Common-mode filter

This application claims priority to China Application Serial Number 201510388876.2, filed Jul. 6, 2015, which is herein incorporated by reference.

The present disclosure relates to a filter, and more particularly, to a common-mod filter and a circuit structure including the common-mode filter.

As human demands for electronic devices become more sophisticated, the feature of high transmission efficiency has become the basic requirement of a new generation of electronic devices. However, in meeting the needs of high efficient transmission, it certainly caused some unexpected circumstances. For example, if the transmission frequency of a signal is continuously increased, the electromagnetic wave is also easy to spread through mediums, resulting in the so-called electromagnetic interference (EMI). The EMI is harmful to the human body and may also cause the produced circuit layout not to pass some security certification specifications.

Under the circumstances, differential transmission-lines that are resistant to the EMI and less susceptible to ground voltage disturbance are therefore widely used. However, in order to contain complicated circuit structures in a limited circuit layout, the differential transmission-lines must have turning points or corners. The turning points or corners often make the differential transmission-lines have unequal lengths so as to generate common-mode noises.

Therefore, some methods for suppressing the common-mode noises have been proposed. For example, the common-mode chock is the most typical one. The common-mode chock is made by winding two independent coils having the same number of turns onto a magnet. The common-mode chock is structurally equivalent to a winding magnetic core, can generate a high conductivity impedance to common-mode noises, and can generate an impedance of almost zero to differential mode signals. However, common-mode chokes usually only work in the MHz range. Because of the frequency characteristics and the parasitic effect of ferromagnetic materials, the common-mode chokes are difficult to be designed at high frequencies over GHz. In addition, the complicated structures of the common-mode chokes are less suitable for miniaturization of circuit nowadays.

Accordingly, a kind of common-mode filters using patterned ground structures to eliminate common-mode noises have been proposed, which can work in the GHz range and have lower costs. However, because the sizes of the patterned ground structures must be half or quarter of the wavelength of transmission signals, the patterned ground structures will occupy a large ground area of a printed circuit board, so that the common-mode filters can not effectively reduce the production areas.

To sum up, how to provide a common-mode filter to solve the shortcomings of too large areas and high frequency operation inefficiencies in the prior arts becomes an important issue to be solved by those in the industry.

An aspect of the disclosure is to provide a common-mode filter.

According to an embodiment of the disclosure, a common-mode filter includes a first transmission line, a second transmission line, a first wiring layer, a second wiring layer, and a third wiring layer. The first wiring layer includes a first conductive capacitor plate, in which at least a part of the first transmission line is located in the first wiring layer, and the first transmission line is electrically coupled with the first conductive capacitor plate. The second wiring layer includes a second conductive plate and a first inductor, and the second conductive capacitor plate is electrically coupled with the first inductor. The third wiring layer includes a third conductive capacitor plate, in which at least a part of the second transmission line is located in the second wiring layer, and the second transmission line is electrically coupled with the third conductive capacitor plate. At least a part of the first conductive capacitor plate faces the second conductive capacitor plate, and at least a part of the second conductive capacitor plate faces the third conductive capacitor plate.

Because at least a part of the first conductive capacitor plate faces the second conductive capacitor plate and at least a part of the second conductive capacitor plate faces the third conductive capacitor plate, the first conductive capacitor plate and the second conductive capacitor plate can form a first capacitor, and the second conductive capacitor plate and the third conductive capacitor plate can form a second capacitor. Furthermore, because the first inductor is electrically coupled with the second conductive capacitor plate, a LC circuit can be formed among the first conductive capacitor plate, the second conductive capacitor plate, the third conductive capacitor plate, and the first inductor. By adjusting the values of inductance and capacitance in the foregoing LC circuit, the LC circuit can be used as a common-mode filter.

Another aspect of the disclosure is to provide a circuit structure.

According to an embodiment of the disclosure, a circuit structure includes a first transmission line, a second transmission line, a first wiring layer, a second wiring layer, a third wiring layer, and a first through hole. The first wiring layer includes a first conductive capacitor plate, in which at least a part of the first transmission line is located in the first wiring layer, and the first transmission line is electrically coupled with the first conductive capacitor plate. The second wiring layer includes a second conductive plate and a first inductor, and the second conductive capacitor plate is electrically coupled with the first inductor. The third wiring layer includes a third conductive capacitor plate. The first through hole is across the first wiring layer, the second wiring layer, and the third wiring layer, in which the second transmission line is electrically coupled with the third conductive capacitor plate via the first through hole. At least a part of the first conductive capacitor plate faces the second conductive capacitor plate, and at least a part of the second conductive capacitor plate faces the third conductive capacitor plate.

The foregoing circuit structure forms a common-mode filter in the transmission paths of the first transmission line and the second transmission line. Furthermore, for the plurality of wiring layers, it is necessary to form through holes to electrically couple different wiring layers. By forming structures such as conductive capacitor plates and inductors in different wiring layers, the circuit structure makes the first transmission line and the second transmission line across different wiring layers form a LC filter circuit. The circuit structure is simple to manufacture and can form the common-mode filter in the transmission paths of the first transmission line and the second transmission line without increasing the existing circuit layout area.

It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the disclosure as claimed.

The disclosure can be more fully understood by reading the following detailed description of the embodiment, with reference r lade to the accompanying drawings as follows:

FIG. 1 is a partial perspective view of a circuit structure according to an embodiment of the disclosure;

FIG. 2 is a perspective view of a common-mode filter n a circuit structure according to an embodiment of the disclosure;

FIG. 3 is a cross-sectional view of FIG. 1 along line 3 - 3 ;

FIG. 4 is an equivalent circuit diagram of a common-mode filter according to an embodiment of the disclosure;

FIG. 5 is an analysis diagram of differential-mode/common-mode insertion loss according to an embodiment of the disclosure;

FIG. 6 is an equivalent circuit diagram of common-mode filters according to an embodiment of the disclosure; and

FIG. 7 is an analysis diagram of insertion loss of common-mode noises of common-mode filters according to an embodiment of the disclosure.

Reference will now be made in detail to the present embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

FIG. 1 is a partial perspective view of a circuit structure according to an embodiment of the disclosure. FIG. 2 is a perspective view of a common-mode filter in a circuit structure according to an embodiment of the disclosure. FIG. 3 is a cross-sectional view of FIG. 1 along line 3 - 3 . As shown in FIG. 1 to FIG. 3 , a circuit structure 10 includes a first transmission line 101 , a second transmission line 102 , a first wiring layer W 1 , a second wiring layer W 2 , a third wiring layer W 3 , and a first through hole PTH 1 ( FIG. 3 ). In the embodiment, the first through hole PTH 1 is a micro-via, but the disclosure is not limited in this regard. In practical applications, the first through hole PTH 1 can be a plating through hole.

The first wiring layer W 1 includes a first conductive capacitor plate 104 , in which at least a part of the first transmission line 101 is located in the first wiring layer W 1 , and the first transmission line 101 is electrically coupled with the first conductive capacitor plate 104 . The second wiring layer W 2 includes a second conductive plate 108 and a first inductor L 1 , and the second conductive capacitor plate 108 is electrically coupled with the first inductor L 1 . The third wiring layer W 3 includes a third conductive capacitor plate 110 . The first through hole PTH 1 is across the first wiring layer W 1 , the second wiring layer W 2 , and the third wiring layer W 3 , in which the second transmission line 102 is electrically coupled with the third conductive capacitor plate 110 via the first through hole PTH 1 .

In the embodiment, in the stacking direction of the first wiring layer W 1 , the second wiring layer W 2 , and the third wiring layer W 3 , at least a part of the first conductive capacitor plate 104 faces the second conductive capacitor plate 108 , and at least a part of the second conductive capacitor plate 108 faces the third conductive capacitor plate 110 . As a result, the first conductive capacitor plate 104 and the second conductive capacitor plate 108 can form a first capacitor C 1 ( FIG. 3 ), and the second conductive capacitor plate 108 and the third conductive capacitor plate 110 can form a second capacitor C 2 ( FIG. 3 ). In addition, because the first inductor L 1 is electrically coupled with the second conductive capacitor plate 108 , a LC circuit can be formed among the first conductive capacitor plate 104 , the second conductive capacitor plate 108 , the third conductive capacitor plate 110 , and the first inductor L 1 . Because the LC circuit has the function of filtering, and the operation frequencies and bandwidth of the LC circuit can be determined by the values of inductance and capacitance, the circuit structure 10 of the embodiment can be used as a common-mode filter.

Furthermore, the embodiment forms conductive capacitor plates and inductor among the plurality of wiring layers, so as to form a filter in the wiring layers. In an embodiment of the disclosure, the first transmission line 101 and the second transmission line 102 can be used to transmit differential-mode signals. In order to effectively suppress common-mode noises in the differential-mode signals, a LC filter circuit can be formed in the transmission paths of the first transmission line 101 and the second transmission line 102 . In addition, by adjusting the values of inductance and capacitance in the LC filter circuit, the LC filter circuit can effectively suppress the common-mode noises in certain frequency band. That is, the first conductive capacitor plate 104 , the second conductive capacitor plate 108 , the third conductive capacitor plate 110 , and the first inductor L 1 shown in FIG. 1 to FIG. 3 can be used as a common-mode filter, which is simple to manufacture without occupying a lot of area.

In an embodiment, a first orthogonal projection P 1 of the first conductive capacitor plate 104 on the third wiring layer W 3 overlaps a second orthogonal projection P 2 of the second conductive capacitor plate 108 on the third wiring layer W 3 , and the first orthogonal projection P 1 and the second orthogonal projection P 2 also overlap the third conductive capacitor plate 110 . That is, any two adjacent ones of the first conductive capacitor plate 104 , the second conductive capacitor plate 108 , and the third conductive capacitor plate 110 face each other, but the disclosure is not limited in this regard. In some embodiments, the first conductive capacitor plate 104 is unnecessary to face the third conductive capacitor plate 110 . As long as the first conductive capacitor plate 104 and the second conductive capacitor plate 108 form the first capacitor C 1 , the second conductive capacitor plate 108 and the third conductive capacitor plate 110 form the second capacitor C 2 , and the first inductor L 1 is electrically coupled with the second conductive capacitor plate 108 , the LC circuit having the function of filtering can be formed.

In an embodiment, the circuit structure 10 further includes a first dielectric layer 112 and a second dielectric layer 114 . The first dielectric layer 112 is located between the first wiring layer W 1 and the second wiring layer W 2 , and the second dielectric layer 114 is located between the second wiring layer W 2 and the third wiring layer W 3 . Furthermore, the first dielectric layer 112 can be located between the first conductive capacitor plate 104 of the first wiring layer W 1 and the second conductive capacitor plate 108 of the second wiring layer W 2 to separate the first conductive capacitor plate 104 and the second conductive capacitor plate 108 , and the second dielectric layer 114 can be located between the second conductive capacitor plate 108 of the second wiring layer W 2 and the third conductive capacitor plate 110 of the third wiring layer W 3 to separate the second conductive capacitor plate 108 and the third conductive capacitor plate 110 , so as to make the first conductive capacitor plate 104 and the second conductive capacitor plate 108 form the first capacitor C 1 and make the second conductive capacitor plate 108 and the third conductive capacitor plate 110 form the second capacitor C 2 , but the disclosure is not limited in this regard. In some embodiments, the first capacitor C 1 and the second capacitor C 2 can be air dielectric capacitors. That is, there can be no dielectric layer between the first conductive capacitor plate 104 and the second conductive capacitor plate 108 and between the second conductive capacitor plate 108 and the third conductive capacitor plate 110 .

As shown in FIG. 1 to FIG. 3 , the circuit structure 10 further includes a second through hole PTH 2 ( FIG. 3 ). The second through hole PTH 2 is across the first wiring layer W 1 , the second wiring layer W 2 , and the third wiring layer W 3 , in which at least a part of the first transmission line 101 is located in the second through hole PTH 2 . In addition, the first conductive capacitor plate 104 , the second conductive capacitor plate 108 , and the third conductive capacitor plate 110 are located between the first through hole PTH 1 and the second through hole PTH 2 . In the embodiment, the second through hole PTH 2 is a plating through hole.

Furthermore, in the circuit structure 10 having a plurality of the wiring layers, it is necessary to form through holes to electrically couple the different wiring layers. In the embodiment of the disclosure, the first transmission line 101 and the second transmission line 102 that can transmit differential-mode signals are at least partially located in the second through hole PTH 2 and the first through hole PTH 1 , respectively. Therefore, by manufacturing the first conductive capacitor plate 104 , the second conductive capacitor plate 108 , the third conductive capacitor plate 110 between the first through hole PTH 1 and the second through hole PTH 2 , the space between the first through hole PTH 1 and the second through hole PTH 2 can be effectively used, and the common-mode filter 100 can be formed in the transmission paths of the first transmission line 101 and the second transmission line 102 without increasing the existing circuit layout area.

As shown in FIG. 3 , in an embodiment, the second wiring layer W 2 is located between the first wiring layer W 1 and the third wiring layer W 3 . That is, the second conductive capacitor plate 108 of the second wiring layer W 2 is electrically coupled with the first inductor L 1 and located between the first conductive capacitor plate 104 and the third conductive capacitor plate 110 , and the structure that the first inductor L 1 electrically coupled between the first capacitor C 1 and the second capacitor C 2 forms the LC filter circuit, but the disclosure is not limited in this regard.

Referring to FIG. 3 and FIG. 4 . FIG. 4 is an equivalent circuit diagram of the common-mode filter 100 according to an embodiment of the disclosure. As shown in the figures, the equivalent circuit of the common-mode filter 100 can be a LC circuit, in which the first inductor L 1 can be electrically coupled with a ground potential. That is, the first inductor L 1 can be electrically coupled between the second conductive capacitor plate 108 and the ground potential. As a result, when the first transmission line 101 and the second transmission line 102 transmit differential-mode signals from an input end V in , because the differential-mode signals have the same amplitude and opposite phases, the differential-mode signals will not be transmitted through the first inductor L 1 . That is, for the differential-mode signals, the first inductor L 1 does not exist. When there exist common-mode noises between the first transmission line 101 and the second transmission line 102 , because the phases of the common ode noises are the same. Hence, when the common-mode noises meet the resonant frequency of the LC circuit, the common-mode noises will oscillate in the LC circuit without being transmitted to an output end V out . Therefore, when the differential-mode signals inputted from the input end V in of the first transmission line 101 and the second transmission line 102 have common-mode noises, only the differential-mode signals can reach the output end V out , so as to achieve the purpose of suppressing the common-mode noises.

FIG. 5 is an analysis diagram of differential-mode/common-mode insertion loss according to an embodiment of the disclosure. As shown in FIG. 5 , at a frequency of about 8.35 GHz of the common-mode noise S 1 , the corresponding insertion loss is about 21 dB. In addition, the common-mode noise S 2 is not affected, which represents that when the center frequency of the transmitted signals occurs at 8.35 GHz, the common-mode filter 100 in the circuit structure 10 can effectively suppress the common-mode noises in the differential-mode signals.

Referring back to FIG. 2 and FIG. 3 . In some embodiments, the circuit structure 10 further includes a fourth wiring layer W 4 , a fifth wiring layer W 5 , and a sixth wiring layer W 6 . The fourth wiring layer W 4 includes a fourth conductive capacitor plate 116 . The fifth wiring layer W 5 includes a fifth conductive plate 118 and a second inductor L 2 ( FIG. 2 ), and the fifth conductive capacitor plate 118 is electrically coupled with the second inductor L 2 . The sixth wiring layer W 6 includes a sixth conductive capacitor plate 120 . In addition, the first through hole PTH 1 and the second through hole PTH 2 are across the first wiring layer W 1 , the second wiring layer W 2 , the third wiring layer W 3 , the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 . The first transmission line 101 can be electrically coupled with the sixth conductive capacitor plate 120 via the second through hole PTH 2 , and the second transmission line 102 can be electrically coupled with the fourth conductive capacitor plate 116 via the first through hole PTH 1 .

In the stacking direction of the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 , at least a part of the fourth conductive capacitor plate 116 faces the fifth conductive capacitor plate 118 , and at least a part of the fifth conductive capacitor plate 118 faces the sixth conductive capacitor plate 120 . As a result, the fourth conductive capacitor plate 116 and the fifth conductive capacitor plate 118 form a third capacitor C 3 ( FIG. 3 ), and the fifth conductive capacitor plate 118 and the sixth conductive capacitor plate 120 form a fourth capacitor C 4 ( FIG. 3 ). In addition, because the second inductor L 2 is electrically coupled with the fifth conductive capacitor plate 118 , another LC filter circuit can be formed among the fourth conductive capacitor plate 116 , the fifth conductive capacitor plate 118 , the sixth conductive capacitor plate 120 , and the second inductor L 2 .

In addition, the operation frequencies and bandwidth of the LC filter circuit can be determined by adjusting the values of inductance and capacitance in the LC filter circuit, so that the fourth conductive capacitor plate 116 , the fifth conductive capacitor plate 118 , the sixth conductive capacitor plate 120 , and the second inductor L 2 can work as another common-mode filter 200 in the circuit structure 10 . As a result, by forming two common-mode filters 100 , 200 in the circuit structure 10 , the common-mode noises having two different center frequencies in the circuit structure 10 can be filtered.

As shown in FIG. 3 , in an embodiment, any two adjacent ones of the first wiring layer W 1 , the second wiring layer W 2 , and the third wiring layer W 3 are separated by a first distance D 1 , any two adjacent ones of the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 are separated by the first distance D 1 , the third wiring layer W 3 and the fourth wiring layer W 4 are separated by a second distance 02 , and the second distance D 2 is greater than the first distance D 1 , so as to prevent the common-mode filter 100 and the common-mode filter 200 in the circuit structure 10 from being too close to affect each other. For example, if the third conductive capacitor plate 110 and the fourth conductive capacitor plate 116 are too close, a parasitic capacitance that can not be ignored may be generated and changes the operation frequencies of the common-mode filters 100 , 200 . In an embodiment, the first distance D 1 can be 30 micrometer, the second distance D 2 can be 800 micrometer, but the disclosure is not limited in this regard.

As shown in FIG. 2 and FIG. 3 , the fourth conductive capacitor plate 116 , the fifth conductive capacitor plate 118 , and the sixth conductive capacitor plate 120 are located between the first through hole PTH 1 and the second through hole PTH 2 . In the circuit structure 10 having a plurality of the wiring layers, it is necessary to form through holes to electrically couple the different wiring layers. Therefore, by manufacturing the fourth conductive capacitor plate 116 , the fifth conductive capacitor plate 118 , and the sixth conductive capacitor plate 120 between the first through hole PTH 1 and the second through hole PTH 2 , the common-mode filter 200 can be formed in the transmission paths of the first transmission line 101 and the second transmission line 102 without increasing the existing circuit layout area.

As shown in FIG. 3 , in an embodiment, the fifth wiring layer W 5 is electrically coupled with the second inductor L 2 and located between the fourth wiring layer W 4 and the sixth wiring layer W 6 , and the structure that the second inductor L 2 electrically coupled between the third capacitor C 3 and the fourth capacitor C 4 forms the LC filter circuit. The positional relationships among the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 is similar to the positional relationships among the first wiring layer W 1 , the second wiring layer W 2 , and the third wiring layer W 3 , so they are not repeated here to avoid duplicity.

Referring to FIG. 6 and FIG. 7 , FIG. 6 is an equivalent circuit diagram of common-mode filters 100 , 200 according to an embodiment of the disclosure. FIG. 7 is an analysis diagram of insertion loss of common-mode noises of the common-mode filters 100 , 200 according to an embodiment of the disclosure. As shown in the figures, the common-mode filters 100 , 200 in parallel connection can filter common-mode noises having two different center frequencies in the circuit structure 10 . It can be seen from FIG. 7 that when the circuit structure 10 only has the common-mode filter 100 or the common-mode filter 200 , the common-mode noises S 3 , S 4 can obtain larger insertion losses (larger than 15 dB) respectively at the frequencies of 8.35 GHz and 6.75 GHz. When the circuit structure 10 has the common-mode filter 100 and the common-mode filter 200 at the same time, the insertion losses of the common-mode noise S 5 respectively at the frequencies of 8.35 GHz and 6.75 GHz are slightly decreased (between 8 dB and 13 dB). However, when the circuit structure 10 has no common-mode filter, the insertion losses of the common-mode noise S 6 respectively at the frequencies of 8.35 GHz and 6.75 GHz are smaller than 1 dB. Accordingly, by forming the common-mode filters 100 , 200 in the circuit structure 10 , the common-mode noises having two different center frequencies in the circuit structure 10 can be effectively filtered.

Referring back to FIG. 1 to FIG. 3 . In an embodiment, the circuit structure 10 further includes a first conductive solder ball 121 and a second conductive solder ball 122 . The first conductive solder ball 121 and the second conductive solder ball 122 are located at a side of the sixth wiring layer W 6 facing away from the fifth wiring layer W 5 , and the first conductive solder ball 121 and the second conductive solder ball 122 are electrically coupled with the first transmission line 101 and the second transmission line 102 , respectively.

In an embodiment, the circuit structure 10 can be a multi-layer printed circuit board. The first conductive solder ball 121 and the second conductive solder ball 122 can be external connection points of the circuit structure 10 . The first transmission line 101 and the second transmission line 102 can be electrically coupled with a chip (not shown) of the circuit structure 10 .

In an embodiment, the first wiring layer W 1 , the second wiring layer W 2 , the third wiring layer W 3 , the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 can include various conductive lines. It should be noted that in the embodiments shown in FIG. 1 to FIG. 3 , except the related conductive lines of the common-mode filters 100 , 200 , other conductive lines of the first wiring layer W 1 , the second wiring layer W 2 , the third wiring layer W 3 , the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 are not illustrated in FIG. 1 to FIG. 3 .

In an embodiment, the circuit structure 10 can further include a power-wiring layer W 7 (shown in FIG. 1 ), and the power-wiring layer W 7 can be electrically coupled with an external power circuit. In addition, should be noted that in some embodiments, a dielectric layer can be included between any two adjacent ones of the first wiring layer W 1 , the second wiring layer W 2 , the third wiring layer W 3 , the fourth wiring layer W 4 , the fifth wiring layer W 5 , the sixth wiring layer W 6 , and the power-.wiring layer W 7 , so as to prevent the conductive lines in the different wiring layers from forming short circuits.

In an embodiment, the first transmission line 101 and the second transmission line 102 can be, for example, planar micro strip lines having elongated shapes, but the disclosure is not limited in this regard. The first wiring layer W 1 , the second wiring layer W 2 , the third wiring layer W 3 , the fourth wiring layer W 4 , the fifth wiring layer W 5 , and the sixth wiring layer W 6 can be, for example, rectangular electrode plates, but the disclosure is not limited in this regard. The first inductor L 1 and the second inductor L 2 can be planar inductor devices, such as planar spiral inductors or planar meander inductors. For example, in the embodiments shown in FIG. 1 and FIG. 2 , each of the first inductor L 1 and the second inductor L 2 can be a planar spiral inductor which includes at least one coil portion across ( FIG. 2 ), and the coil portion 107 can be electrically coupled between the second conductive plate 108 and a ground potential. Specifically, the coil portion 107 can be helically wound into an internal point 107 b (FIG. 2 ) from an end 107 a ( FIG. 2 ), in which the end 107 a can be electrically coupled with the second conductive plate 108 , and the internal point 107 b can be electrically coupled with the ground potential.

To sum up, the circuit structure of the disclosure can form a common-mode filter in the transmission paths of differential transmission lines, so as to suppress the common-mode noises in differential-mode signals. Furthermore, the circuit structure can have a plurality of wiring layers. The differential transmission lines must be connected in different wiring layers via through holes. The circuit structure of the present disclosure can form structures of capacitor and inductor between two through holes, so as to form a LC filter circuit. Accordingly, the circuit structure of the disclosure can form a common-mode filter in the transmission paths of the transmission lines without increasing the existing circuit layout area, and the circuit structure is simple to manufacture without occupying a lot of area.

Although the present disclosure has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present disclosure without departing from the scope or spirit of the disclosure. In view of the foregoing, it is intended that the present disclosure cover modifications and variations of this disclosure provided they fail within the scope of the following claims.