Semiconductor device

This application is a division of U.S. patent application Ser. No. 14/329,413, filed on Jul. 11, 2014, which is a division of U.S. patent application Ser. No. 13/357,381, filed on Jan. 24, 2012, which is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2011-014503, filed on Jan. 26, 2011; the entire contents of each of which are incorporated herein by reference.

Embodiments described herein relate generally to a semiconductor device.

For downsizing of power supply circuits such as a switching power supply, it is effective to increase the switching frequency and reduce the size of passive devices such as inductance and capacitance in power supply circuits. However, the increase in the switching frequency leads to increasing switching loss of switching devices such as a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), or the like, and decreasing power supply efficiency of the switching power supply. Accordingly, for downsizing of power supply circuits such as a switching power supply, it is essential to reduce switching loss while increasing the speed of the switching device.

In MOS gate devices such as a MOSFET, an IGBT, or the like used as a switching device, gate capacitance is reduced by shortening the gate length, thereby the speed being able to be increased. However, reducing the gate capacitance to increase the speed causes resonance between the parasitic inductance included in the wiring and the switching device capacitance. Accordingly, high-frequency noise is generated from the MOS gate device at the time of switching.

As an example for solving the above problem, there is a structure having a p − -type layer provided under a gate electrode of a MOS gate device. Such a structure increases the gate-drain capacitance when a high voltage is applied, whereby temporal variation of the drain voltage (dV/dt) is reduced. Accordingly, switching noise is reduced. However, the manufacturing process of forming a p − -type layer under the gate electrode is complicated. Therefore, a lower limit is caused for cost reduction of MOS gate devices.

FIG. 1 is a cross-section of a semiconductor device 1 according to an embodiment;

FIG. 2A is a cross-sectional view of the major part of a semiconductor device according to a reference example, and FIG. 2B is an equivalent circuit diagram of the semiconductor device according to the reference example;

FIG. 3A is a cross-sectional view of the major part of a semiconductor device according to the embodiment, and FIG. 3B is an equivalent circuit diagram of the semiconductor device according to the embodiment;

FIG. 4 is a plan view of the major part of a semiconductor device according to the first specific example;

FIG. 5A is a cross-sectional view taken along X-X′ of FIG. 4 , FIG. 5B is a cross-sectional view taken along Y-Y′ FIG. 4 , and FIG. 5C is a cross-sectional view taken along Z-Z′ of FIG. 4 ;

FIG. 6 is a plan view of the major part of a semiconductor device according to the first variation of the first specific example;

FIG. 7A is a cross-sectional view taken along X-X′ of FIG. 6 , and FIG. 7B is a cross-sectional view taken along Y-Y′ of FIG. 6 ;

FIG. 8 is a plan view of the major part of a semiconductor device according to the second variation of the first specific example;

FIG. 9A is a cross-sectional view taken along X-X′ of FIG. 8 , and FIG. 9B is a cross-sectional view taken along Y-Y′ of FIG. 8 ;

FIG. 10 is a plan view of the major part of a semiconductor device according to the third variation of the first specific example;

FIG. 11A is a cross-sectional view taken along X-X′ of FIG. 10 and FIG. 11B is a cross-sectional view taken along Y-Y′ of FIG. 10 ;

FIG. 12 is a cross-sectional view of the major part of a semiconductor device according to the fourth variation of the first specific example;

FIG. 13 is a plan view of the major part of a semiconductor device according to the second specific example;

FIG. 14A is a cross-sectional view taken along X-X′ of FIG. 13 , FIG. 14B is a cross-sectional view taken along Y-Y′ of FIG. 13 , and FIG. 14C is a cross-sectional view taken along Z-Z′ of FIG. 13 ;

FIGS. 15A-15C are cross-sectional views of the major part of a semiconductor device according to the first variation of the second specific example. FIG. 15A corresponds to the cross-section taken along X-X′ of FIG. 13 , FIG. 15B corresponds to the cross-section taken along Y-Y′ of FIG. 13 , and FIG. 15C corresponds to the cross-sectional view taken along Z-Z′ of FIG. 13 ;

FIG. 16 is a plan view of the major part of a semiconductor device according to the second variation of the second specific example

FIG. 17A and FIG. 17B are a plan view of the major part of a semiconductor device according to the third variation of the second specific example;

FIG. 18 is a cross-sectional view of the major part of a semiconductor device according to the third specific example;

FIG. 19 is a cross-sectional view of the major part of a semiconductor device according to the first variation of the third specific example; and

FIG. 20 is a cross-sectional view of the major part of a semiconductor device according to the second variation of the third specific example.

A first semiconductor device of an embodiment includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of the first conductivity type, a third semiconductor layer of a second conductivity type, a fourth semiconductor layer of a first conductivity type, a first control electrode, an extraction electrode, a second control electrode, a third control electrode, a first main electrode, and a second main electrode. The second semiconductor layer is provided on the first semiconductor layer. The third semiconductor layer is selectively provided on a surface of the second semiconductor layer. The fourth semiconductor layer is selectively provided on a surface of the third semiconductor layer. The first control electrode faces the second semiconductor layer, the third semiconductor layer, and the fourth semiconductor layer, via a first insulating film. The extraction electrode is electrically connected to the first control electrode and provided on the second semiconductor layer of a second region which is different from a first region having the first control electrode provided therein. The second control electrode and the third control electrode are electrically connected to the extraction electrode, and face the second semiconductor layer under the extraction electrode, via the second insulating film. The first main electrode is connected to the first semiconductor layer. The second main electrode is connected to the third semiconductor layer and the fourth semiconductor layer. The third semiconductor layer is not provided on the surface of the second semiconductor layer under the extraction electrode, but at least a part of the second control electrode and the whole of the third control electrode are provided under the extraction electrode. The electrical resistance of the second control electrode is higher than the electrical resistance of the third control electrode.

Embodiments of the invention will now be described with reference to the drawings. In the specification and the drawings of the application, components similar to those described in regard to a drawing thereinabove are marked with like reference numerals, and a detailed description is omitted as appropriate.

Outline of Embodiments

FIG. 1 is an explanatory drawing of the outline of a semiconductor device according to an embodiment. FIG. 1 shows a cross-section of a semiconductor device 1 according to the embodiment. In the semiconductor device 1 , cell units including a device region 90 and a gate pad region 91 shown in FIG. 1 are arranged periodically. The device region 90 may be denoted as a first region and the gate pad region 91 may be denoted as a second region.

The semiconductor device 1 is provided with a MOSFET having a top-and-bottom electrode structure. In the semiconductor device 1 , an n-type drift layer 11 serving as the second semiconductor layer is provided on an n + -type drain layer 10 serving as the first semiconductor layer.

In a device region 90 corresponding to device central part of the semiconductor device 1 , a p-type base layer 12 serving as the third semiconductor layer is selectively provided on the surface of the n-type drift layer 11 . An n + -type source layer 13 serving as the fourth semiconductor layer is selectively provided on the surface of the p-type base layer 12 . Around the outermost circumference of the device region 90 , a p − -type layer 12 a is provided on the surface of the n-type drift layer 11 . The first gate insulating film 30 serving as the first insulating film is provided on the n-type drift layer 11 , the p-type base layer 12 , the n + -type source layer 13 , and the p − -type layer 12 a.

Additionally, in a direction approximately parallel to the major surface of the n + -type drain layer 10 , a first gate electrode 31 serving as the first control electrode is provided, ranging from a part of the n + -type source layer 13 , via the p-type base layer 12 adjacent to the part, to a part of the n-type drift layer 11 . The first gate insulating film 30 is provided between the first gate electrode 31 , and the n + -type source layer 13 , the p-type base layer 12 and the n-type drift layer 11 . That is, the first gate electrode 31 faces the n-type drift layer 11 , the p-type base layer 12 , and the n + -type source layer 13 , via the first gate insulating film 30 .

The n + -type drain layer 10 has a drain electrode 60 serving as the first main electrode connected thereto. The n + -type source layer 13 and the p-type base layer 12 have a contact layer 61 connected thereto. The p − -type layer 12 a has a contact layer 62 connected thereto. The contact layers 61 and 62 have a source electrode 63 serving as the second main electrode connected thereto. That is, the source electrode 63 is electrically connected to the n + -type source layer 13 and the p-type base layer 12 , via the contact layers 61 and 62 . The first gate insulating film 30 is provided between the source electrode 63 and the contact layers 61 , 62 , and the first gate electrode 31 .

Additionally, in a gate pad region 91 , the second gate insulating film 40 serving as the second insulating film is provided on the n-type drift layer 11 and the p − -type layer 12 a . Furthermore, a gate electrode 41 including the second control electrode and the third control electrode is provided in a direction approximately parallel to the major surface of the n + -type drain layer 10 . As will be described below, at least a part of the second control electrode and the whole of the third control electrode are provided under a gate pad electrode 43 . The gate electrode 41 is provided between the gate pad electrode 43 and the n-type drift layer 11 , via the second gate insulating film 40 . The gate electrode 41 is provided under the gate pad electrode 43 . The gate electrode 41 faces the drain electrode 60 via the second gate insulating film 40 .

The gate electrode 41 has a contact layer 42 connected thereto. The contact layer 42 has the gate pad electrode 43 connected thereto. The second gate insulating film 40 is provided between the gate pad electrode 43 , and the gate electrode 41 and the contact layer 42 .

The gate pad electrode 43 is provided on the n-type drift layer 11 outside the device region 90 having the first gate electrode 31 provided therein. The gate pad electrode 43 is provided on the n-type drift layer 11 in a region different from the region having the first gate electrode 31 provided therein. The gate pad electrode 43 is, for example, an extraction electrode for extracting the first gate electrode 31 to the outside of the semiconductor device 1 . The p-type base layer 12 is not provided under the gate pad electrode 43 . That is, the gate electrode 41 is in contact with the n-type drift layer 11 via the second gate insulating film 40 .

In the semiconductor device 1 , the gate pad electrode 43 is electrically connected to the first gate electrode 31 . The gate electrode 41 is electrically connected to the gate pad electrode 43 .

By such a structure, capacitance between the gate and the drain of the semiconductor device 1 increases, thereby switching noise being suppressed.

The respective main components of the n + -type drain layer 10 , the n-type drift layer 11 , the p-type base layer 12 , the n + -type source layer 13 , and the p − -type layer 12 a are based on silicon (Si), for example.

The main component of the first gate insulating film 30 is silicon oxide (SiO 2 ), for example. The main component of the second gate insulating film 40 is silicon oxide (SiO 2 ), silicon nitride (Si 3 N 4 ), or the like, for example.

The main component of the first gate electrode 31 and the gate electrode 41 is polysilicon, for example.

The main component of the drain electrode 60 , the source electrode 63 , the contact layers 42 , 61 and 62 is a conductive material such as copper (Cu), tungsten (W), aluminum (Al), polysilicon having impurities doped therein, or the like, for example.

Subsequently, an effect of the semiconductor device 1 will be explained.

Before explaining the effect of the semiconductor device 1 , a semiconductor device 100 according to a reference example will be explained.

FIG. 2 is an explanatory drawing of a semiconductor device according to the reference example, in which FIG. 2A is a cross-sectional view of the major part of the semiconductor device according to the reference example, and FIG. 2B is an equivalent circuit diagram of the semiconductor device according to the reference example.

The semiconductor device 100 according to the reference example is not provided with the gate electrode 41 described above. On the semiconductor device 100 , the gate pad electrode 43 is arranged on the gate pad region 91 . The gate pad electrode 43 is electrically connected to the first gate electrode 31 . An insulating film 400 is provided between the gate pad electrode 43 and the n-type drift layer 11 . Furthermore, a p − -type layer 110 is provided under the gate pad electrode 43 . The structure of the semiconductor device 100 other than the device described above is the same as the structure of the semiconductor device 1 .

FIG. 2B shows the connection relation of a source electrode 63 (S), a drain electrode 60 (D), a first gate electrode 31 (G), and a gate pad electrode 43 (G.P.) of the semiconductor device 100 . The gate pad electrode 43 has an external gate resistance Rg connected thereto. The external gate resistance Rg is, for example, a resistance for adjusting the charge/discharge time between the gate and the drain. For example, the higher the external gate resistance Rg is set, the longer the charge/discharge time between the gate and the drain can be made.

In response to downsizing of semiconductor devices, the gate length tends to be much shorter. Accordingly, the facing area between the gate electrode and the drain electrode becomes smaller, thereby the gate-drain capacitance (Cgd) being reduced. Along with downsizing of semiconductor devices, switching speed has thus become faster.

However, if the gate-drain capacitance (Cgd) becomes too small in comparison with the drain-source capacitance (Cds), switching time is determined by the charge/discharge time between the drain and the source, thereby the gate controllability at the time of switching being degraded. Accordingly, switching noise from the semiconductor device 100 becomes easily generated. For example, it becomes impossible to control the temporal variation (dVds/dt) of the drain-source voltage (Vds: Voltage between the drain and the source) with internal gate resistance.

In addition, if the gate-drain capacitance (Cgd) becomes significantly small and switching becomes very fast, there may be case where resonance is generated between the parasitic inductance included in the wiring outside the device and the switching device capacitance such as between the gate and the source, between the gate and the drain, between the drain and the source, or the like. As a result, high-frequency noise may be generated from the semiconductor device 100 at the time of switching.

An approach of setting the charge/discharge time between the gate and the drain longer by the adjustment of the external gate resistance Rg, and of suppressing high-frequency noise can also be considered. However, simply adjusting the external gate resistance Rg has a limit in gate controllability if the gate-drain capacitance (Cgd) becomes too small.

FIG. 3 is an explanatory drawing of an effect of the semiconductor device according to the embodiment, in which FIG. 3A is a cross-sectional view of the major part of the semiconductor device according to the embodiment, and FIG. 3B is an equivalent circuit diagram of the semiconductor device according to the embodiment.

In the semiconductor device 1 , the gate electrode 41 is provided under the gate pad electrode 43 , besides the first gate electrode 31 . The second gate insulating film 40 is provided between the gate electrode 41 and the drain electrode 60 . Alternatively, a depletion layer is formed on the semiconductor layer between the gate electrode 41 and the drain electrode 60 . Therefore, in the semiconductor device 1 , a capacitance between the gate and the drain (Cgd′), besides the gate-drain capacitance (Cgd), is generated between the gate pad electrode 43 and the drain electrode 60 .

Additionally, in the semiconductor device 1 , a high internal gate resistance is generated by electrically connecting the gate electrode 41 having a plane pattern and the gate pad electrode 43 having a plane pattern. For example, the gate pad electrode 43 and the gate electrode 41 are not brought into contact in the entire region in which they face each other. The gate pad electrode 43 and the gate electrode 41 are electrically connected via the thin contact layer 42 .

The gate electrode 41 includes the second control electrode and the third control electrode. At least a part of the second control electrode and the whole of the third control electrode are provided under the gate pad electrode 43 . The electrical resistance of the second control electrode may be set higher than the electrical resistance of the third control electrode. For example, the line width of the second control electrode is made smaller than the width of the third control electrode. Accordingly, a high internal gate resistance rg is generated in the gate electrode 41 .

In this way, in the semiconductor device 1 , an internal gate resistance rg corresponding to the addition of the gate electrode 41 and the gate-drain capacitance (Cgd′) connected to the internal gate resistance rg are added between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd). Because of this, the time constant between the gate and the drain of the semiconductor device 1 becomes larger than in the case of the semiconductor device 100 . As a result, switching noise of the semiconductor device 1 is suppressed in comparison with the case of the semiconductor device 100 .

In addition, according to the semiconductor device 1 , capacitance between the gate and the drain increases without increasing the period of the first gate electrode 31 . Therefore, in the semiconductor device 1 , the channel density per unit area in the device region 90 does not decrease and the ON-resistance per unit area does not increase. Furthermore, the gate electrode 41 is disposed under the gate pad electrode 43 . Therefore, the device area of the semiconductor device 1 does not increase.

With regard to the gate-drain capacitance (Cgd′) under the gate pad electrode 43 , the Cgd′ can be adjusted as appropriate by changing the contact area between the gate electrode 41 and the second gate insulating film 40 . Therefore, design flexibility of the gate-drain capacitance in the semiconductor device 1 increases in comparison with the case of semiconductor device 100 .

Additionally, in the semiconductor device 1 , the manufacturing process of forming a p − -type layer under the gate electrode described above is not required. The patterning of the gate electrode 41 can be performed in the same manufacturing process as the patterning of first gate electrode 31 . For example, the first gate electrode 31 and the gate electrode 41 can be manufactured in the same manufacturing process by using a mask having both the pattern shape of the first gate electrode 31 and the pattern shape of the gate electrode 41 . Because of this, the manufacturing process of the semiconductor device 1 is simplified, thereby reducing the manufacturing cost.

In addition, the sheet resistance of the gate electrode 41 of the gate pad region 91 may be set higher than the sheet resistance of the first gate electrode 31 of the device region 90 (Ω/square). Because of this, it is also possible to further increase the internal gate resistance rg. For example, when the material of the first gate electrode 31 and the gate electrode 41 is polysilicon, their sheet resistances can be made different by changing their impurity concentrations.

In this way, the semiconductor device 1 has a high reliability and can be realized with a low cost.

Subsequently, a specific example of the planar shape of the gate electrode 41 will be explained.

First Specific Example

FIG. 4 is a plan view of the major part of the semiconductor device according to a first specific example.

FIG. 5 is a cross-sectional view of the major part of the semiconductor device according to the first specific example, in which FIG. 5A is a cross-sectional view taken along X-X′ of FIG. 4 , FIG. 5B is a cross-sectional view taken along Y-Y′ FIG. 4 , and FIG. 5C is a a cross-sectional view taken along Z-Z′ of FIG. 4 .

In the semiconductor device 1 A according to the first specific example, the gate electrode 41 includes a second gate electrode 41 B serving as the second control electrode and a third gate electrode 41 A serving as the third control electrode. At least a part of the second gate electrode 41 B and the whole of the third gate electrode 41 A are provided under the gate pad electrode 43 . When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the planar shape of the third gate electrode 41 A is rectangular. The shape of the second gate electrode 41 B is linear. That is, the second gate electrode 41 B is thinner than the third gate electrode 41 A. For example, in a direction along which the first gate electrodes 31 are arranged periodically, the width of the second gate electrode 41 B is smaller than the width of the third gate electrode part 41 A. Because of this, the electrical resistance of the second gate electrode 41 B becomes higher than the electrical resistance of the third gate electrode 41 A.

In the semiconductor device 1 A, the gate pad electrode 43 is connected to a joint 31 a of the first gate electrode 31 , via the contact layer 42 A. The joint 31 a is a part of the first gate electrode 31 . The first gate electrode 31 has the second gate electrode 41 B connected thereto.

In this way, in the semiconductor device 1 A, the gate electrode 41 is provided under the gate pad electrode 43 , besides the first gate electrode 31 . The second gate insulating film 40 is provided between the gate electrode 41 and the drain electrode 60 . Therefore, in the semiconductor device 1 A, the gate-drain capacitance (Cgd′) is generated between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd).

The gate pad electrode 43 and the gate electrode 41 do not contact each other in the entire region in which they face each other, but are electrically connected via the contact layer 42 A provided in a part of the gate pad region 91 . In addition, the gate electrode 41 includes the thin second gate electrode part 41 B. Because of this, a high internal gate resistance rg is generated in the gate electrode 41 .

Therefore, the time constant between the gate and the drain of the semiconductor device 1 A becomes larger than in the case of the semiconductor device 100 . As a result, switching noise of the semiconductor device 1 A is suppressed in comparison with the case of the semiconductor device 100 .

The position of the contact layer does not have to be limited to a corner of the gate pad region 91 . A specific example will be shown next.

First Variation of First Specific Example

FIG. 6 is a plan view of the major part of the semiconductor device according to the first variation of the first specific example.

FIG. 7 is a cross-sectional view of the major part of the semiconductor device according to the first variation of the first specific example, in which FIG. 7A is a cross-sectional view taken along X-X′ of FIG. 6 , and FIG. 7B is a cross-sectional view taken along Y-Y′ of FIG. 6 .

In the semiconductor device 1 B according to the first variation of the first specific example, the gate electrode 41 includes a third gate electrode 41 C and a second the gate electrode 41 D. When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the planar shape of the third gate electrode 41 C is rectangular. However, the linear and thin second gate electrode 41 D enters from an edge of the third gate electrode 41 C toward the central part thereof. The third gate electrode 41 C is shaped such that a part of the third gate electrode 41 C is divided by the second gate electrode 41 D.

In the semiconductor device 1 B, a part of the gate electrode 41 is narrowed. For example, in a direction along which the first gate electrodes 31 are arranged periodically, the width of the second gate electrode 41 D is smaller than the width of the third gate electrode 41 C. The width of the third gate electrode 41 C may be either the width of the third gate electrode 41 C which has been divided, or the width of the third gate electrode 41 C which has not been divided. Because of this, the electrical resistance of the second gate electrode 41 D becomes higher than the electrical resistance of the third gate electrode 41 C.

In the semiconductor device 1 B, the gate pad electrode 43 is connected to a joint 31 b of the first gate electrode 31 , via the contact layer 42 B. The contact layer 42 B is positioned near the center of the two corners of the gate pad region 91 . The joint 31 b is a part of the first gate electrode 31 . In addition, the gate pad electrode 43 is connected to the second gate electrode 41 D, via the contact layer 42 B. The second gate electrode 41 D is connected to the third gate electrode 41 C.

In the semiconductor device 1 B, the gate electrode 41 is provided under the gate pad electrode 43 , besides the first gate electrode 31 . The second gate insulating film 40 is provided between the gate electrode 41 and the drain electrode 60 . The p-type base layer 12 is not provided on the surface of the n-type drift layer 11 of the gate pad region 91 , but the p-type base layer 12 is selectively provided on the surface of the n-type drift layer 11 of the device region 90 .

Therefore, in the semiconductor device 1 B, the gate-drain capacitance (Cgd′) is generated between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd).

The gate pad electrode 43 and the gate electrode 41 do not contact each other in the entire region in which they face each other, but are electrically connected via the contact layer 42 B provided in a part of the gate pad region 91 . In addition, the gate electrode 41 includes the thin second gate electrode 41 D. Because of this, a high internal gate resistance rg is generated n the gate electrode 41 .

Therefore, the time constant between the gate and the drain of the semiconductor device 1 B becomes larger than in the case of the semiconductor device 100 . As a result, switching noise of the semiconductor device 1 B is suppressed in comparison with the case of the semiconductor device 100 .

Second Variation of First Specific Example

FIG. 8 is a plan view of the major part of the semiconductor device according to the second variation of the first specific example.

FIG. 9 is a cross-sectional view of the major part of the semiconductor device according to the second variation of the first specific example, in which FIG. 9A is a cross-sectional view taken along X-X′ of FIG. 8 , and FIG. 9B is a cross-sectional view taken along Y-Y′ of FIG. 8 .

In the semiconductor device 1 C according to the second variation of the first specific example, the gate electrode 41 includes the third gate electrode 41 E, the second gate electrode 41 F, the third gate electrode 41 G, and the second gate electrode 41 H. When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the planar shape of the third gate electrodes 41 E and 41 G is rectangular.

However, the linear and thin second gate electrode 41 F enteres from an edge of the third gate electrode 41 E toward the central part thereof. The third gate electrode 41 E has a shape such that a part of the third gate electrode 41 E is divided by the second gate electrode 41 F. Furthermore, the linear and thin second gate electrode 41 H enteres from an edge of the third gate electrode 41 G toward the central part thereof. The third gate electrode 41 G has a shape such that a part of the third gate electrode 41 G is divided by the second gate electrode 41 H.

In the semiconductor device 1 C, a part of the gate electrode 41 is narrowed. For example, in a direction along which the first gate electrodes 31 are arranged periodically, the width of the second gate electrodes 41 F and 41 H is smaller than the width of the third gate electrodes 41 E and 41 G. The width of the third gate electrodes 41 E and 41 G is the width of the third gate electrodes 41 E and 41 G which have been divided. Because of this, the electrical resistance of the second gate electrodes 41 F and 41 H becomes higher than the electrical resistance of the third gate electrodes 41 E and 41 G.

In the semiconductor device 1 C, the gate pad electrode 43 is connected to the second gate electrode 41 F and the second gate electrode 41 H, via the contact layer 42 C. The contact layer 42 C is positioned near the center of the gate pad region 91 . The second gate electrode 41 F is connected to the third gate electrode 41 E. The second gate electrode 41 H is connected to the third gate electrode 41 G. The third gate electrode 41 E is connected to the joint 31 b which is a part of the first gate electrode 31 . Such a structure also exerts the same effect as in the case of the semiconductor device 1 B.

Third Variation of First Specific Example

FIG. 10 is a plan view of the major part of the semiconductor device according to the third variation of the first specific example.

FIG. 11 is a cross-sectional view of the major part of the semiconductor device according to the third variation of the first specific example, in which FIG. 11A is a cross-sectional view taken along X-X′ of FIG. 10 and FIG. 11B is a cross-sectional view taken along Y-Y′ of FIG. 10 .

In the semiconductor device 1 D according to the third variation of the first specific example, the gate electrode 41 includes the third gate electrode 41 I and the second gate electrode 41 J. When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the planar shape of the third gate electrode 41 I is rectangular. However, the linear and thin second gate electrode 41 J has entered from an edge of the third gate electrode 41 I toward the central part. The third gate electrode 41 I is shaped such that a part of the third gate electrode 41 I is divided by the second gate electrode 41 J.

In the semiconductor device 1 D, a part of the gate electrode 41 is narrowed. For example, in a direction along which the first gate electrodes 31 are arranged periodically, the width of the second gate electrode 41 J is smaller than the width of the third gate electrode 41 I. The width of the third gate electrode 41 I may be either the width of the third gate electrode 41 I which has been divided, or the width of the third gate electrode 41 I which has not been divided. Because of this, the electrical resistance of the second gate electrode 41 J becomes higher than the electrical resistance of the third gate electrode 41 I.

In the semiconductor device 1 D, the gate pad electrode 43 is connected to the joint 31 a which is a part of the first gate electrode 31 , via the contact layer 42 A. In addition, the gate pad electrode 43 is connected to the second gate electrode 41 J, via the contact layer 42 B. The second gate electrode 41 J is connected to the third gate electrode 41 I.

In this way, the semiconductor device 1 D is provided with a first part (contact layer 42 A) connecting the gate pad electrode 43 which is an extraction electrode and the first gate electrode 31 , and a second part (contact layer 42 B) connecting the gate pad electrode 43 which is an extraction electrode and the gate electrode 41 .

Also in such a structure, the gate-drain capacitance (Cgd′) is generated between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd).

The gate pad electrode 43 and the gate electrode 41 do not contact each other in the entire region in which they face each other, but are electrically connected via the contact layer 42 B provided in a part of the gate pad region 91 . In addition, the gate electrode 41 includes the thin second gate electrode 41 J. Accordingly, a high internal gate resistance rg is generated in the gate electrode 41 .

Therefore, the time constant between the gate and the drain of the semiconductor device 1 D becomes larger than in the case of the semiconductor device 100 . As a result, switching noise of the semiconductor device 1 D is suppressed in comparison with the case of the semiconductor device 100 .

Fourth Variation of First Specific Example

FIG. 12 is a cross-sectional view of the major part of the semiconductor device according to the fourth variation of the first specific example.

In the semiconductor device 1 E according to the fourth variation of the first specific example, the thickness of the second gate insulating film 40 A under the gate electrode 41 is larger than the thickness of the first gate insulating film 30 under the first gate electrode 31 .

According to such a structure, avalanche breakdown under the gate pad electrode 43 becomes difficult to be generated when applying a high voltage between the drain and the source. That is, the decrease in breakdown voltage and the decrease in avalanche resistance are suppressed in the semiconductor device 1 E.

Second Specific Example

FIG. 13 is a plan view of the major part of the semiconductor device according to the second specific example.

FIG. 14 is a cross-sectional view of the major part of the semiconductor device according to the second specific example, in which FIG. 14A is a cross-sectional view taken along X-X′ of FIG. 13 , FIG. 14B is a cross-sectional view taken along Y-Y′ of FIG. 13 , and FIG. 14C is a cross-sectional view taken along Z-Z′ of FIG. 13 .

In the semiconductor device 1 F according to the second specific example, the gate electrode 41 includes the third gate electrode 41 K and the second gate electrode 41 L. When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the gate electrode 41 is comb-shaped. That is, the pattern formed by the third gate electrode 41 K and the second gate electrode 41 L is comb-shaped. A plurality of linear third gate electrodes 41 K are connected to the linear and thin second gate electrode 41 L. The second gate electrode 41 L and the third gate electrodes 41 K are approximately perpendicular to each other. The third gate electrodes 41 K are arranged periodically in a direction along which the second gate electrode 41 L extends.

In the semiconductor device 1 F, a part of the gate electrode 41 is narrowed. For example, the width of the second gate electrode 41 L in a direction approximately perpendicular to the direction along which the first gate electrodes 31 are arranged periodically is smaller than the width of the third gate electrode 41 K in a direction along which the first gate electrodes 31 are arranged periodically. Accordingly, the electrical resistance of the second gate electrode 41 L becomes higher than the electrical resistance of the third gate electrode 41 K.

In the semiconductor device 1 F, the gate pad electrode 43 is connected to the joint 31 b which is a part of the first gate electrode 31 , via the contact layer 42 B. In addition, the joint 31 b is connected to the second gate electrode 41 L.

Also in such a structure, the gate-drain capacitance (Cgd′) is generated between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd).

The gate pad electrode 43 and the gate electrode 41 are electrically connected via the contact layer 42 B provided in a part of the gate pad region 91 . In addition, the gate electrode 41 includes the thin second gate electrode 41 L. Because of this, a high internal gate resistance rg is generated in the gate electrode 41 .

In the semiconductor device 1 F, the gate electrode 41 is formed in a comb-shaped manner rather than in a planar-shaped manner, when viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 . In this way, the size of the gate-drain capacitance (Cgd′) can be adjusted as appropriate by changing the pattern of the gate electrode 41 from a planar pattern to a linear pattern.

Therefore, the time constant between the gate and the drain of the semiconductor device 1 F becomes larger than in the case of the semiconductor device 100 . As a result, switching noise of the semiconductor device 1 F is suppressed in comparison with the case of the semiconductor device 100 .

In the semiconductor device 1 F, a p-type guard ring layer 12 b is selectively provided on the surface of the n-type drift layer 11 between the adjacent third gate electrodes 41 K. The p-type guard ring layer 12 b is formed in the same manufacturing process as the p-type base layer 12 . That is, the p-type guard ring layer 12 b is formed simultaneously with the p-type base layer 12 .

Electric field concentration to the gate electrode 41 is suppressed by providing the p-type guard ring layer 12 b , and the decrease in breakdown voltage under the gate pad electrode 43 is suppressed. Because of this, the decrease in avalanche resistance is suppressed in the semiconductor device 1 F.

First Variation of Second Specific Example

FIGS. 15A-15C are cross-sectional views of the major part of the semiconductor device according to the first variation of the second specific example. FIG. 15A corresponds to the cross-section taken along X-X′ of FIG. 13 , FIG. 15B corresponds to the cross-section taken along Y-Y′ of FIG. 13 , and FIG. 15C corresponds to the cross-sectional view taken along Z-Z′ of FIG. 13 .

In the semiconductor device 1 G according to the first variation of the second specific example, a high concentration N-type layer 11 a serving as the fifth semiconductor layer is selectively provided on the surface of the n-type drift layer 11 between the adjacent p-type base layers 12 and between the adjacent p-type guard rings 12 b . The impurity concentration of the high concentration N-type layer 11 a is higher than the impurity concentration of the n-type drift layer 11 .

Due to the disposition of the high concentration N-type layer 11 a , the ON-resistance in the device region 90 is reduced. Furthermore, charging effect on the high concentration N-type layer 11 a rises, and thus the gate-drain capacitance (Cgd′) under the gate pad electrode 43 can be further increased.

Second Variation of Second Specific Example

FIG. 16 is a plan view of the major part of the semiconductor device according to the second variation of the second specific example.

In the semiconductor device 1 H according to the second variation of the second specific example, the gate electrode 41 includes a third gate electrode 41 M, a second gate electrode 41 N, a second gate electrode 41 P, a second gate electrode 41 R, and a second gate electrode 41 Q. When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the gate electrode 41 is lattice-shaped.

That is, a plurality of linear third gate electrodes 41 M are connected to the linear and thin second gate electrodes 41 Q and 41 R. The third gate electrodes 41 M are approximately perpendicular to the second gate electrodes 41 Q and 41 R. The third gate electrodes 41 M are arranged periodically in a direction along which the second gate electrodes 41 Q and 41 R extend. The second gate electrodes 41 Q and 41 R are respectively arranged approximately parallel to each other.

In the semiconductor device 1 H, a part of gate electrode part 41 is narrowed. For example, in a direction along which the first gate electrodes 31 are arranged periodically, the width of the second gate electrodes 41 N and 41 P is smaller than the width of the third gate electrodes 41 M. Because of this, the electrical resistance of the second gate electrodes 41 N and 41 P becomes higher than the electrical resistance of the third gate electrodes 41 M.

In the semiconductor device 1 H, the gate pad electrode 43 is connected to the second gate electrode 41 N and the second gate electrode 41 P, via the contact layer 42 C. The second gate electrode 41 N is connected to the second gate electrode 41 Q. The second gate electrode 41 P is connected to the second gate electrode 41 R. The second gate electrode 41 Q is connected to the joint 31 b which is a part of the first gate electrode 31 .

In the semiconductor device 1 H, the p-type guard ring layer 12 b may be selectively provided on the surface of the n-type drift layer 11 between the adjacent third gate electrodes 41 M, like in the case of the semiconductor device 1 F.

Also in such a structure, the gate-drain capacitance (Cgd′) is generated between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd). Additionally, in the gate electrode 41 , a high internal gate resistance is generated. Therefore, in the semiconductor device 1 H, the same effect as in the case of the semiconductor device 1 F is exerted.

Third Variation of Second Specific Example

FIG. 17A and FIG. 17A are a plan view of the major part of the semiconductor device according to the third variation of the second specific example.

In the semiconductor device 1 J according to the third variation of the second specific example shown in FIG. 17A , the gate electrode 41 includes a third gate electrode 41 S. When viewed from a direction perpendicular to the major surface of the n + -type drain layer 10 , the gate electrode 41 is spiral.

That is, the linear and thin third gate electrode 41 S forms a spiral so as to follow the circumference of the rectangular gate pad electrode 43 .

In the semiconductor device 1 J, the gate pad electrode 43 is connected to the joint 31 a which is a part of the first gate electrode 31 , via the contact layer 42 A. In addition, the gate pad electrode 43 is connected to the third gate electrode 41 S, via the contact layer 42 A.

Also in such a structure, the gate-drain capacitance (Cgd′) is generated between the gate pad electrode 43 and the drain electrode 60 , besides the gate-drain capacitance (Cgd). In addition, a high internal gate resistance is generated in the gate electrode 41 by forming the gate electrode 41 in a spiral manner. In the semiconductor device 1 J, the p-type guard ring layer 12 b may be selectively provided on the surface of the n-type drift layer 11 between the adjacent third gate electrodes 41 S, like in the case of the semiconductor device 1 F. Therefore, in the semiconductor device 1 J, the same effect as in the case of the semiconductor device 1 F is exerted.

In addition, as shown in FIG. 17B , the gate electrode 41 may be configured to include the third gate electrode 41 Sa and the second gate electrode 41 Sb. The line width of the second gate electrode 41 Sb is smaller than the line width of the third gate electrode 41 Sa. Because of this, the electrical resistance of the second gate electrode 41 Sb becomes higher than the electrical resistance of the third gate electrode 41 Sa. Owing to such a structure, the internal gate resistance in the gate electrode 41 further increases.

In the embodiment, a super junction structure may be provided in the semiconductor layer. A semiconductor device having a super junction structure will be explained below, referring to a schematic drawing.

Third Specific Example

FIG. 18 is a cross-sectional view of the major part of the semiconductor device according to a third specific example.

In the semiconductor device 1 K according to the third specific example, the n-type drift layer 11 is provided on the n + -type drain layer 10 in the device region 90 .

In the device region 90 , the p-type base layer 12 is selectively provided on the surface of the n-type drift layer 11 . The n + -type source layer 13 is selectively provided on the surface of the p-type base layer 12 . Around the outermost circumference of the device region 90 , the p − -type layer 12 a is provided on the surface of the n-type drift layer 11 . Inside the n-type drift layer 11 , a p-type pillar layer 12 p serving as the sixth semiconductor layer connected to the p-type base layer 12 is provided periodically in a direction approximately parallel to the major surface of the n + -type drain layer 10 .

That is, in the device region 90 , a super junction structure including the p-type pillar layer 12 p and the n-type pillar layer 11 n is formed in the n-type drift layer 11 . The n-type pillar layers 11 n and the p-type pillar layers 12 p are alternately arranged in a direction approximately parallel to the major surface of the n + -type drain layer 10 . The upper end of the p-type pillar layer 12 p is connected to the p-type base layer 12 .

In the gate pad region 91 , an n-type drift layer having a concentration lower than the n-type pillar layer 11 n in the device region 90 is provided on the n + -type drain layer 10 . The low-concentration n-type drift layer is referred to as an “n − -type layer 15 ” in the following. The p-type pillar layer 12 p is not provided in the gate pad region 91 , and the impurity concentration of the n-type drift layer in the gate pad region 91 , i.e., the n − -type layer 15 is lower than the impurity concentration of the n-type drift layer 11 in the device region 90 . It is desirable that the impurity concentration of the n − -type layer 15 is not more than 1/10 of the n-type pillar layer 11 n (or the n-type drift layer 11 ). The n − -type layer 15 is in contact with the second gate insulating film 40 . In the gate pad region 91 , the super junction structure is not formed.

According to such a structure, the impurity concentration in the n-type pillar layer 11 n can be set higher than the impurity concentration in the n-type drift layer 11 . Because of this, the ON-resistance of the semiconductor device 1 K is further reduced.

However, in a top-and-bottom electrode-structured MOSFET having the super junction structure, the drain-source capacitance (Cds) becomes large due to joining between the n-type pillar layer 11 n and the p-type pillar layer 12 p . A larger drain-source capacitance means that the gate-drain capacitance is relatively small. Accordingly, it can be considered that switching noise is generated from such a MOSFET. For example, there are concerns that the control of the temporal variation of the drain-source voltage (dVds/dt) by internal gate resistance may become impossible (Vds: drain-source voltage).

However, in the semiconductor device 1 K, the p-type base layer 12 and the super junction structure are not provided under the gate pad electrode 43 . Because of this, the drain-source capacitance (Cds) is not generated under the gate pad electrode 43 . That is, the semiconductor device 1 K also has a high gate-drain capacitance. Accordingly, in the semiconductor device 1 K, the temporal variation (dVds/dt) of the drain-source voltage (Vds) can be well controlled by the internal gate resistance. As a result, switching noise is reduced.

Furthermore, in the semiconductor device 1 K, a low concentration n − -type layer 15 is provided under the gate pad electrode 43 . Therefore, when a high voltage source is applied between the drain and the source, the n − -type layer 15 is easily depleted, thereby avalanche breakdown under the gate pad electrode 43 being suppressed. Because of this, the semiconductor device 1 K maintains the high breakdown voltage. Meanwhile, the semiconductor device 1 K maintains the high breakdown voltage even if a low concentration p − -type layer is disposed in place of the n − -type layer 15 .

First Variation of Third Specific Example

FIG. 19 is a cross-sectional view of the major part of the semiconductor device according to the first variation of the third specific example.

In the semiconductor device 1 L according to the first variation of the third specific example, a super junction structure has been formed in the gate pad region 91 , besides the device region 90 . In the gate pad region 91 , n-type pillar layers 15 n and p-type pillar layers 15 p are alternately arranged in a direction approximately parallel to the major surface of the n + -type drain layer 10 .

The impurity concentration in the n-type pillar layer 15 n and the p-type pillar layer 15 p in the gate pad region 91 is lower than the impurity concentration in of the n-type pillar layer 11 n and the p-type pillar layer 12 p in the device region 90 . Because of this, the drain-source capacitance in the gate pad region 91 does not become larger. Furthermore, it is desirable not to connect the p-type pillar layer 15 p to the p-type base layer 12 in order to suppress increase of the drain-source capacitance.

In addition, since the impurity concentration in the n-type pillar layer 15 n and the p-type pillar layer 15 p is low, super junction structure in the gate pad region 91 can be easily depleted. In this way, avalanche breakdown under the gate pad electrode 43 becomes difficult to be generated, because the super junction structure in the gate pad region 91 easily becomes depleted. As a result, the breakdown voltage of the semiconductor device 1 L increases.

Second Variation of Third Specific Example

FIG. 20 is a cross-sectional view of the major part of the semiconductor device according to the second variation of the third specific example.

In the semiconductor device 1 M according to the second variation of the third specific example, a super junction structure is formed in the gate pad region 91 , besides the device region 90 . In the gate pad region 91 , the period with which the n-type pillar layers 15 n and p-type pillar layers 15 p are alternately arranged is shorter than the period with which the n-type pillar layers 11 n and the p-type pillar layers 12 p are alternately arranged in the device region 90 .

Because of this, the super junction structure in the gate pad region 91 can be more easily depleted. Therefore, avalanche breakdown under the gate pad electrode 43 becomes difficult to be generated. As a result, the breakdown voltage of the semiconductor device 1 M increases. Meanwhile, in order to further facilitate depletion of the super junction structure in the gate pad region 91 , the impurity concentration in the n-type pillar layer 15 n and the p-type pillar layer 15 p in the gate pad region 91 may be set lower than the impurity concentration in the n-type pillar layer 11 n and the p-type pillar layer 12 p in the device region 90 .

In super junction structure, the p-type pillar layer may be the sixth semiconductor layer. In addition, since an n-type pillar layer is formed between the p-type pillar layers as a result of having formed the p-type pillar layer in the n-type drift layer, the n-type pillar may be referred to as either the n-type drift layer or the second semiconductor layer.

Hereinabove, embodiments are not limited to these specific examples, and can be modified in a variety of ways without deviating from the purport of the embodiments.

For example, although the embodiments have been explained with the first conductivity type being the n-type and the second conductivity type being the p-type, the embodiments can also be implemented with the first conductivity type being the p-type and the second conductivity type being the n-type.

In addition, although the embodiments have been explained by using a planar-type gate structure, a similar effect can be obtained by applying a similar design to under the gate pad when a trench gate-type gate structure is employed.

In addition, although the plane pattern has not been described in particular, the embodiments are not limited to plane patterns of the MOS gate structure or the super junction structure, and any pattern such as striped, meshed, staggered, honeycombed pattern, or the like, will do.

The embodiments are not limited to the opening positions and the number of the gate contact holes, and can be implemented with a single position or 2 or more positions.

In addition, a uniform p + form layer may be provided between the n + -type drain layer 10 and the n-type drift layer 11 so that the semiconductor device is used as an IGBT device. A part of the p + form layer may be selectively opened so that the semiconductor device is used as a reverse-conducting-type IGBT device.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.