DC biasing circuit for a metal oxide semiconductor transistor

This patent application claims priority from Indian Non provisional patent application number 225/CHE/2009, filed on Feb. 2, 2009 entitled “A DC BIASING CIRCUIT FOR A METAL OXIDE SEMICONDUCTOR TRANSISTOR” and assigned to Cosmic Circuits Private Limited., 303, A Block, AECS Layout, Kundalahalli, Bangalore-560037, India, which is hereby incorporated in its entirety.

1. Field

Embodiments of the present disclosure generally relates to biasing circuits and more particularly to a DC biasing circuit for a Metal Oxide Semiconductor (MOS) transistor for achieving low voltage, high swing, and high efficiency performance.

2. Prior Art

Biasing is done to setup initial voltages and currents in transistor circuits to establish an appropriate quiescent point. Various biasing circuits are used to bias a MOS transistor. In a conventional biasing circuit, a resistor (R) is DC coupled to the MOS transistor and an input signal is AC coupled through a capacitor (C). For example, in a current mirror circuit configuration as depicted in the prior art of FIG. 1 , a source transistor 110 is mirrored to a mirror transistor 105 . The mirroring includes coupling the gate of the source transistor 110 and the gate of the mirror transistor 105 . The source transistor 110 is provided with a current source 125 . The resistor 115 couples the source transistor 110 to the mirror transistor 105 and the capacitor 120 ac couples the input signal.

The RC combination forms a high pass filter for the signal. In such a combination, value of the resistor has to be large in order to achieve a low high pass corner frequency. With the large resistor value, gate leakage or any leakage can cause significant error in the transistor biasing.

The implementation of the resistor using active elements like MOS transistor and diode results in a large input signal swing which causes the resistance to vary and result in poor signal to noise at amplifier output, and a high distortion. The startup time also can be large due to the use of a large resistor to set a DC bias.

In light of the foregoing discussion, there is a need for efficient DC biasing circuit for a MOS transistor.

Hence, it is an objective of the present disclosure to provide an improved circuit for DC biasing of a Metal Oxide Semiconductor (MOS) transistor with good performance for large input signals and insensitive to leakages at the transistor input.

Embodiments of the current disclosure described herein provide a DC biasing circuit for a Metal Oxide Semiconductor (MOS) transistor for achieving low voltage, high swing, and high efficiency performance.

An example of a method for biasing a MOS transistor includes AC coupling an input signal from an amplifier stage to a gate of the MOS transistor. The method includes connecting a pair of diodes in an opposing parallel configuration to a bias transistor and a current source. Further, the method includes generating a DC bias voltage through the bias transistor and the current source. The method also includes clamping the voltage at drain of the bias transistor to a fixed voltage by a clamping circuit. Further, the method includes coupling the DC bias voltage at the drain of the bias transistor to the gate of the MOS transistor through the pair of diodes. The clamping voltage is adjusted so that with large input voltage swing, the voltage across the diodes or a high value resistor is limited and does not degrade the performance.

A DC biasing circuit for a Metal Oxide Semiconductor (MOS) transistor is provided. The DC biasing includes a capacitor coupling a gate of a first MOS transistor to a signal source. Further, the DC biasing circuit also includes a high impedance bias source connected to the gate of the first MOS transistor. The DC biasing circuit includes a current source coupled to the gate of the first MOS transistor through a plurality of diodes in an opposing parallel configuration. The DC biasing circuit also includes a second MOS transistor coupled to the plurality of diodes.

Other aspects and example embodiments are provided in the figures and the detailed description that follows.

The accompanying figures, similar reference numerals may refer to identical or functionally similar elements. These reference numerals are used in the detailed description to illustrate various embodiments and to explain various aspects and advantages of the present disclosure.

FIG. 1 is a schematic diagram of a biasing technique;

FIG. 2 is a schematic diagram of a DC biasing circuit for Metal Oxide Semiconductor (MOS) transistor, embodying the principles of the invention; and

FIG. 3 is an illustration of a method of biasing a metal oxide semiconductor (MOS) transistor.

FIG. 2 is a schematic diagram of a DC biasing circuit 205 for Metal Oxide Semiconductor (MOS) transistor 210 a , embodying the principles of the invention.

The DC biasing circuit 205 for a MOS transistor 210 a , herein known as first transistor 210 a , includes a coupling capacitor 215 . One end of the coupling capacitor 215 is connected to the gate of the first transistor 210 a and the other end is coupled to an input signal.

The first transistor 210 a is coupled to the input signal. The input signal can be an output of an operational amplifier although in some embodiments other devices might be used as an input stage.

The DC biasing circuit 205 includes a high impedance bias source. The high impedance bias source includes a bias transistor herein referred as a second transistor 210 b and a current source 225 . The first transistor 210 a and the second transistor 210 b are N-type Metal Oxide Semiconductor (NMOS) transistors.

In some embodiments, the transistors can be a P-type Metal Oxide Semiconductor (PMOS) transistor.

Further, the DC biasing circuit 205 includes a clamping circuit 210 c . The DC biasing circuit 205 also includes a first diode 220 a and a series connection of a stack of diodes 220 b , 220 c and 220 d . The stack of diodes 220 b , 220 c and 220 d are in parallel connection with the first diode 220 a . A cathode of the diode 220 d is connected to a gate of the first transistor 210 a , to an anode of the diode 220 a , and to the gate of the second transistor 210 b . A cathode of the diode 220 c is connected to the clamping circuit 210 c and to an anode of the diode 220 d . One terminal of the current source 225 is connected to the source of the second transistor 210 b and to the clamping circuit 210 c . A source of the first transistor 210 a and another terminal of the current source 225 are connected to a fixed reference voltage, Vdd 230 . Drain of the second transistor 210 b is connected to ground 235 . The clamping circuit 210 c clamps the DC bias voltage at drain of the second transistor 210 b to a fixed voltage.

In one embodiment the clamping circuit 210 c can be a transistor with the drain and gate shorted together. In some embodiments the clamping circuit 210 c can comprise a combination of active or passive circuit elements.

The resistor value of the DC biasing circuit 205 typically exceeds the order of 1 G ohms. Such a circuit design is capable of working down to the lowest voltage possible as the gate bias for the transistor is decoupled from the input signal common mode (DC values of the input signal).

Further, the DC biasing circuit design depicted in FIG. 1 results in a less control on the quiescent current. Also, the value of DC coupling resistor 115 varies with input swing. To overcome this problem, the resistor 115 is replaced by a combination of diodes which include the first diode 220 a , the second diode 220 b , the third diode 220 c and the fourth diode 220 d.

The current source 225 is used for bias generation. A current filter is used for generating a gate bias for the first transistor 210 a . The current filter includes the second transistor 210 b , the diode 220 a , the diode 220 b , the diode 220 c and the diode 220 d . The current filter results in a better matching. Any gate leakage does not result in a large mismatch as the leakage current flows through the diodes and only results in a change in drain to source voltage Vds of the second transistor 210 b.

The diode 220 a , the diode 220 b and the diode 220 c are connected in series for an efficient and distortion free operation of the first transistor 210 a . The usage of lesser number of diodes in conjunction with the clamping circuit restricts the voltage swing across the diodes. The gate of the first transistor 210 b is connected in series with the diode 220 a , the diode 220 b , and diode 220 c to prevent the discharging of the voltage through the drain of the second transistor 210 b . Further, the output is taken across the load 240 .

The DC biasing circuit 205 facilitates in achieving a very low distortion performance at high swings, while driving a very small resistive load. Also a good transient response can be achieved in the first transistor 210 a in the presence of power supply or spurious spike by employing the DC biasing circuit 205 to the first transistor 210 a.

In an embodiment the DC biasing circuit 205 can be used to bias the output stage of an amplifier.

FIG. 3 is an illustration of a method of biasing a metal oxide semiconductor (MOS) transistor.

At step 305 , an input signal is AC coupled to gate of a MOS transistor. The input signal is AC coupled through a capacitor.

At step 310 , a pair of diodes is connected in an opposing parallel configuration to a bias transistor and a current source. The pair of diodes can be connected by connecting a plurality of diodes in series and connecting another diode in opposing parallel configuration with the series plurality of diodes.

At step 315 , a DC bias voltage is generated through the bias transistor and the current source.

At step 320 , the DC bias voltage is clamped at drain of the bias transistor to a fixed voltage by a clamping circuit. The usage of lesser number of diodes in conjunction with the clamping circuit restricts the voltage swing across the diodes.

At step 325 , the DC bias voltage at drain of the bias transistor is coupled to the gate of the MOS transistor through the pair of diodes.

In the foregoing discussion, the term “coupled” refers to either a direct electrical connection between the devices connected or an indirect connection through one or more passive or active intermediary devices. The term “circuit” means at least either a single component or a multiplicity of components, either active or passive, that are connected together to provide a desired function. The term “signal” means at least one current, voltage, charge, data, or other signal.

Those skilled in the art will recognize that a wide variety of modifications, alterations, and combinations can be made with respect to the above described embodiments without departing from the scope of the invention, and that such modifications, alterations, and combinations are to be viewed as being within the ambit of the inventive concept.

The forgoing description sets forth numerous specific details to convey a thorough understanding of the invention. However, it will be apparent to one skilled in the art that the invention may be practiced without these specific details. Well-known features are sometimes not described in detail in order to avoid obscuring the invention. Other variations and embodiments are possible in light of above teachings, and it is thus intended that the scope of invention not be limited by this Detailed Description, but only by the following Claims.