Apparatus and methods for electronic amplification
Granted 4 Dec 2012 · 1 office action
Assignee: Analog Devices
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Marc Goldfarb · Examiner: Henry Choe · AU 2817 · TC 2800
Life of the application
8 dated eventsAbstract
Apparatus and methods for electronic amplification are provided. In one embodiment, a method includes providing a first differential amplification block, providing a second differential amplification block, electrically connecting the first and second differential amplification blocks in a stack between a first voltage reference and a second voltage reference, amplifying a first signal using the first differential amplification block, and amplifying a second signal using the second differential amplification block. A voltage difference between the first and second voltage references defines a power supply voltage, and the first differential amplification block operates over a first range of the power supply voltage and the second differential amplification block operates over a second range of the power supply voltage.
Description
12 parts›CROSS-REFERENCE TO RELATED APPLICATIONS
This application is related to commonly-owned U.S. patent application Ser. No. 12/407,148, filed Mar. 19, 2009, titled “WIDEBAND RF AMPLIFIERS,” and to commonly-owned U.S. patent application Ser. No. 12/473,697, filed May 28, 2009, titled “HIGH VOLTAGE AMPLIFICATION USING LOW BREAKDOWN VOLTAGE DEVICES.”
›BACKGROUND
1. Field
Embodiments of the invention relate to electronic devices, and more particularly, to amplifiers.
2. Description of the Related Technology
Certain electronic systems, such as mixers, modulators and/or demodulators, can include an amplifier for amplifying a relatively weak signal. For example, a local oscillator may be unable to generate a clock signal having a relatively large voltage swing over a wide range of frequencies, and an amplifier can be used to amplify the clock signal to generate an amplified clock signal.
Various operational parameters of an amplifier can impact the overall performance of an electronic system using the amplifier. For example, DC current consumption of the amplifier can impact overall energy efficiency of the system, while the third order intercept point (IP 3 ) of the system can be affected by the bandwidth of the amplifier. Furthermore, the common mode rejection ratio (CMRR), power conversion gain, spurious free dynamic range (SFDR), and/or various other parameters of the amplifier can impact the performance of the system.
There is a need for improved amplifiers. Furthermore, there is a need for amplifiers having reduced power consumption, increased bandwidth, and/or an improved CMRR.
›SUMMARY
In one embodiment, an apparatus includes a first stacked differential amplifier stage having a non-inverted input, an inverted input, a non-inverted output and an inverted output. The amplifier stages includes a first amplification subcircuit, a second amplification subcircuit, a third amplification subcircuit, and a fourth amplification subcircuit. The first and second amplification subcircuits are arranged as a first differential amplification block, and the third and fourth amplification subcircuits are arranged as a second differential amplification block. Each amplification subcircuit is configured to receive an input signal as an input and to generate an amplified version of the input signal as an output, and the first and second amplification subcircuits are electrically powered in the first differential amplification block and the third and fourth amplification subcircuits are electrically powered in the second differential amplification block such that the first and second amplification subcircuits operate from a first portion of a power supply voltage and the third and fourth amplification subcircuits operate from a second portion of the power supply voltage. The second portion of the power supply voltage is different from the first portion. The inputs of the first and fourth amplification subcircuits are electrically connected to the inverted input, and the inputs of the second and third amplification subcircuits are electrically connected to the non-inverted input. The outputs of the first and fourth amplification subcircuits are electrically connected to the one of the non-inverted output or the inverted output, and the outputs of the second and third amplification subcircuits are electrically connected to the other one of the inverted output or the non-inverted output.
In another embodiment, a method for amplifying a signal is provided. The method includes providing a first differential amplification block, providing a second differential amplification block, and electrically coupling the first and second differential amplification blocks in series between a first voltage reference and a second voltage reference. A voltage difference between the first and second voltage references defines a power supply voltage. The method further includes amplifying a first signal using the first differential amplification block and amplifying a second signal using the second differential amplification block. The first differential amplification block operates over a first range of the power supply voltage and the second differential amplification block operates over a second range of the power supply voltage, the second range different from the first range.
›BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic diagram of one example of an electronic system including an amplifier.
FIG. 2 is a schematic diagram of one example of an amplifier.
FIG. 3A is a schematic diagram of an amplifier in accordance with one embodiment.
FIG. 3B is a schematic diagram of an amplifier in accordance with another embodiment.
FIG. 4A is a circuit diagram of a differential stacked amplifier stage in accordance with one embodiment.
FIG. 4B is a circuit diagram of a differential stacked amplifier stage in accordance with another embodiment.
FIG. 4C is a circuit diagram of a differential stacked amplifier stage in accordance with yet another embodiment.
FIGS. 5A and 5B represent two parts of a single schematic diagram of an amplifier in accordance with another embodiment.
FIG. 6 is a circuit diagram of a portion of one example of a single-ended stacked amplifier stage.
FIG. 7 illustrates the results of a transient voltage simulation for one example of a differential stacked amplifier stage.
›DETAILED DESCRIPTION OF EMBODIMENTS · 1 of 8
The following detailed description of certain embodiments presents various descriptions of specific embodiments of the invention. However, the invention can be embodied in a multitude of different ways as defined and covered by the claims. In this description, reference is made to the drawings where like reference numerals indicate identical or functionally similar elements.
Overview of One Example of an Electronic System Including an Amplifier
FIG. 1 is a schematic diagram of one example of an electronic system 10 . The electronic system 10 includes an oscillator 2 , an amplifier 4 , and a mixer 8 .
The local oscillator 2 can be used to generate a clock signal CLK having a particular frequency. For example, the local oscillator 2 can be used to generate a clock signal CLK for down converting a radio frequency signal from a carrier frequency to an intermediate frequency. In one implementation, the clock signal CLK has a frequency ranging between about 10 MHz to about 5 GHz.
The illustrated electronic system 10 includes the amplifier 4 for amplifying the clock signal CLK generated by the oscillator 2 . For example, the clock signal CLK may not have an amplitude that is sufficient for use by the mixer 8 , and the amplifier 4 can be used to boost the amplitude of the clock signal CLK to a sufficient level. The amplifier 4 can alternatively be used for other functions in addition to amplification, such as the conversion of a single-ended signal to a differential signal. For example, the oscillator 2 and the mixer 8 can be disposed on separate integrated circuits (ICs) and may communicate over a single-ended interface, and the amplifier 4 can be used to convert a single-ended clock signal to generate an amplified differential clock signal suitable for use by the mixer 8 or other component of the electronic system 10 .
The amplifier 4 includes a positive or non-inverted input 3 a and a negative or inverted input 3 b , which collectively form a differential input. The amplifier 4 also includes a positive or non-inverted output 5 a and a negative or inverted output 5 b , which collectively form a differential output.
The non-inverted input 3 a of the amplifier 4 is configured to receive the clock signal CLK from the oscillator 2 , and the inverted input 3 b of the amplifier 4 is electrically connected to a first voltage reference V 1 . The amplifier 4 can amplify a difference between the clock signal CLK and the first voltage reference V 1 to generate a positive or non-inverted amplified clock signal LO P and a negative or inverted amplified clock signal LO N , which collectively form an amplified differential clock signal.
It can be desirable for the amplifier 4 to have a relatively high common mode rejection ratio (CMRR). For example, providing a relatively high CMRR for the amplifier 4 can aid in improving signal balance of a differential output signal when using the amplifier 4 to convert a single-ended input to a differential output.
The mixer 8 can receive a positive or non-inverted RF input signal RF P and a negative or inverted RF input signal RF N , which collectively form a differential RF input voltage. The mixer 8 can be configured to multiply the differential RF input voltage RF P , RF N by the amplified differential clock signal LO P , LO N to generate a non-inverted intermediate frequency signal IF P and an inverted intermediate frequency signal IF N , which collectively form a differential intermediate frequency signal. Although not illustrated in FIG. 1 , the differential intermediate frequency signal IF P , IF N can be provided to other components within the electronic system 10 and/or provided as outputs to the electronic system 10 .
FIG. 2 is a schematic diagram of one example of an amplifier 4 . The amplifier 4 includes a first stage 12 a , a second stage 12 b , a third stage 12 c , a non-inverted input 3 a , an inverted input 3 b , a non-inverted output 5 a , and an inverted output 5 b . The amplifier 4 can amplify a difference between a signal received on the non-inverted and inverted inputs 3 a , 3 b to generate an amplified signal on the non-inverted and inverted outputs 5 a , 5 b.
The first stage 12 a includes a non-inverted input and an inverted input electrically connected to the non-inverted and inverted inputs 3 a , 3 b , respectively. The first stage 12 a further includes a non-inverted output and an inverted output for providing first amplified non-inverted and inverted signals 9 a , 9 b , respectively. The first stage 12 a can amplify a difference between the non-inverted and inverted inputs 3 a , 3 b to generate the first amplified non-inverted and inverted signals 9 a , 9 b.
Similarly, the second stage 12 b includes a non-inverted input and an inverted input for receiving the first amplified non-inverted and inverted signals 9 a , 9 b , respectively. The second stage 12 b further includes a non-inverted output and an inverted output for providing second amplified non-inverted and inverted signals 11 a , 11 b , respectively. The second stage 12 b can amplify a difference between the first amplified non-inverted and inverted signals 9 a , 9 b to generate the second amplified non-inverted and inverted signals 11 a , 11 b . Likewise, the third stage 12 c includes a non-inverted input and an inverted input for receiving the second amplified non-inverted and inverted signals 11 a , 11 b , respectively. The third stage 12 c further includes a non-inverted output and an inverted output electrically connected to the non-inverted and inverted outputs 5 a , 5 b , respectively. The third stage 12 c can amplify a difference between the second amplified non-inverted and inverted signals 11 a , 11 b to generate a differential output signal on the non-inverted and inverted outputs 5 a , 5 b.
By using a plurality of amplifier stages, such as the amplifier stages 12 a - 12 c , a desired overall gain for the amplifier 4 can be achieved. For example, the gain from a single amplifier stage may be insufficient for certain applications, so a plurality of amplifier stages can be cascaded to obtain a desired overall gain. Additionally, using a plurality of stages in an amplifier can aid in increasing the input resistance and/or reducing the output resistance of the amplifier 4 relative to a design using a single stage. Furthermore, a plurality of amplifier stages can be used to raise the output signal of the amplifier 4 to a level where the output signal has a relatively small variation in response to variations in the DC voltage level at the input. Moreover, a plurality of amplifier stages can aid in generating a hard limited output voltage signal, such as a square wave, that is suitable for certain applications, such as rapid mixer switching. Additionally, the addition of differential amplifier stages at the input of amplifier 4 improves the overall CMRR of the amplifier. Although FIG. 2 illustrates a case in which three stages have been used, the amplifier 4 can include more or fewer stages.
›DETAILED DESCRIPTION OF EMBODIMENTS · 2 of 8
Overview of Amplifiers Including One or More Differential Stacked Amplifier Stages
In certain embodiments described herein, amplifiers having one or more differential stacked amplifier stages are provided. The differential stacked amplifier stages can include differential amplification blocks electrically connected in series between two voltage references. By stacking the differential amplification blocks in this manner, the differential amplification blocks can share all or part of a bias current. Additionally, stacking the differential amplification blocks permits the amplification blocks to operate over different ranges of voltage, which can aid in improving the bandwidth of the amplifier stage by reducing voltage swing and allowing the use of thin gate oxide transistors having a relatively small parasitic capacitance. For example, even when a power supply voltage has a magnitude greater than a breakdown voltage of a thin oxide transistor, each stacked differential amplification block can be configured to operate over a portion of the power supply voltage having a magnitude less than the breakdown voltage of the thin-oxide transistor.
FIG. 3A is a schematic diagram of an amplifier 20 in accordance with one embodiment. The amplifier 20 includes a first differential stacked amplifier stage 22 a and a second differential stacked amplifier stage 22 b . The first differential stacked amplifier stage 22 a includes a non-inverted input and an inverted input configured to operate as the non-inverted and inverted inputs 3 a , 3 b of the amplifier 20 , respectively. The first differential stacked amplifier stage 22 a further includes a non-inverted output and an inverted output for generating first amplified non-inverted and inverted signals 9 a , 9 b , respectively. The second stage 22 b includes a non-inverted input and an inverted input for receiving the first amplified non-inverted and inverted signals 9 a , 9 b , respectively. The second stage 22 b further includes a non-inverted output and an inverted output for generating second amplified non-inverted and inverted signals 11 a , 11 b , respectively. The second amplified non-inverted and inverted signals 11 a , 11 b can be used as outputs of the amplifier 20 or provided to another stage of the amplifier. Although the illustrated amplifier 20 includes two stages, persons having ordinary skill in the art will appreciate that the amplifier 20 can be modified to have more or fewer stages, including stages of the same and/or of a different type.
The first differential stacked amplifier stage 22 a includes a first plurality of capacitors 21 a - 21 d , a first plurality of amplification subcircuits 27 a - 27 d , and a second plurality of capacitors 23 a - 23 d . The second differential stacked amplifier stage 22 b includes a third plurality of capacitors 24 a - 24 d , a second plurality of amplification subcircuits 27 a - 27 d , and a fourth plurality of capacitors 25 a - 25 d . The first plurality of amplification subcircuits 27 a - 27 d includes a first amplification subcircuit 27 a , a second amplification subcircuit 27 b , a third amplification subcircuit 27 c , and a fourth amplification subcircuit 27 d . The first and second amplification subcircuits 27 a , 27 b operate as a first differential amplification block 29 a , while the third and fourth amplification subcircuits 27 c , 27 d operate as a second differential amplification block 29 b . Similarly, the second plurality of amplification subcircuits 28 a - 28 d includes a first amplification subcircuit 28 a , a second amplification subcircuit 28 b , a third amplification subcircuit 28 c , and a fourth amplification subcircuit 28 d . The first and second amplification subcircuits 28 a , 28 b operate as a first differential amplification block 31 a , while the third and fourth amplification 28 c , 28 d subcircuits operate as a second differential amplification block 31 b.
The first plurality of capacitors 21 a - 21 d includes a first capacitor 21 a , a second capacitor 21 b , a third capacitor 21 c , and a fourth capacitor 21 d . The first capacitor 21 a includes a first end electrically connected to the inverted input 3 b , and a second end electrically connected to an input of the first amplification subcircuit 27 a or IN 1 . The second capacitor 21 b includes a first end electrically connected to the non-inverted input 3 a , and a second end electrically connected to an input of the second amplification subcircuit 27 b or IP 1 . The third capacitor 21 c includes a first end electrically connected to the non-inverted input 3 a , and a second end electrically connected to an input of the third amplification subcircuit 27 c or IP 2 . The fourth capacitor 21 d includes a first end electrically connected to the inverted input 3 b , and a second end electrically connected to an input of the fourth amplification subcircuit 27 d or IN 2 .
The second plurality of capacitors 23 a - 23 d includes a first capacitor 23 a , a second capacitor 23 b , a third capacitor 23 c , and a fourth capacitor 23 d . The first capacitor 23 a includes a first end electrically connected to an output of the first amplification subcircuit 27 a or OP 1 . The second capacitor 23 b includes a first end electrically connected to an output of the second amplification subcircuit 27 b or ON 1 . The third capacitor 23 c includes a first end electrically connected to an output of the third amplification subcircuit 27 c or ON 2 . The fourth capacitor 23 d includes a first end electrically connected to an output of the fourth amplification subcircuit 27 d or OP 2 . The first capacitor 23 a further includes a second end electrically connected to a second end of the fourth capacitor 23 d to generate the first amplified non-inverted signal 9 a . The second capacitor 23 b further includes a second end electrically connected to a second end of the third capacitor 23 c to generate the first amplified inverted signal 9 b.
The amplification subcircuits 27 a - 27 d are electrically connected in a stack between a first voltage reference V 1 and a second voltage reference V 2 . The first and second voltage references V 1 , V 2 can be, for example, positive and negative voltage references, respectively, and a difference between the voltage references V 1 , V 2 can represent a power supply voltage. In another example, the first voltage reference V 1 can correspond to a positive voltage, and the second voltage reference V 2 can correspond to ground. The first and second amplification subcircuits 27 a , 27 b can operate as a first differential amplification block 29 a , and the third and fourth amplification subcircuits 27 c , 27 d can operate as a second differential amplification block 29 b , and the first and second differential amplification blocks 29 a , 29 b can be electrically connected in series between the first and second voltage references V 1 , V 2 . Thus, the first and second amplification subcircuits 27 a , 27 b can be positioned above the third and fourth amplification subcircuits 27 c , 27 d , such that the first and second amplification subcircuits 27 a , 27 b operate over a first portion of the power supply voltage and the third and fourth amplification subcircuits 27 c , 27 d operate over a second portion of the power supply voltage. By stacking the amplification subcircuits 27 a - 27 d in this manner, power consumption can be reduced and a relatively high common mode rejection ratio (CMRR) can be achieved, as will be described in detail below.
›DETAILED DESCRIPTION OF EMBODIMENTS · 3 of 8
The third plurality of capacitors 24 a - 24 d includes a first capacitor 24 a , a second capacitor 24 b , a third capacitor 24 c , and a fourth capacitor 24 d . The first capacitor 24 a includes a first end electrically connected to the first inverted amplified signal 9 b and a second end electrically connected to an input of the first amplification subcircuit 28 a or IN 1 . The second capacitor 24 b includes a first end electrically connected to the first non-inverted amplified signal 9 a and a second end electrically connected to an input of the second amplification subcircuit 28 b or IP 1 . The third capacitor 24 c includes a first end electrically connected to the first non-inverted amplified signal 9 a and a second end electrically connected to an input of the third amplification subcircuit 28 c or IP 2 . The fourth capacitor 24 d includes a first end electrically connected to the inverted amplified signal 9 b and a second end electrically connected to an input of the fourth amplification subcircuit 28 d or IN 2 .
The fourth plurality of capacitors 25 a - 25 d includes a first capacitor 25 a , a second capacitor 25 b , a third capacitor 25 c , and a fourth capacitor 25 d . The first capacitor 25 a includes a first end electrically connected to an output of the first amplification subcircuit 28 a or OP 1 . The second capacitor 25 b includes a first end electrically connected to an output of the second amplification subcircuit 28 b or ON 1 . The third capacitor 25 c includes a first end electrically connected to an output of the third amplification subcircuit 28 c or ON 2 . The fourth capacitor 25 d includes a first end electrically connected to an output of the fourth amplification subcircuit 28 d or OP 2 . The first capacitor 25 a further includes a second end electrically connected to a second end of the fourth capacitor 25 d to generate the second non-inverted amplified signal 11 a . The second capacitor 25 b further includes a second end electrically connected to a second end of the third capacitor 25 c to generate the second inverted amplified signal 11 b.
The amplification subcircuits 28 a - 28 d can be arranged in a stack between the first voltage reference V 1 and the second voltage reference V 2 , as was described above. The difference between the first and second voltage references V 1 , V 2 can define a power supply voltage of the amplification subcircuits 28 a - 28 d . Additionally, the first and second amplification subcircuits 28 a , 28 b can operate as a first differential amplification block 31 a , and the third and fourth amplification subcircuits 28 c , 28 d can operate as a second differential amplification block 31 b . The first and second amplification subcircuits 28 a , 28 b can be positioned above the third and fourth amplification subcircuits 28 c , 28 d in a stack such that the first and second amplification subcircuits 28 a , 28 b operate over a first portion of the power supply voltage and the third and fourth amplification subcircuits 28 c , 28 d operate over a second portion of a power supply voltage. For example, the first and second amplification subcircuits 28 a , 28 b can operate over a portion of the power supply voltage ranging between about the voltage of the second voltage reference V 2 to about half the difference between the voltage of the first and second voltage references V 1 , V 2 , and the third and fourth amplification subcircuits 28 c , 28 d can operate over a portion of the power supply voltage ranging between about the voltage of the first voltage reference V 1 and about half the difference between the voltage of the first and second voltage references V 1 , V 2 .
Providing differential stacked amplifier stages can aid in increasing the dynamic range of the amplifier 4 ( FIG. 2 ), thereby aiding in amplifying signals in a noisy environment. Additionally, as will be described in detail below, by stacking the amplifier stages, the DC current consumed in biasing the amplifier stages can be reduced relative to a configuration in which stages are not stacked.
Although FIG. 3A illustrates a case where the non-inverted and inverted outputs of the first differential stacked amplifier stage 22 a are electrically connected to the non-inverted and inverted inputs of the second differential stacked amplifier stage 22 b , respectively, in an alternative configuration, the non-inverted and inverted outputs of the first differential stacked amplifier stage 22 a can be electrically connected to the inverted and non-inverted inputs of the second differential stacked amplifier stage 22 b , respectively.
FIG. 3B is a schematic diagram of an amplifier 30 in accordance with another embodiment. The amplifier 30 includes a first differential stacked amplifier stage 32 a and a second differential stacked amplifier stage 32 b . The first differential stacked amplifier stage 32 a includes a non-inverted input and an inverted input configured to operate as non-inverted and inverted inputs 3 a , 3 b of the amplifier 30 , respectively. The first differential stacked amplifier stage 32 a further includes outputs for generating first amplified non-inverted signals 13 b , 13 c and for generating first amplified inverted signals 13 a , 13 d . The second stage 32 b includes non-inverted inputs for receiving the first amplified non-inverted signals 13 a , 13 d and inverted inputs for receiving the first amplified inverted signals 13 b , 13 c . The second stage 32 b further includes a non-inverted output and an inverted output for providing second amplified non-inverted and inverted signals 11 a , 11 b , respectively.
The first differential stacked amplifier stage 32 a includes a first plurality of capacitors 21 a - 21 d , a first plurality of amplification subcircuits 27 a - 27 d , and a second plurality of capacitors 26 a - 26 h . The second differential stacked amplifier stage 32 b includes a second plurality of amplification subcircuits 28 a - 28 d and a third plurality of capacitors 25 a - 25 d . The first plurality of amplification subcircuits 27 a - 27 d and the second plurality of amplification subcircuits 28 a - 28 d can each be electrically connected in a stack as was described above with respect to the amplifier 20 of FIG. 3A . However, in contrast to the amplifier 20 of FIG. 3A , the amplifier 30 of FIG. 3B has used a different arrangement of capacitors to provide inter-stage coupling between the amplifier stages. For example, the differential stacked amplifier stages 22 a , 22 b of FIG. 3A have been electrically coupled using capacitors arranged in a star configuration, while the differential stacked amplifier stages 32 a , 32 b of FIG. 3B have been electrically coupled using capacitors arranged in a bridge configuration, as will be described below.
›DETAILED DESCRIPTION OF EMBODIMENTS · 4 of 8
The second plurality of capacitors 26 a - 26 h includes a first capacitor 26 a , a second capacitor 26 b , a third capacitor 26 c , a fourth capacitor 26 d , a fifth capacitor 26 e , a sixth capacitor 26 f , a seventh capacitor 26 g , and an eighth capacitor 26 h.
The output of the first amplification subcircuit 27 a is electrically connected to a first end of the first third capacitor 26 c and to a first end of the fifth capacitor 26 e , while the output of the second amplification subcircuit 27 b is electrically connected to a first end of the first capacitor 26 a and to a first end of the seventh capacitor 26 g . The output of the third amplification subcircuit 27 c is electrically connected to a first end of the second capacitor 26 b and to a first end of the eighth capacitor 26 h , while the output of the fourth amplification subcircuit 27 d is electrically connected to a first end of the fourth capacitor 26 d and to a first end of the sixth capacitor 26 f.
The first capacitor 26 a further includes a second end electrically connected to a second end of the second capacitor 26 b to generate the inverted amplified signal 13 a , which has been provided to the input of the first amplification subcircuit 28 a or IN 1 . The third capacitor 26 c further includes a second end electrically connected to a second end of the fourth capacitor 26 d to generate the non-inverted amplified signal 13 b , which has been provided to the input of the second amplification subcircuit 28 b or IP 1 . Similarly, the fifth capacitor 26 e further includes a second end electrically connected to a second end of the sixth capacitor 26 f to generate the non-inverted amplified signal 13 c , which has been provided to the input of the third amplification subcircuit 28 c or IP 2 . The seventh capacitor 26 g further includes a second end electrically connected to a second end of the eighth capacitor 26 h to generate the inverted amplified signal 13 d , which has been provided to the input of the fourth amplification subcircuit 28 d or IN 2 .
As illustrated by FIGS. 3A-3B , amplifier stages can be electrically coupled using a variety of techniques. Persons having ordinary skill in the art will appreciate that the stages can be electrically coupled using any suitable technique. Additional details of the amplifier 30 of FIG. 3B can be similar to those described above with respect to the amplifier 20 of FIG. 3A .
FIG. 4A is a circuit diagram of a differential stacked amplifier stage 40 in accordance with one embodiment. The differential stacked amplifier stage 40 includes a first amplification subcircuit 37 a , a second amplification subcircuit 37 b , a third amplification subcircuit 37 c , a fourth amplification subcircuit 37 d , and a bias circuit 50 .
The first amplification subcircuit 37 a includes a first PMOS transistor 41 , a first NMOS transistor 46 and a first resistor 51 , and the second amplification subcircuit 37 b includes a second PMOS transistor 42 , a second NMOS transistor 47 , and a second resistor 52 . The third amplification subcircuit 37 c includes a third PMOS transistor 43 , a third NMOS transistor 48 , and a third resistor 53 , and the fourth amplification subcircuit 37 d includes a fourth PMOS transistor 44 , a fourth NMOS transistor 49 , and a fourth resistor 54 . Each PMOS and NMOS transistor 41 - 44 , 46 - 49 includes a gate, a drain and a source.
The gate of the first PMOS transistor 41 is electrically connected to a first end of the first resistor 51 and to the gate of the first NMOS transistor 46 at the input of the first amplification subcircuit 37 a or IN 1 . The drain of the first PMOS transistor 41 is electrically connected to a second end of the first resistor 51 and to the drain of the first NMOS transistor 46 at the output of the first amplification subcircuit 37 a or OP 1 . Similarly, the gate of the second PMOS transistor 42 is electrically connected to a first end of the second resistor 52 and to the gate of the second NMOS transistor 47 at the input of the second amplification subcircuit 37 b or IP 1 . The drain of the second PMOS transistor 42 is electrically connected to a second end of the second resistor 52 and to the drain of the second NMOS transistor 47 at the output of the second amplification subcircuit 37 b or ON 1 . The gate of the third PMOS transistor 43 is electrically connected to a first end of the third resistor 53 and to the gate of the third NMOS transistor 48 at the input of the third amplification subcircuit 37 c or IP 2 . The drain of the third PMOS transistor 43 is electrically connected to a second end of the third resistor 53 and to the drain of the third NMOS transistor 48 at the output of the third amplification subcircuit 37 c or ON 2 . Similarly, the gate of the fourth PMOS transistor 44 is electrically connected to a first end of the fourth resistor 54 and to the gate of the fourth NMOS transistor 49 at the input of the fourth amplification subcircuit 37 d or IN 2 . The drain of the fourth PMOS transistor 44 is electrically connected to a second end of the fourth resistor 54 and to the drain of the fourth NMOS transistor 49 at the output of the fourth amplification subcircuit 37 d or OP 2 .
The sources of the first and second PMOS transistors 41 , 42 are electrically connected to the bias circuit 50 at a first node labeled N 1 , and the sources of the third and fourth NMOS transistors 48 , 49 are electrically connected to the bias circuit 50 at a second node labeled N 2 . Additionally, the sources of the first and second NMOS transistors 46 , 47 are electrically connected to the sources of the third and fourth PMOS transistors 43 , 44 at a third node labeled N 3 .
The bias circuit 50 can be electrically connected between the first and second voltage references V 1 , V 2 , and can be configured to bias the amplification subcircuits 37 a - 37 d by generating a bias current I BIAS from the node N 1 to the node N 2 . The nodes N 1 -N 3 can each have a DC bias voltage suitable to permit the first and second amplification subcircuits 37 a , 37 b to operate over a first range of voltage, and to permit the third and fourth amplification subcircuits 37 c , 37 d to operate over a second range of voltage. In one implementation, the difference between the first and second voltage references V 2 , V 1 is in the range of about 2.5 V to about 5 V, and the first node N 1 is biased at a DC voltage ranging between about 1.375 V to about 3.75 V, the second node N 2 is biased at a DC voltage ranging between about 0.625 V to about 1.25 V, and the third node N 3 is biased at a DC voltage ranging between about 1.25 V to about 2.5 V.
›DETAILED DESCRIPTION OF EMBODIMENTS · 5 of 8
The illustrated amplification subcircuits have been electrically connected in a stack. By stacking the amplification subcircuits 37 a - 37 d , the amplification subcircuits 37 c , 37 d can share the bias circuit I BIAS with the amplification subcircuits 37 a , 37 b , thereby reducing DC current draw of the amplifier stage. Additionally, stacking the amplification subcircuits can provide a variety of additional benefits, such as permitting the use of transistors having a relatively thin gate oxide and breakdown voltage, which can have less capacitance and operate over a wider band of frequencies compared to thick gate oxide transistors. To aid in providing similar operation for the amplification subcircuits in both the top and bottom of the stack, in certain implementations the NMOS and PMOS transistors can have bodies biased at similar voltages. For example, the bodies of PMOS transistors 41 - 44 can be electrically connected to the sources of the PMOS transistors 41 - 44 , respectively, and a triple well or other suitable process can be used to electrically connect the bodies of the first and second NMOS transistors 46 , 47 to the node N 3 and the bodies of the third and fourth NMOS transistors 48 , 49 to the node N 2 .
The resistors 51 - 54 can aid in biasing the amplification subcircuits 37 a - 37 d , respectively. For example, the first resistor 51 can be electrically connected between the input and the output of the first amplification subcircuit 37 a , thereby permitting the input and output of the first amplification subcircuit 37 a to have about the same DC bias voltage. Biasing the amplification subcircuits in this manner can aid in providing amplification subcircuits that can be self-biasing, which can aid in operating the amplification subcircuits across different voltage ranges of a power supply voltage.
Although not illustrated in FIG. 4A , the differential stacked amplifier stage 40 can include additional circuit elements, such as capacitors for coupling the differential stacked amplifier stage 40 to other circuitry. For example, capacitors can aid in biasing the amplification subcircuits 37 a - 37 d , while permitting relatively high-frequency signals to reach the inputs of the amplification subcircuits and/or combine at the outputs of the amplification subcircuits to achieve the desired electrical connectivity of the amplifier stage.
In certain implementations, the input impedance of the bias circuit 50 at the nodes N 1 and N 2 can be relatively high. Configuring the bias circuit 50 to have a relatively high input impedance at the nodes N 1 and N 2 can aid in improving the common mode rejection ratio (CMRR) of the amplifier by reducing a variation of the bias current I BIAS with respect to a change in common mode input voltage.
FIG. 4B is a circuit diagram of a differential stacked amplifier stage 55 in accordance with another embodiment. The differential stacked amplifier stage 55 includes a first amplification subcircuit 37 a , a second amplification subcircuit 37 b , a third amplification subcircuit 37 c , and a fourth amplification subcircuit 37 d , as was described above with respect to FIG. 4A . Additionally, the differential stacked amplifier stage 55 includes PMOS bias transistors 61 , 62 , NMOS bias transistors 64 , 65 , bias resistors 66 - 69 , and a current source 70 for biasing the amplification subcircuits 37 a - 37 d . The PMOS and NMOS bias transistors 61 , 62 , 64 , 65 each include a gate, a drain, and a source.
The first bias resistor 66 includes a first end electrically connected to the second voltage reference V 2 , and a second end electrically connected to the source of the first PMOS bias transistor 61 . The gate and drain of the first PMOS bias transistor 61 are electrically connected to a first end of the current source 70 and to the gate of the second PMOS bias transistor or PMOS mirroring transistor 62 . The second bias resistor 67 includes a first end electrically connected to the second voltage reference V 2 and a second end electrically connected to the source of the second PMOS bias transistor 62 . The drain of the second PMOS bias transistor 62 is electrically connected to the first node N 1 .
The third bias resistor 68 includes a first end electrically connected to the first voltage reference V 1 , and a second end electrically connected to the source of the first NMOS bias transistor 64 . The gate and drain of the first NMOS bias transistor 64 are electrically connected to a second end of the current source 70 and to the gate of the second NMOS bias transistor or NMOS mirroring transistor 65 . The fourth bias resistor 69 includes a first end electrically connected to the first voltage reference V 1 , and a second end electrically connected to the source of the second NMOS bias transistor 65 . The drain of the second NMOS bias transistor 65 is electrically connected the second node N 2 .
The bias resistors 66 - 69 , NMOS bias transistors 64 , 65 , PMOS bias transistors 61 , 62 , and current source 70 can operate as a bias circuit for the amplification subcircuits 37 a - 37 d . For example, the current source 70 can generate a current that can be mirrored using PMOS bias transistors 61 , 62 and NMOS bias transistors 64 , 65 to generate a bias current I BIAS for biasing amplification subcircuits 37 a - 37 d . For example, a portion I 1 of the bias current I BIAS can be used to bias the first amplification subcircuit 37 a , while a portion I 2 of the bias current I BIAS can be used to bias the second amplification subcircuit 37 b . As illustrated in FIG. 4B , the current I BIAS can also be used to bias the third and fourth amplification subcircuits 37 c , 37 d . For example, the currents I 1 and I 2 can combine at the node N 3 and can be used to generate the currents I 3 and I 4 for biasing the third and fourth amplification subcircuits 37 c , 37 d , respectively.
As illustrated in FIG. 4B , by stacking the amplification subcircuits 37 a - 37 d , a reduction in DC bias current can be achieved relative to a scheme in which the amplification subcircuits are not stacked and separate bias currents and/or biasing circuits are used.
›DETAILED DESCRIPTION OF EMBODIMENTS · 6 of 8
FIG. 4C is a circuit diagram of a differential stacked amplifier stage 80 in accordance with yet another embodiment. The differential stacked amplifier stage 80 includes a first amplification subcircuit 37 a , a second amplification subcircuit 37 b , a third amplification subcircuit 37 c , and a fourth amplification subcircuit 37 d , as was described above with respect to FIGS. 4A-4B . Additionally, the differential stacked amplifier stage 80 includes first and second bias resistors 81 , 82 for biasing the amplification subcircuits 37 a - 37 d . The differential stacked amplifier stage 80 includes a relatively simple biasing scheme using the first and second bias resistors 81 , 82 , and thus can have less biasing components and almost the same performance as the differential stacked amplifier stages of FIGS. 4A-4B .
The first bias resistor 81 includes a first end electrically connected to the second voltage reference V 2 and a second end electrically connected to the first node N 1 . The second bias resistor 82 includes a first end electrically connected to the first voltage reference V 1 and a second end electrically connected to the second node N 2 . The first and second bias resistors 81 , 82 can aid in biasing the amplification subcircuits 37 a - 37 d by generating a bias current I BIAS and establishing a DC bias voltage for the first and second nodes N 1 , N 2 . In certain implementations, the first and second bias resistors 81 , 82 can operate as a bias circuit having a reduced component count and complexity relative to certain other bias circuits.
FIGS. 5A and 5B represents two parts of a single schematic diagram of an amplifier 90 in accordance with another embodiment. The amplifier 90 includes a first differential stacked amplifier stage 22 a , a second differential stacked amplifier stage 22 b , a first single-ended stacked amplifier stage 91 a , a second single-ended stacked amplifier stage 91 b , a third single-ended stacked amplifier stage 91 c , capacitors 98 a - 98 d and the resistors 99 a , 99 b . The first differential stacked amplifier stage 22 a can be electrically coupled to non-inverted and inverted inputs 3 a , 3 b of the amplifier 20 , and can generate first amplified non-inverted and inverted signals 9 a , 9 b . The second differential stacked amplifier stage 22 b can amplify the first amplified non-inverted and inverted signals 9 a , 9 b to generate the second amplified non-inverted and inverted signals 11 a , 11 b . Additional details of the first and second differential stacked amplifier stages 22 a , 22 b can be as described above with respect to FIG. 3A . The single-ended stacked amplifier stages 91 a - 91 c are cascaded end-to-end in series, with the first stacked amplifier stage 91 a receiving the second amplified non-inverted and inverted signals 11 a , 11 b , and the third stacked amplifier stage 91 c electrically coupled to the non-inverted and inverted outputs 5 a , 5 b of the amplifier 90 .
The first single-ended stacked amplifier stage 91 a includes capacitors 92 a - 92 d , amplification subcircuits 101 a , 101 b , and amplification subcircuits 102 a , 102 b . The second single-ended stacked amplifier stage 91 b includes capacitors 94 a - 94 d , amplification subcircuits 104 a , 104 b , and amplification subcircuits 105 a , 105 b . The third single-ended stacked amplifier stage 91 b includes capacitors 96 a - 96 d , amplification subcircuits 108 a , 108 b , and amplification subcircuits 109 a , 109 b.
The capacitor 92 a includes a first end configured to receive the inverted amplified signal 11 b , and a second end electrically connected to an input of the amplification subcircuit 101 a . The capacitor 92 b includes a first end configured to receive the non-inverted amplified signal 11 a , and a second end electrically connected to an input of the amplification subcircuit 101 b . The capacitor 92 c includes a first end configured to receive the non-inverted amplified signal 11 a , and a second end electrically connected to an input of the amplification subcircuit 101 c . The capacitor 92 d includes a first end configured to receive the inverted amplified signal 11 b , and a second end electrically connected to an input of the amplification sub circuit 101 d.
The amplification subcircuits 101 a , 101 b are electrically connected in a stack between the voltage reference V 2 and the voltage reference V 1 . A difference between the first and second voltage references V 1 , V 2 can define a power supply voltage, and the amplification subcircuit 101 a can operate over a first range of the power supply voltage while the amplification subcircuit 101 b can operate over a second range of the power supply voltage. Similarly, the amplification subcircuits 102 a , 102 b are electrically connected in a stack between the first and second voltage references V 1 , V 2 , and the amplification subcircuit 102 a can operate over the first range of the power supply voltage and the amplification subcircuit 102 b can operate over the second range of the power supply voltage. Additional details of the amplification subcircuits can be as described below with reference to FIG. 6 .
The capacitors 94 a - 94 d each include a first end electrically connected to an output of the amplification subcircuits 101 a , 101 b , 102 a , 102 b , respectively, and a second end electrically connected to an input of the amplification subcircuits 104 a , 104 a , 105 a , 105 b , respectively. Similarly, the capacitors 96 a - 96 d each include a first end electrically connected to an output of the amplification subcircuits 104 a , 104 b , 105 a , 105 b , respectively, and a second end electrically connected to an input of the amplification subcircuits 108 a , 108 b , 109 a , 109 b , respectively. The capacitors 98 a - 98 d each include a first end electrically connected to an output of the amplification subcircuits 108 a , 108 b , 109 a , 109 b , respectively. The capacitor 98 a includes a second end electrically connected to a second end of the capacitor 98 d , to a first end of the resistor 99 a , and to the non-inverted output 5 a . The capacitor 98 b includes a second end electrically connected to a second end of the capacitor 98 c , to a first end of the resistor 99 b , and to the inverted output 5 b . The resistor 99 a further includes a second end electrically connected to a second end of the resistor 99 b to generate a common mode voltage output 100 , which can have a voltage level equal to about the magnitude of the common mode voltage of the non-inverted and inverted outputs 5 a , 5 b.
›DETAILED DESCRIPTION OF EMBODIMENTS · 7 of 8
The illustrated amplifier 90 includes a plurality of differential stacked amplifier stages 22 a , 22 b cascaded in an amplification chain with a plurality of single-ended stacked amplifier stages 91 a - 91 c . As illustrated in FIGS. 5A and 5B , the differential stacked amplifier stages 22 a , 22 b have been used as first and second stages of the amplifier 90 , and the single-ended stacked amplifier stages 91 a - 91 c have been used as third, fourth, and fifth stages of the amplifier 90 , respectively. In certain implementations, one or more differential stacked amplifier stages are provided before one or more single-ended stacked amplifier stages in a chain of amplifier stages. For example, a differential stacked amplifier stage can be provided as a first stage of an amplifier, and a single-ended stacked amplifier stage can be provided as a final stage of an amplifier. Since differential stacked amplifier stages can have a relatively greater common mode rejection ratio (CMRR) relative to single-ended stacked amplifier stages, using one or more differential stacked amplifier stage as input stages of an amplifier can aid in improving the CMRR of the amplifier. Additionally, since the DC current consumption and/or circuit area of a single-ended stacked amplifier stage can be less than that of a differential stacked amplifier stage having a similar gain, providing one or more single-ended stacked amplifier stages after the one or more differential stacked amplifier stages can aid in achieving a desired overall gain of the amplifier while reducing current consumption and/or circuit area relative to a design using only differential stacked amplifier stages. Furthermore, the combination of differential and single-ended stacked amplified stages can be used to provide a hard limited output voltage signal, such as a square wave suitable for switching a mixer, while maintaining a relatively high CMRR and a relatively small current relative to conventional schemes used to provide hard limited output voltage signals. Additionally, the inclusion of differential amplifier stages at the input of amplifier 90 improves the overall CMRR of the amplifier.
FIG. 6 is a circuit diagram of one example of a portion of a single-ended stacked amplifier stage 110 . The illustrated circuit includes a first amplification subcircuit 113 a , a second amplification subcircuit 113 b , a first bias resistor 120 , and a second bias resistor 121 . The circuit shown in FIG. 6 can be used, for example, in the first, second, and third single-ended stacked amplifier stages 91 a - 91 c of FIGS. 5A and 5B .
The first amplification subcircuit 113 a includes a first PMOS transistor 111 , a first NMOS transistor 114 , and a first resistor 118 . The second amplification subcircuit 113 b includes a second PMOS transistor 112 , a second NMOS transistor 115 , and a second resistor 119 . The first and second PMOS transistors 111 , 112 and the first and second NMOS transistors 114 , 115 each include a gate, a drain, and a source.
The gate of the first PMOS transistor 111 is electrically connected to a first end of the first resistor 118 and to the gate of the first NMOS transistor 114 at the input of the first amplification subcircuit 113 a or IP. The drain of the first PMOS transistor 111 is electrically connected to a second end of the first resistor 118 and to the drain of the first NMOS transistor 114 at the output of the first amplification subcircuit 113 a or ON. Similarly, the gate of the second PMOS transistor 112 is electrically connected to a first end of the second resistor 119 and to the gate of the second NMOS transistor 115 at the input of the second amplification subcircuit 113 b or IN. The drain of the second PMOS transistor 112 is electrically connected to a second end of the second resistor 119 and to the drain of the second NMOS transistor 115 at the output of the second amplification subcircuit 113 b or OP.
The source of the first PMOS transistor 111 is electrically connected to a first end of the first bias resistor 120 . The first bias resistor 120 further includes a second end electrically connected to the second voltage reference V 2 . The source of the second NMOS transistor 115 is electrically connected to a first end of the second bias resistor 121 . The second bias resistor 121 further includes a second end electrically connected to the first voltage reference V 1 . To aid in providing similar operation for the amplification subcircuits in both the top and bottom of the stack, in certain implementations the NMOS and PMOS transistors can have bodies biased at similar voltages. For example, the bodies of PMOS transistors 111 , 112 can be electrically connected to the sources of the PMOS transistors 111 , 112 , respectively, and a triple well or other suitable process can be used to electrically connect the body of the first NMOS transistor 114 to the source of the first NMOS transistor 114 and to electrically connect the body of the second NMOS transistor 115 to the source of the second NMOS transistor 115 .
FIG. 7 illustrates the results of a transient voltage simulation 130 for one example of a differential stacked amplifier stage. The simulation 130 includes first through seventh waveforms 131 - 137 . The simulation 130 can correspond to one implementation of the differential stacked amplifier stage 40 of FIG. 4A . For example, the first waveform 131 can correspond to a waveform of the node N 1 , the second waveform 132 can correspond to a waveform of the output of the first amplification subcircuit 37 a or OP 1 , the third waveform 133 can correspond to a waveform of the output of the second amplification subcircuit 37 b or ON 1 , the fourth waveform 134 can correspond to a waveform of the node N 3 , the fifth waveform 135 can correspond to a waveform of the output of the third amplification subcircuit 37 c or ON 2 , the sixth waveform 136 can correspond to a waveform of the output of the fourth amplification subcircuit 37 d or OP 2 , and the seventh waveform 137 can correspond to a waveform of the node N 2 . As illustrated in FIG. 7 , the first and second amplification subcircuits can operate over a first range of voltage 140 and the third and fourth amplification subcircuits can operate over a second range of voltage 141 .
›DETAILED DESCRIPTION OF EMBODIMENTS · 8 of 8
The foregoing description and claims may refer to elements or features as being “connected” or “coupled” together. As used herein, unless expressly stated otherwise, “connected” means that one element/feature is directly or indirectly connected to another element/feature, and not necessarily mechanically. Likewise, unless expressly stated otherwise, “coupled” means that one element/feature is directly or indirectly coupled to another element/feature, and not necessarily mechanically. Thus, although the various schematics shown in the figures depict example arrangements of elements and components, additional intervening elements, devices, features, or components may be present in an actual embodiment (assuming that the functionality of the depicted circuits is not adversely affected).
Applications
Devices employing the above described schemes can be implemented into various electronic devices. For example, amplifiers having stacked amplification subcircuits can be used in wireless infrastructure for cellular base stations and/or in circuits for radio links, receiver mixer chains, digital predistortion transmitter observation receivers, and/or other RF applications. Examples of the electronic devices can also include consumer electronic products, parts of the consumer electronic products, electronic test equipment, memory chips, memory modules, circuits of optical networks or other communication networks, and disk driver circuits. The consumer electronic products can include, but are not limited to, a mobile phone, a telephone, a television, a computer monitor, a computer, a hand-held computer, a personal digital assistant (PDA), a microwave, a refrigerator, an automobile, a stereo system, a cassette recorder or player, a DVD player, a CD player, a VCR, an MP3 player, a radio, a camcorder, a camera, a digital camera, a portable memory chip, a washer, a dryer, a washer/dryer, a copier, a facsimile machine, a scanner, a multi functional peripheral device, a wrist watch, a clock, a global positioning system (GPS) device, a remote control device, a wireless network terminal, etc. Further, the electronic device can include unfinished products.
Although this invention has been described in terms of certain embodiments, other embodiments that are apparent to those of ordinary skill in the art, including embodiments that do not provide all of the features and advantages set forth herein, are also within the scope of this invention. Moreover, the various embodiments described above can be combined to provide further embodiments. In addition, certain features shown in the context of one embodiment can be incorporated into other embodiments as well. Accordingly, the scope of the present invention is defined only by reference to the appended claims.
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