Computer enclosure

1. Technical Field

The present invention relates to a computer enclosure for enclosing computer components.

2. Description of Related Art

Computer enclosures are equipped to house different operating components. The amount of heat generated from operating components has risen dramatically as the operating components have become more sophisticated. In addition, smaller computer enclosures which occupy less space have become popular. Heat dissipation from the computer enclosure has become a big problem for the computer industry.

Conventional means for heat dissipation of computer enclosure includes mounting fans in the computer enclosure. However, additional fans generate additional noise.

Therefore, a computer enclosure is desired to overcome the above-described deficiency.

FIG. 1 is an exploded, isometric view of an embodiment of a computer enclosure;

FIG. 2 is an exploded, isometric view similar to FIG. 1 , but viewed from another aspect; and

FIG. 3 is an assembled, isometric view of the computer enclosure of FIG. 1 .

Referring to FIGS. 1 and 2 , the computer enclosure includes a base 10 and a cover 30 .

The base 10 includes a circular support plate 13 . A plurality of air vents 133 is defined in the support plate 13 and configured for allowing air to pass through the support plate 13 . A cylindrical wall 11 extends from a perimeter of the support plate 13 . The cylindrical wall 11 and the support plate 13 cooperatively define a receiving room 14 below the support plate 13 . In one embodiment, a fan 20 is mounted on a bottom side of the support plate 13 and received in the receiving room 14 . A circular bottom plate 15 is mounted on a bottom edge of the cylindrical wall 11 to enclose the fan 20 in the receiving room 14 . A plurality of air vents 153 is defined in the bottom plate 15 and configured for allowing air to pass through the bottom plate 15 . In another embodiment, the fan may be mounted to the bottom plate 15 .

A plurality of upright support racks 17 is mounted on a top side of the support plate 13 . Different operating components may be mounted on the support racks 17 . For example, an optical disk drive (ODD) 52 may be mounted on one support rack 17 , and a motherboard 51 may be mounted on another support rack 17 . A side of the motherboard 51 is equipped with a plurality of interface ports 513 . A plurality of clasps 134 is formed around a perimeter of the support plate 13 . Each clasp 134 includes a connecting portion 135 connected to the base 10 , and a clasping portion 136 located above the support plate 13 . A clasping groove 137 is defined between each clasping portion 136 and the base 10 .

The cover 30 includes a circular top plate 31 , and a sidewall 32 extending from a perimeter of the top plate 31 . A plurality of air vents 313 is defined in the top plate 31 and configured for allowing air to pass through the top plate 31 . The sidewall 32 defines an opening 323 corresponding to the interface ports 513 of the motherboard 51 . In one embodiment, a plurality of flanges 325 are formed on a bottom edge of the sidewall 32 . A cutout 327 is defined between every two adjacent flanges 325 .

Referring also to FIG. 3 , the bottom plate 15 is secured to the base 10 to enclose the fan 20 in the receiving room 14 . The bottom edge of the sidewall 32 is placed on the support plate 13 so that the operating components such as the motherboard 51 and the ODD 52 are enclosed and protected by the cover 30 . The cover 30 is attached to the base by aligning the cutouts 327 with the clasps 134 and then rotating the cover 30 such that the flanges 325 slide into the clasping grooves 137 and the clasping portions 136 latches onto the flanges 325 .

In one embodiment, the fan 20 is configured to propels air through the support racks 17 , thereby transferring heat away from the operating components. In addition, because heat naturally rises, the air propelled by the fan 20 is the same direction of the free convection of hot air. Thus, the heat dissipation efficiency of the computer enclosure is high.

It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.