Complementary metal oxide silicon transceiver having integrated power amplifier
Granted 9 Apr 2019 · no office action yet
Current assignee: RENESAS DEVICE DESIGN CORPORATION · originally FCI USA LLC
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Myung Woon Hwang, Min Chul Kang, Dong Hyun Ko · Examiner: Patricia T Nguyen · AU 2842 · TC 2800
Life of the application
10 dated eventsAbstract
A complementary metal oxide silicon transceiver having an integrated power amplifier is provided. The complementary metal oxide silicon transceiver having the integrated power amplifier is capable of controlling an output power according to a communication environment to solve the following problem that with the increment of an output level of a power amplifier, performance is decreased when noises flow into other blocks of a transceiver with power and thus are inputted to the power amplifier.
Description
11 parts›Field
The present disclosure relates to a complementary metal oxide silicon (CMOS) transceiver having an integrated power amplifier.
›Background
The following content only provides background information related to embodiments of the present disclosure, and thus it does not constitute the prior art.
Recently, most blocks of wireless transceivers are manufactured as single chips using complementary metal oxide silicon (CMOS) manufacturing processes.
However, power amplifiers included in the blocks in the wireless transceivers are implemented (manufactured) using InGap/GaAs heterojunction bipolar transistor (HBT) manufacturing processes due to performance. The InGap/GaAs HBT manufacturing processes require higher cost than that of the CMOS manufacturing processes.
A transceiver and a power amplifier are implemented as a multi-chip because differences of the manufacturing processes. In order to match two chips including a transceiver and a power amplifier, additional components are required. Accordingly, more and more researches are toward the trend that the power amplifier is built in the transceiver after the power amplifier is manufactured by the CMOS manufacturing processes.
When a maximum output level of a power amplifier is used in a wireless communication system, a long distance communication can be implemented. Therefore, a transceiver is basically designed according to the maximum output level in which power efficiency can be achieved maximally. However, a lower output level can be implemented in a short distance communication environment according to a communication environment. In the above-mentioned process, the power amplifier can have good efficiency in the maximum output level, but the power efficiency cannot be improved in the lower output level. Accordingly, a low power mode is required.
A reason that it is difficult to dispose (manufacture) the power amplifier included in plural blocks in the wireless transceiver as a chip is described as follows. With the increment of the output level of the power amplifier, performance is decreased when noises flow into other blocks of the transceiver with power and thus are inputted to the power amplifier. Accordingly, a transceiver configured to eliminate the above-mentioned decreased performance is required.
›SUMMARY OF THE DISCLOSURE
An objective of the present disclosure is to provide a complementary metal oxide silicon transceiver having an integrated power amplifier capable of controlling an output power according to a communication environment to solve the following problem that with the increment of an output level of a power amplifier, performance is decreased when noises flow into other blocks of a transceiver with power and thus are inputted to the power amplifier.
An implementation manner in accordance with an embodiment of the present disclosure provides a transmitter including a power supply part configured to output a direct current to direct current voltage or a battery voltage; a mixer configured to receive differential input signals from a local oscillator via in-phase input terminals and quadrature input terminals, and configured to output a frequency mixed signal after up mixing frequencies of the differential input signals; a driver amplifier connected to output terminals of the mixer, configured to receive the frequency mixed signal, configured to receive the direct current to direct current voltage or the battery voltage, configured to amplify the frequency mixed signal, and configured to output a drive signal, wherein the direct current to direct current voltage or the battery voltage serves as a power source of the driver amplifier; and a power amplifier comprising a first power amplifier and a second power amplifier which are connected to output terminals of the driver amplifier, configured to receive the direct current to direct current voltage or the battery voltage, configured to amplify the drive signal inputted to the first power amplifier and the second power amplifier, and configured to output a power signal in a balanced unbalanced (Balun) type, wherein the direct current to direct current voltage or the battery voltage serves a power source of the power amplifier.
As mentioned above, in the embodiment of the present disclosure, in order to increase a power supply rejection ratio (PSRR) of the driver amplifier serving an input of the power amplifier, a low dropout (LDO) regulator is disposed inside the driver amplifier. As such, the power amplifier included in plural blocks of a wireless transceiver is manufactured as a chip to solve the following problem that with the increment of the output level of the power amplifier, the performance is decreased when the noises flow into other blocks of the transceiver with the power and thus are inputted to the power amplifier.
In other words, when the low dropout regulator is used outside the chip, the noises of the power sources can be eliminated but the noises of the bonding wires resulted from inductance coupling in a chip package. In the embodiment of the present disclosure, the low dropout regulator is disposed inside the driver amplifier in the wireless transceiver, so as to achieve effect of eliminating the noises of the bonding wires resulted from inductance.
The embodiment of the present disclosure has the following effect. In order to control an output power to increase power efficiency in a low power level, the power amplifier has a low power mode. The driver amplifier configured to drive the power amplifier further has a gain mode. The driver amplifier can control the output power in 1 dB per step.
The embodiment of the present disclosure has the following effect. When a receiver is constituted, a receiver chip developed by a CMOS and a power amplifier chip can be manufactured as a single chip capable of adjusting an output power by using a CMOS manufacturing process. In the power amplifier, the power efficiency in the low power level can be increased in the low power mode.
›BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 illustrates a circuit structure diagram of a transmitter including a power amplifier in accordance with an embodiment of the present disclosure.
FIG. 2 illustrates a detailed circuit structure diagram of the transmitter in accordance with an embodiment of the present disclosure.
FIG. 3 illustrates a detailed circuit diagram of switching elements in the driver amplifier in accordance with an embodiment of the present disclosure.
›DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS · 1 of 6
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.
FIG. 1 illustrates a circuit structure diagram of a transmitter (TX) including a power amplifier (PA) in accordance with an embodiment of the present disclosure. FIG. 2 illustrates a detailed circuit structure diagram of the transmitter in accordance with an embodiment of the present disclosure.
The transmitter 100 in accordance with the embodiment of the present disclosure includes a power supply part 108 , a mixer 110 , a driver amplifier (DA) 120 , and a power amplifier (PA) 130 . Components included in the transmitter 100 are not limited thereto.
The embodiment of the present disclosure is described based on the transmitter 100 included in a wireless transceiver or in a receiver (RX).
When the power amplifier 130 included in plural blocks of the transmitter 100 included in the wireless transceiver is manufactured as a single chip, the following effect occurs. With the increment of an output level of the power amplifier 130 , performance is decreased when noises of bonding wire inductance flow into other blocks of the transceiver with power and a chip package, and thus the noises are inputted to the power amplifier. In order to eliminate the effect of the decreased performance, the transmitter 100 of the present disclosure increases a power supply rejection ratio (PSRR) of the driver amplifier 120 inputted to the power amplifier 130 . The transmitter 100 of the present disclosure can include a low dropout (LDO) regulator 124 disposed therein to increase the PSRR.
When the transmitter 100 controls an output power, the power amplifier 130 should have a low power mode to increase power efficiency in a low power level. The driver amplifier 120 configured to drive the power amplifier 130 further has a gain mode. The driver amplifier 120 can control the output power in 1 dB per step.
The power amplifier 130 using a CMOS manufacturing process can be built in the transmitter 100 and support communication standards of wireless local area network (WLAN), e.g., 802.11b, 802.11g, and 802.11n.
The transmitter 100 can support a maximum power of 21 dBm (Pmax=21 dBm) using the CMOS manufacturing process. When the transmitter 100 supports 802.11b, the transmitter 100 can support 21 dBm. When the transmitter 100 supports modulation and coding scheme 7 (MCS 7), the transmitter 100 can support 17 dBm.
In order to eliminate, by building the power amplifier 130 in the transmitter 100 , the decreased performance of other blocks resulted from the power, the low dropout regulator 124 is disposed in the driver amplifier 120 .
A driving amplifying part 122 is positioned below the low dropout regulator 124 bonding to the power amplifier 130 .
The driver amplifier 120 connected to the mixer 110 has the gain mode. In the power amplifier 130 , a power mode can be controlled by switching ON/OFF of two power amplifiers including a first power amplifier (PA 1 ) 132 and a second power amplifier (PA 2 ) 134 before a balanced unbalanced (Balun) transformer is implemented.
The power supply part 108 is connected to the driver amplifier 120 and the power amplifier 130 . The power supply part 108 provides a direct current to direct current (DC-DC) voltage or a battery voltage V_bat.
The mixer 110 is a passive mixer. The passive mixer can minimize a power supply coupling. The mixer 110 receives differential input signals from a local oscillator (LO) via in-phase and quadrature input terminals IQ_IN, and outputs a frequency mixed signal after up mixing frequencies of the differential input signals.
The driver amplifier 120 is connected to output terminals of the mixer 110 and receives the frequency mixed signal. The driver amplifier 120 receives the DC-DC voltage or the battery voltage V_bat from the power supply part 108 , amplifies the frequency mixed signal, and outputs a drive signal. The DC-DC voltage or the battery voltage V_bat serves a power source.
The output power of the driver amplifier 120 is set to be less than 1 dB per step, so that variations at inter stage matching with the power amplifier 130 can be minimized. Therefore, linearity performance of the power amplifier 130 does not change.
The driver amplifier 120 directly receives the DC-DC voltage or the battery voltage V_bat. The driver amplifier 120 uses the DC-DC voltage or the battery voltaic V_bat as a power source.
In order to avoid the power supply coupling resulted from the increment of the output power of the power amplifier 130 , the driver amplifier 120 uses the power source with another connecting method inside a chip. That is, the low dropout regulator 124 configured to drive the driver amplifier 120 is disposed to be connected to the DC-DC voltage or the battery voltage V_bat.
When only pins are disposed outside the chip to use other voltages without disposing the low dropout regulator 124 , the coupling of the noises to a bonding wire L_bondwire affects the driver amplifier 120 due to a drive voltage VDD_PA. Accordingly, as shown in FIG. 2 , the bonding wire L_bondwire is configured to isolate the low dropout regulator 124 in the package. Then, the noises from the power source are eliminated by the low dropout regulator 124 .
The power amplifier 130 includes the first power amplifier 132 and the second power amplifier 134 connected to the output terminals of the driver amplifier 120 . The power amplifier 130 receives the DC-DC voltage or the battery voltage V_bat from the power supply part 108 , amplifies the drive signal inputted to the first power amplifier 132 and the second power amplifier 134 , and outputs a power signal in a Balun type. The DC-DC voltage or the battery voltage V_bat serves a power source.
In order to increase the power efficiency based on various output powers, the power amplifier 130 can include plural modes. The power amplifier 130 directly receives the DC-DC voltage or the battery voltage V_bat from the power supply part 108 . The DC-DC voltage or the battery voltage V_bat inputted from the power supply part 108 serves a power source of the power amplifier 130 .
›DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS · 2 of 6
As shown in FIG. 1 , when the power amplifier 130 uses a maximum output power, the first power amplifier 132 and the second power amplifier 134 are operated in an ON state. The driver amplifier 120 is also in an ON state, thereby corresponding to the maximum output power.
As shown in FIG. 2 , the power supply part 108 is connected to the driver amplifier 120 and the power amplifier 130 via the bonding wires L_bondwire. The power supply part 108 provides the DC-DC voltage or the battery voltage V_bat for the driver amplifier 120 and the power amplifier 130 via the bonding wires L_bondwire.
The mixer 110 receives the differential input signals from the local oscillator, and outputs the frequency mixed signal after up mixing the frequencies the differential input signals.
The mixer 110 includes an in-phase path (I path) and a quadrature path (Q path). The I path and the Q path are implemented by passive mixer switches including plural amplifying elements. Different from the driver amplifier 120 and the power amplifier 130 , the mixer 110 is a passive mixer which does not require receiving the DC-DC voltage or the battery voltage V_bat from the power supply part 108 .
The mixer 110 amplifies in-phase components of the differential input signals in the I path via in-phase input terminals (I input terminals) I_INP and I_INM, and amplifies quadrature components of the differential input signals in the Q path via quadrature input terminals (Q input terminals) Q_INP and Q_INM. Then, the frequency mixed signal is acquired by up mixing the frequencies of the two amplified signals.
The I path of the mixer 110 includes a first mixer core switch MN 1 , a second mixer core switch MN 2 , a third mixer core switch MN 3 , and a fourth mixer core switch MN 4 . A current drawing-out terminal of the first mixer core switch MN 1 and a current drawing-out terminal of the third mixer core switch MN 3 are connected to the I input terminal I_INP. A current drawing-in terminal of the second mixer core switch MN 2 and a current drawing-in terminal of the fourth mixer core switch MN 4 are connected to the I input terminal. A current drawing-in terminal of the first mixer core switch MN 1 is connected to a current drawing-out terminal of the second mixer core switch MN 2 . A current drawing-in terminal of the third mixer core switch MN 3 is connected to a current drawing-out terminal of the fourth mixer core switch MN 4 . An input terminal of the second mixer core switch MN 2 is connected to an input terminal of the third mixer core switch MN 3 .
The first mixer core switch MN 1 and the fourth mixer core switch MN 4 receive a local oscillator plus phase signal LO_P of the local oscillator in a channel frequency for a frequency up-mixing. The local oscillator plus phase signal LO_P serves one of the differential signals. The second mixer core switch MN 2 and the third mixer core switch MN 3 receive a local oscillator minus phase signal LO_M of the local oscillator in the channel frequency for the frequency up-mixing. The local oscillator minus phase signal LO_M serves as the other of the differential signals. A duty cycle is 25%.
The Q path of the mixer 110 includes the same structure as that of the I path.
A first capacitor C 1 and a second capacitor C 2 are connected between the output terminals of the mixer 110 and the input terminals of the driver amplifier 120 .
One terminal of the first capacitor C 1 is connected to the current drawing-in terminal of the first mixer core switch MN 1 and the current drawing-out terminal of the second mixer core switch MN 2 . The other terminal of the first capacitor C 1 is connected to one terminal of the driver amplifier 120 . One terminal of the second capacitor C 2 is connected to the current drawing-in terminal of the third mixer core switch MN 3 and the current drawing-out terminal of the fourth mixer core switch MN 4 . The other terminal of the second capacitor C 2 is connected to the other terminal of the driver amplifier 120 . The first capacitor C 1 and the second capacitor C 2 eliminate direct current components of the frequency mixed signal outputted by the mixer 110 , and then the frequency mixed signal is applied to a fifth amplifier MN 5 and a sixth amplifier MN 6 to serve as a bias voltage.
The driver amplifier 120 is connected to the output terminals of the mixer 110 to receive the frequency mixed signal. The driver amplifier 120 receives the DC-DC voltage or the battery voltage V_bat, amplifies the frequency mixed signal, and outputs the drive signal. The DC-DC voltage or the battery voltage V_bat serves as a power source.
The driver amplifier 120 includes the driving amplifying part 122 including a plurality of switching elements, the low dropout regulator 124 , and a first transformer xfmr 1 . Input terminals of the driving amplifying part 122 are connected to the output terminals of the mixer 110 . Output terminals of the driving amplifying part 122 are connected to input terminals of the first transformer xfmr 1 .
The driving amplifying part 122 includes the fifth amplifier MN 5 , the sixth amplifier MN 6 , a seventh amplifier MN 7 , and an eighth amplifier MN 8 .
Voltages applied to a first drive control input terminal VB 1 _DA and a second drive control input terminal VB 2 _DA are referred to direct current bias voltages of the fifth amplifier MN 5 , the sixth amplifier MN 6 , the seventh amplifier MN 7 , and the eighth amplifier MN 8 . When 0V is applied to the first drive control input terminal VB 1 _DA and the second drive control input terminal VB 2 _DA, the fifth amplifier MN 5 , the sixth amplifier MN 6 , the seventh amplifier MN 7 , and the eighth amplifier MN 8 can be turned off.
A current draw terminal of the fifth amplifier MN 5 and a current drawing-out terminal of the sixth amplifier MN 6 are connected with each other. A control input terminal of the fifth amplifier MN 5 and a control input terminal of the sixth amplifier MN 6 are connected to the first drive control input terminal VB 1 _DA. A first resistor R 1 is connected between the control input terminal of the fifth amplifier MN 5 and the first drive control input terminal VB 1 _DA. One terminal of the first resistor R 1 is connected to the control input terminal of the fifth amplifier MN 5 . The other terminal of the first resistor R 1 is connected to the first drive control input terminal VB 1 _DA. A second resistor R 2 is connected between the control input terminal of the sixth amplifier MN 6 and the first drive control input terminal VB 1 _DA. One terminal of the second resistor R 2 is connected to the control input terminal of the sixth amplifier MN 6 . The other terminal of the second resistor R 2 is connected to the first drive control input terminal VB 1 _DA.
›DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS · 3 of 6
A current drawing-in terminal of the fifth amplifier MN 5 is connected to a current drawing-out terminal of the seventh amplifier MN 7 . A current drawing-in terminal of the sixth amplifier MN 6 is connected to a current drawing-out terminal of the eighth amplifier MN 8 . A control input terminal of the seventh amplifier MN 7 and a control input terminal of the eighth amplifier MN 8 are connected to the second drive control input terminal VB 2 _DA. A third resistor R 3 is connected between the control input terminal of the seventh amplifier MN 7 and the second drive control input terminal VB 2 _DA. One terminal of the third resistor R 3 is connected to the control input terminal of the seventh amplifier MN 7 . The other terminal of the third resistor R 3 is connected to the second drive control input terminal VB 2 _DA. A fourth resistor R 4 is connected between the control input terminal of the eighth amplifier MN 8 and the second drive control input terminal VB 2 _DA. One terminal of the fourth resistor R 4 is connected to the control input terminal of the eighth amplifier MN 8 . The other terminal of the fourth resistor R 4 is connected to the second drive control input terminal VB 2 _DA.
A current drawing-in terminal of the seventh amplifier MN 7 is connected to one of the input terminals of the first transformer xfmr 1 . A current drawing-in terminal of the eighth amplifier MN 8 is connected to the other of the input terminals of the first transformer xfmr 1 . The fifth amplifier MN 5 and the sixth amplifier MN 6 are gain variable amplifiers. Each of the fifth amplifier MN 5 and the sixth amplifier MN 6 includes plural sets of amplifying circuits at a magnification of 2 N . N is a positive integer greater than or equal to 0. Each set of the amplifying circuits includes two amplifiers, and the sets of the amplifying circuits are connected in parallel.
The driver amplifier 120 in which the fifth amplifier MN 5 and the sixth amplifier serve as inputs is not implemented by a single metal oxide semiconductor (MOS). As shown in FIG. 3 , plural metal oxide semiconductors can be connected in parallel to control the size of the driver amplifier 120 . The seventh amplifier MN 7 and the eighth amplifier MN 8 are implemented by metal oxide semiconductors having a single size. When the gain of the driver amplifier 120 is changed, an output impedance of the driver amplifier 120 can be minimized because the size of the seventh amplifier MN 7 and the eighth amplifier MN 8 is fixed. As such, a situation that the performance of the power amplifier 130 is affected because the gain of the amplifier 120 is changed can be avoided.
One terminal of the low dropout regulator 124 is connected to the power supply part 108 . The other terminal of the low dropout regulator 124 is connected to a tap between the two input terminals of the first transformer xfmr 1 . The low dropout regulator 124 is connected to the power supply part 108 via the bonding wire L_bondwire. The DC-DC voltage or the battery voltage V_bat inputted via the bonding wire L_bondwire is stabilized by the low dropout regulator 124 and then inputted to the first transformer xfmr 1 .
Larger noises are generated in the power amplifier 130 because of the DC-DC voltage or the battery voltage V_bat applied by the power supply part 108 . In the meantime, the larger noises are applied to the DC-DC voltage of the power supply part 108 or the battery voltage V_bat. In order to eliminate the larger noises generated in the power amplifier 130 , the driving amplifying part 122 of the drier amplifier 120 is connected to the low dropout regulator 124 .
In other words, the coupling of the larger noises via the bonding wire L_bondwire in the power amplifier 130 directly affects the DC-DC voltage of the power supply part 108 or the battery voltage V_bat. When the low dropout regulator 124 is used outside the chip, effect of decreasing the noises is less significant. Accordingly, the low dropout regulator 124 is disposed inside the chip.
The first transformer xfmr 1 converts a voltage level of the drive signal and outputs a converted drive signal. The amplified output power (drive signal) in the driver amplifier 120 is transmitted to the power amplifier 130 via the first transformer xfmr 1 . The tap of the first transformer xfmr 1 is connected to the low dropout regulator 124 . The low dropout regulator 124 is connected to a power pin of the power supply part 108 via the bonding wire L_bondwire. The tap of the first transformer xfmr 1 serves as an inductive load of the driver amplifier 120 . The first transformer xfmr 1 is used for inter-stage matching and impedance transformation.
The power amplifier 130 has a characteristic of increasing a saturation power (Psat), so that a cell is larger. Accordingly, input impedance should be designed to be smaller. The driver amplifier 120 should be designed to be capable of driving the input impedance. Therefore, the driver amplifier 120 includes the first transformer xfmr 1 . Two coils of the first transformer xfmr 1 may be at a ratio of one of 1:1, 2:1, and 3:1.
When the two coils of the first transformer xfmr 1 is at a ratio of 1:1, relative characteristics are described as follows. The input impedance of the power amplifier 130 is presented at a ratio of 1:1 in the output of the driver amplifier 120 . Accordingly, a voltage swing is small, and VDD_DA is lowered. A high radio frequency (RF) again is difficult to be implemented because load impedance is small.
When the two coils of the first transformer xfmr 1 is at a ratio of 3:1, relative characteristics are described as follows. The input impedance of the power amplifier 130 is presented at a ratio of 9:1 in the output of the driver amplifier 120 . Accordingly, a voltage swing is large. When VDD_DA is high enough, a higher radio frequency (RF) gain can be acquired. Although a coupling coefficient at the ratio of 3:1 is smaller than that at the ratio of 1:1 and thus the gain at the ratio of 3:1 seems to be smaller than that at the ratio of 1:1, the gain at the ratio of 3:1 is larger than that at the ratio of 1:1 in a practical situation.
›DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS · 4 of 6
The characteristics of the ratios can be traded off according to a condition of VDD_DA and a required gain.
The power amplifier 130 is connected to the output terminals of the driver amplifier 120 . The power amplifier 130 includes the first power amplifier 132 and the second power amplifier 134 which are connected to the output terminals of the driver amplifier 120 . The power amplifier 130 receives the DC-DC voltage or the battery voltage V_bat from the power supply part 108 , amplifies the drive signal inputted to the first power amplifier 132 and the second power amplifier 134 , and outputs the power signal in a Balun type. The DC-DC voltage or the battery voltage V_bat serves a power source. The DC-DC voltage or the battery voltage V_bat serves a power source.
The power amplifier 130 includes the first power amplifier 132 , the second power amplifier 134 , and a second transformer xfmr 2 . The first power amplifier 132 and the second power amplifier 134 are connected to the power supply part 108 via the bonding wire L_bondwire. Output terminals of the first power amplifier 132 and the second power amplifier 134 are connected to input terminals of the second transformer xfmr 2 . The second transformer xfmr 2 converts a voltage level of the power signal and outputs a converted power signal.
When the first power amplifier 132 and the second power amplifier 134 are operated in an ON state, the power amplifier 130 is operated in a high power mode. When the first power amplifier 132 is operated in the ON state but the second power amplifier 134 is operated in an OFF state, the power amplifier 130 is operated in a low power mode. Alternatively, when the first power amplifier 132 is operated in the OFF state but the second power amplifier 134 is operated in an ON state, the power amplifier 130 is operated in the low power mode.
The first power amplifier 132 includes a ninth amplifier MN 9 , a tenth amplifier MN 10 , an eleventh amplifier MN 11 , and a twelfth amplifier MN 12 . A current drawing-out terminal of the ninth amplifier MN 9 and a current drawing-out terminal of the tenth amplifier MN 10 are connected with each other. A control input terminal of the ninth amplifier MN 9 and a control input terminal of the tenth amplifier MN 10 are connected to a first power control input terminal VB 1 _PA 1 . A fifth resistor R 5 is connected between the control input terminal of the ninth amplifier MN 9 and the first power control input terminal VB 1 _PA 1 . One terminal of the fifth resistor R 5 is connected to the control input terminal of the ninth amplifier MN 9 . The other terminal of the fifth resistor R 5 is connected to the first power control input terminal VB 1 _PA 1 . A sixth resistor R 6 is connected between the control input terminal of the tenth amplifier MN 10 and the first power control input terminal VB 1 _PA 1 . One terminal of the sixth resistor R 6 is connected to the control input terminal of the tenth amplifier MN 10 . The other terminal of the sixth resistor R 6 is connected to the first power control input terminal VB 1 _PA 1 .
Voltages applied to the first power control input terminal VB 1 _PA 1 and second power control input terminal VB 2 _PA 1 are referred to direct current bias voltages of the ninth amplifier MN 9 , the tenth amplifier MN 10 , the eleventh amplifier MN 11 , and the twelfth Amplifier MN 12 . When 0V is applied to the first power control input terminal VB 1 _PA 1 and the second power control input terminal VB 2 _PA 1 , the ninth amplifier MN 9 , the tenth amplifier MN 10 , the eleventh amplifier MN 11 , and the twelfth amplifier MN 12 can be turned off.
A current drawing-in terminal of the ninth amplifier MN 9 is connected to a current drawing-out terminal of the eleventh amplifier MN 11 . A current drawing-in terminal of the tenth amplifier MN 10 is connected to a current drawing-out terminal of the twelfth amplifier MN 12 . A control input terminal of the eleventh amplifier MN 11 and a control input terminal of the twelfth amplifier MN 12 are connected to the second power control input terminal VB 2 _PA 1 . A seventh resistor R 7 is connected between the control input terminal of the eleventh amplifier MN 11 and the second power control input terminal VB 2 _PA 1 . One terminal of the seventh resistor R 7 is connected to the control input terminal of the eleventh amplifier MN 11 . The other terminal of the seventh resistor R 7 is connected to the second power control input terminal VB 2 _PA 1 . An eighth resistor R 8 is connected between the control input terminal of the twelfth amplifier MN 12 and the second power control input terminal VB 2 _PA 1 . One terminal of the eighth resistor R 8 is connected to the control input terminal of the twelfth amplifier MN 12 . The other terminal of the eighth resistor R 8 is connected to the second power control input terminal VB 2 _PA 1 .
A current drawing-in terminal of the eleventh amplifier MN 11 is connected to one of input terminals of the second transformer xfmr 2 . A current drawing-in terminal of the twelfth amplifier MN 12 is connected to the other of the input terminals of the second transformer xfmr 2 . The output terminals of the driver amplifier 120 are connected to the control input terminal of the ninth amplifier MN 9 and the control input terminal of the tenth amplifier MN 10 .
A third capacitor C 3 and a fourth capacitor C 4 are connected between the output terminals of the driver amplifier 120 and input terminals of the first power amplifier 132 . One terminal of the third capacitor C 3 is connected to one of the output terminals of the first transformer xfmr 1 . The other terminal of the third capacitor C 3 is connected to the control input terminal of the ninth amplifier MN 9 . One terminal of the fourth capacitor C 4 is connected to the other of the output terminals of the first transformer xfmr 1 . The other terminal of the fourth capacitor C 4 is connected to the control input terminal of the tenth amplifier MN 10 .
›DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS · 5 of 6
The third capacitor C 3 and the fourth capacitor C 4 can eliminate direct current components of the drive signal.
The second power amplifier 131 includes a thirteenth amplifier MN 13 , a fourteenth amplifier MN 14 , a fifth amplifier MN 15 , and a sixteenth amplifier MN 16 . A current drawing-out terminal of the thirteenth amplifier MN 13 and a current drawing-out terminal of the fourteenth amplifier MN 14 are connected with each other. A control input terminal of the thirteenth amplifier MN 13 and a control input terminal of the fourteenth amplifier MN 14 are connected to a first power control input terminal VB 1 _PA 2 . A ninth resistor R 9 is connected between the control input terminal of the thirteenth amplifier MN 13 and the first power control input terminal VB 1 _PA 2 . One terminal of the ninth resistor R 9 is connected to the control input terminal of the thirteenth amplifier MN 13 . The other terminal of the ninth resistor R 9 is connected to the first power control input terminal VB 1 _PA 2 . A tenth resistor R 10 is connected between the control input terminal of the fourteenth amplifier MN 14 and the first power control input terminal VB 1 _PA 2 . One terminal of the tenth resistor R 10 is connected to the control input terminal of the fourteenth amplifier MN 14 . The other terminal of the tenth resistor R 10 is connected to the first power control input terminal VB 1 _PA 2 .
Voltages applied to the first power control input terminal VB 1 _PA 2 and a second power control input terminal VB 2 _PA 2 are referred to direct current bias voltages of the thirteenth amplifier MN 13 , the fourteenth amplifier MN 14 , the fifth amplifier MN 15 , and the sixteenth amplifier MN 16 . When 0V is applied to the first power control input terminal VB 1 _PA 2 and the second power control input terminal VB 2 _PA 2 , the thirteenth amplifier MN 13 , the fourteenth amplifier MN 14 , the fifth amplifier MN 15 , and the sixteenth amplifier MN 16 can be turned off.
A current drawing-in terminal of the thirteenth amplifier MN 13 is connected to a current drawing-out terminal of the fifth amplifier MN 15 . A current drawing-in terminal of the fourteenth amplifier MN 14 is connected to a current drawing-out terminal of the sixteenth amplifier MN 16 . A control input terminal of the fifth amplifier MN 15 and a control input terminal of the sixteenth amplifier MN 16 are connected to the second power control input terminal VB 2 _PA 2 . An eleventh resistor R 11 is connected between the control input terminal of the fifth amplifier MN 15 and the second power control input terminal VB 2 _PA 2 . One terminal of the eleventh resistor R 11 is connected to the control input terminal of the fifth amplifier MN 15 . The other terminal of the eleventh resistor R 11 is connected to the second power control input terminal VB 2 _PA 2 . A twelfth resistor R 12 is connected between the control input terminal of the sixteenth amplifier MN 16 and the second power control input terminal VB 2 _PA 1 . One terminal of the twelfth resistor R 12 is connected to the control input terminal of the sixteenth amplifier MN 16 . The other terminal of the twelfth resistor R 12 is connected to the second power control input terminal VB 2 _PA 2 .
A current drawing-in terminal of the fifth amplifier MN 15 is connected to one of the input terminals of the second transformer xfmr 2 . A current drawing-in terminal of the sixteenth amplifier MN 16 is connected to the other of the input terminals of the second transformer xfmr 2 . The output terminals of the driver amplifier 120 are connected to the control input terminal of the thirteenth amplifier MN 13 and the control input terminal of the fourteenth amplifier MN 14 .
A fifth capacitor C 5 and a sixth capacitor C 6 are connected between the output terminals of the driver amplifier 120 and input terminals of the second power amplifier 134 . One terminal of the fifth capacitor C 5 is connected to one of the output terminals of the first transformer xfmr 1 . The other terminal of the fifth capacitor C 5 is connected to the control input terminal of the thirteenth amplifier MN 13 . One terminal of the sixth capacitor C 6 is connected to the other of the output terminals of the first transformer xfrm 1 . The other terminal of the sixth capacitor C 6 is connected to the control input terminal of the fourteenth amplifier MN 14 . The fifth capacitor C 5 and the sixth capacitor C 6 can eliminate the direct current components of the drive signal.
The output power passing through secondary inductance of the first transformer xfmr 1 and transmitted via the third capacitor C 3 to the sixth capacitor C 6 is amplified by the first power amplifier 132 and the second power amplifier 134 . The voltages of the first power control input terminal VB 1 _PA 1 and the second power control input terminal VB 2 _PA 1 can be controlled by the third capacitor C 3 to the sixth capacitor C 6 , so that the power amplifier 130 is operated in the high power mode or the low power mode by controlling the first power amplifier 132 and the second power amplifier 134 to be turned on or turned off.
The output power (a power signal) is generated after the outputs of the first power amplifier 132 and the second power amplifier 134 pass the second transformer xfmr 2 serving as a balanced unbalanced (Balun) transformer. For example, an amplifier constituted by the ninth amplifier MN 9 to the twelfth amplifier MN 12 is called the first power amplifier 132 . An amplifier constituted by the thirteenth amplifier MN 13 to the sixteenth amplifier MN 16 is called the second power amplifier 134 . In the high power mode, voltages enabling the first power amplifier 132 to be turned on are inputted to the first power control input terminal VB 1 _PA 1 and the second power control input terminal VB 2 _PA 1 , and voltages enabling the second power amplifier 134 to be turned on are inputted to the first power control input terminal VB 1 _PA 2 and the second power control input terminal VB 2 _PA 2 . In the high power mode, the maximum output level is used. In the high power mode in practice, the power gain is approximately 15 dB. A gain ratio of the first power amplifier 132 to the second power amplifier 134 is 1:1.
›DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS · 6 of 6
Turning off only one of the first power amplifier 132 and the second power amplifier 134 can enter the low power mode. For example, the second power amplifier 134 is turned off, and the first power amplifier 132 serves as a main amplifier in the low power mode. When the bias voltages enabling the first power amplifier 132 to be turned on are inputted to the first power control input terminal VB 1 _PA 1 and the second power control input terminal VB 2 _PA 1 , the first power control input terminal VB 1 _PA 2 and the second power control input terminal VB 2 _PA 2 are grounded to turn off the second power amplifier 134 , and the gain ratio is set as 1:1, the power gain is decreased by 6 dB.
In the low power mode, the state of the second power amplifier 134 which is turned off affects performance most. However, when the power amplifier constituted by the thirteenth amplifier MN 13 to the sixteenth amplifier MN 16 is operated in a small signal mode, the problem does not exist.
In the low power mode, the thirteenth amplifier MN 13 to the sixteenth amplifier MN 16 are turned off in the small signal mode. However, the outputs of the eleventh amplifier MN 11 and the twelfth amplifier MN 12 serve as the output of the power amplifier 130 and swing in a larger range of an output power level. Accordingly, turning off the states of the fifteenth amplifier MN 15 and the sixteenth amplifier MN 16 accurately is most important.
The second transformer xfmr 2 serves as a Balun transformer. The second transformer xfmr 2 may be used for impedance transformation. The second transformer xfmr 2 may be connected to a receiver via a switching circuit. When the second transformer xfmr 2 is connected to the receiver via the switching circuit, the transmitter 100 may be implemented as a transceiver.
FIG. 3 illustrates a detailed circuit diagram of switching elements in the driver amplifier in accordance with an embodiment of the present disclosure.
As shown in FIG. 2 , the driver amplifier 120 in accordance with the embodiment of the present disclosure includes the driving amplifying part 122 . The driving amplifying part 122 includes the fifth amplifier MN 5 , the sixth amplifier MN 6 , the seventh amplifier MN 7 , and the eighth amplifier MN 8 . The current drawing-out terminal of the fifth amplifier MN 5 and the current drawing-out terminal of the sixth amplifier MN 6 are connected with each other.
The control input terminal of the fifth amplifier MN 5 and the control input terminal of the sixth amplifier MN 6 are connected to the first drive control input terminal VB 1 _DA. The first resistor R 1 is connected between the control input terminal of the fifth amplifier MN 5 and the first drive control input terminal VB 1 _DA. One terminal of the first resistor R 1 is connected to the control input terminal of the fifth amplifier MN 5 . The other terminal of the first resistor R 1 is connected to the first drive control input terminal VB 1 _DA.
The second resistor R 2 is connected between the control input terminal of the sixth amplifier MN 6 and the first drive control input terminal VB 1 _DA. One terminal of the second resistor R 2 is connected to the control input terminal of the sixth amplifier MN 6 . The other terminal of the second resistor R 2 is connected to the first drive control input terminal VB 1 _DA.
The current drawing-in terminal of the fifth amplifier MN 5 is connected to the current drawing-out terminal of the seventh amplifier MN 7 . The current drawing-in terminal of the sixth amplifier MN 6 is connected to the current drawing-out terminal of the eighth amplifier MN 8 . The fifth amplifier MN 5 and the sixth amplifier MN 6 are gain variable amplifiers. Each of the fifth amplifier MN 5 and the sixth amplifier MN 6 includes plural sets of amplifying circuits at a magnification of 2 N . N is a positive integer greater than or equal to 0. Each set of the amplifying circuits includes two amplifiers, and the sets of the amplifying circuits are connected in parallel.
FIG. 3 illustrates a detailed circuit of the fifth amplifier MN 5 in FIG. 2 . The circuit is used for controlling a power gain of the driver amplifier 120 based on transconductance (Gm). In main Gm cells, N source pins are added and grounded. Each of the main Gm cells can amplify 2 times. Each of the main Gm cells can be connected to a switch, so as to control the Gm to be ranged from V_CON<0> to V_CON<N>.
While the embodiments of the present disclosure have been shown and described, it will be understood the above-mentioned embodiments are merely exemplary to explain the present disclosure and not to be construed as limiting the present disclosure. Various changes, modifications, equivalents, and variants may be made by those skilled in the art from the scope of the present disclosure.
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3 codes- H03F1/02
- H03F3/24
- H04B1/04
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