Constant current circuit
Granted 5 Jul 2011 · 1 office action
Current assignee: Ablic Inc. · originally Seiko Group Corporation
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Makoto Mitani, Fumiyasu Utsunomiya · Examiner: Adolf Berhane · AU 2838 · TC 2800
Life of the application
11 dated eventsAbstract
Provided is a constant current circuit capable of supplying a stable constant current. Even when K values of NMOS transistors vary due to manufacturing fluctuations in semiconductor devices, a voltage generated across a resistor is always a threshold voltage difference between the NMOS transistors, and thus hardly varies. Even when the K values of the NMOS transistors vary due to a change in temperature, the voltage generated across the resistor is always the threshold voltage difference between the NMOS transistors, and thus hardly varies.
Description
7 parts›RELATED APPLICATIONS
This application claims priority under 35 U.S.C. §119 to Japanese Patent Application No. JP2008-031613 filed on Feb. 13, 2008, the entire content of which is hereby incorporated by reference.
›BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a constant current circuit for supplying a constant current.
2. Description of the Related Art
At present, there is a case where a constant current circuit for supplying a constant current is mounted on a semiconductor device.
A conventional constant current circuit is described. FIG. 3 illustrates the conventional constant current circuit.
A K value (driving capacity) of a PMOS transistor P 1 is higher than a K value of a PMOS transistor P 2 , or a K value of an NMOS transistor N 2 is higher than a K value of an NMOS transistor N 1 . A gate-source voltage difference between the NMOS transistors N 1 and N 2 is generated across a resistor R 1 , and hence a current flowing into the resistor R 1 is a constant current (see, for example, JP 2803291 B (FIG. 1)).
A conventional constant current circuit for low current consumption is described. FIG. 4 illustrates the conventional constant current circuit for low current consumption.
The K value of the PMOS transistor P 1 is higher than the K value of the PMOS transistor P 2 , or the K value of the NMOS transistor N 2 is higher than the K value of the NMOS transistor N 1 . When a resistor R 2 is provided between a gate and source of the NMOS transistor N 1 , a gate voltage of the NMOS transistor N 2 becomes lower and thus the NMOS transistor N 2 operates in a sub-threshold region, whereby the current consumption of the constant current circuit reduces. A voltage obtained by subtracting a voltage generated across the resistor R 2 from the gate-source voltage difference between the NMOS transistors N 1 and N 2 is generated across the resistor R 1 , and hence a current flowing into the resistor R 1 is a constant current (see, for example, JP 06-152272 A (FIG. 1)).
However, the K values of the NMOS transistors N 1 and N 2 vary due to a fluctuation in gate oxide film thickness during a semiconductor device manufacturing process. Therefore, the gate-source voltage difference between the NMOS transistors N 1 and N 2 varies. Then, the voltage generated across the resistor R 1 varies, and hence the constant current of the constant current circuit varies. In other words, the constant current of the constant current circuit varies due to manufacturing fluctuations in semiconductor devices.
The carrier mobility of a MOS transistor has a temperature coefficient. Therefore, when a temperature increases, the K value becomes lower. When a temperature reduces, the K value becomes higher. That is, when a temperature changes, the K value also changes. Thus, the gate-source voltage difference between the NMOS transistors N 1 and N 2 also changes. Then, the voltage generated across the resistor R 1 changes, and hence the constant current of the constant current circuit also changes. In other words, the constant current of the constant current circuit changes with a change in temperature.
Therefore, a constant current circuit capable of supplying a stable constant current irrespective of the manufacturing fluctuations in semiconductor devices and the change in temperature is required.
›SUMMARY OF THE INVENTION
The present invention has been made in view of the problems described above. It is an object of the present invention to provide a constant current circuit capable of supplying a stable constant current.
In order to solve the above-mentioned problems, the present invention provides a constant current circuit for supplying a constant current, including: a second PMOS transistor; a first PMOS transistor through which a drain current flows based on a drain current of the second PMOS transistor; a first NMOS transistor through which a drain current equal to the drain current of the first PMOS transistor flows when a voltage based on a drain voltage of the first PMOS transistor is applied to a gate of the first NMOS transistor; a second NMOS transistor through which a drain current equal to the drain current of the second PMOS transistor flows when a voltage based on a gate voltage of the first NMOS transistor is applied to a gate of the second NMOS transistor, the second NMOS transistor being lower in threshold voltage than the first NMOS transistor; and a first resistor provided between a source of the second NMOS transistor and a ground terminal, for generating a voltage based on a threshold voltage difference between the first NMOS transistor and the second NMOS transistor to supply the constant current.
According to the present invention, even when K values of the first and second NMOS transistors vary due to manufacturing fluctuations in semiconductor devices, a voltage generated across the first resistor is always a threshold voltage difference between the first and second NMOS transistors and thus hardly varies, with the result that the constant current of the constant current circuit hardly varies.
Even when the K values of the first and second NMOS transistors vary due to a change in temperature, the voltage generated across the first resistor is always the threshold voltage difference between the first and second NMOS transistors and thus hardly varies, with the result that the constant current of the constant current circuit hardly varies.
Therefore, the constant current circuit may supply a stable constant current irrespective of the manufacturing fluctuations in semiconductor devices and the change in temperature.
›BRIEF DESCRIPTION OF THE DRAWINGS
In the accompanying drawings:
FIG. 1 illustrates a constant current circuit according to a first embodiment of the present invention;
FIG. 2 illustrates a constant current circuit according to a second embodiment of the present invention;
FIG. 3 illustrates a conventional constant current circuit; and
FIG. 4 illustrates another conventional constant current circuit.
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 1 of 3
Hereinafter, embodiments of the present invention are described with reference to the attached drawings.
First Embodiment
A structure of a constant current circuit according to a first embodiment of the present invention is described. FIG. 1 illustrates the constant current circuit according to the first embodiment.
The constant current circuit includes an activating circuit 10 , PMOS transistors P 1 and P 2 , NMOS transistors N 1 and LN 2 , and a resistor R 1 .
The activating circuit 10 is provided between a power supply terminal and a ground terminal and has an input terminal and an output terminal. The input terminal is connected to a gate of the PMOS transistor P 1 , a gate and drain of the PMOS transistor P 2 , and a drain of the NMOS transistor LN 2 . The output terminal is connected to a drain of the PMOS transistor P 1 , a gate and drain of the NMOS transistor N 1 , and a gate of the NMOS transistor LN 2 . Sources of the PMOS transistors P 1 and P 2 are connected to power supply terminals. A source of the NMOS transistor N 1 is connected to the ground terminal. A source of the NMOS transistor LN 2 is connected to one end of a resistor R 1 . The other end of the resistor R 1 is connected to the ground terminal. The PMOS transistor P 2 is diode-connected, and the PMOS transistors P 1 and P 2 are current-mirror connected to each other. The NMOS transistor N 1 is diode-connected, and the NMOS transistors N 1 and LN 2 are current-mirror connected to each other.
The constant current circuit has two stable points, that is, a case where no current flows and a case where a constant current flows. The activating circuit 10 operates so as to shift the constant current circuit from the former case to the latter case. Specifically, when the constant current flowing through the resistor R 1 is smaller than a predetermined current, the drain current of the PMOS transistor P 2 and the drain current of the NMOS transistor LN 2 are smaller than a predetermined current, and the gate voltage of the PMOS transistor P 2 is equal to or larger than a predetermined voltage, the activating circuit 10 causes an activation current to flow from the power supply terminal to the gate of the NMOS transistor LN 2 , thereby activating the constant current circuit.
A drain current flows through the PMOS transistor P 1 based on the drain current of the PMOS transistor P 2 . A voltage based on a drain voltage of the PMOS transistor P 1 is applied to the gate of the NMOS transistor N 1 , and a drain current equal to the drain current of the PMOS transistor P 1 flows through the NMOS transistor N 1 . A voltage based on a gate voltage of the NMOS transistor N 1 is applied to the gate of the NMOS transistor LN 2 , and a drain current equal to the drain current of the PMOS transistor P 2 flows through the NMOS transistor LN 2 . A K value (driving capacity) ratio between the PMOS transistors P 1 and P 2 is equal to a K value ratio between the NMOS transistors N 1 and LN 2 . When the K value ratio between the PMOS transistors P 1 and P 2 is 1:1, the constant current circuit is designed such that the K value ratio between the NMOS transistors N 1 and LN 2 is also 1:1. When the K value ratio between the PMOS transistors P 1 and P 2 is 2:1, the constant current circuit is designed such that the K value ratio between the NMOS transistors N 1 and LN 2 is 2:1. In other words, a current density to the K value, of the current flowing through the PMOS transistor P 1 and the NMOS transistor N 1 is equal to a current density to the K value, of the current flowing through the PMOS transistor P 2 and the NMOS transistor LN 2 . The NMOS transistor LN 2 has a lower threshold voltage than the NMOS transistor N 1 .
The resistor R 1 is a polysilicon resistor. The resistor R 1 is used to generate a voltage obtained as the threshold voltage difference between the NMOS transistors N 1 and LN 2 . The resistor R 1 has a sheet resistance value of approximately 300Ω to 400Ω, and hence the resistance value of the resistor R 1 hardly changes even when there are manufacturing fluctuations in semiconductor devices or a change in temperature.
Next, an operation of the constant current circuit is described.
Assume that the K value ratio between the PMOS transistors P 1 and P 2 is 1:1 and the K value ratio between the NMOS transistors N 1 and LN 2 is 1:1. Assume that the NMOS transistor N 1 has a threshold voltage of 0.5 V, an overdrive voltage of 0.1 V, and a gate-source voltage of 0.6 V. Assume that the NMOS transistor LN 2 has a threshold voltage of 0.2 V. Assume that the PMOS transistors P 1 and P 2 and the NMOS transistors N 1 and LN 2 operate in a saturation region.
In such a case, the K values and the drain currents of the PMOS transistors P 1 and P 2 are equal to each other and the K values and the drain currents of the NMOS transistors N 1 and LN 2 are equal to each other. Therefore, the current densities of the PMOS transistors P 1 and P 2 are equal to each other and the current densities of the NMOS transistors N 1 and LN 2 are equal to each other. Accordingly, an overdrive voltage of the NMOS transistor LN 2 is equal to the overdrive voltage of the NMOS transistor N 1 , that is, 0.1 V, and a gate-source voltage of the NMOS transistor LN 2 becomes a sum voltage (0.3 V) of the threshold voltage (0.2 V) and the overdrive voltage (0.1 V). Thus, a voltage generated across the resistor R is 0.3 V because the gate-source voltage of the NMOS transistor N 1 is 0.6 V and the gate-source voltage of the NMOS transistor LN 2 is 0.3 V. In other words, the generated voltage is a gate-source voltage difference between the NMOS transistors N 1 and LN 2 . The overdrive voltages of the NMOS transistors N 1 and LN 2 are equal to each other, that is, 0.1 V, and hence the voltage generated across the resistor R is a threshold voltage difference between the NMOS transistors N 1 and LN 2 (0.5 V−0.2 V=0.3 V). A constant current is supplied through the resistor R based on the generated voltage. The constant current is fed from the constant current circuit to the outside through a current mirror circuit (not shown).
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 2 of 3
Assume that the threshold voltage of the NMOS transistor N 1 is expressed by Vt 1 , the overdrive voltage thereof is expressed by Vo 1 , the gate-source voltage thereof is expressed by Vgs 1 , the threshold voltage of the NMOS transistor LN 2 is expressed by Vt 2 , the overdrive voltage thereof is expressed by Vo 2 , and the gate-source voltage thereof is expressed by Vgs 2 . In this case, a voltage Vref generated across the resistor R 1 is calculated as follows.
Vref=Vgs 1 −Vgs 2=( Vo 1 +Vt 1)−( Vo 2 +Vt 2) (1)
The overdrive voltages of the NMOS transistors N 1 and LN 2 are equal to each other, and hence the voltage Vref is calculated as follows.
Vref=Vt 1 −Vt 2 (2)
In a normal semiconductor device manufacturing process, a fluctuation in threshold voltage difference between the NMOS transistors N 1 and LN 2 , which is caused by manufacturing fluctuations is small. Changes in threshold voltages of the NMOS transistors N 1 and LN 2 , which are caused by a change in temperature are substantially equal to each other. Therefore, even when a temperature changes, the threshold voltage difference between the NMOS transistors N 1 and LN 2 hardly changes.
Assume that, due to manufacturing fluctuations in semiconductor devices, the K values of the NMOS transistors N 1 and LN 2 vary. Assume that, due to a change in temperature, the K values of the NMOS transistors N 1 and LN 2 vary.
In this case, when the K values vary (change), the overdrive voltages of the NMOS transistors N 1 and LN 2 similarly vary (change), and hence an overdrive voltage difference between the NMOS transistors N 1 and LN 2 hardly varies from 0 V (hardly changes from 0 V). Thus, the voltage generated across the resistor R 1 is always the threshold voltage difference between the NMOS transistors N 1 and LN 2 and is maintained to be 0.3 V. A constant current is supplied through the resistor R based on the generated voltage. The constant current is fed from the constant current circuit to the outside through a current mirror circuit (not shown).
With this structure, even when the K values of the NMOS transistors N 1 and LN 2 vary due to the manufacturing fluctuations in semiconductor devices, the gate-source voltage difference between the NMOS transistors N 1 and LN 2 and the overdrive voltage difference therebetween hardly vary. Then, the voltage generated across the resistor R is always the threshold voltage difference between the NMOS transistors N 1 and LN 2 and thus hardly varies, with the result that the constant current of the constant current circuit hardly varies.
Even when the K values of the NMOS transistors N 1 and LN 2 vary due to the change in temperature, the gate-source voltage difference between the NMOS transistors N 1 and LN 2 and the overdrive voltage difference therebetween hardly vary. Then, the voltage generated across the resistor R is always the threshold voltage difference between the NMOS transistors N 1 and LN 2 and thus hardly varies, with the result that the constant current of the constant current circuit hardly varies.
Thus, the constant current circuit may supply a stable constant current irrespective of the manufacturing fluctuations in semiconductor devices and the change in temperature.
Second Embodiment
Next, a structure of a constant current circuit according to a second embodiment of the present invention is described. FIG. 2 illustrates the constant current circuit according to the second embodiment.
The constant current circuit according to the second embodiment further includes a resistor R 2 , unlike the first embodiment.
The resistor R 2 is provided between the gate and drain of the NMOS transistor N 1 .
The constant current circuit has two stable points, that is, a case where no current flows and a case where a constant current flows. The activating circuit 10 operates so as to shift the constant current circuit from the former case to the latter case. Specifically, when the constant current flowing through the resistor R 1 is smaller than a predetermined current, the drain current of the PMOS transistor P 2 and the drain current of the NMOS transistor LN 2 are smaller than a predetermined current, and the gate voltage of the PMOS transistor P 2 is equal to or larger than a predetermined voltage, the activating circuit 10 causes an activation current to flow from the power supply terminal to the gate of the NMOS transistor LN 2 , thereby activating the constant current circuit. Other examples of the activating method include a method of causing the activation current to flow from the power supply terminal to the gate of the NMOS transistor N 1 and a method of pulling the activation current from the gate of the PMOS transistor P 2 to the ground terminal. However, in the activating methods, the gate of the NMOS transistor N 1 becomes a high voltage before the drain thereof, and hence the voltage at the gate of the NMOS transistor N 1 increases to a power supply potential and the voltage at the drain thereof is maintained at a ground potential. In other words, the NMOS transistor N 1 is stabilized in a state in which a large current flows, and the NMOS transistor LN 2 is stabilized in a state in which no current flows. Therefore, according to the activation methods, the voltage is not generated across the resistor R 1 , and hence the constant current circuit does not supply the constant current. In contrast to this, according to the activation method in the present invention, the drain of the NMOS transistor N 1 becomes a high voltage before the gate thereof, and hence the NMOS transistor LN 2 is stabilized in a state in which a current flows. Therefore, according to the activation method in the present invention, the voltage is generated across the resistor R 1 , and hence the constant current circuit supplies the constant current.
Each of the resistors R 1 and R 2 is a polysilicon resistor. The resistor R 1 is used to generate a voltage obtained by subtracting the voltage generated across the resistor R 1 from the threshold voltage difference between the NMOS transistors N 1 and LN 2 . The resistors R 1 and R 2 have a sheet resistance value of approximately 300Ω to 400Ω, and hence the resistance values of the resistors R 1 and R 2 hardly change even when there are manufacturing fluctuations in semiconductor devices or a change in temperature.
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 3 of 3
Next, an operation of the constant current circuit is described.
Assume that the threshold voltage of the NMOS transistor N 1 is 0.5 V and the threshold voltage of the NMOS transistor LN 2 is 0.1 V. In this case, the threshold voltage difference between the NMOS transistors N 1 and LN 2 is 0.4 V. Assume that the gate-source voltage of the PMOS transistor P 2 is 1.0 V. In this case, assume that the power supply voltage lowers to 1.2 V which is smaller than a sum voltage (1.4 V) of the threshold voltage difference between the NMOS transistors N 1 and LN 2 (0.4 V) and the gate-source voltage of the PMOS transistor P 2 (1.0 V).
Then, in the first embodiment, the voltage generated across the resistor R 1 is not a voltage (0.4 V) but a reduced voltage, and hence the current flowing into the resistor R 1 is not the constant current and becomes smaller. That is, the constant current circuit cannot operate at a low power supply voltage.
In contrast to this, according to the second embodiment, the resistor R 2 is further provided and each of the resistors R 1 and R 2 has a resistance value of half the resistance value of the resistor R 1 described in the first embodiment. Then, a voltage of half the threshold voltage difference between the NMOS transistors N 1 and LN 2 (0.2 V) is generated across each of the resistors R 1 and R 2 . The voltage generated across the resistor R 1 is the voltage of half the threshold voltage difference between the NMOS transistors N 1 and LN 2 and the resistor R 1 has the resistance value of half the resistance value of the resistor R 1 described in the first embodiment, and hence a current value of the current flowing into the resistor R 1 is equal to a current value of the current flowing into the resistor R 1 described in the first embodiment. In other words, the constant current circuit may operate even at the low power supply voltage.
With this structure, when the resistor R 2 is further provided, the voltage is generated across the resistor R 2 , and hence the voltage generated across the resistor R 1 is reduced by the voltage generated across the resistor R 2 . Therefore, even when the power supply voltage is accordingly reduced, the constant current circuit may operate.
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