Low profile LED lamp bulb

The present invention relates to an LED lamp, especially related to a low profile LED lamp.

FIGS. 1A ˜ 1 B show a prior art.

FIG. 1A shows a prior art lead frame

FIG. 1A shows that U.S. Pat. No. 8,791,484 disclosed an LED lamp which has a lead frame including a top metal 22 , 22 P, a metal lead 21 , a branch lead 23 paralleled with the metal lead 21 . A metal connection 27 connecting the metal lead 21 and the branch lead 23 . An LED chip 26 straddles the gap G between the top metal pad 22 P and the metal lead 21 .

Since the metal lead 21 is in a shape of a longitudinal elongated rectangle and the metal connection 27 is configured near the bottom of the metal lead 21 . The bottom part of the metal lead 21 is not suitable for bending inwards to make a low profile LED lamp. Bending the bottom metal plate 21 inwards shall cause circuit short and damage the LED lamp.

FIG. 1B shows an LED lamp using the traditional lead frame of FIG. 1A

FIG. 1B shows a traditional LED lamp using the lead frame of FIG. 1A . Due to the long length in longitudinal direction of the metal lead 21 , an exclusive heat sink 914 in cylinder shape is needed for the lower portion of the metal lead 21 to attach. A lamp base 66 is configured on bottom of the heat sink 914 . Based on the metal lead 21 to be used in the prior art LED lamp, the height of the LED lamp is significantly greater than a traditional one. However, for some applications, a low profile LED lamp is required while with high heat dissipation.

The prior art long metal lead 21 can not meet the height requirement for producing a low profile LED lamp in some applications. Further, an exclusive heat sink 914 has to be configured for the lower portion of the metal lead 21 to attach. The prior art LED lamp is bulky and heavy. The disadvantage for the prior art LED lamp includes height problem and weight problem. A low profile LED lamp without having an exclusive heat sink while with high heat dissipation is eagerly required.

FIGS. 1A ˜ 1 B show a prior art.

FIGS. 2A ˜ 2 B show a lead frame according to the present invention.

FIGS. 3A ˜ 3 B show a light unit for a low profile LED lamp according to the present invention.

FIGS. 4A ˜ 4 B show a low profile LED lamp according to the present invention.

FIGS. 5A ˜ 5 B show different views over the low profile lead frame according to the present invention.

FIGS. 6A ˜ 6 B show a modification embodiment according to the present invention.

FIGS. 7A ˜ 7 C show a metal interposer heat coupler according to the present invention.

FIG. 8 shows another modification embodiment according to the present invention.

FIG. 9 shows a bottom cup according to the present invention.

The present invention discloses a low profile LED lamp with light weight and high heat dissipation is eagerly required. The present invention LED lamp is light weight because it does not need to have an exclusive heat sink for heat dissipation.

FIGS. 2A ˜ 2 B show a lead frame according to the present invention

FIG. 2A shows a lead frame suitable for being configured in a low profile LED lamp. The lead frame has a plurality of lead frame units 30 , each lead frame unit 30 further comprises a left top metal section 31 T, a left middle metal section 31 M connected with a bottom end of the left top section 31 T. A right top metal section 32 T is configured independent from the left top metal section 31 T, and a right bottom metal section 32 B is connected with a bottom end of the right top section 32 T, and a top-down tapered metal section 31 B is connected with a bottom end of the left middle metal section 31 M. The top-down tapered metal section 31 B is configured on bottom of the right bottom metal section 32 B and electrically isolated from the right bottom metal section 32 B; the top-down tapered metal section 31 B is adaptive for bending inwards to form a cup bottom which is suitable for fitting in the low profile LED lamp. FIG. 2A shows the right bottom metal section 32 B of a lead frame unit 30 is integrated with a left middle metal section 31 M of another lead frame unit 30 in its right side.

FIG. 2B shows the lower portion of the lead frame bended inwards to form a lead frame bottom cup 300 on bottom. The difference height d is shown between a bottom of the FIG. 2A and a bottom of FIG. 2B . The height d is reduced from the total height of the lead frame unit 30 after the lead frame has been bent inwards to form a lead frame metal cup 300 . So that a low profile LED lamp is developed with the lead frame metal cup 300 of FIG. 2B according to the present invention.

FIGS. 3A ˜ 3 B show a light unit for a low profile LED lamp according to the present invention

FIG. 3A shows an LED chip 36 straddling a gap G 1 between the left top metal section 31 T and the right top metal section 32 T to form a light unit 30 U.

FIG. 3B shows light unit for a low profile LED lamp according to the present invention

FIG. 3B shows a low profile light units suitable for a low profile LED lamp can be made after bending the bottom portion of the lead frame of FIG. 3A . FIG. 3B shows a bottom cup 300 is formed which is suitable for being configured inside a low profile LED lamp. The LED chip 36 in combination with the left top metal section 31 T and the right top metal section 32 T are integrated into a group which is bendable so that it is possible to adjust the light direction of the LED chip 36 before assembly.

FIGS. 4A ˜ 4 B show a low profile LED lamp according to the present invention

FIG. 4A shows a low profile LED lamp can be made by using the low profile lead frame bottom cup 300 . A protection cover 35 comprises a top cover 35 T, a circular lens 35 M, and a protection bottom cup 35 B. The top cover 35 T is configured on top of the plurality of light units 30 U. The circular lens 35 M is configured on a bottom end of the top cover 35 T. The protection bottom cup 35 B is configured on a bottom end of the circular lens 35 M. The lead frame bottom cup 300 fits in the inner side of the protection bottom cup 35 B.

The top-down tapered bottom metal section 31 B attaches onto an inner surface of the protection bottom cup 35 B. Heat generated from the light unit 30 U can be dissipated through the protection bottom cup 35 B which is configured to contact the top-down tapered bottom metal section 31 B. The combination of the top cover 35 T, the circular lens 35 M, and the protection bottom cup 35 B forms a bulb to protect the LED lamp from being contaminated by dust and moisture. A lamp base 66 is configured on a bottom end of the protection bottom cup 35 B. A top metal ring 66 T is configured on a top of the lamp base 66 for a better connection between the protection bottom cup 35 B and the lamp base 66 .

FIG. 4B shows that the circular lens 35 M is aligned with the plurality of LED chips so that the direction of light beam emitted from the LED chip 36 can be projected into a wide range illumination including a bottom section of the LED lamp as shown in FIG. 4B .

FIG. 4B shows the circular lens 35 M is configured at a waist of the protection cover 35 ; the plurality of light chips 36 facing the circular lens 35 M. The circular lens 35 M modifies the light beam emitted from the light chips 36 . FIG. 4B shows that the light beams fans out after passing the circular lens 35 M as an example.

FIGS. 5A ˜ 5 B show different views over the low profile lead frame according to the present invention

FIG. 5A shows a side view of the low profile lead frame according to the present invention. The low profile lead frame is formed mainly because of the bendable top-down tapered metal section 31 B which is bendable inwards to form a lead frame metal cup 300 .

FIG. 5B shows a bottom view of the low profile lead frame of FIG. 5A

FIG. 5B show a circular area 31 C is formed in the center communicated with a space of the lamp base 66 .

FIGS. 6A ˜ 6 B show a modification embodiment according to the present invention

FIG. 6A shows metal extension 31 E is extended from a bottom end of the top-down tapered metal section 31 B. The metal extension 31 E is then attached onto an inner surface of the top metal ring 66 T so that partial of the heat generated from the light unit 30 U can be dissipated from the lamp base 66 . An insulation layer 39 is sandwiched between the metal extension 31 E and the top metal ring 66 T for electrical insulation there between.

FIG. 6B shows the metal extension 31 E attached onto an inner surface of the top metal ring 66 T so that partial heat generated from the light unit 30 U can be dissipated from the lamp base 66 .

FIGS. 7A ˜ 7 C show a metal interposer heat coupler according to the present invention

FIG. 7A shows a metal interposer 38 functions as a heat coupler between the lead frame metal cup 300 and the lamp base 66 so that partial of the heat generated from the light unit 30 U can be transmitted to the lamp base 66 for a better heat dissipation.

FIG. 7B shows the metal interposer 38 comprises a polygon metal 38 T configured on top. Each facet of the polygon metal 38 T matches one of the top-down tapered metal sections 31 B of the lead frame bottom cup 300 .

FIG. 7C shows the metal interposer 38 comprises a cylinder metal 38 B configured on bottom.

FIG. 8 shows another modification embodiment according to the present invention

FIG. 8 show the metal interposer 38 is inserted in the center of the lead frame, wherein the polygon top 38 T touches inner surface of the top-down tapered metal section 31 B; and the bottom of the cylinder metal 38 B fits in the central space of the top metal ring 66 T of the lamp base 66 . An insulation layer 392 is inserted between the cylinder metal 38 B and the top metal ring 66 T for electrically insulation there between.

FIG. 9 shows a bottom cup according to the present invention.

FIG. 9 show the bottom cup 35 B has a bottom extension 35 E protruded downwards from the bottom. The bottom extension 35 E function as the insulation layer 39 , 392 .

While several embodiments have been described by way of example, it will be apparent to those skilled in the art that various modifications may be configured without departs from the spirit of the present invention. Such modifications are all within the scope of the present invention, as defined by the appended claims.