Stress tolerant differential colpitts voltage controlled oscillators
Granted 25 Oct 2011 · 2 office actions
Current assignee: MARVELL ASIA PTE, LTD. · originally Marvell Technology Group Ltd.
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Inventors: Belal Helal, Chuan-Cheng Cheng, Himanshu Arora · Examiner: Levi Gannon · AU 2817 · TC 2800
Life of the application
13 dated eventsAbstract
Some of the embodiments of the present disclosure provide an apparatus comprising a voltage controlled oscillator (VCO) having a first transistor, a first resistor operatively coupled between a first terminal of the first transistor and a first node, a first capacitor operatively coupled between a second terminal of the first transistor and the first node, and a second capacitor operatively coupled to the first node, wherein the first capacitor and the second capacitor forms a capacitive voltage divider. Other embodiments are also described and claimed.
Description
8 parts›CROSS REFERENCE TO RELATED APPLICATIONS
The present application claims priority to U.S. Patent Application No. 61/086,976, filed Aug. 7, 2008, entitled “STRESS TOLERANT LOW VOLTAGE COLPITTS VOLTAGE CONTROLLED OSCILLATOR,” the entire specification of which is hereby incorporated by reference in its entirety for all purposes, except for those sections, if any, that are inconsistent with this specification.
›TECHNICAL FIELD
Embodiments of the present invention relate to voltage controlled oscillators (VCOs), and more specifically to differential colpitts VCOs.
›BACKGROUND
FIG. 1 schematically illustrates an exemplary differential colpitts voltage controlled oscillator (VCO) 100 . The differential colpitts VCO 100 is generally well known to those skilled in the art. The VCO 100 of FIG. 1 may include differential pair transistors T 1 and T 2 , and a tank of inductors L 1 and L 2 and varactors C 3 and C 4 . The transistor pair T 1 and T 2 may be cross coupled such that the drain of one transistor is operatively coupled to the gate of the other transistor. The transistors T 1 and T 2 may be biased by respective bias current sources I bias1 and I bias2 . The drain terminals of transistors T 1 and T 2 may form the two output terminals O/P 1 and O/P 2 of the VCO 100 . The source terminals of transistors T 1 and T 2 may be operatively coupled to nodes 122 and 124 , respectively. A resonator circuit of the VCO 100 may include the series of inductors L 1 and L 2 and the series of varactor C 3 and C 4 . A supply voltage Vdd (operatively coupled at the centre tap of the inductors L 1 and L 2 ) and a control voltage Vcontrol (operatively coupled in between the varactors C 3 and C 4 ) may control the output voltage swing and frequency.
The VCO 100 may also include capacitors C 11 and C 12 that form a capacitive voltage divider, where capacitor C 11 may be operatively coupled to node 122 and drain terminal of the transistor T 1 , and capacitor C 12 may be operatively coupled between node 122 and the ground. Similarly, capacitors C 21 and C 22 may form a capacitive voltage divider, where capacitor C 21 may be operatively coupled to node 124 and drain terminal of the transistor T 2 , and capacitor C 22 may be operatively coupled between node 124 and the ground.
For some applications, it may be desirable that the output voltage of the VCO 100 has a relatively higher voltage swing. For a given frequency, higher output voltage swing may increase a slew rate of the output voltage, and thus may result in relatively lower phase noise. An increase in the output voltage swing may be achieved, for example, by increasing the supply voltage Vdd, appropriately tuning one or more inductors and/or capacitors of VCO 100 , and/or the like.
Also, with improvements in integration of semiconductor devices and developments in semiconductor manufacturing technology, thin oxide based low voltage devices are increasingly used in various applications. For example, thin oxide based low voltage transistors are increasingly used in radio frequency (RF) applications, which may require the transistors to operate at GHz frequencies. To ensure faster switching at GHz frequencies, the transistors T 1 and T 2 may be low voltage thin oxide transistors, i.e., may operate at a relatively low operating voltage (e.g., as compared to thick oxide devices rated for higher operating voltage). Such low voltage transistors, by virtue of being based on thin gate oxide, may be able to withstand a relatively lower level of stress voltage.
For the purpose of this disclosure and unless otherwise mentioned, a maximum stress tolerance voltage of a transistor may refer to approximately a maximum voltage that any two terminals of a transistor may be able to tolerate or withstand, without stressing the transistor (e.g., without adversely affecting one or more intrinsic characteristics of the transistor, such as mobility, threshold voltage of the transistor, intrinsic noise traits etc). For example, for a given submicron CMOS process, the operating voltage of transistors T 1 and T 2 may be about 1.2 volts (V), and the transistors T 1 and T 2 may have a safety margin of about 20%. Accordingly, the maximum stress tolerance voltage of transistors T 1 and T 2 may be about 1.4 V. That is, if the maximum voltage across any two terminals of transistors T 1 and T 2 (e.g., Vgs, Vgd, Vds) exceeds 1.4 V, the transistor is assumed to be operating under stress, which may degrade the performance (e.g., degrade the yield and noise) of the transistor, thereby degrading the phase noise of the VCO.
As previously discussed, for some applications, it may be desirable to have a higher output voltage swing of the VCO 100 , for a given frequency of oscillation. However, if the output voltage swing is increased (e.g., by increasing Vdd), the maximum voltage experienced across any two terminals of the transistor T 1 and/or T 2 may also increase, and may exceed the maximum stress tolerance voltage of the transistors. For example, for nominal values of various components of the VCO 100 and for an output voltage swing of 1.2 V, the voltage swing of Vgs and/or Vds of the transistors T 1 and T 2 may exceed 1.4 V for about 15% of the duty cycle time. Thus, in case the transistors T 1 and T 2 are thin oxide low voltage transistors with a maximum stress tolerance voltage of 1.4 V, the transistors T 1 and T 2 may be in stress for about 15% of time the VCO is oscillating. The amount and duration of stress on the transistors may increase further with a further increase in the output voltage swing. For example, the transistors T 1 and T 2 may be in stress for about 22% of the duty cycle time for an output voltage swing of about 1.3 V
Thus, the VCO 100 with thin oxide low voltage transistors T 1 and T 2 may not be able to handle a relatively large output voltage swing (e.g., output voltage swing of 1.2 V or more) without stressing the transistors T 1 and T 2 .
›SUMMARY
In various embodiments, the present disclosure provides a voltage controlled oscillator (VCO) comprising a first transistor, a first resistor operatively coupled between a first terminal of the first transistor and a first node, a first capacitor operatively coupled between a second terminal of the first transistor and the first node, and a second capacitor operatively coupled to the first node, wherein the first capacitor and the second capacitor forms a capacitive voltage divider. In various embodiments, the VCO further comprises a second transistor, wherein the first transistor and the second transistor forms a cross coupled transistor pair, a second resistor operatively coupled between a first terminal of the second transistor and a second node, and a second capacitor operatively coupled between a second terminal of the second transistor and the second node. In various embodiments, a first voltage is substantially equal to a maximum stress tolerance voltage of the first transistor, a second voltage is substantially equal to a maximum voltage swing that any two terminals of the first transistor would experience if the values of the first and second resistances were almost equal to 0 ohm, a third voltage is substantially equal to a difference between the first and second voltages, a first current is substantially equal to a maximum current that the first terminal of the first transistor would experience if the values of the first and second resistances were almost equal to 0 ohm, and wherein a value of the first resistor is chosen to be substantially equal to a ratio of the third voltage and the first current.
In various embodiments, a gate terminal of the first transistor is operatively coupled to a drain terminal of the second transistor, and a gate terminal of the second transistor is operatively coupled to a drain terminal of the first transistor. The VCO may further comprise a fourth capacitor operatively coupled to the second node, wherein the third capacitor and the fourth capacitor forms another capacitive voltage divider. The VCO may further comprise an inductor-capacitor (LC) resonator circuit operatively coupled to drain terminals of the first and second transistors. The VCO may be a differential colpitts VCO. The first terminal of the first transistor may be the source terminal of the first transistor, and wherein the first terminal of the second transistor may be the source terminal of the second transistor. In various embodiments, the first resistor and the second resistor may be configured to reduce a maximum voltage experienced by any two terminals of the first transistor and the second transistor, without decreasing a swing of an output voltage of the VCO and without affecting a phase noise of the VCO. The first transistor and the second transistor may be thin oxide low voltage transistors. The first and second resistors may be selected from a group comprising metal-oxide-semiconductor field-effect transistors (MOSFETs), bipolar junction transistors (BJT), field effect transistors (FET), junction gate field-effect transistors (JFET), and the like. The first and second resistances may be adjustable resistances, and where a values of the first and second resistances may be programmed based at least in part on a desired voltage swing of an output voltage of the VCO, maximum stress tolerance levels of the first and second transistors, a maximum voltage swing experienced by any two terminals of the first and second transistors, and maximum bias currents of the first and second transistors.
In various embodiments, the present disclosure also provides a differential colpitts voltage controlled oscillator (VCO) comprising a cross coupled transistor pair comprising a first transistor and a second transistor, a first capacitive voltage divider associated with the first transistor and comprising at least a first capacitor, a second capacitive voltage divider associated with the second transistor and comprising at least a second capacitor, a first resistor operatively coupled between a source terminal of the first transistor and the first capacitor, and a second resistor operatively coupled between a source terminal of the second transistor and the second capacitor. The first capacitive voltage divider may comprise a third capacitor having an end operatively coupled in between the first capacitor and the first resistor. The third capacitor may also a part of the second capacitive voltage divider, and another end of the third capacitor may be operatively coupled in between the second capacitor and the second resistor. The drain terminals of the first and second transistors may be operatively coupled to two output ports of the VCO. The first and second resistors may be configured to reduce a maximum voltage swing of a gate to source voltage of the first transistor and second transistor, respectively, below a threshold voltage level, without affecting a swing of an output voltage of the VCO. The first and second transistors may be biased using a cascode current source.
In various embodiments, the present disclosure also provides a method of forming a differential colpitts voltage controlled oscillator, the method comprising forming a cross coupled transistor pair that comprises a first transistor and a second transistor, forming a first capacitive voltage divider associated with the first transistor, the first capacitive voltage divider comprising at least a first capacitor, forming a second capacitive voltage divider associated with the second transistor, the second capacitive voltage divider comprising at least a second capacitor, degenerating a transconductance of the first transistor by operatively coupling a first resistor between a source terminal of the first transistor and the first capacitor, and degenerating a transconductance of the second transistor by operatively coupling a second resistor between a source terminal of the second transistor and the second capacitor. The method may further comprise biasing the first transistor and the second transistor using a cascode current mirror.
›BRIEF DESCRIPTION OF THE DRAWINGS
In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of embodiments in accordance with the present invention is defined by the appended claims and their equivalents.
FIG. 1 schematically illustrates an exemplary differential colpitts VCO;
FIG. 2 schematically illustrates an exemplary differential colpitts VCO, in accordance with various embodiments of the present invention; and
FIG. 3 schematically illustrates another exemplary differential colpitts VCO biased with a wide swing cascode current mirror, in accordance with various embodiments of the present invention.
›DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION · 1 of 3
In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. Therefore, the following detailed description is not to be taken in a limiting sense, and the scope of embodiments is defined by the appended claims and their equivalents.
Various operations may be described as multiple discrete operations in turn, in a manner that may be helpful in understanding embodiments of the present invention; however, the order of description should not be construed to imply that these operations are order dependent.
The description may use the phrases “in an embodiment,” or “in embodiments,” which may each refer to one or more of the same or different embodiments. The phrase “in some embodiments” is used repeatedly. The phrase generally does not refer to the same embodiments; however, it may. The terms “comprising,” “having,” and “including” are synonymous, unless the context dictates otherwise. The phrase “A and/or B” means (A), (B), or (A and B). The phrase “NB” means (A), (B), or (A and B), similar to the phrase “A and/or B.” The phrase “at least one of A, B and C” means (A), (B), (C), (A and B), (A and C), (B and C) or (A, B and C). The phrase “(A) B” means (B) or (A and B), that is, A is optional.
FIG. 2 schematically illustrates an exemplary differential colpitts VCO 200 , in accordance with various embodiments of the present invention. The VCO 200 may be used in a variety of applications, including, for example, in a phase locked loop (PLL) circuit.
In various embodiments, one or more components of the VCO 200 may be at least in part similar to the corresponding components of the VCO 100 of FIG. 1 . For example, similar to VCO 100 , the VCO 200 may also include the differential pair transistors T 1 and T 2 , and the tank of inductors L 1 and L 2 and varactors C 3 and C 4 . The transistor pair T 1 and T 2 may be cross coupled such that the drain of one transistor is operatively coupled to the gate of the other transistor. Such a cross coupled configuration of the transistor may facilitate a oscillation or swing of an output voltage of the VCO 200 .
In various embodiments, the transistors T 1 and T 2 may be N channel metal-oxide-semiconductor field-effect transistors (MOSFETs), although other appropriate types of transistors (e.g., bipolar junction transistor (BJT), field effect transistor (FET), junction gate field-effect transistor (JFET), or the like) may also be used. In various embodiments, transistors T 1 and T 2 may be thin gate oxide low voltage transistors used in typical submicron CMOS process.
The transistors T 1 and T 2 may be biased by respective bias current sources I bias1 and I bias2 . The drain terminals of transistors T 1 and T 2 may form the two output terminals O/P 1 and O/P 2 of the VCO 200 . A resonator circuit of the VCO 200 may include the series of inductors L 1 and L 2 and the series of varactors C 3 and C 4 . The supply voltage Vdd (operatively coupled in between the inductors L 1 and L 2 ) and the control voltage Vcontrol (operatively coupled in between the capacitors L 1 and L 2 ) may control the output voltage swing and frequency. Similar to the VCO 100 of FIG. 1 , the VCO 200 may also include capacitors C 11 and C 12 that form a capacitive voltage divider, and capacitors C 21 and C 22 that form another capacitive voltage divider. In various embodiments, the capacitive voltage divider comprising of C 11 and C 12 forms a positive feedback loop across the transistor T 1 . This capacitive voltage divider may enhance the transconductance gm of the transistor T 1 , which may facilitate the voltage swing for a given bias current. Similarly, the capacitive voltage divider comprising of C 11 and C 12 may form a positive feedback loop, thereby enhancing the transconductance gm of the transistor T 2 , which may facilitate the voltage swing at the output terminals of the VCO 200 .
The two capacitive voltage dividers form a distinguishing characteristic of a differential colpitts VCO. In contrast, some of the other conventional VCOs include a differential pair of transistors, but no capacitive voltage divider associated with each of the transistors.
In various embodiments, the VCO 200 of FIG. 2 may also include a first resistor R 1 operatively coupled between the source terminal of the transistor T 1 and node 222 , and a second resistor R 2 operatively coupled between the source terminal of the transistor T 2 and node 224 . In various embodiments, the resistors R 1 and R 2 may be adjustable, as illustrated in FIG. 2 . However, in other embodiments, the resistors R 1 and/or R 2 may have fixed values. One end of the capacitors C 11 and C 12 and the bias current source I bias1 may also be operatively coupled to node 222 , as illustrated in FIG. 2 . Similarly, one end of the capacitors C 11 and C 12 and the bias current source I bias2 may also be operatively coupled to node 224 .
In various embodiments, the resistors R 1 and R 2 may facilitate in decreasing a stress voltage experienced by the transistors T 1 and/or T 2 (e.g., decreasing a maximum voltage swing experienced by any two terminals of transistors T 1 and/or T 2 ), without substantially decreasing an output voltage swing of the VCO 200 . In various embodiments, the resistors R 1 and R 2 may act as degeration resistances, and may decrease a transconductance gm of the transistors T 1 and T 2 , respectively. In various embodiments, this decrease in gm may be countered at least partially by increasing the currents of the current sources I bias1 and I bias2 . Also, the resistors R 1 and R 2 may increase the output impedances of the transistors T 1 and T 2 , and may not affect loading of the VCO tank significantly.
›DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION · 2 of 3
In various embodiments, the values of the resistances R 1 and R 2 may be chosen such that the resistances may not significantly affect the output voltage swing of the output of the VCO, and may also not affect the phase noise of the VCO.
In various embodiments, a voltage ΔV 1 may be a difference between a first voltage V 11 and a second voltage V 12 , where V 11 may be approximately equal to a maximum stress tolerance voltage of transistors T 1 . Voltage V 12 may be approximately equal to a maximum voltage that any two terminals (e.g., gate and source terminals) of the transistor T 1 may experience if the value of the resistance R 1 is almost equal to 0 ohm, for a given output voltage swing. That is, voltage V 12 may be substantially equal to the maximum voltage swing of any two terminals of transistor T 1 of the VCO 100 of FIG. 1 (in which R 1 is not present). Thus, it may be desirable to decrease the maximum stress voltage or voltage swing experienced by the transistor T 1 by at least ΔV 1 , so that the transistor T 1 is not stressed during operation. In various embodiments, a current I d1max may be substantially equal to a maximum current that the drain terminal of the transistor T 1 would experience if the value resistance R 1 of VCO 200 was almost equal to 0 ohm, for the given output voltage swing. Thus, I d1max may be substantially equal to a maximum current that the drain terminal of the transistor T 1 experiences in the VCO 100 (where R 1 is not present). In various embodiments, the transistor T 1 may experience the maximum drain current I d1max substantially simultaneously with the transistor T 1 experiencing the voltage V 12 . The resistance R 1 may be used to reduce the stress voltage experienced by the transistor T 1 by ΔV 1 while the transistor drain current is I d1max . Accordingly, in various embodiments, the value of the resistance R 1 may be equal to about ΔV 1 /I d1max .
Voltages ΔV 2 , V 12 , and V 22 , and current I d2max may similarly be defined with respect to transistor T 2 , and in various embodiments, the value of the resistance R 2 may be equal to about ΔV 2 /I d2max . In various embodiments, the VCO 200 may be symmetric, i.e., transistors T 1 and T 2 may have similar characteristics, and the resistances R 1 and R 2 may have substantially equal values, but the embodiments are not necessarily limited as such.
For example, in various embodiments, the maximum stress tolerance voltage of transistor T 1 (e.g., V 11 ) may be 1.4 V, and for nominal values of various components of the VCO 200 and for 1.3 V output voltage swing, the maximum swing of voltages Vgs, Vds and/or Vgd over time (e.g., voltage V 12 ) may be about 1.5 V. Thus, ΔV 1 may be about 100 mV. Also, the maximum drain current I d1max may be about 10 milliAmpere (mA), which may be experienced by the transistor T 1 when the associated voltage swing is maximum. Thus, the value of resistance R 1 (and also R 2 , in case transistor T 2 has similar characteristics as transistor T 1 ) may be equal to about 100 mV/10 mA=10 ohm.
It is well known to those skilled in the art that improving VCO phase noise involves lowering the resistance (losses) in the VCO tank network. However, in various embodiments, introduction of the resistors R 1 and R 2 at the respective source terminals of the transistors, and judicious selection of the resistor R 1 and R 2 values may ensure that the resistors R 1 and R 2 does not adversely impact the phase noise of the VCO 200 , and at the same time lowers the stress voltage to which the transistors T 1 and T 2 are subjected to. In various embodiments, having a relatively higher value of the resistances R 1 and/or R 2 (e.g., higher than ΔV 1 /I d1max and/or ΔV 2 /I d2max ) may adversely affect the phase noise of the VCO 200 . On the other hand, having a relatively lower value of the resistances R 1 and/or R 2 (e.g., lower than ΔV 1 /I d1max and/or ΔV 2 /I d2max ) may not fully mitigate the stress of the transistors T 1 and/or T 2 .
Thus, the resistances R 1 and R 2 may facilitate in decreasing the maximum voltage swing of voltages Vgs, Vgd and/or Vds of transistors T 1 and/or T 2 below a threshold voltage level (e.g., maximum stress tolerance voltage), without significantly decreasing the output voltage swing of the VCO 200 , and without significantly adversely affecting the phase noise of the VCO 200 .
In various embodiments, the resistances R 1 and R 2 may be fixed or adjustable. For example, the resistance values of R 1 and R 2 may be adjusted based at least in part on a desired output voltage swing, a frequency of the output voltage, a maximum stress tolerance levels of transistors T 1 and T 2 , a maximum voltage swing experienced by any two terminals of transistors T 1 and/or T 2 , the bias currents of the transistors T 1 and T 2 , and/or the like.
FIG. 3 schematically illustrates an exemplary differential colpitts VCO 300 biased with a wide swing cascode current mirror, in accordance with various embodiments of the present invention. In various embodiments, one or more components of the VCO 300 may be at least in part similar to the corresponding components of the VCO 200 . For example, similar to VCO 200 , the VCO 300 may also include the differential pair transistors T 1 and T 2 , and the tank of inductors L 1 and L 2 and varactors C 3 and C 4 . Similar to the VCO 200 of FIG. 2 , the VCO 300 may also include capacitors C 11 and C 21 , and resistances R 1 and R 2 .
In various embodiments, the capacitors C 12 and C 22 of the VCO 200 of FIG. 2 may be combined in a single capacitor C 2 in the VCO 300 of FIG. 3 , which may result in improved harmonics performance and reduced area of the VCO 300 . The capacitor C 2 may be operatively coupled between nodes 322 and 324 . Thus, capacitors C 11 and C 2 may form a first capacitive voltage divider, and capacitors C 21 and C 2 may form a second capacitive voltage divider, where the capacitor C 2 may be common in both the first and second capacitive voltage dividers.
›DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION · 3 of 3
In various embodiments, the current sources I bias1 and I bias2 of VCO 200 of FIG. 2 may be replaced by a cascode current source in the VCO 300 . The cascode current source may include a current source I bias and transistors T 3 -T 8 , as illustrated in FIG. 3 .
In various embodiments, similar to the VCO 200 of FIG. 2 , the resistances R 1 and R 2 of the VCO in FIG. 3 may decrease the maximum voltage swing of voltages Vgs, Vgd and/or Vds of transistors T 1 and/or T 2 below a threshold voltage level (e.g., maximum stress tolerance voltage), without significantly decreasing the output voltage swing of the VCO 300 , and without significantly adversely affecting the phase noise of the VCO 300 .
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art and others, that a wide variety of alternate and/or equivalent implementations may be substituted for the specific embodiment illustrated and described without departing from the scope of the present invention. This present invention covers all methods, apparatus, and articles of manufacture fairly falling within the scope of the appended claims either literally or under the doctrine of equivalents. This application is intended to cover any adaptations or variations of the embodiment discussed herein. Therefore, it is manifested and intended that the invention be limited only by the claims and the equivalents thereof.
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