USPatent applicationPatented

Time-interleaved track-and-hold circuit using distributed global sine-wave clock

Granted 16 Jul 2013 · no office action yet

Current assignee: Avago Technologies General IP · originally Broadcom

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Inventors: Tao Jiang, Patrick Yin Chiang, Freeman Y. Zhong · Examiner: Lam T Mai · AU 2819 · TC 2800

Application· this page
13/450,204
filed 18 Apr 2012
Publication
Not published
not published
Patent
US 8,487,795
granted 16 Jul 2013

Life of the application

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Abstract

A time-interleaved track-and-hold circuit includes a clock generator adapted to receive a global sine-wave clock signal and to generate therefrom multiple square-wave output clock signals of different phases. The track-and-hold circuit includes a switching array operative in at least a track mode or a hold mode. The switching array includes multiple switch circuits, each switch circuit adapted to receive an analog input signal, a corresponding one of the output clock signals, and the global sine-wave clock signal. Each switch circuit is operative to utilize the corresponding one of the output clock signals during the track mode for tracking the analog input signal, and is operative during the hold mode to store the input signal sampled during the track mode as an output of the switch circuit and to utilize the global sine-wave clock signal during the hold mode for synchronizing sampling instants of the respective outputs of the switch circuits.

Description

10 parts
›BACKGROUND

As data communication systems reach multi-gigabit per second (Gbps) rates, the task of ensuring good signal integrity, both on-chip and off-chip, becomes increasingly important. At such high-speed data rates, clock jitter becomes a signal-integrity challenge. At the system-level behavior, for example, jitter generation, amplification and cancellation must be taken into account, with noise sources introduced from either off-chip or on-chip. The term “jitter” is often defined as the short-term variations of a periodic digital signal's significant instants (i.e., periodicity) from their ideal positions in time (see, e.g., Bell Communications Research, Inc. (Bellcore), “Synchronous Optical Network (SONET) Transport Systems: Common Generic Criteria, TR-253-CORE,” Issue 2, Rev. 1, December 1997, the disclosure of which is incorporated by reference herein in its entirety for all purposes).

High-speed signaling (e.g., greater than about 25 Gbps wireline communications) requires low jitter receiver clock sampling to achieve low bit-error rate (BER). For instance, an analog-to-digital converter (ADC) operating at ultra-high speed (e.g., greater than about 10 giga-samples per second (GS/s)) typically suffers from inaccuracy of its sampling clock due to both static and dynamic timing errors. Conventional approaches to reduce static timing error in a data communication system, including, for example, the use of phase calibration in time-interleaving techniques, have resulted in increasing the complexity (e.g., through required additional circuitry or algorithms) and/or power consumption in the system, and are therefore undesirable. Furthermore, these calibration circuits may not be able to alleviate much of the dynamic timing errors introduced by high-frequency clock jitter.

›SUMMARY

Principles of embodiments of the invention advantageously provide a novel architecture for reducing clock jitter in a time-interleaved track-and-hold circuit. Rather than using a square-wave clock, as is conventionally performed, the track-and-hold circuit according to embodiments of the invention employs a lower jitter global sine-wave clock for synchronizing the sampling instants of each time-interleaved ADC channel. The track-and-hold circuit according to embodiments of the invention beneficially combines the global sine-wave clock, for precisely determining the sampling instants with a low jitter clock, with time-interleaving phase clocks, for selecting the respective ADC channels, without significantly impacting circuit design complexity or power consumption.

In accordance with an embodiment of the invention, a time-interleaved track-and-hold circuit for reducing jitter in an analog-to-digital converter, including a plurality of corresponding time-interleaved analog-to-digital converter channels, includes a clock generator operative to receive a global sine-wave input clock signal and to generate therefrom multiple square-wave output clock signals, each of the output clock signals having different phases relative to one another. The track-and-hold circuit further includes a switching array operative in one of at least a track mode and a hold mode. The switching array includes multiple switch circuits, each of the switch circuits being adapted to receive an analog input signal supplied to the track-and-hold circuit, a corresponding one of the output clock signals, and the global sine-wave input clock signal. Each of the switch circuits is operative to utilize the corresponding one of the output clock signals during the track mode for tracking the analog input signal, and is operative during the hold mode to store the input signal sampled during the track mode as an output of the switch circuit and to utilize the global sine-wave input clock signal during the hold mode for synchronizing sampling instants of the respective outputs of the plurality of switch circuits.

In accordance with another embodiment of the invention, a time-interleaved data converter circuit includes a track-and-hold circuit, a plurality of ADCs, and a multiplexer. The track-and-hold circuit includes a clock generator operative to receive a global sine-wave input clock signal and to generate therefrom multiple square-wave output clock signals, each of the output clock signals having different phases relative to one another. The track-and-hold circuit further includes a switching array operative in one of at least a track mode and a hold mode. The switching array includes multiple switch circuits, each of the switch circuits being adapted to receive an analog input signal, a corresponding one of the output clock signals, and the global sine-wave input clock signal. Each of the switch circuits is operative to utilize the corresponding one of the output clock signals during the track mode for tracking the analog input signal, and is operative during the hold mode to store the input signal sampled during the track mode as an output of the switch circuit and to utilize the global sine-wave input clock signal during the hold mode for synchronizing sampling instants of the respective outputs of the plurality of switch circuits. The analog-to-digital converters are coupled to the track-and-hold circuit and arranged in parallel with one another, each of the analog-to-digital converters being operative to receive from the track-and-hold circuit a corresponding sample of the analog input signal. The multiplexer is operative to combine digital outputs generated by the respective analog-to-digital converters and to generate therefrom an output digital signal of the data converter circuit, the output digital signal being indicative of the analog input signal.

Embodiments of the invention will become apparent from the following detailed description, which is to be read in connection with the accompanying drawings.

›BRIEF DESCRIPTION OF THE DRAWINGS

The following drawings are presented by way of example only and without limitation, wherein like reference numerals (when used) indicate corresponding elements throughout the several views, and wherein:

FIG. 1 is a block diagram depicting at least a portion of an illustrative time-interleaved ADC circuit, which can be modified to incorporate techniques according to embodiments of the invention;

FIG. 2 is a block diagram depicting at least a portion of an illustrative time-interleaved ADC circuit which utilizes a calibration mechanism for reducing static errors;

FIG. 3 is a graph conceptually depicting an effective number of bits (ENOB) versus sampling clock frequency for various jitter levels of the sampling clock;

FIG. 4A is a block diagram depicting at least a portion of an exemplary time-interleaved ADC circuit, according to an embodiment of the invention;

FIG. 4B depicts exemplary waveforms corresponding to certain signals associated with the illustrative ADC circuit shown in FIG. 4A ;

FIG. 5 is a schematic diagram depicting at least a portion of an exemplary multi-phase clock generator, suitable for use in the illustrative ADC circuit shown in FIG. 4A ;

FIG. 6A is a schematic diagram depicting at least a portion of an exemplary bootstrapped switch circuit suitable for use in the illustrative ADC circuit shown in FIG. 4A , according to an embodiment of the invention;

FIG. 6B is a schematic diagram depicting an exemplary transistor-level implementation of the illustrative bootstrapped switch circuit shown in FIG. 6A , according to an embodiment of the invention; and

FIG. 7 graphically depicts simulated post-layout performance results corresponding to an exemplary implementation of a time-interleaved track-and-hold circuit with global sine-wave sampling, according to an embodiment of the invention.

It is to be appreciated that elements in the figures are illustrated for simplicity and clarity. Common but well-understood elements that may be useful or necessary in a commercially feasible embodiment may not be shown in order to facilitate a less hindered view of the illustrated embodiments.

›DETAILED DESCRIPTION · 1 of 7

Embodiments of the invention will be described herein in the context of illustrative time-interleaved track-and-hold circuits. It should be understood, however, that embodiments of the invention are not limited to these or any other particular circuit arrangements. While embodiments of the invention may be described herein with reference to specific clock generation circuitry and/or to specific frequencies (or frequency ranges) of operation, it is to be understood that embodiments of the invention are not limited to use with these specific circuits or frequencies, and that embodiments of the invention may be employed with other signaling circuitry and/or in other frequency ranges, as will become apparent to those skilled in the art. Moreover, it will become apparent to the skilled artisan given the teachings herein that numerous modifications can be made to the embodiments shown that are within the scope of the claimed invention. That is, no limitations with respect to the embodiments shown and described herein are intended or should be inferred.

As a preliminary matter, for the purposes of clarifying and describing embodiments of the invention, the following table (Table 1) provides a summary of certain acronyms and their corresponding definitions, as the terms are used herein:

The term MISFET as used herein is intended to be construed broadly and to encompass any type of metal-insulator-semiconductor field-effect transistor. The term MISFET is, for example, intended to encompass semiconductor field-effect transistors that utilize an oxide material as their gate dielectric (i.e., metal-oxide-semiconductor field-effect transistors (MOSFETs)), as well as those that do not. In addition, despite a reference to the term “metal” in the acronym MISFET, the term MISFET is also intended to encompass semiconductor field-effect transistors wherein the gate is formed from a non-metal, such as, for instance, polysilicon.

Although embodiments of the invention described herein may be implemented using p-channel MISFETs (hereinafter called “PFETs” or “PMOS” devices) and n-channel MISFETs (hereinafter called “NFETs” or “NMOS” devices), as may be formed using a complementary metal-oxide-semiconductor (CMOS) fabrication process, it is to be appreciated that embodiments of the invention are not limited to such transistor devices and/or such a fabrication process, and that other suitable devices, such as, for example, bipolar junction transistors (BJTs), etc., and/or fabrication processes (e.g., bipolar, BiCMOS, etc.), may be similarly employed, as will be understood by those skilled in the art. Moreover, although embodiments of the invention are typically fabricated in a silicon wafer, embodiments of the invention can alternatively be fabricated in wafers comprising other materials, including but not limited to gallium arsenide (GaAs), indium phosphide (InP), etc.

As previously stated, a standard approach for providing clock sampling with small static timing error is to utilize time-interleaving techniques with a global track-and-hold buffer. More particularly, to achieve high resolution at speeds near and above 1 Gbps, for example, multiple ADC channels could be time-interleaved. With reference to FIG. 1 , a block diagram depicts at least a portion of an illustrative time-interleaved ADC circuit 100 , which can be modified to incorporate techniques according to embodiments of the invention. The ADC circuit 100 includes a plurality of subranging ADCs (sub-ADC), 102 through 104 , each having an input coupled with a first terminal of corresponding switch, 106 through 108 , respectively, and having an output coupled with a corresponding input of a multiplexer 110 . Second terminals of the respective switches 106 through 108 are connected together at a common node, N 1 , adapted to receive an input signal. Each of the switches 106 through 108 is adapted to receive a corresponding control signal for selectively activating the switch.

The input signal fed to the ADCs via switches 106 through 108 is generated from an analog input signal, Vin, which is fed, via a series sampling switch 112 , to a global track-and-hold buffer circuit 114 . Switch 112 acts as a first-stage track-and-hold circuit that samples the input signal, Vin, with an input clock Vck. The effective signal-to-noise ratio (SNR) is critically limited by the clock jitter of the input clock Vck. Buffer circuit 114 acts, at least in part, as an isolation buffer that decouples the sampled signal seen after switch 112 from the multiple time-interleaving switches 106 through 108 . A front end of the ADC circuit 100 comprising series sampling switch 112 , buffer circuit 114 and switches 106 through 108 forms at least a portion of a track-and-hold circuit.

The buffer circuit 114 , in this embodiment, is represented as an ideal current source 115 connected in series with a PMOS transistor M 1 , although the invention is not limited to this or any specific circuit configuration. More particularly, a source (S) of transistor M 1 is coupled with the current source 115 at node N 1 , a drain (D) of M 1 is adapted for connection to ground, or an alternative voltage source, and a gate (G) of M 1 is connected with the switch 112 at a first terminal thereof. A second terminal of the switch 112 is adapted for receiving the input signal Vin. The switch 112 is selectively activated by a control signal, f s , which is derived from an input clock signal, Vck, supplied to the ADC circuit 100 .

Here, the multiple sub-ADCs are used in a parallel time-interleaved array, with each ADC 102 through 104 and corresponding switch 106 through 108 , respectively, forming a separate ADC sub-channel in the array. The multiplexer 110 functions primarily to combine digital outputs of the respective ADC channels and to generate therefrom an output digital signal of the ADC circuit 100 . In this structure, each time-interleaved ADC channel samples the input signal in turn. With N ADC channels operating in parallel, the overall sampling rate increases by a factor of N over that of a single channel, where N is an integer greater than one. It is to be appreciated that the invention is not limited to any specific number of ADCs, nor is the invention limited to any specific ADC configuration.

›DETAILED DESCRIPTION · 2 of 7

While time-interleaving provides an increased overall sampling rate, a time-interleaved arrangement generally introduces static errors due to phase misalignment and/or channel mismatch. For example, mismatches in gain, offset, and sample time among the time-interleaved ADCs 102 through 104 generate undesired spectral components and degrade the signal-to-noise and distortion ratio (SNDR) of the ADC circuit 100 . These static errors due to phase misalignment (e.g., phase de-skew) and channel mismatch can be eliminated by using a global track-and-hold buffer 114 running at ultra-high frequency (e.g., about 10 GHz). In addition, the clock generator 116 is adapted to receive the input clock signal Vck and to generate the plurality of control signals for selectively activating the switches 106 through 108 , with each control signal having a frequency associated therewith that is a division N of the input clock frequency. The control signals generated by clock generator 116 are time-interleaved, low-frequency phases of the input clock signal Vck. Although static errors caused by phase de-skew can be eliminated by using the high-speed buffer 114 with the global track-and-hold of switch 112 , power consumption in the circuit significantly increases as the buffer 114 is running at a very high frequency and drives a large capacitive load exhibited by switches 106 through 108 .

Alternatively, rather than using the global track-and-hold buffer 114 running at ultra-high frequency, the illustrative time-interleaved track-and-hold circuit may employ complex multi-phase clocks and calibration circuitry for reducing static errors resulting from phase misalignment and/or channel mismatch. For example, FIG. 2 is a block diagram depicting at least a portion of an illustrative time-interleaved ADC circuit 200 which utilizes a calibration mechanism for reducing static errors.

Specifically, the time-interleaved ADC circuit 200 includes a plurality of subranging ADCs (sub-ADC), 102 through 104 , each having an input coupled with a first terminal of corresponding switch, 106 through 108 , respectively, and having an output coupled with a corresponding input of a multiplexer 110 . Second terminals of the respective switches 106 through 108 are connected together at a common node, N 1 , adapted to receive an input signal. Each of the switches 106 through 108 is adapted to receive a corresponding control signal for selectively activating the switch. The multiple sub-ADCs are used in a parallel time-interleaved array, with each sub-ADC 102 through 104 and corresponding switch 106 through 108 , respectively, forming a separate ADC sub-channel in the array. A front end of the ADC circuit 200 comprising switches 106 through 108 forms at least a portion of a track-and-hold circuit. Thus, the time-interleaved ADC circuit 200 includes an array of time-interleaved ADCs connected in manner consistent with the array of ADCs shown in FIG. 1 .

The time-interleaved ADC circuit 200 further includes a multi-phase clock generator 202 , which replaces the high-speed buffer 114 and front-end track-and-hold circuit 112 shown in FIG. 1 . The multi-phase clock generator 202 comprises multiple-phase clock generators as well as phase calibration circuitry configured to reduce static errors resulting from phase misalignment and/or channel mismatch. However, while power consumption in the ADC circuit 200 is significantly reduced compared to the ADC circuit 100 shown in FIG. 1 by eliminating the high-speed buffer 114 , such power savings comes at the expense of significantly increased circuit complexity and accompanying overhead of the multi-phase clock generator. Moreover, even if static timing errors are compensated in the multi-phase clock generator 202 , dynamic timing error or clock jitter that is intrinsic or manifested due to power-supply noise cannot be avoided using the illustrative ADC circuit architecture shown in FIGS. 1 and 2 .

The amount of jitter present in the sampling clock has a significant effect on the accuracy and resolution of an ADC. By way of illustration only, FIG. 3 is a graph which conceptually depicts the effective number of bits (ENOB) versus sampling clock frequency, Fin, for various levels of root-mean-square (RMS) jitter of the sampling clock. As will be known by those skilled in the art, ENOB provides an indication of the quality of an ADC; this measurement is related to the test frequency and the signal-to-noise ratio. As apparent from FIG. 3 , to achieve at least 5-bit ENOB at a Nyquist frequency of 5 GHz, the RMS jitter of the sampling clock must be smaller than one picosecond (ps). Likewise, to achieve 8-bit ENOB at 5 GHz, the RMS jitter of the sampling clock must be about 0.1 ps.

Embodiments of the invention take advantage of the observation that a pure sine-wave clock, for example, a clock signal generated directly from a low-noise voltage-controlled oscillator (VCO) such as, but not limited to, an on-chip inductive-capacitive (LC) VCO, provides better jitter performance than a square-wave clock. This is due, at least in part, to the fact that the square-wave clock is typically generated by passing a sine-wave signal through an inverter stage (or an inverter-like buffer) for driving larger loads. This inverter-like buffer will introduce power supply-induced jitter, resulting primarily from fluctuations in the supply voltage, ground or voltage supply noise, etc. Furthermore, a square wave may introduce undesired spectral components, such as, for example, through gate-drain capacitive coupling. Therefore, embodiments of the invention beneficially utilize a sine-wave signal as a global clock to synchronize the sampling instants of each time-interleaved ADC channel. In this manner, a time-interleaved track-and-hold circuit in accordance with embodiments of the invention advantageously reduces the effect of phase misalignment without consuming significant power or requiring complex calibration circuitry, while exhibiting the advantages of an intrinsically low jitter sine-wave source directly.

›DETAILED DESCRIPTION · 3 of 7

FIG. 4A is a block diagram depicting at least a portion of an exemplary time-interleaved ADC circuit 400 , according to an embodiment of the invention. FIG. 4B depicts exemplary waveforms corresponding to certain signals associated with the illustrative ADC circuit 400 shown in FIG. 4A . With reference to FIG. 4A , the time-interleaved ADC circuit 400 includes a plurality of subranging ADCs (sub-ADC), 402 , 404 , through 406 , a switch array 408 operatively coupled with the plurality of ADCs, and a multi-phase clock generator 410 . A front end of the ADC circuit 400 comprising the switch array 408 and multi-phase clock generator 410 forms at least a portion of a track-and-hold circuit. Although not explicitly shown for clarity purposes, output signals generated by the plurality of ADCs 402 through 406 are fed to a multiplexer (e.g., multiplexer 110 ) in a manner consistent with the ADC circuits 100 and 200 shown in FIGS. 1 and 2 , respectively.

Each of the ADCs 402 through 406 includes an input coupled with the switch array 408 and adapted to receive a time-interleaved sample of an analog input signal, Vin, supplied to the ADC circuit 400 . The time-interleaving track-and-hold operation of the ADC circuit 400 is primarily a function of the switch array 408 . The switch array 408 , in this embodiment, comprises a plurality of switches, 412 , 414 , through 416 , with each switch corresponding to a given one of the ADCs 402 , 404 , through 406 , respectively. Thus, for example, if there are eight ADCs in the track-and-hold circuit 400 , the switch array 408 will also include at least eight individual switches. A first node of each switch 412 through 416 is coupled with an input of a corresponding ADC 402 through 406 , respectively, and second nodes of the switches are connected together at a common node, N 1 , and adapted to receive the analog input signal Vin. Each of the switches 412 through 416 includes a control input adapted to receive a corresponding control signal for selectively activating the switch. Moreover, each of the switches 412 through 416 in the respective time-interleaved ADC channels is adapted to receive the same sine-wave sampling clock signal, f s , as will be described in further detail below in conjunction with FIG. 6 . The multiple ADCs are used in a parallel time-interleaved array, with each ADC 402 through 406 and corresponding switch 412 through 416 , respectively, forming a separate ADC channel in the array.

It is to be appreciated that the switches 412 through 416 are represented symbolically (e.g., single-pole-single-throw switches) for simplicity. However, these switches are, in practice, implemented as switching circuits comprising one or more transistors (e.g., NFETs and/or PFETs, boot-strapped switches, etc.) or alternative electronic switching elements (e.g. CML, differential input latches, bipolar, GaAs or InP switches, etc.), as will become apparent to those skilled in the art. Furthermore, it is to be understood that the invention is not limited to any specific number of ADCs and corresponding switches in the ADC circuit 400 .

Rather than using a global square-wave clock, as is conventionally done, the ADC circuit 400 employs a lower-jitter global sine-wave clock supplied to each switch 412 through 416 to synchronize the sampling instants of each time-interleaved ADC channel, without the need for a wide-bandwidth, power-consuming global track-and-hold buffer (e.g., buffer 114 shown in FIG. 1 ). The ADC circuit 400 beneficially combines the global sine-wave clock, for determining low jitter sampling instants, with time-interleaving phase clocks, for selecting the respective ADC channels, without increasing circuit design complexity or power consumption.

One benefit of this approach is the ability to use a much higher frequency for the purer global sine-wave clock, while still performing sub-sampling using noisier time-interleaved multi-phase clocks. Because the sampling instants in the ADC circuit 400 are determined by the global sine-wave clock in the track-and-hold front end portion of the ADC circuit, any de-skew in the time-interleaving square-wave clocks will not affect the sampling performance, provided such skew is within an acceptable timing margin. Conventional phase calibration can be performed to align (e.g., center) the time-interleaved phase within a center of the high-frequency sine-wave clock source, thereby minimizing effects of both static and dynamic timing uncertainty of the time-interleaved phases. This approach advantageously reduces the design requirement for accuracy of the multi-phase clock generator 410 , and relaxes the constraint placed on absolute jitter performance of the sine-wave clock while maintaining the Nyquist sampling rate set by the N time-interleaved phases.

Time-interleaving phase clock signals, ck 1 , ck 2 , through ckn (where n is an integer indicative of the number of ADC channels), for selectively controlling the individual switches 412 , 414 , through 416 , respectively, in the switch array 408 , are generated by the multi-phase clock generator 410 . The multi-phase clock generator 410 is operative to receive the sine-wave sampling clock signal f s , and to generate therefrom the respective square-wave phase clock signals ck 1 through ckn. As shown in FIG. 4B , rising and falling edges of each square-wave phase clock signal are aligned with corresponding zero-crossings of the global sine-wave sampling clock signal f s ; a pulse width, w, of each phase clock signal, in this embodiment, is two cycles of the sampling clock, although the invention is not limited to this clocking scheme. For example, another embodiment may utilize a multi-phase clock generator comprising several stages of clock dividers, thereby generating multiple time-interleaved phases, where each individual phase is adapted to be individually adjusted for a desired phase position.

In the embodiment shown in FIGS. 4A and 4B , the phases of adjacent clock signals generated by the multi-phase clock generator 410 are delayed, relative to one another, by one cycle of the global sine-wave sampling clock signal f s . More particularly, the rising edge of clock signal ck 2 , which occurs at time t 2 , is delayed from the rising edge of adjacent clock signal ck 1 , which occurs at time t 1 , by one period of the sampling clock signal f s ; the rising edge of clock signal ck 3 (not explicitly shown), which occurs at time t 3 , is delayed from the rising edge of adjacent clock signal ck 2 by one period of f s ; and so on for the remaining clock signals, with the rising edge of clock signal ck 1 being delayed from the rising edge of adjacent clock signal ckn, which occurs at time t 0 , by one period of f s . A frequency of each of the clock signals ck 1 through ckn will be the frequency of the sine-wave sampling clock f divided by N, where N is the number of ADC channels in the ADC circuit 400 .

›DETAILED DESCRIPTION · 4 of 7

FIG. 5 is a schematic diagram depicting at least a portion of an exemplary multi-phase clock generator 500 , suitable for use in the illustrative ADC circuit 400 of FIG. 4A . In this embodiment, the multi-phase clock generator 500 is an eight-phase clock generator adapted to drive an eight-channel time-interleaved ADC array, although the invention is not limited to any specific number of phases or corresponding ADC channels. The multi-phase clock generator 500 includes a plurality of D-type flip-flops (DFFs) 502 , 504 , 506 , 508 , 510 , 512 , 514 and 516 , connected together in a cascaded configuration, each DFF being operative to generate a unique one of multiple output clock phases, ck 1 , ck 2 , ck 3 , ck 4 , ck 5 , ck 6 , ck 7 and ck 8 , respectively. Each of the DFFs includes a data input, D, adapted to receive a data input signal, a clock input adapted to receive a clock signal, and first and second outputs, Q and Q, respectively, for generating output signals; the second output is a logical complement of the first output. The second outputs of the respective DFFs 502 through 516 are connected with corresponding input of a logic block 518 .

Specifically, the data input of DFF 502 is adapted to receive an output generated by the logic block 118 , the first output of DFF 502 is connected with the data input of DFF 504 , the first output of DFF 504 is connected with the data input of DFF 506 , the first output of DFF 506 is connected with the data input of DFF 508 , the first output of DFF 508 is connected with the data input of DFF 510 , the first output of DFF 510 is connected with the data input of DFF 512 , the first output of DFF 512 is connected with the data input of DFF 514 , and the first output of DFF 514 is connected with the data input of DFF 516 . The output clock phases are generated as buffered outputs of the corresponding DFFs. More particularly, the first output of DFF 502 is passed through a first buffer stage 520 to generate the output clock phase ck 1 , the first output of DFF 504 is passed through a second buffer stage 522 to generate the output clock phase ck 2 , the first output of DFF 506 is passed through a third buffer stage 524 to generate the output clock phase ck 3 , the first output of DFF 508 is passed through a fourth buffer stage 526 to generate the output clock phase ck 4 , the first output of DFF 510 is passed through a fifth buffer stage 528 to generate the output clock phase ck 5 , the first output of DFF 512 is passed through a sixth buffer stage 530 to generate the output clock phase ck 6 , the first output of DFF 514 is passed through a seventh buffer stage 532 to generate the output clock phase ck 7 , and the first output of DFF 516 is passed through an eighth buffer stage 534 to generate the output clock phase ck 8 . Each of the respective buffer stages 520 through 534 may comprise, for example, at least one inverter, although alternative buffer circuit arrangements are similarly contemplated.

The multi-phase clock generator 500 is adapted to receive a first sine-wave clock signal, sin p, and a second sine-wave clock signal, sin n. The first and second sine-wave clock signals are shifted in phase relative to one another by 180 degrees. In alternative embodiments, the input sine-wave clock signals can be shifted in phase by something other than 180 degrees relative to one another. For example, four input sine-wave clocks (rather than two) can be used, with the phases of the respective input clock signals being shifted by 90 degrees relative to one another. In this manner, an effective real sampling rate of four times the clock frequency can be achieved. For the general case in which there are N input sine-wave clocks employed, where N is an integer, the respective input clock signals will be shifted by 360/N degrees relative to one another, so that an effective real sampling rate of N times the clock frequency can be achieved.

According to the choice of the number of DFFs and the logic, the number of the multi-phase clocks and the pulse width of each clock can be selected. The first sine-wave clock signal sin p is supplied to the clock inputs of a first subset of the DFFs, namely, DFFs 502 , 506 , 510 and 514 , and the second sine-wave clock signal sin n is supplied to the clock inputs of a second subset of the DFFs, namely, DFFs 504 , 508 , 512 and 516 . Thus, the sine-wave clock signals received by any two adjacent DFFs will be 180 degrees out of phase relative to one another. In this manner, each output clock pulse generated by a given DFF will be delayed from an adjacent DFF by one effective sampling clock cycle, and a duration (i.e., pulse width) of each output clock pulse will be two effective sampling clock cycles, as previously described. In the illustrative embodiment in which two sine wave clocks with 180 degree phase difference are employed (e.g., sin p and sin n), the effective global sampling rate will be twice that of the sine-wave clock; in the DFF loop comprising DFFs 502 through 516 , each clock pulse will be delayed from an adjacent clock pulse by half of the sine-wave clock cycle, which is equivalent to one clock cycle of the effective sampling clock. Similarly, the pulse width will be one clock cycle of the sine-wave, but also equal to two effective sampling clock cycle. It is to be understood, however, that the invention is not limited to this particular clock phase generation arrangement.

Using the time-interleaving architecture of the ADC circuit 400 , the time-interleaved phases are determined during a track phase (i.e., track mode) by the noisier square-wave clocks ck 1 through ckn, while the more critical sampling instants are determined by the rising edge of the global pure, low jitter sine-wave clock, as previously stated. In this manner, timing accuracy of the ADC circuit 400 is improved from both static and dynamic timing error perspectives.

Consider, for example, that modern resonant-based inductor-capacitor (LC) oscillators can achieve jitter/phase-noise performance vastly superior to ring oscillator-based clock generators. By way of illustration only, in the paper Jri Lee, “A 75-GHz Phase-Locked Loop in 90-nm CMOS Technology,” IEEE J. Solid - State Circuits , vol. 43, no. 6, pp. 1414-1426, June 2008, the disclosure of which is incorporated by reference herein in its entirety for all purposes, a 75-GHz phase-locked loop using on-chip resonators was shown to achieve peak-to-peak and rms jitter of 609 femtoseconds (fs), pp and 87 fs, rms, respectively. Such a sine-wave improves jitter by a factor of five times (5×) over conventional sine-wave resonator due to the high frequency of oscillation. The ADC circuit 400 is suitable for use with this sine-wave for the front-end global sampling clock, down-sampled with the lower-speed, time-interleaved multi-phase square-wave clocks.

›DETAILED DESCRIPTION · 5 of 7

Table 2 below provides a comparison of some illustrative ADCs in CMOS technology. Note, that most designs are limited to less than 30 dB signal-to-noise and distortion ratio (SNDR), with very large power consumption (e.g., up to about 9000 milliwatts (mW)). Here, clock jitter is a primary limitation.

The references listed in Table 2 above, which describe details of the respective illustrative ADCs used in the comparison, are as follows: [1] S. M. Louwsma, et al., “A 1.35 GS/s, 10 b, 175 mW Time-Interleaved AD Converter in 0.13 μm CMOS,” IEEE J. Solid - State Circuits , vol. 43, no. 4, pp. 778-786, April 2008; [2] K. Poulton, et al., “A 4 GSample/s 8-bit ADC in 0.35 μm CMOS,” ISSCC Dig. Tech. Papers , pp. 166-167, February 2002; [3] M. El-Chammas, et al., “A 12-GS/s 81-mW 5-bit Time-Interleaved Flash ADC with Background Timing Skew Calibration,” IEEE J. Solid - State Circuits , vol. 46, no. 4, pp. 838-847, April 2011; [4] K. Poulton, et al., “A 20 GS/s 8b ADC with a 1 MB Memory in 0.18 μm CMOS,” ISSCC Dig. Tech. Papers , pp. 318-319, February 2003; [5] P. Schvan, et al., “A 24 GS/s 6b ADC in 90 nm CMOS,” ISSCC Dig. Tech Papers, pp. 544-545, February 2008; and [6] Y. M. Greshishchev, et al., “A 40 GS/s 6b ADC in 65 nm CMOS,” ISSCC Dig. Tech. Papers, pp. 390-391, February 2010; the disclosures of these references are incorporated by reference herein in their entireties for all purposes.

FIG. 6A is a schematic diagram depicting at least a portion of an exemplary bootstrapped switch circuit 600 suitable for use in the illustrative time-interleaved ADC circuit 400 shown in FIG. 4A , according to an embodiment of the invention. The switch circuit 600 is intended to depict an exemplary implementation of one of the plurality of switches 412 through 416 in the ADC circuit 400 of FIG. 4A . In FIG. 6A , φ 1 and φ 2 are two phases of a sampling clock signal supplied to the switch circuit 600 (which may be, for example 180 degrees apart), Vin is the analog input signal supplied to the switch array 408 in FIG. 4A , Vout is the sampled output signal supplied to the corresponding ADC with which the switch circuit 600 is connected, and VDD and VSS are the voltage supply and voltage return, respectively, for the switch circuit 600 . The primary signal switch is NFET 602 (MSW), while the additional components, namely, switches S 1 through S 6 and capacitor C 1 , constitute the bootstrap circuit.

A first terminal of switch S 1 is connected with a source (S) of NFET MSW and adapted to receive the analog input signal Vin, a second terminal of S 1 is connected with a first terminal of switch S 3 and a first terminal of capacitor C 1 , a control input of S 1 is adapted to receive clock φ 1 , a second terminal of S 3 is adapted for connection to VSS, and a control input of S 3 is adapted to receive clock φ 2 . A first terminal of switch S 2 is connected with a gate (G) of NFET MSW and a first terminal of switch S 5 , a second terminal of S 2 is connected with a first terminal of switch S 4 and a second terminal of capacitor C 1 , a control input of S 2 is adapted to receive clock φ 1 , a second terminal of S 4 is adapted for connection with VDD, and a control input of S 4 is adapted to receive clock φ 2 . A second terminal of switch S 5 is connected with a first terminal of switch S 6 , a control input of S 5 is adapted to receive clock φ 2 , a second terminal of S 6 is adapted for connection with VSS, and a control input of S 6 is adapted to receive a global sine-wave sampling clock signal, sin. Switches S 5 and S 6 form at least a portion of discharge path. The sampled output signal Vout is generated at a drain (D) of NFET MSW.

Because an MOS device is symmetrical in nature, and thus bi-directional, the assignment of source and drain designations in the MOS device is essentially arbitrary. Therefore, the source and drain of a given MOS device may be referred to herein generally as first and second source/drain, respectively, with the understanding that the term “source/drain” in this context denotes a source or a drain.

In terms of operation, when clock φ 2 is asserted (e.g., logic high), switches S 3 and S 4 will be closed and switches S 1 and S 2 will be open, thereby allowing capacitor C 1 to charge to VDD. During φ 2 , switch S 5 also turns on. Thus, when switch S 6 is turned on, as a function of sine-wave signal sin, the gate of NFET MSW will be pulled to VSS, thereby turning off MSW. The addition of switch S 6 to the discharge path 604 in the switch circuit 600 of each ADC channel, controlled by a common global sine-wave sampling clock signal sin, functions to synchronize a sampling instant of the time-interleaved ADC channels in the ADC circuit (e.g., ADC circuit 400 shown in FIG. 4A ), thereby significantly improving overall jitter performance in the ADC circuit.

When clock φ 1 is asserted, switches S 3 , S 4 and S 5 will be open and switches S 1 and S 2 will be closed, thereby connecting the precharged capacitor C 1 between the gate and source of NFET MSW such that the gate-source voltage of MSW will be equal to Vc (approximately VDD) across C 1 . Assuming VDD is greater than a threshold voltage of NFET MSW (a likely assumption), MSW will turn on and pass the input signal Vin to the output (i.e., Vout=Vin). This switch configuration enables rail-to-rail signal switching since the gate-source voltage is always constant during φ 1 independently of the input signal Vin.

FIG. 6B is a schematic diagram depicting an exemplary transistor-level implementation 650 of the illustrative bootstrapped switch circuit 600 shown in FIG. 6A , according to an embodiment of the invention. In FIG. 6B , signal cks is one of the phases of the time-interleaved clocks, which may be equivalent clock φ 1 , generated by the multi-phase clock generator 410 in FIG. 4A , or alternative clock generation circuitry, and signal cksb is the complement of the clock signal cks. The exemplary switch circuit 650 includes a plurality of NFETs, M 0 , M 1 , M 2 , M 5 , M 7 , M 8 , M 9 and M 10 , and a plurality of PFETs, M 3 , M 4 and M 6 . A source of NFET M 0 is adapted for connection with VSS (e.g., ground), a drain of M 0 is connected with a source of NFET M 1 , and a gate of M 0 is adapted to receive a global sine-wave sampling clock signal, sin. A drain of NFET M 1 is connected with a source of NFET M 2 , and a gate of M 1 is adapted to receive the clock signal cksb, which is a logical complement of clock signal cks generated by an inverter 654 , or an alternative inverting buffer. A drain of NFET M 2 is coupled with a gate of PFET M 3 and a drain of PFET M 4 at node N 1 , and a gate of M 2 is adapted to receive a control signal, vcal, which is used in this embodiment, in conjunction with M 2 , as part of an optional calibration mechanism to compensate for process variation and mismatch between time-interleaved ADC channels. NFETs M 0 , M 1 and M 2 form a discharge path 652 for selectively discharging node N 1 to VSS.

›DETAILED DESCRIPTION · 6 of 7

An important aspect of embodiments of the invention is the addition of a transistor (an NFET in this embodiment, although the invention is not limited to an NFET device) M 0 in the discharge path 652 which is gated by the global sine-wave clock signal sin. This same sine-wave clock is similarly used to gate a corresponding transistor in the discharge paths of each of the respective switch circuits (e.g., switches 412 through 416 in FIG. 4A ) in the time-interleaved ADC channels. As long as the rising edge of the clock signal cksb arrives earlier than that of the global sine-wave clock signal sin, then the cut-off point will be determined by the global sine-wave clock. In this manner, transistor M 0 in each of the switch circuits in the track-and-hold circuit functions to synchronize the sampling instants of the respective ADC channels with the global sine clock, as previously stated.

It is to be appreciated that the track-and-hold portion of the ADC circuit (e.g., circuit 400 in FIG. 4A ) in which the switch circuit 650 is employed, by design, is able to account for phase error between each of the multi-phase clocks, and therefore complicated phase calibration circuitry may not be required. However, the inclusion of transistor M 2 (in this embodiment, an NFET) and corresponding calibration voltage vcal further enhances the performance of the circuit, since it will affect the sampling instant in each time-interleaved ADC channel if there is a mismatch in process technology (being part of the discharge path 652 ). For example, if the threshold voltages associated with transistors M 0 , M 1 , and M 2 in different time-interleaved ADC channels are not substantially the same, the sampling instants will also be slightly shifted relative to one another, and that can affect overall performance. Thus, to compensate for this potential mismatch, transistor M 2 and its corresponding voltage vcal are beneficially used to control (i.e., “tune”) an on-resistance of M 2 , thereby controlling a resistor-capacitor (RC) delay of the overall discharge path 652 from node N 1 to VSS. This calibration voltage vcal can be generated, for example, by using a standard DC reference voltage generator, such as, but not limited to, a resistive ladder or other low-power digital-to-analog converter (DAC), to generate the voltage vcal. Since channel mismatch and process variation generally cannot be predicted with sufficient accuracy, the use of such a simple calibration scheme enhances the performance of the track-and-hold circuit in which the switch circuit 650 is employed, without significantly increasing power consumption or circuit complexity. Another embodiment for calibrating the sampling instant is to insert a variable capacitance or current source into the node N 1 , or similarly, changing a time constant for the sampling instant that “cuts-off” switch M 5 .

With continued reference to FIG. 6B , a drain of PFET M 3 is adapted for connection with VDD, a gate of M 3 is connected with node N 1 , a source of M 3 and a source of PFET M 4 is connected with a first terminal of a first capacitor C 1 at node N 2 , a drain of M 4 is connected with node N 1 , and a gate of M 4 is connected with drains of PFET M 6 and NFETs M 7 and M 8 at node N 3 . It should be noted that the respective bulks of transistors M 3 and M 4 are connected to the highest potential, i.e., node N 2 , and not to VDD. A source of M 6 is adapted for connection with VDD, gates of M 6 and M 7 are adapted to receive the clock signal cks, and sources of M 7 , M 8 and NFET M 9 and a second terminal of capacitor C 1 are connected together at node N 4 . Gates of M 8 , M 9 and NFET M 5 are connected with node N 1 , a drain of M 9 is connected with a source of M 5 and adapted to receive the input signal Vin, a drain of M 5 is connected with a first terminal of a second capacitor C 2 and operative to generate the output signal Vout, and a second terminal of capacitor C 2 is adapted for connection with ground or VSS. The capacitor C 2 functions, at least in part, to temporarily store a value of the sampled input signal as the output signal Vout during the hold mode of operation. A drain of NFET M 10 is connected with node N 4 , a gate of M 10 is adapted to receive the clock signal cksb, and a source of M 10 is adapted for connection with VSS.

The switch circuit 650 is an implementation of a symmetrical bootstrapped switch, according to an embodiment of the invention. Comparing FIGS. 6A and 6B , NFET M 5 in FIG. 6B corresponds to primary switching NFET MSW in FIG. 6A , NFET M 9 corresponds to switch S 1 , PFET M 4 corresponds to switch S 2 , NFET M 10 corresponds to switch S 3 , PFET M 3 corresponds to switch S 4 , NFET M 1 corresponds to switch S 5 , and NFET M 0 corresponds to switch S 6 . The remaining transistors, namely, PFET M 6 , and NFETs M 7 and M 8 , and modified connectivity of switch circuit 650 are introduced to provide all switch operation from rail-to-rail while limiting the gate-source voltage on any transistor to VDD to reduce voltage stress on the transistors. For example, gate connections of transistor M 3 and M 4 prevent their overstress as the voltage on node N 2 rises above VDD. Transistor M 7 turns on transistor M 4 on the rising edge of clock signal cks, while transistor M 8 keeps M 4 turned on as the voltage on node N 4 rises to the voltage of the input signal Vin. Gate connections of transistors M 8 and M 9 allow M 8 and M 9 to be turned on similar to the main switching transistor M 5 .

In addition to providing the ability to adjust for mismatch between time-interleaved ADC channels, as described herein above, transistor M 2 further prevents the gate-drain voltage of transistor M 1 from exceeding VDD when clock signal cks is asserted (e.g., logic high). Specifically, when the clock signal cks is asserted, the clock signal cksb supplied to the gate of transistor M 1 will be a logic low, thereby turning off M 1 . When transistor M 1 is off, its drain-bulk diode junction voltage reaches a reverse bias voltage of 2VDD. This should be compatible with prescribed technology limits.

›DETAILED DESCRIPTION · 7 of 7

By way of example only and without loss of generality, consider a 12 GS/s 8-channel ADC circuit in which aspects according to embodiments of the invention are employed. As observed from exemplary circuit simulation results, when there is no sine-wave modulation (that is, the gate of transistor M 0 in switch circuit 650 is shorted to VDD instead of applying the global sine-wave clock signal sin in FIG. 6B ), the ADC circuit can only achieve a signal-to-noise ratio of about 28 dB at the Nyquist input frequency, with phase de-skew in each channel no larger than about 4 ps. Alternatively, the ADC circuit incorporating switch circuit 650 with sine-wave modulation (that is, the global sine-wave clock signal sin is supplied to the gate of transistor M 0 in switch circuit 650 in FIG. 6B ) can achieve a signal-to-noise ratio of about 40 dB under the same operating conditions.

FIG. 7 graphically depicts simulated post-layout performance results corresponding to an exemplary implementation of a time-interleaved ADC circuit (e.g., ADC circuit 400 shown in FIG. 4A ) comprising switch circuits 650 shown in FIG. 6B , according to an embodiment of the invention. The 8-channel time-interleaved ADC circuit is driven differentially by two complementary sine-wave clocks having a frequency of 6 GHz, so that the overall sampling rate is 12 GS/s, while the frequency of the input signal is near the Nyquist rate of 6 GHz. In this simulation, a certain amount (e.g., up to 4 ps in each channel) of phase error is deliberately introduced. Such phase difference can be achieved by coarse adjustment with little circuit complexity and/or power consumption. Besides, a dynamic jitter of RMS 600 fs for the sine-wave clock is also assumed, which is achievable by directly using sine-wave clocks in the real circuits. As apparent from FIG. 7 , the ADC circuit which incorporates techniques in accordance with embodiments of the invention achieves improved SNDR.

At least a portion of the techniques of the embodiments of the invention may be implemented in an integrated circuit. In forming integrated circuits, identical die are typically fabricated in a repeated pattern on a surface of a semiconductor wafer. Each die includes a device described herein, and may include other structures and/or circuits. The individual die are cut or diced from the wafer, then packaged as an integrated circuit. One skilled in the art would know how to dice wafers and package die to produce integrated circuits. Integrated circuits so manufactured are considered part of this invention.

An integrated circuit in accordance with embodiments of the invention can be employed in essentially any application and/or electronic system in which ADC circuits may be employed. Suitable systems for implementing techniques of embodiments of the invention may include, but are not limited to, data processors, personal computers, mobile phones, multimedia systems, data communication systems, etc. Systems incorporating such integrated circuits are considered part of embodiments of the invention. Given the teachings of embodiments of the invention provided herein, one of ordinary skill in the art will be able to contemplate other implementations and applications of the techniques of embodiments of the invention.

The illustrations of embodiments of the invention described herein are intended to provide a general understanding of the architecture of various embodiments of the invention, and they are not intended to serve as a complete description of all the elements and features of apparatus and systems that might make use of the architectures and circuits according to embodiments of the invention described herein. Many other embodiments will become apparent to those skilled in the art given the teachings herein; other embodiments are utilized and derived therefrom, such that structural and logical substitutions and changes can be made without departing from the scope of this disclosure. The drawings are also merely representational and are not drawn to scale. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.

Embodiments of the inventive subject matter are referred to herein, individually and/or collectively, by the term “embodiment” merely for convenience and without intending to limit the scope of this application to any single embodiment or inventive concept if more than one is, in fact, shown. Thus, although specific embodiments have been illustrated and described herein, it should be understood that an arrangement achieving the same purpose can be substituted for the specific embodiment(s) shown; that is, this disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will become apparent to those of skill in the art given the teachings herein.

The abstract is provided to comply with 37 C.F.R. §1.72(b), which requires an abstract that will allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, it can be seen that various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the appended claims reflect, inventive subject matter lies in less than all features of a single embodiment. Thus the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as separately claimed subject matter.

Given the teachings of embodiments of the invention provided herein, one of ordinary skill in the art will be able to contemplate other implementations and applications of the techniques of embodiments of the invention. Although illustrative embodiments of the invention have been described herein with reference to the accompanying drawings, it is to be understood that embodiments of the invention are not limited to those precise embodiments, and that various other changes and modifications are made therein by one skilled in the art without departing from the scope of the appended claims.

›Tables in the description — 2
TABLE 1
AcronymDefinition
ADCanalog-to-digital converter
MISFETmetal-insulator-semiconductor field-effect transistor
MOSFETmetal-oxide-semiconductor field-effect transistor
NFETn-channel field-effect transistor
PFETp-channel field-effect transistor
NMOSn-channel metal-oxide-semiconductor
PMOSp-channel metal-oxide-semiconductor
CMOScomplementary metal-oxide-semiconductor
ICintegrated circuit
ENOBeffective number of bits
VCOvoltage-controlled oscillator
SNDRsignal-to-noise and distortion ratio
RMSroot-mean-square
DFFD-type flip-flop
TABLE 2 — FoM
ResolutionSpeedPowerSNDRTechnology[pJ/conv-
Reference[Bits][GS/s][mW][dB][nm]step]
[1]820900029.518018.45
[2]624120026.4902.92
[3]610.3160032.4904.56
[4]640150025.2652.52
[5]5128125.1650.46
[6]61643530.8650.96

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Classifications

14 codes
IPC · International Patent Classification
Section H — Electricity
  • H03M1/00
USPC · US Patent Classification
341/122375/346375/232327/91370/329327/94375/341341/155327/415375/229327/52327/434375/233

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