Method and device for repairing semiconductor chips

The present disclosure relates to a method and a device for repairing chips, and more particularly to a method and a device for repairing semiconductor chips.

In recent years, LEDs (light-emitting diodes) have been used widely due to good light-emitting quality and high light-emitting efficiency. LEDs have been developed capable of emitting red, green, and blue light, and LEDs have been increasingly used for various applications such as a full-color LED display, so that color performance of the full-color LED display can be increased. Typically, the red, green, and blue lights respectively generated by the red, green, and blue LEDs mixed to form colored light with high brightness and contrast, so as to display some information for viewer.

One aspect of the present disclosure relates to a method and a device for repairing semiconductor chips.

One of the embodiments of the present disclosure provides a method for repairing semiconductor chips, including: providing an LED module that includes a circuit substrate and a light-emitting group disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the light-emitting group includes a plurality of light-emitting units, each light-emitting unit includes an LED chip and a conductive substance disposed between a bottom side of the LED chip and the circuit substrate, and at least one of the light-emitting units is a bad light-emitting unit; projecting a laser light source generated by a laser generating module onto the bad light-emitting unit so as to decrease the bonding strength between the bad light-emitting unit and the circuit substrate; removing the bad light-emitting unit from the circuit substrate by a chip pick-and-place module so as to form a vacancy on the light-emitting group; placing a good light-emitting unit inside the vacancy by the chip pick-and-place module of the light-emitting group by the chip pick-and-place module, wherein the good light-emitting unit includes a good LED chip and a new conductive substance disposed on a bottom side of the good LED chip; and then projecting the laser light source generated by the laser generating module onto the good light-emitting unit so as to fix the good light-emitting unit on the circuit substrate and electrically connect the good light-emitting unit to the circuit substrate.

Another one of the embodiments of the present disclosure provides a method for repairing semiconductor chips, including: providing an LED module that includes a circuit substrate and a plurality of light-emitting units disposed on the circuit substrate and electrically connected to the circuit substrate, wherein at least one of the light-emitting units is a bad light-emitting unit; projecting a laser light source generated by a laser generating module onto the bad light-emitting unit so as to decrease the bonding strength between the bad light-emitting unit and the circuit substrate; removing the bad light-emitting unit from the circuit substrate by a chip pick-and-place module so as to form a vacancy; placing a good light-emitting unit inside the vacancy by the chip pick-and-place module; and then electrically connecting the good light-emitting unit to the circuit substrate.

Yet another one of the embodiments of the present disclosure provides a device for repairing semiconductor chips, and the device can be applied to an LED module. The LED module includes a circuit substrate and a plurality of light-emitting units disposed on the circuit substrate and electrically connected to the circuit substrate, and at least one of the light-emitting units is a bad light-emitting unit. The device for repairing semiconductor chips includes a laser generating module and a chip pick-and-place module. The laser generating module is adjacent to the circuit substrate and disposed under the circuit substrate for generating a laser light source. The chip pick-and-place module is adjacent to the light-emitting unit and disposed above the light-emitting unit. The laser light source generated by the laser generating module is projected onto the bad light-emitting unit so as to decrease the bonding strength between the bad light-emitting unit and the circuit substrate. The bad light-emitting unit is removed from the circuit substrate by the chip pick-and-place module so as to form a vacancy, and a good light-emitting unit is placed inside the vacancy by the chip pick-and-place module.

Therefore, by matching the features of “projecting a laser light source generated by a laser generating module onto the bad light-emitting unit so as to decrease the bonding strength between the bad light-emitting unit and the circuit substrate”, “removing the bad light-emitting unit from the circuit substrate by a chip pick-and-place module so as to form a vacancy”, “placing a good light-emitting unit inside the vacancy by the chip pick-and-place module” and “electrically connecting the good light-emitting unit to the circuit substrate”, the bad light-emitting unit can be replaced by the good light-emitting unit so as to repair the LED module.

Therefore, by matching the features of “the laser generating module adjacent to the circuit substrate and disposed under the circuit substrate for generating a laser light source” and “the chip pick-and-place module adjacent to the light-emitting unit and disposed above the light-emitting unit”, the laser light source generated by the laser generating module can be projected onto the bad light-emitting unit so as to decrease the bonding strength between the bad light-emitting unit and the circuit substrate, and the bad light-emitting unit can be removed from the circuit substrate by the chip pick-and-place module so as to form a vacancy. Whereby, a good light-emitting unit can be placed inside the vacancy by the chip pick-and-place module, so that the bad light-emitting unit can be replaced by the good light-emitting unit so as to repair the LED module.

To further understand the techniques, means and effects of the present disclosure, the following detailed descriptions and appended drawings are hereby referred to, such that, and through which, the purposes, features and aspects of the present disclosure can be thoroughly and concretely appreciated. However, the appended drawings are provided solely for reference and illustration, without any intention to limit the present disclosure.

The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

FIG. 1 shows a flowchart of a method for repairing semiconductor chips according to the present disclosure;

FIG. 2 shows a schematic view of step S 100 of the method for repairing semiconductor chips according to the present disclosure;

FIG. 3 shows a schematic view of steps S 102 and S 102 (B) of the method for repairing semiconductor chips according to the present disclosure;

FIG. 4 shows a schematic view of step S 104 of the method for repairing semiconductor chips according to the present disclosure;

FIG. 5 shows a schematic view of step S 106 of the method for repairing semiconductor chips according to the present disclosure;

FIG. 6 shows a schematic view of steps S 108 , S 110 and S 110 (B) of the method for repairing semiconductor chips according to the present disclosure;

FIG. 7 shows a schematic view of step S 102 (A) of the method for repairing semiconductor chips according to the present disclosure; and

FIG. 8 shows a schematic view of step S 110 (A) of the method for repairing semiconductor chips according to the present disclosure.

Embodiments of a method and a device for repairing semiconductor chips according to the present disclosure are described herein. Other advantages and objectives of the present disclosure can be easily understood by one skilled in the art from the disclosure. The present disclosure can be applied in different embodiments. Various modifications and variations can be made to various details in the description for different applications without departing from the scope of the present disclosure. The drawings of the present disclosure are provided only for simple illustrations, but are not drawn to scale and do not reflect the actual relative dimensions. The following embodiments are provided to describe in detail the concept of the present disclosure, and are not intended to limit the scope thereof in any way.

Referring to FIG. 1 to FIG. 6 , the present disclosure provides a method for repairing semiconductor chips, including the following steps:

Firstly, referring to FIG. 1 and FIG. 2 , providing an LED module 1 that includes a circuit substrate 10 and a plurality of light-emitting units 11 disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10 , and at least one of the light-emitting units 11 being a bad light-emitting unit 11 B (step S 100 ). In other words, the LED module 1 includes a circuit substrate 10 and a light-emitting group G disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10 , and the light-emitting group G includes a plurality of light-emitting units 11 .

For example, each light-emitting unit 11 includes an LED chip 111 and a conductive substance 112 disposed between a bottom side of the LED chip 111 and the circuit substrate 10 . In addition, the LED chip 111 may be a GaN LED chip or any type of LED chip. The conductive substance 112 may be an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP) or any type of conductive material. It should be noted that the bad light-emitting unit 11 B may have an LED chip 111 that is unable to provide a light source, or the bad light-emitting unit 11 B may have a conductive substance 112 that is unable to provide a conductive path. However, it is merely an example and is not meant to limit the scope of the present disclosure.

Next, referring to FIG. 1 and FIG. 3 , projecting a laser light source L generated by a laser generating module 2 onto the bad light-emitting unit 11 B so as to decrease the bonding strength or the adhesive strength between the bad light-emitting unit 11 B and the circuit substrate 10 (step S 102 ). For example, when the laser light source L generated by the laser generating module 2 is projected onto the bad light-emitting unit 11 B, the bonding strength or the adhesive strength between the bad light-emitting unit 11 B and the circuit substrate 10 would be decreased, so that it is easy for the bad light-emitting unit 11 B to separate from the circuit substrate 10 .

Afterward, referring to FIG. 1 and FIG. 4 , removing the bad light-emitting unit 11 B from the circuit substrate 10 by a chip pick-and-place module 3 so as to form a vacancy G 10 (step S 104 ), or removing the bad light-emitting unit 11 B from the circuit substrate 10 by a chip pick-and-place module 3 so as to form a vacancy G 10 on the light-emitting group G For example, chip pick-and-place module 3 may be a vacuum sucker, a vacuum suction nozzle, or any type of pick and place machine, but it is not meant to limit the scope of the present disclosure.

Subsequently, referring to FIG. 1 and FIG. 5 , placing a good light-emitting unit 11 N inside the vacancy G 10 by the chip pick-and-place module 3 (step S 106 ), or placing a good light-emitting unit 11 N inside the vacancy G 10 of the light-emitting group G by the chip pick-and-place module 3 . For example, the good light-emitting unit 11 N includes a good LED chip 111 N and a new conductive substance 112 N disposed on a bottom side of the good LED chip 111 N, and the new conductive substance 112 N may be an anisotropic conductive paste or any type of conductive material, but it is not meant to limit the scope of the present disclosure.

Thereafter, referring to FIG. 1 and FIG. 6 , electrically connecting the good light-emitting unit 11 N to the circuit substrate 10 (step S 108 ). For example, the step (S 108 ) of electrically connecting the good light-emitting unit 11 N to the circuit substrate 10 further includes: projecting the laser light source L generated by the laser generating module 2 onto the good light-emitting unit 11 N so as to fix the good light-emitting unit 11 N on the circuit substrate 10 and electrically connect the good light-emitting unit 11 N to the circuit substrate 10 (step S 110 ).

More particularly, referring to FIG. 1 , FIG. 3 and FIG. 7 , the step (S 102 ) of projecting the laser light source L generated by the laser generating module 2 onto the bad light-emitting unit 11 B further includes: referring to FIG. 1 and FIG. 7 , detecting a position of a contact interface between the circuit substrate 10 and the conductive substance 112 of the bad light-emitting unit 11 B by a position detecting module 4 (step S 102 (A)); and then referring to FIG. 1 and FIG. 3 , projecting the laser light source L generated by the laser generating module 2 onto the contact interface between the circuit substrate 10 and the conductive substance 112 of the bad light-emitting unit 11 B so as to decrease the bonding strength between the circuit substrate 10 and the conductive substance 112 of the bad light-emitting unit 11 B (step S 102 (B)). For example, as shown in FIG. 7 , the position detecting module 4 at least includes a receiving element 40 for receiving a detection wave L′ (such as a detection signal) that can be provided by the laser generating module 2 , but it is not meant to limit the scope of the present disclosure.

More particularly, referring to FIG. 1 , FIG. 6 and FIG. 8 , the step (S 110 ) of projecting the laser light source L generated by the laser generating module 2 onto the good light-emitting unit 11 N further includes: referring to FIG. 1 and FIG. 8 , detecting a position of the new conductive substance 112 N of the good light-emitting unit 11 N by a position detecting module 4 (step S 110 (A)), and then referring to FIG. 1 and FIG. 6 , projecting the laser light source L generated by the laser generating module 2 onto the new conductive substance 112 N of the good light-emitting unit 11 N so as to solidify the new conductive substance 112 N (step S 110 (B)). For example, as shown in FIG. 8 , the position detecting module 4 at least includes a receiving element 40 for receiving a detection wave L′ (such as a detection signal) that can be provided by the laser generating module 2 , but it is not meant to limit the scope of the present disclosure.

It should be noted that referring to FIG. 1 to FIG. 8 , the present invention further provides a device Z for repairing semiconductor chips, including a laser generating module 2 and a chip pick-and-place module 3 . For example, the device Z for repairing semiconductor chips can be applied to an LED module 1 . The LED module 1 includes a circuit substrate 10 and a plurality of light-emitting units 11 disposed on the circuit substrate 10 and electrically connected to the circuit substrate 10 , and the at least one of the light-emitting units 11 is a bad light-emitting unit 11 B.

More particularly, referring to FIG. 3 and FIG. 6 , the laser generating module 2 is adjacent to the circuit substrate 10 and disposed under the circuit substrate 10 for generating a laser light source L.

For example, as shown in FIG. 3 , the laser light source L generated by the laser generating module 2 can be projected onto the bad light-emitting unit 11 B so as to decrease the bonding strength between the bad light-emitting unit 11 B and the circuit substrate 10 . That is to say, the laser light source L generated by the laser generating module 2 can be projected onto the contact interface between the circuit substrate 10 and the conductive substance 112 of the bad light-emitting unit 11 B so as to decrease the bonding strength between the circuit substrate 10 and the conductive substance 112 of the bad light-emitting unit 11 B.

For example, as shown in FIG. 6 , the laser light source L generated by the laser generating module 2 can be projected onto the good light-emitting unit 11 N so as to fix the good light-emitting unit 11 N on the circuit substrate 10 and electrically connect the good light-emitting unit 11 N to the circuit substrate 10 . That is to say, the laser light source L generated by the laser generating module 2 can be projected onto the new conductive substance 112 N of the good light-emitting unit 11 N so as to solidify the new conductive substance 112 N, so that the good light-emitting unit 11 N can be fixed on the circuit substrate 10 and electrically connected to the circuit substrate 10 .

More particularly, referring to FIG. 5 and FIG. 6 , the chip pick-and-place module 3 is adjacent to the light-emitting unit 11 and disposed above the light-emitting unit 11 . For example, the bad light-emitting unit 11 B can be removed from the circuit substrate 10 by the chip pick-and-place module 3 so as to form a vacancy G 10 (as shown in FIG. 5 ), and a good light-emitting unit 11 N can be placed inside the vacancy G 10 by the chip pick-and-place module 3 .

More particularly, referring to FIG. 7 and FIG. 8 , the device Z for repairing semiconductor chips further includes a position detecting module 4 adjacent to the circuit substrate 10 and disposed under the circuit substrate 10 for detecting a position of a contact interface between the circuit substrate 10 and a conductive substance 112 of the bad light-emitting unit 11 B, or for detecting a position of a new conductive substance 112 N of the good light-emitting unit 11 N.

Therefore, by matching the features of “projecting a laser light source L generated by a laser generating module 2 onto the bad light-emitting unit 11 B so as to decrease the bonding strength between the bad light-emitting unit 11 B and the circuit substrate 10 ”, “removing the bad light-emitting unit 11 B from the circuit substrate 10 by a chip pick-and-place module 3 so as to form a vacancy G 10 ”, “placing a good light-emitting unit 11 N inside the vacancy G 10 by the chip pick-and-place module 3 ” and “electrically connecting the good light-emitting unit 11 N to the circuit substrate 10 ”, the bad light-emitting unit 11 B can be replaced by the good light-emitting unit 11 N so as to repair the LED module 1 .

Therefore, by matching the features of “the laser generating module 2 adjacent to the circuit substrate 10 and disposed under the circuit substrate 10 for generating a laser light source L” and “the chip pick-and-place module 3 adjacent to the light-emitting unit 11 and disposed above the light-emitting unit 11 ”, the laser light source L generated by the laser generating module 2 can be projected onto the bad light-emitting unit 11 B so as to decrease the bonding strength between the bad light-emitting unit 11 B and the circuit substrate 10 , and the bad light-emitting unit 11 B can be removed from the circuit substrate 10 by the chip pick-and-place module 3 so as to form a vacancy G 10 . Whereby, a good light-emitting unit 11 N can be placed inside the vacancy G 10 by the chip pick-and-place module 3 , so that the bad light-emitting unit 11 B can be replaced by the good light-emitting unit 11 N so as to repair the LED module 1 .

The aforementioned descriptions merely represent the preferred embodiments of the present disclosure, without any intention to limit the scope of the present disclosure which is fully described only within the following claims. Various equivalent changes, alterations or modifications based on the claims of the present disclosure are all, consequently, viewed as being embraced by the scope of the present disclosure.