USPatent applicationPatented

Process for the manufacture of contact strips for electrolyzers

Granted 26 Jan 2016 · 11 office actions

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43 dated events
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Abstract

In the case of a process for the manufacture of contact strips, in particular for electrolyzers (membrane cells), the objective is to provide a solution that allows to create a cheap but also extremely efficient method for the manufacture of such contact strips at a high electrical efficiency. This objective is achieved by applying the roll bonding method to attach a copper strip to a titanium strip.

Description

1 parts
›This application is a 371 of PCT/EP2008/051158 filed…

This application is a 371 of PCT/EP2008/051158 filed Jan. 30, 2008

The invention relates to a process for the manufacture of contact strips, in particular for electrolysers (membrane cells).

Such electrolysis cells are, for example, described in applicant's document WO 98/15675 A1. Contact strips are especially required to establish electrical contact between adjacent electrolysers. Various methods are available for the manufacture of such contact strips and for their attachment to the cell walls.

Applicant's document WO 01/85388 A1 describes the manufacture of such contact strips, too. In this case, a laser pressure-welding procedure is used to weld contact strips of material with good electrical conductivity to titanium sheet strips.

In case sheet strips are connected to items of dissimilar materials, a known practice is to use explosion-bonding methods. The said method uses material that is bonded to the carrier base material at high speed by igniting explosive material so that grid-type metal bonding is obtained between the two materials. This procedure, however, is comparatively sophisticated and expensive.

The objective of the invention is to provide a cheap but also extremely efficient method which permits the manufacture of such contact strips at a high electrical efficiency.

The objective of the invention is achieved by implementing a process of the type described above and thereby attaching a copper strip to a titanium strip, using the roll bonding method.

It was surprising to find that an attachment of a titanium strip on the one side, to a copper strip on the other, by the method recommended in this invention was easily feasible, the high pressure exerted by the rollers on the contact surfaces of the metal thus destroying or removing any oxide layers and improving the electrical conductivity.

Embodiments of this invention are described in the sub-claims, a benefit achievable in this case being a cold forming rate of 60 to 80% in a first step of the roll bonding process.

A further embodiment of the process in accordance with the invention provides for the use of an untreated titanium strip in combination with a cleaned Cu strip in the roll bonding process, in particular a cleaned SeCu strip. A typical semi-finished strip of titanium, such as “TIKRUTAN®” manufactured by Messrs. Krupp, is suitable for this purpose.

A further embodiment can be implemented in such a manner that the titanium strip and/or copper strip are brushed on the bonding side prior to feeding them to the machine. An enhanced embodiment of the invention provides for a brushing of the respective strip in a longitudinal direction to the rolling operation.

The invention also provides for a rolling pressure of 780 t per 200 mm width at xy mm length when performing the roll bonding process.

It was also found that the copper strip can act as an intermediate layer between nickel and titanium so that a three-metal strip can be formed in accordance with the invention, i.e. a nickel strip being attached to the copper strip by the said roll bonding method, which also permits a synchronous bonding of the three strips.

Further features, characteristics and benefits of the invention are described below and illustrated by the drawings listed below:

FIGS. 1 and 2 show a simplified cross-sectional view of the contact strips manufactured in accordance with the invention.

In the case of FIG. 1 , contact strip 1 consists of titanium strip 2 and copper strip 3 which is attached to titanium strip 2 by the roll bonding method.

In order to form two contact webs 3 a and 3 b , it is possible to remove, for example by machining, the centre part in particular of the copper strip in such a manner that longitudinal groove 4 is obtained.

FIG. 2 illustrates the possibility of providing contact strip 1 a with copper strip 3 as intermediate layer between titanium strip 2 and nickel strip 5 , the latter being additionally attached to the structure. In this case, a longitudinal centre groove 4 a is provided, too.

A typical contact strip manufacture is described below in more detail:

Material: TIKRUTAN® 12 titanium strip, dimensions 200×3.5 mm, cleaned, copper strip SeCu, dimensions 200×2.88 mm, pre-rolled at a 40% forming rate. Resulting sheet thickness of 6.38 mm on machine feed side; titanium and copper materials being brushed on the bonding side in a longitudinal direction to the rolling operation prior to feeding them to the machine.

Machine parameters: advance speed of 3 m/min., rolling pressure approx. 780 t.

A roll-bonded cladding structure of 2.05 mm was obtained, the cold forming rate amounting to approximately 68%. The envisaged bimetal strength of 1.60 mm could be finish-rolled in one pass. The subsequent cutting of a 7.0 mm width and the bending test did not cause any delamination of the roll-bonded strips of the composite metal structure.

The twisting test (twisting ratio of 1:8× to and fro, twisting ratio of 2:8× in one direction) did not cause any visible component delamination.

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Claims as granted

9 claims

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Classifications

3 codes
IPC · International Patent Classification
Section B — Performing operations; transporting
  • B23K31/00
  • B32B37/10
Section C — Chemistry; metallurgy
  • C25B9/04

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File wrapper

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Pendency
8.0 y
2,918 days filing → grant
Office actions
11
non-final + final
Responses
11
5 RCE
Interviews
6
examiner interview summaries
Examiner
Aaron Austin
art unit 1781 · TC 1700
Citations: 11 back · 5 forward

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