Printed circuit board

1. Technical Field

The present disclosure relates to printed circuit boards, and more particularly to a printed circuit board with even current distribution.

2. Description of the Related Art

Electronic components are mounted on printed circuit boards for transmitting electronic signals. Each pin of an electronic component allows for a maximum current flow. To avoid an overcurrent through a pin, engineers usually use more than one pin to divide the current.

However, current flowing through different regions of the printed circuit board are different. Pins located in the different regions may have different current values. Thus, current through the printed circuit board must be reduced to prevent damage to the pins located in the region where current is too high, which may reduce current in the low areas to less than a desirable amount. As a result, the pins of the electronic component have low service efficiency.

What is needed, is a printed circuit board which can solve the above-mentioned problem.

The FIGURE is a schematic diagram of one embodiment of a printed circuit board of the present disclosure.

Referring to the FIGURE, one embodiment of a printed circuit board 10 of the present disclosure includes a reference layer, such as a power layer 20 , and a plurality of signal layers (not shown). The power layer 20 is configured to supply power from a power unit (not shown) exterior to electronic component mounted on the printed circuit board 10 . An electronic component, such as a power connector 30 is mounted on the power layer 20 of the printed circuit board 10 . The power connector 30 includes nine pins P 11 -P 19 . All the pins P 11 -P 19 are connected to the power layer 20 of the printed circuit board 10 for transmitting electronic signals from the power layer 20 to other electronic components (not shown) connected to the power layer 20 . Nine holes 11 - 19 are defined in the power layer 20 , one for each of the pins P 11 -P 19 . Diameters of the holes 11 - 13 are R 1 . Diameters of the holes 14 - 16 are R 2 . Diameters of the holes 17 - 19 are R 3 . R 2 is greater than R 3 , but less than R 1 . Each of the nine holes 11 - 19 is defined adjacent from a corresponding pin of the power connector 30 , namely each of the nine holes 11 - 19 is empty and not allowed to have any pin P 11 -P 19 of the power connector 30 enter therein (as shown in the FIGURE). Each of the nine holes 11 - 19 is adjacent from a corresponding pin by a selected distance and a selected angle which may differ depending on the embodiment. In the illustrated embodiment, R 1 is about 0.35 mm, R 2 is about 0.32 mm, and R 3 is about 0.30 mm. It may be understood that in the illustrated embodiment of the FIGURE, holes 11 - 13 , 14 - 16 , and 17 - 19 are defined in different columns where holes 14 - 16 neighbor corresponding holes of holes 11 - 13 . Accordingly, holes 17 - 19 neighbor corresponding holes of holes 17 - 19 . Similarly, pins corresponding to the holes 11 - 19 are defined in their respective neighboring columns.

It is known that diameters of holes, such as the holes 11 - 19 , are inversely proportional to their resistance. In other words, resistances of the holes 14 - 16 are higher than resistances of the next smaller holes 11 - 13 , and lower than the resistances of the larger holes 17 - 19 . Because resistance is a ratio of the degree to which an object opposes an electric current through the object, the electric current in the power layer 20 of the printed circuit board 10 tends to flow to a first region where the pins 11 - 13 are located.

In one exemplary example, the printed circuit board 10 was simulated using simulation software to obtain the following data. Current through the pins P 11 -P 19 of the power connector 30 are listed in Table 1. However, it may be understood that these current values are exemplary and depend on various factors, which include, but are not limited to, environmental factors, material and compositions of the printed circuit board 10 , and positions of the components electrically coupled to the printed circuit board 10 .

According to Table 1, current through the pins P 11 -P 13 are approximately the same, current through the pins P 14 -P 16 are approximately the same, and current through the pins P 17 -P 19 are approximately the same. It can be seen that the differences in current through the different groups of pins P 11 -P 13 , P 14 -P 16 , and P 17 -P 19 are obviously small. Accordingly, by use of placing holes of varying diameters selectively and judiciously throughout the power layer 20 near selective pins of an integrated circuit, a user can easily control current flow through each of the pins of the integrated circuit. It may be appreciated that controlling current flow through each of the pins of integrated circuit can limit inrush current, in one exemplary example.

The foregoing description of the various inventive embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others of ordinary skill in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternately embodiments will become apparent to those of ordinary skill in the art to which the present disclosure pertains without departing from its spirit and scope. Accordingly, the scope of the present disclosure is defined by the appended claims rather than the foregoing description and the various inventive embodiments described therein.