Device for dissipating heat from at least one electronic component

This current application claims the priority of German Patent Application DE 10 2015 200 548.8, filed on Jan. 15, 2015, which is incorporated by reference herein in its entirety.

The present invention relates to an assembly for cooling at least one electronic component disposed on a printed circuit board in accordance with the type defined in greater detail in the preamble of claim 1 .

By way of example, a device for cooling an electronic device and an associated production method are known from DE 10 2013 204 029 A1. The cooling device is intended for a control device, which is disposed in a housing and comprises an electronic circuit disposed on a printed circuit board, having an element that produces a lossy line, wherein a contact pressure for establishing mechanical and thermal contact with the printed circuit board is provided on the housing. The contact pressure is disposed adjacent to the element producing a lossy line.

Tensions arise due to the different heights and tolerances of the electrical components in the circuitry, and because of bends in the printed circuit board, or carrier plate, respectively, which lead to the cooling surfaces of the components or printed circuit board not lying, or lying with different pressures, against the cooling device. As a result of the high working temperatures, the poorly cooled elements reduce the lifetime of the electronic components.

The FIGURE shows a schematic view of a possible embodiment variation of an assembly for cooling at least one electronic component 2 , 2 A disposed on a printed circuit board 1 via a cooling element 3 .

The present embodiments addresses the object of proposing an assembly of the type described above, with which a sufficient cooling, or heat discharge, of the electronic components is enabled and furthermore, a tension-free mounting of the printed circuit board is implemented.

This object is achieved in accordance with the present embodiments by the features of claim 1 , wherein in advantageous designs can be derived from the dependent Claims, the description and the drawings.

Thus, an assembly for heat discharge, or cooling, of at least one of the electronic components disposed on a printed circuit board or suchlike via at least one cooling element is proposed, wherein the printed circuit board is held between elastic elements to compensate for tolerances in a housing or suchlike, wherein at least one cooling surface region protruding from the cooling element faces the undersurface of the printed circuit board that is to be cooled in the region of the component disposed on the upper surface.

In this manner, the printed circuit board having the electric components is preferably clamped between two elastic elements, specifically on the upper surface and the lower surface. There are raised regions on the cooling element, in the form of cooling surfaces, which are disposed directly beneath the surfaces of the printed circuit board that are to be cooled. Preferably, an elastic thermally conductive film, or thermally conductive pad, or suchlike, is provided as an elastic component between the protruding cooling surface region and the undersurface of the printed circuit board. The rises, or raised cooling regions are designed such that the thermally conductive film is not damaged by pressure.

On the opposite side, or in the region of the upper surface, of the printed circuit board, a rubber element, as an additional elastic element, or an element with similar properties, is pressed directly onto the electronic components using a stable housing frame element. Alternatively, the elastic element can also be pressed onto the printed circuit board directly adjacent to the electronic component. It is also conceivable that the elastic element is pressed onto both the components as well as the upper surface of the printed circuit board.

With the proposed assembly, a secure, uniform pressure can be achieved in the region of the surfaces on the thermally conductive film, or on the cooling element, respectively, that are to be cooled, despite different structural heights or tolerances with electronic components that lie closely packed together. As a result, there is no tension to the printed circuit board as a result of tolerances at the screw connections or the rigid elements.

The assembly according to the present embodiments can be used, for example, in the power electronics of a vehicle transmission. By way of example, electronic components in a housing form the power electronics can be cooled there when the assembly is provided.

The present embodiments shall be explained in greater detail below based on the single FIGURE.

The FIGURE shows a schematic view of a possible embodiment variation of an assembly for cooling at least one electronic component 2 , 2 A disposed on a printed circuit board 1 via a cooling element 3 .

In accordance with the present embodiments, it is provided that the printed circuit board 1 is held between two elastic elements in a housing, in order to compensate for tolerances, wherein at least one cooling surface region 4 , 4 A protruding from the cooling element 3 faces the undersurface of the printed circuit board 1 that is to be cooled in the region of the component 2 , 2 A disposed on the upper surface.

To improve the heat transfer, an elastic element and an elastic thermally conductive film 5 are provided, in each case, between the protruding cooling surface regions 4 , 4 A and the undersurface of the printed circuit board 1 . The elastic thermally conductive film 5 serves as a connection in the region of the undersurface of the printed circuit board between the surfaces that are specifically configured for cooling on the printed circuit board 1 and the rises 4 , 4 A formed on the cooling element 3 , or the cooling plate, which serve to ensure the optimal connection between the printed circuit board 1 and the cooling element 3 directly on the surfaces that are to be cooled. Preferably, the elastic thermally conductive film 5 is made from an electrically insulating material. In this manner, the elastic thermally conductive film 5 also serves as an elastic element on the cooling side, as well as to establish an electric insulation between the printed circuit board 1 and the cooling element 3 , or the housing, respectively. As a result, a significantly smaller structural shape can be obtained, and the configuration of the printed circuit board 1 is substantially more flexible.

As an elastic element, a rubber element 6 , or suchlike having corresponding elastic properties, is provided on the upper surface of the printed circuit board 1 , which is pressed against the upper surface of the printed circuit board 1 and/or against the components 3 disposed on the printed circuit board 1 , via a housing frame element

Because of the embedding on both sides with the assembly according to the present embodiments, there is absolutely no tension or torsion applied to the printed circuit board 1 . Furthermore, a uniform pressure is applied to the surfaces that are to be cooled, and thus a uniform cooling of the components is likewise obtained.

As can be seen in the FIGURE, the protruding cooling surface regions 4 , 4 A on the at least one cooling element 3 forming the housing undersurface are formed as rises protruding into the interior opening. With the depicted design variation, two cooling surface regions 4 , 4 A are provided, by way of example, as rises. The cooling element 3 forms a housing element having a basically trough-shaped design, which is closed at the top by the stable housing frame element 7 .

1 printed circuit board

2 , 2 A electronic component

3 cooling element

4 , 4 A cooling surface region

5 elastic thermally conductive film, or pad

6 rubber element

7 housing frame element