Electronic component

This application claims the benefit of priority to Japanese Patent Application No. 2014-250206 filed on Dec. 10, 2014 and is a Continuation Application of PCT Application No. PCT/JP2015/072479 filed on Aug. 7, 2015. The entire contents of each application are hereby incorporated herein by reference.

1. Field of the Invention

The present invention relates to electronic components, and particularly relates to an electronic component including a plurality of LC parallel resonators.

2. Description of the Related Art

The laminated band pass filter disclosed in International Publication No. WO 2007/119356 (particularly FIGS. 46 and 47) is known as an example of a past invention regarding an electronic component. This laminated band pass filter includes four LC parallel resonators. The LC parallel resonators are arranged in a row in a left-right direction and are magnetically coupled to each other. The laminated band pass filter functions as a band pass filter.

According to a variation of the laminated band pass filter, a capacitor is added, the capacitor being connected between the two LC parallel resonators provided on both ends. This makes it possible to adjust the frequency of attenuation poles.

Incidentally, it has been difficult to achieve desired bandpass characteristics with the laminated band pass filter disclosed in International Publication No. WO 2007/119356. To be more specific, adding a capacitor to the laminated band pass filter changes the frequencies of all of the attenuation poles. It is thus difficult to achieve desired bandpass characteristics with the laminated band pass filter.

Accordingly, preferred embodiments of the present invention provide electronic components that achieve desired bandpass characteristics.

An electronic component according to a preferred embodiment of the present invention includes a multilayer body including a plurality of insulation layers laminated in a lamination direction; two or more first LC parallel resonators arranged in an orthogonal direction orthogonal or substantially orthogonal to the lamination direction, each first LC parallel resonator including a first inductor and a first capacitor; two second LC parallel resonators disposed so as to enclose the two or more first LC parallel resonators from both sides in the orthogonal direction, each second LC parallel resonator including a second inductor and a second capacitor; a second capacitor connected to one end of the two second LC parallel resonators; and a first connecting conductor that connects two of the first LC parallel resonators that are not adjacent in the orthogonal direction, or connects one of the first LC parallel resonators and one of the second LC parallel resonators that are not adjacent in the orthogonal direction. Resonators of the two or more first LC parallel resonators and the two second LC parallel resonators adjacent in the orthogonal direction magnetically couple with each other to define a band pass filter.

According to various preferred embodiments of the present invention, desired bandpass characteristics are achieved easily.

The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.

FIG. 1 is an equivalent circuit diagram illustrating an electronic component 10 a according to a first preferred embodiment of the present invention.

FIG. 2 is an external perspective view of electronic components 10 a to 10 e.

FIG. 3A is an exploded perspective view of the electronic component 10 a.

FIG. 3B is a see-through view of the electronic component 10 a from above.

FIG. 4 is a graph illustrating bandpass characteristics (S 21 ) of a first model.

FIG. 5 is a graph illustrating bandpass characteristics (S 21 ) of a second model.

FIG. 6 is a graph illustrating bandpass characteristics (S 21 ) of a third model.

FIG. 7 is an equivalent circuit diagram illustrating the electronic component 10 b according to a second preferred embodiment of the present invention.

FIG. 8 is an exploded perspective view of the electronic component 10 b.

FIG. 9 is an exploded perspective view of the electronic component 10 c.

FIG. 10 is an equivalent circuit diagram illustrating the electronic component 10 d.

FIG. 11 is an equivalent circuit diagram illustrating the electronic component 10 e.

First Preferred Embodiment

An electronic component according to a first preferred embodiment of the present invention will be described hereinafter with reference to the drawings. FIG. 1 is an equivalent circuit diagram illustrating an electronic component 10 a according to the first preferred embodiment.

First, an equivalent circuit of the electronic component 10 a will be described with reference to the drawings. As illustrated in FIG. 1 , the electronic component 10 a includes, as an equivalent circuit configuration, inductors L 1 to L 4 , L 11 , and L 12 , capacitors C 1 to C 4 and C 11 , and outer electrodes 14 a to 14 c , and is a band pass filter that allows high-frequency signals in a predetermined band to pass.

The outer electrodes 14 a and 14 b are input/output terminals that input/output a high-frequency signal. The outer electrode 14 c is a ground terminal that is grounded.

The inductor L 1 (an example of a second inductor) and the capacitor C 1 (an example of a second capacitor) are connected to each other in parallel, and define an LC parallel resonator LC 1 (an example of a second LC parallel resonator). A resonant frequency of the LC parallel resonator LC 1 is f1. The inductor L 2 (an example of a first inductor) and the capacitor C 2 (an example of a first capacitor) are connected to each other in parallel, and define an LC parallel resonator LC 2 (an example of a first LC parallel resonator). A resonant frequency of the LC parallel resonator LC 2 is f2. The inductor L 3 (an example of a first inductor) and the capacitor C 3 (an example of a first capacitor) are connected to each other in parallel, and define an LC parallel resonator LC 3 (an example of a first LC parallel resonator). A resonant frequency of the LC parallel resonator LC 3 is f3. The inductor L 4 (an example of a second inductor) and the capacitor C 4 (an example of a second capacitor) are connected to each other in parallel, and define an LC parallel resonator LC 4 (an example of a second LC parallel resonator). A resonant frequency of the LC parallel resonator LC 4 is f4.

One end of the LC parallel resonator LC 1 is connected to the outer electrode 14 a . One end of the LC parallel resonator LC 4 is connected to the outer electrode 14 b . Furthermore, the LC parallel resonators LC 1 to LC 4 are arranged in that order between the outer electrode 14 a and the outer electrode 14 b . With the LC parallel resonators LC 1 to LC 4 , adjacent resonators magnetically couple with each other, and thus, the LC parallel resonators LC 1 to LC 4 define a band pass filter. Other ends of the LC parallel resonators LC 1 to LC 4 are connected to the outer electrode 14 c.

The capacitor C 11 is connected between the outer electrode 14 a and the outer electrode 14 b , and thus is connected between one end of the LC parallel resonator LC 1 and one end of the LC parallel resonator LC 4 .

The inductor L 11 connects the inductor L 1 (the LC parallel resonator LC 1 ) and the inductor L 3 (the LC parallel resonator LC 3 ), which are not adjacent to each other. The inductor L 12 connects the inductor L 2 (the LC parallel resonator LC 2 ) and the inductor L 4 (the LC parallel resonator LC 4 ), which are not adjacent to each other.

The electronic component 10 a defines a band pass filter that allows high-frequency signals at frequencies near f1 to f4 to pass from the outer electrode 14 a to the outer electrode 14 b . To be more specific, impedance values of the LC parallel resonators LC 1 to LC 4 are at a maximum when high-frequency signals near f1 to f4 are inputted from the outer electrode 14 a . As such, high-frequency signals at frequencies near f1 to f4 cannot pass through the LC parallel resonators LC 1 to LC 4 and are thus not outputted from the outer electrode 14 c . As a result, high-frequency signals at frequencies near f1 to f4 are outputted from the outer electrode 14 b . Meanwhile, high-frequency signals not at frequencies near f1 to f4 pass through the LC parallel resonators LC 1 to LC 4 and are outputted from the outer electrode 14 c.

Next, the specific configuration of the electronic component 10 a will be described with reference to the drawings. FIG. 2 is an external perspective view of the electronic component 10 a . FIG. 3A is an exploded perspective view of the electronic component 10 a . FIG. 3B is a see-through view of the electronic component 10 a from above. FIG. 3B illustrates only a multilayer body 12 , inductor conductor layers 18 a to 18 d , and via hole conductors v 1 to v 8 . In the following, a lamination direction of the electronic component 10 a is defined as a top-bottom direction (the bottom side is an example of one side in the lamination direction, and the top side is an example of another side in the lamination direction). Additionally, when the electronic component 10 a is viewed in plan view from above, the direction in which a longer side of the electronic component 10 a extends is defined as the left-right direction (an example of an orthogonal direction; the right side is an example of one side in the orthogonal direction, and the left side is an example of another side in the orthogonal direction), whereas the direction in which a shorter side of the electronic component 10 a extends is defined as a front-rear direction. The top-bottom direction, the front-rear direction, and the left-right direction are orthogonal or substantially orthogonal to one another.

The electronic component 10 a includes: the multilayer body 12 ; the outer electrodes 14 a to 14 c ; the inductor conductor layers 18 a to 18 d ; capacitor conductor layers 20 a to 20 d and 22 ; a ground conductor layer 21 ; connecting conductor layers 30 a and 30 b ; and via hole conductors v 1 to v 8 , v 11 , v 12 , and v 21 to v 26 (an example of interlayer connecting conductors).

The multilayer body 12 preferably has a substantially rectangular-parallelepiped shape, and preferably is formed by laminating insulation layers 16 a to 16 i so that the insulation layers are arranged in that order from top to bottom. When viewed in plan view from above, the insulation layers 16 a to 16 i preferably have substantially rectangular shapes, and preferably are formed from a ceramic material, etc., for example. Hereinafter, a main surface on the top side of the insulation layers 16 a to 16 i will be called a front surface, and a main surface on the bottom side of the insulation layers 16 a to 16 i will be called a rear surface.

The inductor conductor layers 18 a to 18 d are band-shaped conductor layers provided on the front surface of the insulation layer 16 b , and extend in the front-rear direction of the insulation layer 16 b.

The via hole conductor v 1 (an example of a third interlayer connecting conductor) penetrates the insulation layers 16 b to 16 g in the top-bottom direction. A top end of the via hole conductor v 1 is connected to a front end of the inductor conductor layer 18 a . Thus, the via hole conductor v 1 extends downward from the inductor conductor layer 18 a.

The via hole conductor v 2 (an example of a fourth interlayer connecting conductor) penetrates the insulation layers 16 b to 16 f in the top-bottom direction. A top end of the via hole conductor v 2 is connected to a rear end of the inductor conductor layer 18 a.

The inductor conductor layer 18 a (an example of a second inductor conductor layer) and the via hole conductors v 1 and v 2 are included in the inductor L 1 . As a result, when viewed in plan view from the left, the inductor L 1 has an angled U shape that is open downward.

The capacitor conductor layers 20 a and 20 d (an example of a second capacitor conductor layer) are band-shaped conductor layers provided on the front surface of the insulation layer 16 h . The capacitor conductor layers 20 a and 20 d extend in the front-rear direction near the left and right shorter sides of the insulation layer 16 h.

The ground conductor layer 21 (an example of a first ground conductor layer and a second ground conductor layer) is a substantially rectangular conductor layer provided on the front surface of the insulation layer 16 g . The ground conductor layer 21 covers substantially the entire surface of the insulation layer 16 g . Accordingly, the capacitor conductor layer 20 a opposes the ground conductor layer 21 with the insulation layer 16 g located therebetween. However, a right-front corner and a left-front corner are cut out from the ground conductor layer 21 to allow the via hole conductors v 1 and v 7 to pass.

The capacitor conductor layer 20 a and the ground conductor layer 21 are included in the capacitor C 1 . Additionally, a bottom end of the via hole conductor v 1 is connected to the capacitor conductor layer 20 a . A bottom end of the via hole conductor v 2 is connected to the ground conductor layer 21 . The inductor L 1 and the capacitor C 1 thus define the LC parallel resonator LC 1 by being connected to each other in parallel.

The via hole conductors v 3 and v 5 (an example of a second interlayer connecting conductor) penetrate the insulation layers 16 b to 16 i in the top-bottom direction. A top end of the via hole conductor v 3 is connected to a front end of the inductor conductor layer 18 b . A top end of the via hole conductor v 5 is connected to a front end of the inductor conductor layer 18 c.

The via hole conductors v 4 and v 6 (an example of a first interlayer connecting conductor) penetrate the insulation layers 16 b to 16 e in the top-bottom direction. A top end of the via hole conductor v 4 is connected to a rear end of the inductor conductor layer 18 b . A top end of the via hole conductor v 6 is connected to a rear end of the inductor conductor layer 18 c.

The inductor conductor layer 18 b (an example of a first inductor conductor layer) and the via hole conductors v 3 and v 4 are included in the inductor L 2 . As a result, when viewed in plan view from the left, the inductor L 2 has an angled U shape that is open downward. Likewise, the inductor conductor layer 18 c (an example of the first inductor conductor layer) and the via hole conductors v 5 and v 6 are included in the inductor L 3 . As a result, when viewed in plan view from the left, the inductor L 3 has an angled U shape that is open downward.

The capacitor conductor layers 20 b and 20 c (an example of a first capacitor conductor layer) are substantially rectangular conductor layers provided on the front surface of the insulation layer 16 f . The capacitor conductor layers 20 b and 20 c are provided adjacent to the vicinity of the center of a rear-side longer side of the insulation layer 16 f , and oppose the ground conductor layer 21 with the insulation layer 16 f located therebetween.

The capacitor conductor layer 20 b and the ground conductor layer 21 are included in the capacitor C 2 . Additionally, a bottom end of the via hole conductor v 3 is connected to the ground conductor layer 21 . A bottom end of the via hole conductor v 4 is connected to the capacitor conductor layer 20 b . The inductor L 2 and the capacitor C 2 thus define the LC parallel resonator LC 2 by being connected to each other in parallel. The LC parallel resonator LC 2 is located to the right of the LC parallel resonator LC 1 . The capacitor conductor layer 20 and the ground conductor layer 21 are included in the capacitor C 3 . Additionally, a bottom end of the via hole conductor v 5 is connected to the ground conductor layer 21 . A bottom end of the via hole conductor v 6 is connected to the capacitor conductor layer 20 c . The inductor L 3 and the capacitor C 3 thus define the LC parallel resonator LC 3 by being connected to each other in parallel. The LC parallel resonator LC 3 is located to the left of the LC parallel resonator LC 4 .

The via hole conductor v 7 (an example of the third interlayer connecting conductor) penetrates the insulation layers 16 b to 16 g in the top-bottom direction. A top end of the via hole conductor v 7 is connected to a front end of the inductor conductor layer 18 d.

The via hole conductor v 8 (an example of the fourth interlayer connecting conductor) penetrates the insulation layers 16 b to 16 f in the top-bottom direction. A top end of the via hole conductor v 8 is connected to a rear end of the inductor conductor layer 18 d . Thus, the via hole conductor v 8 extends downward from the inductor conductor layer 18 d.

The inductor conductor layer 18 d (an example of the second inductor conductor layer) and the via hole conductors v 7 and v 8 are included in the inductor L 4 . As a result, when viewed in plan view from the left, the inductor L 4 has an angled U shape that is open downward.

The capacitor conductor layer 20 d and the ground conductor layer 21 are included in the capacitor C 4 . Additionally, a bottom end of the via hole conductor v 7 is connected to the capacitor conductor layer 20 d . A bottom end of the via hole conductor v 8 is connected to the ground conductor layer 21 . The inductor L 4 and the capacitor C 4 thus define the LC parallel resonator LC 4 by being connected to each other in parallel.

As illustrated in FIG. 3B , the LC parallel resonators LC 1 to LC 4 define loop surfaces S 1 to S 4 surrounded by the inductors L 1 to L 4 and the capacitors C 1 to C 4 , the loop surfaces S 1 to S 4 being parallel or substantially parallel with respect to the top-bottom direction. Each loop surface is a plane crossing through the left-right direction of the respective inductor conductor layers.

The via hole conductors v 21 to v 26 penetrate the insulation layers 16 g to 16 i in the top-bottom direction. Top ends of the via hole conductors v 21 to v 26 are connected to the ground conductor layer 21 . Bottom ends of the via hole conductors v 21 to v 26 are connected to the outer electrode 14 c . The LC parallel resonators LC 1 to LC 4 are connected to the outer electrode 14 c as a result.

The LC parallel resonators LC 1 to LC 4 are arranged in that order from the left side to the right side.

Accordingly, adjacent ones of the loop surfaces S 1 to S 4 of the LC parallel resonators LC 1 to LC 4 , with respect to the left-right direction, oppose each other. Specifically, the loop surface S 1 (an example of a second loop surface) and the loop surface S 2 (an example of a first loop surface) oppose each other. The loop surface S 2 and the loop surface S 3 (an example of the first loop surface) oppose each other. The loop surface S 3 and the loop surface S 4 (an example of a fourth loop surface) oppose each other. Accordingly, with the LC parallel resonators LC 1 to LC 4 , resonators adjacent in the left-right direction magnetically couple with each other, and thus, the LC parallel resonators LC 1 to LC 4 define a band pass filter.

The capacitor conductor layer 22 is a band-shaped conductor layer provided on the front surface of the insulation layer 16 e . The capacitor conductor layer 22 extends in the left-right direction near the front-side longer side of the insulation layer 16 e . Thus, when viewed in plan view from above, the capacitor conductor layer 22 overlaps with front ends of the capacitor conductor layers 20 a and 20 d . Thus, the capacitor conductor layer 22 is interposed between the capacitor conductor layer 20 a and the capacitor conductor layer 20 d to define the capacitor C 11 . Note that the capacitor conductor layer 22 does not overlap with the inductor conductor layers 18 a to 18 d , the ground conductor layer 21 , and so on when viewed in plan view.

The connecting conductor layer 30 a (an example of a first connecting conductor) is a line-shaped conductor layer provided on the front surface of the insulation layer 16 c . The connecting conductor layer 30 a connects two inductors (LC parallel resonators) that are not adjacent in the left-right direction, namely the inductor L 1 (the LC parallel resonator LC 1 ) and the inductor L 3 (the LC parallel resonator LC 3 ). In other words, the connecting conductor layer 30 a connects the inductor L 1 (the LC parallel resonator LC 1 ) that, of the inductors L 1 and L 4 (the LC parallel resonators LC 1 and LC 4 ), is located on the left side, and the inductor L 3 (the LC parallel resonator LC 3 ) that, of the inductors L 2 and L 3 (the LC parallel resonators LC 2 and LC 3 ), is located on the right side. A front end of the connecting conductor layer 30 a is connected to the via hole conductor v 5 . A rear end of the connecting conductor layer 30 a is connected to the via hole conductor v 2 . The connecting conductor layer 30 a is included in the inductor L 11 .

The connecting conductor layer 30 b (an example of a second connecting conductor) is a line-shaped conductor layer provided on the front surface of the insulation layer 16 d . The connecting conductor layer 30 b connects two inductors (LC parallel resonators) that are not adjacent in the left-right direction, namely the inductor L 2 (the LC parallel resonator LC 2 ) and the inductor L 4 (the LC parallel resonator LC 4 ). In other words, the connecting conductor layer 30 b connects the inductor L 4 (the LC parallel resonator LC 4 ) that, of the inductors L 1 and L 4 (the LC parallel resonators LC 1 and LC 4 ), is located on the right side, and the inductor L 2 (the LC parallel resonator LC 2 ) that, of the inductors L 2 and L 3 (the LC parallel resonators LC 2 and LC 3 ), is located on the left side. A front end of the connecting conductor layer 30 b is connected to the via hole conductor v 3 . A rear end of the connecting conductor layer 30 b is connected to the via hole conductor v 8 . The connecting conductor layer 30 b is included in the inductor L 12 .

When viewed in plan view from above, the connecting conductor layer 30 a and the connecting conductor layer 30 b intersect. As a result, the connecting conductor layer 30 a and the connecting conductor layer 30 b magnetically couple.

According to the electronic component 10 a of the present preferred embodiment, desired bandpass characteristics are achieved easily. This will be described below with reference to the drawings. FIG. 4 is a graph illustrating bandpass characteristics (S 21 ) of a first model. FIG. 5 is a graph illustrating bandpass characteristics (S 21 ) of a second model. FIG. 6 is a graph illustrating bandpass characteristics (S 21 ) of a third model. In FIGS. 4 to 6 , the vertical axis represents |S 21 |, and the horizontal axis represents a frequency. “S 21 ” represents the value of a ratio of the strength of a high-frequency signal outputted from the outer electrode 14 b relative to the strength of a high-frequency signal inputted from the outer electrode 14 a.

The inventors created the first to third models described below and calculated the bandpass characteristics of the models through computer simulations. The first model is a model in which the connecting conductor layers 30 a and 30 b are omitted from the electronic component 10 a , and a line width of the capacitor conductor layer 22 is increased or the capacitor conductor layer 22 is positioned on a lower side in the electronic component 10 a . The second model is a model in which the connecting conductor layers 30 a and 30 b are omitted from the electronic component 10 a . The third model is a model of the electronic component 10 a . The line width of the capacitor conductor layer 22 in the second model and the line width of the capacitor conductor layer 22 in the third model are the same. The first model and the second model correspond to models according to comparative examples.

The bandpass characteristics of the first model are the characteristics indicated in FIG. 4 . In the bandpass characteristics of the first model, attenuation poles P 1 and P 2 are provided at frequencies lower than a pass band, and attenuation poles P 3 and P 4 are provided at frequencies higher than the pass band. In this first model, there is a desire to increase the attenuation at the attenuation poles P 1 to P 4 to obtain bandpass characteristics that rise and fall sharply on both ends of the pass band.

Accordingly, making the line width of the capacitor conductor layer 22 in the second model narrower than the line width of the capacitor conductor layer 22 in the first model, or positioning the capacitor conductor layer 22 on a lower side, can be considered. Doing so reduces a capacitance value of the capacitor C 11 . As a result, as illustrated in FIG. 5 , the attenuation at the attenuation pole P 3 increases, and the bandpass characteristics fall sharply on the high-frequency side of the pass band.

However, when the capacitance value of the capacitor C 11 drops, the attenuation pole P 1 and the attenuation pole P 2 become closer, as illustrated in FIG. 5 . As a result, the attenuation poles P 1 and P 2 disappear, resulting in a softer waveform. Thus, the bandpass characteristics no longer rise sharply on the low-frequency side of the pass band.

Accordingly, in the third model, the connecting conductor layers 30 a and 30 b are provided. Thus, the LC parallel resonator LC 1 and the LC parallel resonator LC 3 magnetically couple, and the LC parallel resonator LC 2 and the LC parallel resonator LC 4 magnetically couple. As a result, the attenuation pole P 1 and the attenuation pole P 2 are distanced from each other, which causes the attenuation poles P 1 and P 2 to appear, without the positional relationship between the attenuation pole P 3 and the attenuation pole P 4 changing. Furthermore, the attenuation at the attenuation pole P 1 in the third model is greater than the attenuation at the attenuation poles P 1 and P 2 in the first model. In other words, in the third model, bandpass characteristics that rise and fall sharply on both ends of the pass band are obtained.

As described thus far, by adjusting the capacitance value of the capacitor C 11 and also providing the connecting conductor layers 30 a and 30 b , the attenuations and frequencies of the attenuation poles P 1 to P 4 provided at both ends of the pass band are able to be adjusted. Thus, according to the electronic component 10 a , the desired bandpass characteristics are achieved easily.

Additionally, according to the electronic component 10 a , the connecting conductor layers 30 a and 30 b overlap with each other when viewed in plan view from above. This makes it easy for the connecting conductor layers 30 a and 30 b to magnetically couple and electrically couple. Thus, by adjusting the surface area over which the connecting conductor layer 30 a and the connecting conductor layer 30 b overlap, the magnetic coupling and the electrical coupling are able to be adjusted. The bandpass characteristics of the electronic component 10 a are able to be adjusted as a result.

Second Preferred Embodiment

An electronic component according to a second preferred embodiment of the present invention will be described hereinafter with reference to the drawings. FIG. 7 is an equivalent circuit diagram illustrating an electronic component 10 b according to the second preferred embodiment. FIG. 8 is an exploded perspective view of the electronic component 10 b.

As illustrated in FIGS. 7 and 8 , the electronic component 10 b differs from the electronic component 10 a in that the inductor L 12 (the connecting conductor layer 30 b ) is not provided. Thus, in this manner, it is also possible to provide only one of the inductor L 11 (the connecting conductor layer 30 a ) and the inductor L 12 (the connecting conductor layer 30 b ).

The electronic component 10 b provides the same effects as those of the electronic component 10 a.

Third Preferred Embodiment

An electronic component according to a third preferred embodiment of the present invention will be described hereinafter with reference to the drawings. FIG. 9 is an exploded perspective view of an electronic component 10 c.

As illustrated in FIG. 9 , the electronic component 10 c differs from the electronic component 10 a in that the connecting conductor layer 30 a and the connecting conductor layer 30 b do not intersect when viewed in plan view from above, and in terms of the direction of the LC parallel resonator LC 3 . Thus, in this manner, the connecting conductor layers 30 a and 30 b are able to be provided so as not to intersect in the case where the connecting conductor layer 30 a and the connecting conductor layer 30 b are not to strongly magnetically couple and electrically couple.

The electronic component 10 c provides the same effects as those of the electronic component 10 a.

Fourth Preferred Embodiment

An electronic component according to a fourth preferred embodiment of the present invention will be described hereinafter with reference to the drawings. FIG. 10 is an equivalent circuit diagram illustrating an electronic component 10 d.

As illustrated in FIG. 10 , the electronic component 10 d differs from the electronic component 10 a in that a capacitor C 12 is provided instead of the inductor L 12 .

The electronic component 10 d provides the same effects as those of the electronic component 10 a.

Fifth Preferred Embodiment

An electronic component according to a fifth preferred embodiment of the present invention will be described hereinafter with reference to the drawings. FIG. 11 is an equivalent circuit diagram illustrating an electronic component 10 e.

As illustrated in FIG. 11 , the electronic component 10 e differs from the electronic component 10 a in that LC parallel resonators LC 1 to LC 5 are provided. Thus, in this manner, the electronic component 10 e may include five LC parallel resonators.

Additionally, in the electronic component 10 e , an inductor L 13 connects the two LC parallel resonators, that is, the LC parallel resonator LC 2 and the LC parallel resonator LC 4 that are not adjacent in the left-right direction.

The electronic component 10 e provides the same effects as those of the electronic component 10 a.

Note that in the electronic component 10 e , it is sufficient that the inductor L 13 connects any two LC parallel resonators that are not adjacent in the left-right direction, for example. Accordingly, the inductor L 13 may connect the LC parallel resonator LC 1 and the LC parallel resonator LC 3 , or may connect the LC parallel resonator LC 1 and the LC parallel resonator LC 4 . Alternatively, the inductor L 13 may connect the LC parallel resonator LC 2 and the LC parallel resonator LC 5 , or may connect the LC parallel resonator LC 3 and the LC parallel resonator LC 5 .

Accordingly, it is sufficient that the inductor L 13 connects any two of the LC parallel resonators LC 2 to LC 4 that are not adjacent to each other in the left-right direction, or connects any two of the LC parallel resonators LC 1 to LC 5 that are not adjacent in the left-right direction, namely one of the LC parallel resonators LC 1 and LC 5 and one of the LC parallel resonators LC 2 to LC 4 . However, the inductor L 13 must not connect the LC parallel resonator LC 1 and the LC parallel resonator LC 5 that are located on both ends.

Other Preferred Embodiments

The electronic components according to preferred embodiments of the present invention are not limited to the above-described electronic components 10 a to 10 e , and can be modified without departing from the essential spirit thereof.

The configurations of the electronic components 10 a to 10 e may be combined as desired.

Note also that the loop surfaces S 1 to S 4 need not be parallel to each other.

As described above, preferred embodiments of the present invention are useful in electronic components, and are particularly advantageous in that desired bandpass characteristics are achieved easily.

While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.