Electronic device with fan

1. Technical Field

The disclosure relates to electronic devices, and particularly to an electronic device with a fan mounted therein having an excellent heat dissipation capability.

2. Description of Related Art

Nowadays, with the development of electronic technology, an electronic device such as a computer or a server is devised to be much thinner and smaller than before, yet hold many more electronic modules. However, the electronic modules generate a large amount of heat during operation. The interior space of the electronic device is very limited, and the electronic modules occupy much of that space. Therefore, the space saved for a fan for dissipating heat generated from the electronic modules is becoming smaller and smaller, and a gap between the fan and a casing of the electronic device is becoming narrower and narrower. During operation, only a little of ambient air is drawn along the gap by the fan, and heat dissipation capability of the fan is very limited. As a result, heat generated by the electronic modules cannot be efficiently taken away.

What is needed, therefore, is an electronic device with a fan mounted therein which can overcome the limitations described.

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is a cross sectional view of an electronic device in accordance with an embodiment of the disclosure.

FIG. 2 is an isometric view of an inverted fan of the electronic device of FIG. 1 .

Referring to FIG. 1 , an electronic device 100 in accordance with an embodiment of the disclosure includes a casing 10 and a fan 20 received in the casing 10 . In this embodiment, the electronic device 100 is a notebook computer, and the fan 20 is a centrifugal fan.

Also referring to FIG. 2 , the fan 20 includes a fan frame 22 and an impeller 24 mounted in the fan frame 22 . The fan frame 22 includes a first plate, a second plate, and a sidewall 224 interconnecting the first plate and the second plate. In this embodiment, the first plate is a bottom plate 226 , and the second plate is a cover plate 222 . The cover plate 222 , the bottom plate 226 and the sidewall 224 cooperatively form a chamber 23 receiving the impeller 24 therein. The fan 20 defines an air outlet 2240 in the sidewall 224 , three first air inlets 2260 in the bottom plate 226 , and a second air inlet 2220 in the cover plate 222 . The air outlet 2240 is perpendicular to the first air inlets 2260 and the second air inlet 2220 , and the first air inlets 2260 align with the second air inlet 2220 . Ambient airflow flows into the fan 20 through the first air inlets 2260 and the second air inlet 2220 , and flows out of the fan 20 via the air outlet 2240 .

The bottom plate 226 includes a fixing seat 2262 at a center thereof. The impeller 24 is fixed on the fixing seat 2262 . The three first air inlets 2260 are around the fixing seat 2262 . The bottom plate 226 includes a horizontal first area 2264 and an inclined second area 2266 slantwise from the first area 2264 towards the cover plate 222 of the fan frame 22 . The first air inlets 2260 are defined in the first area 2264 . The second area 2266 extends from the air inlets 2260 along a direction away from the air inlets 2260 . The second area 2266 has a lateral side in connection with the sidewall 224 , and an opposite lateral side near the first air inlets 2260 . The sidewall 224 has a height near the first area 2264 larger than that near the second area 2266 . Therefore, a portion of the air outlet 2240 between the first area 2264 and the cover plate 2240 has a height larger than that of another portion of the air outlet 2240 between the second area 2266 and the cover plate 2240 .

The second air inlet 2220 is defined in a center of the cover plate 222 , opposite to the first air inlets 2260 in the bottom plate 226 . A plurality of protrusions 2242 protrude outward from a periphery of the sidewall 224 for mounting the fan 20 on the casing 10 of the electronic device 100 .

The casing 10 includes a first cover, a second cover and a side plate 18 between the first and second covers. In this embodiment, the first cover is a bottom cover 16 , and the second cover is a top cover 14 . A side plate 18 extends upwardly from an outer periphery of the bottom cover 16 as a single piece. The first air inlets 2260 of the fan 20 are located near the bottom cover 16 of the casing 10 . The second air inlet 2220 of the fan 20 is located near the top cover 14 of the casing 10 . Namely, the bottom cover 16 faces the bottom plate 226 of the fan 20 , and the top cover 14 faces the top plate 222 of the fan 20 . The air outlet 2240 of the fan 20 is oriented to the side plate 18 of the casing 10 . The bottom cover 16 extends upwardly and slantwise relative to a horizontal plane AA′ which is parallel to the top cover 14 as actual required. Such an arrangement, a first side, i.e. left side, of the casing 10 has a thickness larger than that of a second side, i.e. right side, of the casing 10 . A height H of the bottom cover 16 relative to the horizontal plane AA′ gradually increases from the left side of the casing 10 to the right side of the casing 10 . The bottom plate 226 of the fan 20 is located near but spaced from the bottom cover 16 of the casing 10 . The first area 2264 of the bottom plate 226 is located near the left side of the casing 10 . The second area 2266 of the bottom plate 226 is located near the right side of the casing 10 . A height h of the second area 2266 relative to the horizontal plane AA′ also gradually increases from the left side of the casing 10 to the right side of the casing 10 . A larger gap 30 between the second area 2266 of the fan 20 and the bottom cover 16 of the casing 10 is achieved, and substantially equal to a gap 40 between the first area 2264 of the fan 20 and the bottom cover 16 of the casing 10 in size.

According to the disclosure, since the height h of the second area 2266 of the fan 20 relative to the horizontal plane AA′ increases from the left side to the right side of the casing 10 , the gap 30 between the second area 2266 of the fan 20 and the bottom cover 16 of the casing 10 is not reduced even though the height H of the bottom cover 16 of the casing 10 relative to the horizontal plane AA′ increases from the left side to the right side of the casing 10 . This facilitates more airflow flowing into the first air inlets 2260 along the gap 30 . Thus, a heat dissipation efficiency of the electronic device 100 is improved.

It is believed that the embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.