reference to the drawings.

First Embodiment

FIG. 1 is a cross-sectional view illustrating a laminated coil component according to a first embodiment of the present invention. As illustrated in FIG. 1 , a laminated coil component 1 includes an element assembly 2 formed by laminating a plurality of insulation layers, a coil unit 3 formed inside the element assembly 2 by a plurality of coil conductors 4 and 5 , and a pair of external electrodes 6 formed on both end surfaces of the element assembly 2 .

The element assembly 2 is a rectangular parallelepiped or cubic laminated body which consists of a sintered body obtained by laminating a plurality of ceramic green sheets. The element assembly 2 includes a coil unit arrangement layer 2 A which has the coil unit 3 arranged therein and a pair of shape retention layers 2 B which is provided to have the coil unit arrangement layer 2 A interposed therebetween. The coil unit arrangement layer 2 A and the shape retention layer 2 B are made from glass-ceramic (specific composition will be described below). At least the coil unit arrangement layer 2 A is made from amorphous ceramics. The shape retention layer 2 B has a function of retaining a shape of the coil unit arrangement layer 2 A during sintering. The shape retention layer 2 B is formed to entirely cover an end surface 2 a and an end surface 2 b facing each other in the laminating direction among end surfaces of the coil unit arrangement layer 2 A. A thickness of the coil unit arrangement layer 2 A is, for example, equal to or larger than 0.1 mm in the laminating direction, and a thickness of the shape retention layer 2 B is equal to or larger than 5 μm in the laminating direction.

The coil unit arrangement layer 2 A contains, as main constituents, 35 weight % to 60 weight % of borosilicate glass, 15 weight % to 35 weight % of quartz and amorphous silica in the remainder, and contains alumina as an accessory constituent, and 0.5 weight % to 2.5 weight % of alumina is contained with respect to 100 weight % of the main constituents. After baking is completed, the coil unit arrangement layer 2 A has a composition containing 86.7 weight % to 92.5 weight % of SiO 2 , 6.2 weight % to 10.7 weight % of B 2 O 3 , 0.7 weight % to 1.2 weight % of K 2 O and 0.5 weight % to 2.4 weight % of Al 2 O 3 . When the coil unit arrangement layer 2 A contains 86.7 weight % to 92.5 weight % of SiO 2 , dielectric constant of the coil unit arrangement layer 2 A can be decreased. In addition, when the coil unit arrangement layer 2 A contains 0.5 weight % to 2.4 weight % of Al 2 O 3 , crystal transition of the coil unit arrangement layer 2 A can be prevented. MgO or CaO (1.0 weight % or less) may be contained.

The shape retention layer 2 B contains, as main constituents, 50 weight % to 70 weight % of glass and 30 weight % to 50 weight % of alumina. After baking is completed, the shape retention layer 2 B has a composition containing 23 weight % to 42 weight % of SiO 2 , 0.25 weight % to 3.5 weight % of B 2 O 3 , 34.2 weight % to 58.8 weight % of Al 2 O 3 and 12.5 weight % to 31.5 weight % of alkaline earth metal oxide, in which 60 weight % or more of the alkaline earth metal oxide (that is, 7.5 weigh % to 31.5 weight % of the entirety of the shape retention layer 2 B) is SrO.

A softening point of the coil unit arrangement layer 2 A is set to be lower than a softening point or a melting point of the shape retention layer 2 B. Specifically, a softening point of the coil unit arrangement layer 2 A is 800 to 1,050° C., and a softening point or a melting point of the shape retention layer 2 B is equal to or higher than 1,200° C. When a softening point of the coil unit arrangement layer 2 A is lowered, the coil unit arrangement layer 2 A can become amorphous. When a softening point or a melting point of the shape retention layer 2 B is raised, a shape of the coil unit arrangement layer 2 A having a low softening point is not deformed and can be retained during baking.

Since a softening point cannot be lowered when SrO is contained, SrO is not contained in the coil unit arrangement layer 2 A. Herein, since SrO is difficult to diffuse, SrO of the shape retention layer 2 B is restrained from diffusing to the coil unit arrangement layer 2 A during baking. In addition, the coil unit arrangement layer 2 A can contain SiO 2 having a relatively low dielectric constant by such an amount that is deficient in SrO, whereby dielectric constant can be decreased. Accordingly, a Q (quality factor) value of a coil can be increased. On the other hand, the shape retention layer 2 B can contain less SiO 2 compared to the coil unit arrangement layer 2 A by such an amount that SrO is contained, whereby dielectric constant is increased. However, the shape retention layer 2 B does not contain the coil conductors 4 and 5 therein, and does not affect a Q value of a coil. In addition, the coil unit arrangement layer 2 A has a large amount of SiO 2 and a low strength whereas the shape retention layer 2 B has a small amount of SiO 2 and a high strength. The shape retention layer 2 B can function as a reinforcement layer for the coil unit arrangement layer 2 A after baking is completed.

The coil unit 3 has the coil conductor 4 related to a winding pack and the coil conductor 5 related to a lead-out portion which is connected with the external electrode 6 . The coil conductors 4 and 5 are formed by a conductive paste having, for example, any of silver, copper and nickel as a main constituent. The coil unit 3 is arranged only inside the coil unit arrangement layer 2 A and is not arranged in the shape retention layer 2 B. In addition, none of the coil conductors 4 and 5 in the coil unit 3 are in contact with the shape retention layer 2 B. Both end portions of the coil unit 3 in the laminating direction are apart from the shape retention layer 2 B, the ceramic of the coil unit arrangement layer 2 A is arranged between the coil unit 3 and the shape retention layer 2 B. The coil conductor 4 related to a winding pack is configured by forming a conductive pattern having a predetermined winding by use of a conductive paste on the ceramic green sheet which forms the coil unit arrangement layer 2 A. The conductive patterns of the layers are connected with each other via through-hole conductors in the laminating direction. In addition, the coil conductor 5 related to a lead-out portion is configured by a conductive pattern in such a manner that an end portion of a winding pattern is extended out to the external electrode 6 . A coil pattern of the winding pack, the number of windings, a lead-out position of the lead-out portion or the like is not particularly specified.

A pair of external electrodes 6 is formed to cover both end surfaces facing each other in a direction orthogonal to the laminating direction among end surfaces of the element assembly 2 . Each of the external electrodes 6 is formed to entirely cover each of both end surfaces and a portion thereof may go around to other four surfaces from each of both end surfaces. Each of the external electrodes 6 is formed by screen-printing a conductive paste having, for example, any of silver, copper and nickel as a main constituent, or by a dip method.

Next, a method of manufacturing the laminated coil component 1 of the above-described configuration will be described.

First, ceramic green sheets forming the coil unit arrangement layer 2 A and ceramic green sheets forming the shape retention layer 2 B are prepared. A ceramic paste is adjusted to have the above-described composition, is molded to have a sheet shape by a doctor blade method or the like, and each of the ceramic green sheets is prepared.

Subsequently, each of through-holes is formed by laser processing or the like at a predetermined position on each of the ceramic green sheets which become the coil unit arrangement layer 2 A, that is, each of the through-holes is formed at a pre-arranged position where a through-hole electrode is formed. Next, each of the conductive patterns is formed on each of the ceramic green sheets which become the coil unit arrangement layer 2 A. Herein, each of the conductive patterns and each of the through-hole electrodes are formed by a screen printing method using a conductive paste which contains silver, nickel or the like.

Subsequently, each of the ceramic green sheets is laminated. At this time, the ceramic green sheet which becomes the coil unit arrangement layer 2 A is stacked on the ceramic green sheet which becomes the shape retention layer 2 B, and the ceramic green sheet which becomes the shape retention layer 2 B is stacked thereon. The shape retention layers 2 B formed at a bottom portion and an upper portion may be formed by a piece of ceramic green sheet, or may be formed by a plurality of ceramic green sheets. Next, each of the ceramic green sheets is crimped by exerting pressure thereon in the laminating direction.

Subsequently, a laminated body is baked at a predetermined temperature (for example, approximately 800 to 1,150° C.) to form the element assembly 2 . At this time, a set baking temperature is equal to or higher than a softening point of the coil unit arrangement layer 2 A, and is set to be lower than a softening point or a melting point of the shape retention layer 2 B. At this time, the shape retention layer 2 B retains a shape of the coil unit arrangement layer 2 A.

Subsequently, the external electrodes 6 are formed on the element assembly 2 . Accordingly, the laminated coil component 1 is formed. An electrode paste, which has silver, nickel or copper as a main constituent, is coated on each of both end surfaces of the element assembly 2 in the longitudinal direction, baking is carried out at a predetermined temperature (for example, approximately 600 to 700° C.), and electroplating is carried out to form the external electrode 6 . Cu, Ni, Sn and the like can be used for the electroplating.

Next, an operation and effect of the laminated coil component 1 according to the first embodiment will be described.

Smoothness of the surface of a coil conductor is preferably improved to increase a Q (quality factor) value of a coil. The higher a frequency becomes, the shallower skin depth becomes, and smoothness of the surface of a coil conductor affects a Q value at a high frequency. For example, when, as illustrated in FIG. 2( b ) , smoothness of the surface of a coil conductor is deteriorated and concavity and convexity are formed, surface resistance of the coil conductor is increased and a Q value of a coil is decreased. On the other hand, when smoothness of the surface of a coil conductor is improved as illustrated in FIG. 2( a ) , surface resistance of the coil conductor is decreased and a Q value of a coil can be increased.

It is effective to make a ceramic of an element assembly amorphous to improve smoothness of the surface of a coil conductor. When an element assembly is crystalline as illustrated in FIG. 3( a ) , concavity and convexity of the surface of a coil conductor becomes large due to concavity and convexity of the surface of the element assembly in contact therewith, and thus smoothness is deteriorated. On the other hand, when an element assembly is amorphous, as illustrated in FIG. 3( b ) , the surface of a coil conductor becomes smooth due to a smooth surface of the element assembly in contact therewith, and thus smoothness is improved.

Herein, when a softening point is lowered to make an element assembly amorphous, the inventors find a problem that, as illustrated in FIG. 4( b ) , the entirety of the element assembly is softened, and thus a shape of the element assembly becomes round and is not retained. As a result of intensive research, the inventors come to find the configuration of the laminated coil component 1 according to the embodiment.

In the laminated coil component 1 according to the embodiment, the element assembly 2 includes the coil unit arrangement layer 2 A which has the coil unit 3 arranged therein, and the shape retention layer 2 B which has the coil unit arrangement layer 2 A interposed therebetween. Since the shape retention layer 2 B is made from glass-ceramic containing SrO, a softening point thereof is high. On the other hand, a softening point of the coil unit arrangement layer 2 A is set to be lower than a softening point or a melting point of the shape retention layer 2 B to make the coil unit arrangement layer 2 A amorphous. Since the coil unit arrangement layer 2 A of which a softening point is lowered in this way is interposed between the shape retention layers 2 B, a shape of the coil unit arrangement layer 2 A does not become round and is retained during baking. Herein, when material such as MgO or CaO for increasing a softening point diffuses from the shape retention layer 2 B to the coil unit arrangement layer 2 A during baking, a softening point of the coil unit arrangement layer 2 A cannot be lowered and the coil unit arrangement layer 2 A cannot become amorphous. However, since SrO has no characteristics of diffusion, it can be prevented that a softening point of the coil unit arrangement layer 2 A is raised by the diffusion of SrO from the shape retention layer 2 B during baking. Accordingly, the coil unit arrangement layer 2 A can reliably become amorphous. As described above, when the coil unit arrangement layer 2 A becomes amorphous, smoothness of the surfaces of the coil conductors 4 and 5 can be improved, and thus a Q value of the laminated coil component 1 can be increased.

In the embodiment, an element assembly is not entirely amorphous and includes a crystalline portion by such a small amount (0.5 weight % to 2.4 weight %) that alumina is contained. However, the amount is extremely small, and thus a smooth surface is obtained as illustrated in FIG. 3( b ) . As such, the term “amorphous” herein corresponds to even a case where a crystalline portion is included as far as the portion is small.

FIG. 5( a ) shows enlarged photographs illustrating phases of a coil conductor and an element assembly of a laminated coil component according to a comparative example, and FIG. 5( b ) shows enlarged photographs illustrating phases of a coil conductor and an element assembly of a laminated coil component according to an example.

In a laminated coil component according to the comparative example, an element assembly is crystalline. In the comparative example as illustrated in FIG. 5( a ) , an element assembly becomes crystalline, and thus smoothness of a coil conductor is deteriorated. The laminated coil component according to the comparative example is manufactured using materials and manufacturing conditions as follows. That is, a coil unit arrangement layer of the laminated coil component according to the comparative example contains, as main constituents, 70 weight % of glass and 30 weight % of alumina. After baking is completed, the coil unit arrangement layer of the laminated coil component according to the comparative example contains 1.5 weight % of B 2 O 3 , 2.1 weight % of MgO, 37 weight % of Al 2 O 3 , 32 weight % of SiO 2 , 4 weight % of CaO, 22 weight % of SrO and 0.21 weight % of BaO. The laminated coil component according to the comparative example does not have a shape retention layer. In addition, Ag is used as material of the coil conductor. In addition, a baking temperature is set to 900° C.

On the other hand, in a laminated coil component according to the example, an element assembly is amorphous. In the example as illustrated in FIG. 5( b ) , an element assembly becomes amorphous, and thus smoothness of a coil conductor is improved. Accordingly, a high Q value can be achieved. The laminated coil component according to the example is manufactured using materials and manufacturing conditions as follows. That is, a coil unit arrangement layer of the laminated coil component according to the example contains, as main constituents, 60 weight % of borosilicate glass, 20 weight % of quartz, 20 weight % of amorphous silica and 1.5 weight % of alumina. After baking is completed, the laminated coil component according to the example contains 10.2 weight % of B 2 O 3 , 1.2 weight % of Al 2 O 3 , 87.5 weight % of SiO 2 and 1.1 weight % of K 2 O. A shape retention layer of the laminated coil component according to the example contains, as main constituents, 70 weight % of glass and 30 weight % of alumina. After baking is completed, the shape retention layer of the laminated coil component according to the example contains 1.5 weight % of B 2 O 3 , 2.1 weight % of MgO, 37 weight % of Al 2 O 3 , 32 weight % of SiO 2 , 4 weight % of CaO, 22 weight % of SrO and 0.21 weight % of BaO. In addition, Ag is used as material of the coil conductor. In addition, a baking temperature is set to 900° C.

Second Embodiment

FIG. 1 is a cross-sectional view illustrating a laminated coil component according to a second embodiment of the present invention. As illustrated in FIG. 1 , the laminated coil component 1 includes the element assembly 2 formed by laminating a plurality of insulation layers, the coil unit 3 formed inside the element assembly 2 by a plurality of coil conductors 4 and 5 , and a pair of external electrodes 6 formed on both end surfaces of the element assembly 2 .

The element assembly 2 is a rectangular parallelepiped or cubic laminated body which consists of a sintered body obtained by laminating a plurality of ceramic green sheets. The element assembly 2 includes a coil unit arrangement layer 2 A which has the coil unit 3 arranged therein and a pair of shape retention layers 2 B which is provided to have the coil unit arrangement layer 2 A interposed therebetween. The coil unit arrangement layer 2 A and the shape retention layer 2 B are made from glass-ceramics (specific composition will be described below). The coil unit arrangement layer 2 A is made from amorphous ceramics. The shape retention layer 2 B is made from crystalline ceramics. The shape retention layer 2 B has a function of retaining a shape of the coil unit arrangement layer 2 A during sintering. The shape retention layer 2 B is formed to entirely cover an end surface 2 a and an end surface 2 b facing each other in the laminating direction among end surfaces of the coil unit arrangement layer 2 A. A thickness of the coil unit arrangement layer 2 A is, for example, equal to or larger than 0.1 mm in the laminating direction, and a thickness of the shape retention layer 2 B is equal to or larger than 5 μm in the laminating direction.

The coil unit arrangement layer 2 A contains, as main constituents, 35 weight % to 60 weight % of borosilicate glass, 15 weight % to 35 weight % of quartz and amorphous silica in the remainder, and contains alumina as an accessory constituent, and 0.5 weight % to 2.5 weight % of alumina is contained with respect to 100 weight % of the main constituents. After baking is completed, the coil unit arrangement layer 2 A has a composition containing 86.7 weight % to 92.5 weight % of SiO 2 , 6.2 weight % to 10.7 weight % of B 2 O 3 , 0.7 weight % to 1.2 weight % of K 2 O and 0.5 weight % to 2.4 weight % of Al 2 O 3 . When the coil unit arrangement layer 2 A contains 86.7 weight % to 92.5 weight % of SiO 2 , dielectric constant of the coil unit arrangement layer 2 A can be decreased. In addition, when the coil unit arrangement layer 2 A contains 0.5 weight % to 2.4 weight % of Al 2 O 3 , crystal transition of the coil unit arrangement layer 2 A can be prevented. MgO or CaO (1.0 weight % or less) may be contained.

The shape retention layer 2 B contains, as main constituents, 80 weight % to 20 weight % of glass and 20 weight % to 80 weight % of alumina. After baking is completed, the shape retention layer 2 B has a composition containing 4.5 weight % to 28 weight % of SiO 2 , 0.25 weight % to 20 weight % of B 2 O 3 , 20 weight % to 80 weight % of Al 2 O 3 and 10 weight % to 48 weight % of alkaline earth metal oxide. SrO, BaO, CaO or MgO is preferable as an alkaline earth metal oxide, particularly, SrO or BaO is preferable. When the shape retention layer 2 B contains 20 to 80 weight % of Al 2 O 3 , the shape retention layer 2 B can be kept crystalline. When the shape retention layer 2 B contains SrO or BaO, the shape retention layer 2 B can be baked at a low temperature. A low-temperature baking indicates baking at a temperature of approximately 800 to 950° C.

A softening point of the coil unit arrangement layer 2 A is set to be lower than a softening point or a melting point of the shape retention layer 2 B. Specifically, a softening point of the coil unit arrangement layer 2 A is 800 to 1,050° C., and a softening point or a melting point of the shape retention layer 2 B is equal to or higher than 1,200° C. When a softening point of the coil unit arrangement layer 2 A is lowered, the coil unit arrangement layer 2 A can become amorphous. When a softening point or a melting point of the crystalline shape retention layer 2 B is raised, a shape of the coil unit arrangement layer 2 A having a low softening point is not deformed and can be retained during baking.

The coil unit 3 has the coil conductor 4 related to a winding pack and the coil conductor 5 related to a lead-out portion which is connected with the external electrode 6 . The coil conductors 4 and 5 are formed by a conductive paste having, for example, any of silver, copper and nickel as a main constituent. The coil unit 3 is arranged only inside the coil unit arrangement layer 2 A and is not arranged in the shape retention layer 2 B. In addition, any of the coil conductors 4 and 5 in the coil unit 3 is not in contact with the shape retention layer 2 B. Both end portions of the coil unit 3 in the laminating direction are apart from the shape retention layer 2 B, the ceramic of the coil unit arrangement layer 2 A is arranged between the coil unit 3 and the shape retention layer 2 B. The coil conductor 4 related to a winding pack is configured by forming a conductive pattern having a predetermined winding by use of a conductive paste on the ceramic green sheet which forms the coil unit arrangement layer 2 A. The conductive patterns of the layers are connected with each other via through-hole conductors in the laminating direction. In addition, the coil conductor 5 related to a lead-out portion is configured by a conductive pattern in such a manner that an end portion of a winding pattern is extended out to the external electrode 6 . A coil pattern of the winding pack or the number of windings, a lead-out position of the lead-out portion or the like is not particularly specified.

A pair of external electrodes 6 is formed to cover both end surfaces facing each other in a direction orthogonal to the laminating direction among end surfaces of the element assembly 2 . Each of the external electrodes 6 is formed to entirely cover each of both end surfaces and a portion thereof may go around to other four surfaces from each of both end surfaces. Each of the external electrodes 6 is formed by screen-printing a conductive paste having, for example, any of silver, copper and nickel as a main constituent, or by a dip method.

Next, a method of manufacturing the laminated coil component 1 of the above-described configuration will be described.

First, ceramic green sheets forming the coil unit arrangement layer 2 A and ceramic green sheets forming the shape retention layer 2 B are prepared. A ceramic paste is adjusted to have the above-described composition, is molded to have a sheet shape by a doctor blade method or the like and each of the ceramic green sheets is prepared.

Subsequently, each of through-holes is formed by laser processing or the like at a predetermined position on each of the ceramic green sheets which become the coil unit arrangement layer 2 A, that is, each of the through-holes is formed at a pre-arranged position where a through-hole electrode is formed. Next, each of the conductive patterns is formed on each of the ceramic green sheets which become the coil unit arrangement layer 2 A. Herein, each of the conductive patterns and each of the through-hole electrodes are formed by a screen printing method using a conductive paste which contains silver, nickel or the like.

Subsequently, each of the ceramic green sheets is laminated. At this time, the ceramic green sheet which becomes the coil unit arrangement layer 2 A is stacked on the ceramic green sheet which becomes the shape retention layer 2 B, and the ceramic green sheet which becomes the shape retention layer 2 B is stacked thereon. The shape retention layers 2 B formed at a bottom portion and an upper portion may be formed by a piece of ceramic green sheet, or may be formed by a plurality of ceramic green sheets. Next, each of the ceramic green sheets is crimped by exerting pressure thereon in the laminating direction.

Subsequently, a laminated body is baked at a predetermined temperature (for example, approximately 800 to 1,150° C.) to form the element assembly 2 . At this time, a set baking temperature is equal to or higher than a softening point of the coil unit arrangement layer 2 A, and is set to be lower than a softening point or a melting point of the shape retention layer 2 B. At this time, the shape retention layer 2 B retains a shape of the coil unit arrangement layer 2 A.

Subsequently, the external electrodes 6 are formed on the element assembly 2 . Accordingly, the laminated coil component 1 is formed. An electrode paste, which has silver, nickel or copper as a main constituent, is coated on each of both end surfaces of the element assembly 2 in the longitudinal direction, baking is carried out at a predetermined temperature (for example, approximately 600 to 700° C.), and electroplating is carried out to form the external electrode 6 . Cu, Ni, Sn and the like can be used for the electroplating.

Next, an operation and effect of the laminated coil component 1 according to the second embodiment will be described.

Smoothness of the surface of a coil conductor is preferably improved to increase a Q (quality factor) value of a coil. The higher a frequency becomes, the shallower skin depth becomes, and smoothness of the surface of a coil conductor affects a Q value at a high frequency. For example, when, as illustrated in FIG. 2( b ) , smoothness of the surface of a coil conductor is deteriorated and concavity and convexity are formed, surface resistance of the coil conductor is increased and a Q value of a coil is decreased. On the other hand, when smoothness of the surface of a coil conductor is improved as illustrated in FIG. 2( a ) , surface resistance of the coil conductor is decreased and a Q value of a coil can be increased.

It is effective to make a ceramic of an element assembly amorphous to improve smoothness of the surface of a coil conductor. When an element assembly is crystalline as illustrated in FIG. 3( a ) , concavity and convexity of the surface of a coil conductor becomes large due to concavity and convexity of the surface of the element assembly in contact therewith, and thus smoothness is deteriorated. On the other hand, when an element assembly is amorphous as illustrated in FIG. 3( b ) , the surface of a coil conductor becomes smooth due to a smooth surface of the element assembly in contact therewith, and thus smoothness is improved.

Herein, when a softening point is lowered to make an element assembly amorphous, the inventors find a problem that, as illustrated in FIG. 4( b ) , the entirety of the element assembly is softened, and thus a shape of the element assembly becomes round and is not retained. As a result of intensive research, the inventors come to find the configuration of the laminated coil component 1 according to the embodiment.

In the laminated coil component 1 according to the embodiment, the element assembly 2 includes the coil unit arrangement layer 2 A which has the coil unit 3 arranged therein, and the shape retention layer 2 B which retains a shape of the coil unit arrangement layer 2 A. Since the shape retention layer 2 B is a crystalline layer which is made from glass-ceramic, the shape retention layer 2 B is not softened during baking process. Accordingly, the shape retention layer 2 B can retain a shape even during baking. On the other hand, since the coil unit arrangement layer 2 A is an amorphous layer which is made from glass-ceramic, the coil unit arrangement layer 2 A is prone to be softened during baking. However, since the element assembly 2 has not only the coil unit arrangement layer 2 A but also the shape retention layer 2 B, the coil unit arrangement layer 2 A is supported by the shape retention layer 2 B during baking, and thus a shape of the coil unit arrangement layer 2 A does not become round and is retained during baking. As described above, when the coil unit arrangement layer 2 A becomes amorphous while a shape is retained during baking, smoothness of the surface of the coil conductor 4 can be improved, and thus a Q value of the laminated coil component 1 can be increased.

In addition, in the laminated coil component 1 according to the embodiment, a pair of shape retention layers 2 B has the coil unit arrangement layer 2 A interposed therebetween. Accordingly, a shape retention effect can be increased by the shape retention layer 2 B.

In the embodiment, the coil unit arrangement layer 2 A is not entirely amorphous and includes a crystalline portion by such a small amount (0.5 weight % to 2.4 weight %) that alumina is contained. However, the amount is extremely small, and thus a smooth surface is obtained as illustrated in FIG. 3( b ) . As such, the term “amorphous” herein corresponds to even a case where a crystalline portion is included as far as the portion is small.

FIG. 5( a ) shows enlarged photographs illustrating phases of a coil conductor and an element assembly of a laminated coil component according to a comparative example.

In a laminated coil component according to the comparative example, an element assembly is crystalline. In the comparative example as illustrated in FIG. 5( a ) , an element assembly becomes crystalline, and thus smoothness of a coil conductor is deteriorated. The laminated coil component according to the comparative example is manufactured using materials and manufacturing conditions as follows. A coil unit arrangement layer of the laminated coil component according to the comparative example contains, as main constituents, 70 weight % of glass and 30 weight % of alumina. After baking is completed, the coil unit arrangement layer of the laminated coil component according to the comparative example contains 1.5 weight % of B 2 O 3 , 2.1 weight % of MgO, 37 weight % of Al 2 O 3 , 32 weight % of SiO 2 , 4 weight % of CaO, 22 weight % of SrO and 0.21 weight % of BaO. The laminated coil component according to the comparative example does not have a shape retention layer. In addition, Ag is used as material of the coil conductor. In addition, a baking temperature is set to 900° C.

On the other hand, in a laminated coil component according to an example, an element assembly is amorphous. In the example, an element assembly becomes amorphous, and thus smoothness of a coil conductor is improved. Accordingly, a high Q value can be achieved. The laminated coil component according to the example is manufactured using materials and manufacturing conditions as follows. A coil unit arrangement layer of the laminated coil component according to the example contains, as main constituents, 60 weight % of borosilicate glass, 20 weight % of quartz, 20 weight % of amorphous silica and 1.5 weight % of alumina. After baking is completed, the laminated coil component according to the example contains 10.2 weight % of B 2 O 3 , 1.2 weight % of Al 2 O 3 , 87.5 weight % of SiO 2 and 1.1 weight % of K 2 O. A shape retention layer of the laminated coil component according to the example contains, as main constituents, 70 weight % of glass and 30 weight % of alumina. After baking is completed, the shape retention layer of the laminated coil component according to the example contains 1.5 weight % of B 2 O 3 , 2.1 weight % of MgO, 37 weight % of Al 2 O 3 , 25 weight % of SiO 2 , 4 weight % of CaO, 26 weight % of SrO and 3.21 weight % of BaO. In addition, Ag is used as material of the coil conductor. In addition, a baking temperature is set to 900° C.

Third Embodiment

FIG. 6 is a cross-sectional view illustrating a laminated coil component according to a third embodiment of the present invention. As illustrated in FIG. 6 , the laminated coil component 1 includes the element assembly 2 formed by laminating a plurality of insulation layers, the coil unit 3 formed inside the element assembly 2 by a plurality of coil conductors 4 and 5 , and a pair of external electrodes 6 formed on both end surfaces of the element assembly 2 .

The element assembly 2 is a rectangular parallelepiped or cubic laminated body which consists of a sintered body obtained by laminating a plurality of ceramic green sheets. For a size of the element assembly 2 , the length is set to approximately 0.3 to 1.7 mm, the width is set to approximately 0.1 to 0.9 mm, and the height is set to approximately 0.1 to 0.9 mm. The element assembly 2 includes a coil unit arrangement layer 2 A which has the coil unit 3 arranged therein; a pair of reinforcement layers 2 B which is provided to have the coil unit arrangement layer 2 A interposed therebetween; and a stress relaxation layer 2 C which is formed between the coil unit arrangement layer 2 A and the reinforcement layer 2 B. The coil unit arrangement layer 2 A is an amorphous layer which is made from glass-ceramic. A thickness of the coil unit arrangement layer 2 A is set to 0.1 mm or more. The reinforcement layer 2 B is a crystalline layer which is made from glass-ceramic. The reinforcement layer 2 B has a function of reinforcing strength of the amorphous coil unit arrangement layer 2 A. In addition, the reinforcement layer 2 B also has a function of retaining a shape of the coil unit arrangement layer 2 A during baking. A thickness of the reinforcement layer 2 B is set to 5 μm or more. The stress relaxation layer 2 C is a layer which has a lot of pores therein and is made from ceramics. The stress relaxation layer 2 C has a function of mitigating stress exerted on the element assembly 2 . A thickness of the stress relaxation layer 2 C is set to approximately 10 to 25 μm. The reinforcement layer 2 B is formed to entirely cover the end surface 2 a and the end surface 2 b facing each other in the laminating direction among end surfaces of the coil unit arrangement layer 2 A. In addition, the stress relaxation layer 2 C is formed between the coil unit arrangement layer 2 A and the reinforcement layer 2 B to entirely cover the end surface 2 a and the end surface 2 b.

The coil unit arrangement layer 2 A contains, as main constituents, 35 weight % to 60 weight % of borosilicate glass, 15 weight % to 35 weight % of quartz and amorphous silica in the remainder, and contains alumina as an accessory constituent, and 0.5 weight % to 2.5 weight % of alumina is contained with respect to 100 weight % of the main constituents. After baking is completed, the coil unit arrangement layer 2 A has a composition containing 86.7 weight % to 92.5 weight % of SiO 2 , 6.2 weight % to 10.7 weight % of B 2 O 3 , 0.7 weight % to 1.2 weight % of K 2 O and 0.5 weight % to 2.4 weight % of Al 2 O 3 . When the coil unit arrangement layer 2 A contains 86.7 weight % to 92.5 weight % of SiO 2 , dielectric constant of the coil unit arrangement layer 2 A can be decreased. In addition, when the coil unit arrangement layer 2 A contains 0.5 weight % to 2.4 weight % of Al 2 O 3 , crystal transition of the coil unit arrangement layer 2 A can be prevented. When the coil unit arrangement layer 2 A contains 0.7 weight % to 1.2 weight % of K 2 O, a sintering can be carried out at a low temperature (800 to 950° C.), and the coil unit arrangement layer 2 A can become an amorphous layer. MgO or CaO (1.0 weight % or less) may be contained.

The reinforcement layer 2 B contains, as main constituents, 50 weight % to 70 weight % of glass and 30 weight % to 50 weight % of alumina. After baking is completed, the reinforcement layer 2 B has a composition containing 23 weight % to 42 weight % of SiO 2 , 0.25 weight % to 3.5 weight % of B 2 O 3 , 34.2 weight % to 58.8 weight % of Al 2 O 3 and 12.5 weight % to 31.5 weight % of alkaline earth metal oxide, in which 60 weight % or more of the alkaline earth metal oxide (that is, 7.5 weight % to 31.5 weight % of the entirety of the reinforcement layer 2 B) is SrO.

The stress relaxation layer 2 C is a ceramic layer having a higher porosity compared to the coil unit arrangement layer 2 A and the reinforcement layer 2 B. Porosity of the stress relaxation layer 2 C is preferably 8 to 30%, more preferably 10 to 25%. When porosity of the stress relaxation layer 2 C is within this range, a stress relaxation performance can be sufficiently ensured. In addition, when porosity is excessively large, deterioration over time or insufficient strength is caused by absorption of moisture. However, when porosity of the stress relaxation layer 2 C is equal to or less than 30%, more preferably equal to or less than 25%, deterioration over time or insufficient strength can be restrained. The term “porosity” is a value determined by calculating a percent of pores (an area occupied by pores with reference to an entire area of the field of view observed) shown in the field of view observed of the stress relaxation layer 2 C when a SEM image of the fracture surface of a ceramic is image-analyzed after baking is completed.

Specifically, the stress relaxation layer 2 C is formed when an amorphous ceramic layer configuring the coil unit arrangement layer 2 A has a lot of pores therein. When the ceramic green sheet of the coil unit arrangement layer 2 A having the above-described composition and the ceramic green sheet of the reinforcement layer 2 B having the above-described composition are laminated and the resultant laminated body is baked, as illustrated in FIG. 7( a ) , diffusion of K, B or the like takes place near the boundary of both layers. That is, a constituent (indicated by M in the figure), such as K or B, of the coil unit arrangement layer 2 A diffuses to the reinforcement layer 2 B having less the constituent compared to the coil unit arrangement layer 2 A. Accordingly, a constituent, such as K or B is reduced near the boundary of the amorphous layer, balance of a composition is collapsed, and thus the region is not sufficiently sintered. When an insufficient sintering takes place as such, grain growth in the region is not sufficiently carried out, and, as a result, pores H are formed as illustrated in FIG. 7( b ) . An adjustment of porosity of the stress relaxation layer 2 C is carried out by adjusting the constituents in the boundary portion of the ceramic green sheet of the coil unit arrangement layer 2 A and the ceramic green sheet of the reinforcement layer 2 B. When the constituents of both ceramic green sheets are adjusted, a constituent such as K or B diffuses from the reinforcement layer 2 B to the coil unit arrangement layer 2 A, and thus pores may be formed in the crystalline ceramic layer configuring the reinforcement layer 2 B to form the stress relaxation layer 2 C. However, a percentage of K 2 content of the reinforcement layer 2 B is less than a percentage of K 2 content of the coil unit arrangement layer 2 A, and the stress relaxation layer 2 C may be formed in the coil unit arrangement layer 2 A.

A method of forming the stress relaxation layer 2 C may be adopted in addition to the above-described method of adjusting the constituents of the ceramic green sheet of the coil unit arrangement layer 2 A and the ceramic green sheet of the reinforcement layer 2 B. For example, a green sheet containing resin particles may be interposed between the ceramic green sheet of the coil unit arrangement layer 2 A and the ceramic green sheet of the reinforcement layer 2 B. When the green sheet is baked, resin particles are burned down to become pores. Accordingly, a portion of the green sheet becomes the stress relaxation layer 2 C. At this time, a constituent of the green sheet is not particularly specified. Alternatively, the ceramic green sheet (insulation paste) of the coil unit arrangement layer 2 A and/or the ceramic green sheet (insulation paste) of the reinforcement layer 2 B may have a large amount of resin in the boundary portion. Accordingly, since a large amount of resin is contained in the portion, the portion has pores formed therein by baking and becomes the stress relaxation layer 2 C. When a large amount of resin is contained to form pores, the amount of the resin is preferably 20 weight % to 30 weight % of the weight of ceramic powder.

The coil unit 3 has the coil conductor 4 related to a winding pack and the coil conductor 5 related to a lead-out portion which is connected with the external electrode 6 . The coil conductors 4 and 5 are formed by a conductive paste having, for example, any of silver, copper and nickel as a main constituent. The coil unit 3 is arranged only inside the coil unit arrangement layer 2 A and is not arranged in the reinforcement layer 2 B and the stress relaxation layer 2 C. In addition, any of the coil conductors 4 and 5 in the coil unit 3 is not in contact with the reinforcement layer 2 B and the stress relaxation layer 2 C. Both end portions of the coil unit 3 in the laminating direction are apart from the reinforcement layer 2 B and the stress relaxation layer 2 C, the ceramic of the coil unit arrangement layer 2 A is arranged between the coil unit 3 , the reinforcement layer 2 B and the stress relaxation layer 2 C. The coil conductor 4 related to a winding pack is configured by forming a conductive pattern having a predetermined winding by use of a conductive paste on the ceramic green sheet which forms the coil unit arrangement layer 2 A. The conductive patterns of the layers are connected with each other via through-hole conductors in the laminating direction. In addition, the coil conductor 5 related to a lead-out portion is configured by a conductive pattern in such a manner that an end portion of a winding pattern is extended out to the external electrode 6 . A coil pattern of the winding pack, the number of windings, a lead-out position of the lead-out portion or the like is not particularly specified.

A pair of external electrodes 6 is formed to cover both end surfaces facing each other in a direction orthogonal to the laminating direction among end surfaces of the element assembly 2 . Each of the external electrodes 6 is formed to entirely cover each of both end surfaces and a portion thereof may go around to other four surfaces from each of both end surfaces. Each of the external electrodes 6 is formed by screen-printing a conductive paste having, for example, any of silver, copper and nickel as a main constituent, or by a dip method.

Next, a method of manufacturing the laminated coil component 1 of the above-described configuration will be described.

First, ceramic green sheets forming the coil unit arrangement layer 2 A and ceramic green sheets forming the reinforcement layer 2 B are prepared. A ceramic paste is adjusted to have the above-described composition, is molded to have a sheet shape by a doctor blade method or the like and each of the ceramic green sheets is prepared. A composition may be differently adjusted in such a manner that the stress relaxation layer 2 C is prone to be formed only near the boundary between the ceramic green sheet of the coil unit arrangement layer 2 A and the ceramic green sheet of the reinforcement layer 2 B.

Subsequently, each of through-holes is formed by laser processing or the like at a predetermined position on each of the ceramic green sheets which become the coil unit arrangement layer 2 A, that is, each of the through-holes is formed at a pre-arranged position where a through-hole electrode is formed. Next, each of the conductive patterns is formed on each of the ceramic green sheets which become the coil unit arrangement layer 2 A. Herein, each of the conductive patterns and each of the through-hole electrodes are formed by a screen printing method using a conductive paste which contains silver, nickel or the like.

Subsequently, each of the ceramic green sheets is laminated. At this time, the ceramic green sheet which becomes the coil unit arrangement layer 2 A is stacked on the ceramic green sheet which becomes the reinforcement layer 2 B, and the ceramic green sheet which becomes the reinforcement layer 2 B is stacked thereon. The reinforcement layers 2 B formed at a bottom portion and an upper portion may be formed by a piece of ceramic green sheet, or may be formed by a plurality of ceramic green sheets. Next, each of the ceramic green sheets is crimped by exerting pressure thereon in the laminating direction.

Subsequently, a laminated body is baked at a predetermined temperature (for example, approximately 800 to 1,150° C.) to form the element assembly 2 . At this time, a set baking temperature is equal to or higher than a softening point of the coil unit arrangement layer 2 A, and is set to be lower than a softening point or a melting point of the reinforcement layer 2 B. At this time, the reinforcement layer 2 B retains a shape of the coil unit arrangement layer 2 A. In addition, since a region corresponding to the stress relaxation layer 2 C is not sufficiently sintered compared to other regions during baking, sufficient grain growth does not take place, and thus pores are formed. Accordingly, the amorphous coil unit arrangement layer 2 A, the crystalline reinforcement layer 2 B and the stress relaxation layer 2 C having a high porosity are formed.

Subsequently, the external electrodes 6 are formed on the element assembly 2 . Accordingly, the laminated coil component 1 is formed. An electrode paste, which has silver, nickel or copper as a main constituent, is coated on each of both end surfaces of the element assembly 2 in the longitudinal direction, baking is carried out at a predetermined temperature (for example, approximately 600 to 700° C.), and electroplating is carried out to form the external electrode 6 . Cu, Ni, Sn and the like can be used for the electroplating.

Next, an operation and effect of the laminated coil component 1 according to the third embodiment will be described.

Smoothness of the surface of a coil conductor is preferably improved to increase a Q (quality factor) value of a coil. The higher a frequency becomes, the shallower skin depth becomes, and smoothness of the surface of a coil conductor affects a Q value at a high frequency. For example, when, as illustrated in FIG. 2( b ) , smoothness of the surface of a coil conductor is deteriorated and concavity and convexity are formed, surface resistance of the coil conductor is increased and a Q value of a coil is decreased. On the other hand, when smoothness of the surface of a coil conductor is improved as illustrated in FIG. 2( a ) , surface resistance of the coil conductor is decreased and a Q value of a coil can be increased.

It is effective to make a ceramic of an element assembly amorphous to improve smoothness of the surface of a coil conductor. When an element assembly is crystalline as illustrated in FIG. 3( a ) , concavity and convexity of the surface of a coil conductor becomes large due to concavity and convexity of the surface of the element assembly in contact therewith, and thus smoothness is deteriorated. On the other hand, when an element assembly is amorphous as illustrated in FIG. 3( b ) , the surface of a coil conductor becomes smooth due to a smooth surface of the element assembly in contact therewith, and thus smoothness is improved.

Herein, the inventors find a problem that, when the element assembly is amorphous, strength of the element assembly becomes weak, and thus cracking or chipping is caused by external stress or impact. As a result of intensive research, the inventors come to find a preferred configuration of the laminated coil component 1 .

In the laminated coil component 1 according to the embodiment, the element assembly 2 includes the coil unit arrangement layer 2 A which has the coil unit 3 arranged therein, and the reinforcement layer 2 B which reinforces the coil unit arrangement layer 2 A. Since the coil unit arrangement layer 2 A is an amorphous layer which is made from glass-ceramic, smoothness of the surfaces of the coil conductors 4 and 5 arranged therein can be improved, and thus a Q value of the laminated coil component 1 can be increased. In addition, since the reinforcement layer 2 B is a crystalline layer, the reinforcement layer 2 B can reinforce the amorphous coil unit arrangement layer 2 A. Furthermore, the element assembly 2 includes the stress relaxation layer 2 C between the coil unit arrangement layer 2 A and the reinforcement layer 2 B. Since the stress relaxation layer 2 C has a higher porosity than other portions, the stress relaxation layer 2 C can mitigate stress exerted on the element assembly 2 with being interposed between the coil unit arrangement layer 2 A and the reinforcement layer 2 B. Accordingly, a Q value of the laminated coil component 1 can be improved and resistance to stress can be increased.

In the embodiment, the coil unit arrangement layer 2 A is not entirely amorphous and includes a crystalline portion by such a small amount (0.5 weight % to 2.5 weight %) that alumina is contained. However, the amount is extremely small, and thus a smooth surface is obtained as illustrated in FIG. 3( b ) . As such, the term “amorphous” herein corresponds to even a case where a crystalline portion is included as far as the portion is small.

The present invention is not limited to the above-described embodiments.

For example, in the above-described embodiments, a laminated coil component having one coil unit is illustrated. However, for example, a laminated coil component may have a plurality of coil units in an array.

In addition, in the first and second embodiments described above, the coil unit arrangement layer 2 A is interposed between a pair of shape retention layers 2 B on both sides in the laminating direction. However, the shape retention layer 2 B may be formed only on one side.

In addition, in the third embodiment, the coil unit arrangement layer 2 A is interposed between a pair of reinforcement layers 2 B and the stress relaxation layer 2 C on both sides in the laminating direction. However, the reinforcement layer 2 B and the stress relaxation layer 2 C may be formed only on one side. Alternatively, a pair of shape retention layers 2 B is formed on both sides in the laminating direction, whereas the stress relaxation layer 2 C may be formed only on one side in the laminating direction.

The present invention can be used in a laminated coil component.

1 laminated coil component

2 element assembly

2 A coil unit arrangement layer

2 B shape retention layer, reinforcement layer

2 C stress relaxation layer

3 coil unit

4 , 5 coil conductor

6 external electrode