USPatent applicationPending
Printed circuit board comprising metal bump and method of manufacturing the same
Pending · filed 13 Mar 2009 · 3 office actions
Assignee: none recorded yet
Application· this page
12/382,360
filed 13 Mar 2009
Publication
US 20100139964 A1
published 10 Jun 2010
Patent
Not granted yet
still under examination
File wrapper
Examiner
Chandrika Prasad
art unit 2833 · TC 2800
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