Balanced resistance capacitive sensing apparatus

Capacitive sensing devices, otherwise known as touch sensing devices or proximity sensors are widely used in modern electronic devices/apparatus. A capacitive sensing device is often used for touch based navigation, selection, or other input, in response to a finger, stylus, or other object being placed on or in proximity to a sensor of the capacitive sensing device. In such a capacity, capacitive sensing devices are often employed in computers (e.g. notebook/laptop computers), touch screens, media players, multi-media devices, remote controls, personal digital assistants, smart devices, telephones, control consoles, and the like. Un-patterned sheet sensors (both capacitive and resistive) are often employed as a simple and economical method means for implementing attractive sensors for sensing contact, touch, and/or proximity based inputs.

However, there exist many limitations to the current state of technology with respect to capacitive sensing devices. For example, during operation a capacitive sensing device may become distorted due to the presence of noise. That is, interference sources such as LCD's and RF transmitters can corrupt signals produced by capacitive sensors within the capacitive sensing device.

Embodiments for a capacitive sensing apparatus with attenuated electrical interference across a plurality of routing traces are provided. One embodiment forms a first sensor electrode on a substrate. In addition, a first set of routing traces is formed on the substrate, the first routing trace coupled with the first sensor electrode. One embodiment additionally forms a second sensor electrode on the substrate. A second set of routing traces differing in length from the first routing trace is also formed on the substrate, the second routing trace coupled with the second sensor electrode. To attenuate electrical interference, the second routing trace is formed having an approximately equal RC time constant characteristic as the first routing trace.

The accompanying drawings, which are incorporated in and form a part of this specification, illustrate example embodiments of the subject matter described herein and, together with the description, serve to explain principles discussed below.

FIG. 1 is block diagram of a sensor device according to an embodiment of the present technology.

FIG. 2 is a top view of a sensor and routing trace array according to an embodiment of the present technology.

FIG. 3 is a flow diagram of a method for forming a capacitive sensing apparatus with attenuated electrical interference across a plurality of routing traces in accordance with an embodiment of the present technology.

The drawings referred to below and in the detailed description should not be understood as being drawn to scale unless specifically noted.

Reference will now be made in detail to embodiments of the presented technology, examples of which are illustrated in the accompanying drawings. While the presented technology will be described in conjunction with embodiments, it will be understood that the descriptions are not intended to limit the presented technology to these embodiments. On the contrary, the descriptions are intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope as defined by the appended claims. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the presented technology. However, the presented technology may, in some embodiments, be practiced without these specific details. In other instances, well known methods, procedures, components, and circuits have not been described in detail as not to unnecessarily obscure aspects of the presented technology.

Overview of Discussion

In various embodiments, apparatus and techniques for balancing the RC time constants among the sensing channels in a capacitive sensing apparatus is described. In one embodiment, the balancing is a result of adding resistance in a controlled manner across one or more of the sensing channels (or routing traces) in a sensor device.

In one embodiment, a first material and a second material having a resistivity different from a resistivity of the first material is provided in series when forming each of the plurality of routing traces. By incorporating materials with different resistivity into each of the plurality of routing traces, the resultant impedance mismatch will allow each of the routing traces to act as a radio frequency (RF) reflector. Further, the impedance mismatch will reduce routing trace antenna efficiencies thereby resulting in reduced interference properties. For example, small resistivity changes in the routing trace will significantly reduce the RF coupling efficiency. In other words, the impedance mismatch will deter the routing trace from acting as an antenna when RF or other low frequency interference is encountered; such as when a sensor device is used in mobile phone applications, LCD applications, or the like.

In a further embodiment, the resistance of the routing traces may be varied per routing trace to provide an approximate RC time constant that is similar for each routing trace. In other words, by balancing the RC time constant across two or more routing traces common mode interference will be received at the controller as common mode noise and will result in a capacitive sensing device with significantly better balanced common mode RF interference recognition and removal.

Thus, when a sensing frequency is varied each routing trace will be affected similarly; that is, in a common mode fashion. As such, embodiments described herein provide a cost effective method of adding this resistance to a routing trace. Moreover, since the sensor device controller firmware is presently designed to cope with common mode disturbances, the technology described herein will enable variable sensing frequencies, reduce clock modulation related jitter, and the like while adding little or no present or follow-on programming overhead. Additionally, embodiments described herein may also be utilized for RC sheet sensors.

With reference now to FIG. 1 , a sensor device 109 is shown. In one embodiment, sensor device 109 is implemented in an application specific integrated circuit (ASIC) that is specifically designed and configured to operate in conjunction with sensor electrodes of the capacitive touch sensing device.

In one embodiment, sensor device 109 includes a controller 102 coupled to sensor electrode 106 a and sensor electrode 106 n via trace 108 a and trace 108 n , respectively. Although two sensor electrodes are shown in FIG. 1 , embodiments are well suited for use with a capacitive touch sensing device comprised of a single sensor electrode, two sensor electrodes, or more than two sensor electrodes. Additionally, embodiments in accordance with the present invention are well suited to use sensor electrodes having any of various shapes, sizes, or patterns.

FIG. 1 also includes an object 112 (e.g. a finger, a stylus, a pointing object, etc.) shown approaching sensor electrodes 106 a and 106 n . In general, as object 112 moves towards or away from sensor device 109 , a change in a measured capacitance value will be observed.

With reference now to FIG. 2 , a sensor device 202 is shown in accordance with an embodiment of the technology. In general, FIG. 2 includes a substrate 204 having a plurality of traces 108 a - 108 n formed thereon. In one embodiment, sensor electrodes 106 a - 106 n and routing traces 108 a - 108 n form the sensing area of sensor device 202 . Furthermore, routing traces 108 a - 108 n are each coupled to controller 102 , of FIG. 1 , to enable the operation of sensor device 109 . It is noted that sensor device 109 may be placed over an information display device such as a liquid crystal display (LCD) or over an RF radiating device such as a mobile phone. As such, a user would view the underlying image or information display by looking through sensing area of sensor array 202 . It is noted that any number of sets of conductive traces may be implemented in accordance with the present embodiment. For example, operations described herein may be repeated as desired.

In one embodiment, sensor electrodes 106 a - 106 n includes a clear conductive material. For example, in one instance, sensor electrodes 106 a - 106 n are disposed by printing (e.g., screen printing) a conductive polymer in a desired conductive pattern. In one embodiment, such a polymer is clear in coloration. In another embodiment, sensor electrodes 106 a - 106 n are disposed through patterning a conductive material such as ITO (indium tin oxide) on a thermoplastic polymer substrate such as a PET (polyethylene terephthalate) substrate or glass. In some instances this conductive material (e.g., ITO) comprises a water clear conductive coating.

It is appreciated that sensor electrodes 106 a - 106 n may comprise several layers of conductive and insulating materials. For example, sensor electrodes 106 a - 106 n that supports two-dimensional sensing of objects may be built up from one or more ITO+PET layers. When two or more ITO+PET layers are used, they are laminated together, such as with optically clear adhesive. In some embodiments the ITO is disposed into capacitive sensor pattern 125 via a sputtering process.

In general, routing traces 108 a - 108 n are utilized to electrically access and couple with sensor electrodes 106 a - 106 n and are disposed contemporaneously with the disposition of sensor electrodes 106 a - 106 n . Normally, routing traces 108 a - 108 n are used for connecting sensor electrodes 106 a - 106 n with electronic components, such as an ASIC configured for interpreting whether and/or where an object touches or comes into proximity with the sensing region (sensor electrodes 106 a - 106 n ) of capacitive sensor 109 of FIG. 1 .

For example, conductive ink pads and/or traces may be incorporated into or proximate to routing traces 108 a - 108 n . Such traces and/or pads may be disposed in one or more regions of sensor device 109 . In one embodiment, conductive pads are used for coupling routing traces 108 a - 108 n with controller 102 . In addition, although sensor device 202 has been shown as being substantially planar, it may be formed into a non-planar shape such as a curved surface of an automotive dashboard or console panel or sensor device 202 may be disposed as a keypad on an electronic device or over a display, such as a liquid crystal display.

In a further embodiment, an insulating material is deposited above the set of conductive traces. It is noted that the insulating material may act as protection (e.g., from handling damage) for the set of conductive traces and also provide them electrical insulation from the outside world. As such, the deposition of the insulating material may be an optional and may be implemented in diverse ways. For example, a deposition of a dielectric layer (e.g., SiO 2 , Spin-On-Glass, and the like) may be used as the insulating material. It is appreciated that the insulating material may include a substantially transparent insulating material or an opaque insulating material. Additionally, the insulating material may be deposited to cover the entire set of conductive traces or it may be deposited to cover one or more portions of the set of conductive traces.

In one embodiment, each of routing traces 108 a - 108 n have a first material 208 having a first resistivity and a second material 210 having a second resistivity. Moreover, the first resistivity of the first material 208 is different than the resistivity of the second material 210 . In one embodiment, first material 208 and second material 210 may be materials such as conductive ink and indium tin oxide (ITO). In another embodiment, less than every trace 108 a - 108 n includes the two materials. Sensor device 202 also includes a plurality of sensor electrodes such as sensor electrode 106 a made of a plurality of sensor elements. In yet another embodiment, each of routing traces 108 a - 108 n may be formed of a single material or a compound having different shapes and/or thicknesses to provide a first resistance region and a second resistance region. In so doing, that is, by incorporating materials with different resistivity, or differing resistance regions, into each of the plurality of traces, the resultant impedance mismatch will allow each of routing traces 108 a - 108 / n to act as RF reflectors. Further, the impedance mismatch will reduce routing traces 108 a - 108 n antenna efficiencies thereby resulting in reduced interference properties.

In one embodiment, described in detail herein, a capacitance of routing trace 108 a is approximately equal to the capacitance of routing trace 108 n . This is accomplished, in one embodiment, by controlling the amount of first material 208 and second material 210 used when forming each routing trace. In another embodiment, also described further herein, an RC time constant associated with the first routing trace 108 a is approximately equal to the RC time constant associated with the second routing trace 108 n . This may also be accomplished, in one embodiment, by controlling the amount of first material 208 and second material 210 used when forming each routing trace. For example, in one embodiment, the first material 208 and second material 210 may be disposed in sequence, interspersed, overlaid, or otherwise distributed in routing traces 108 a - 108 n.

Moreover, although second material 210 is shown in a similar location, it is understood that second material 210 may be found in any location throughout routing traces 108 a - 108 n . In addition, it is also understood that routing traces 108 a - 108 n may have more than one portion formed of second material 210 . Moreover, each of routing traces 108 a - 108 n may be formed with different amounts, combinations, or patterns of first material 208 and second material 210 . For example, a longer routing trace 108 a may be formed with a different amount and/or shape of first material 208 and second material 210 than a shorter routing trace 108 n.

With reference now to FIG. 3 , a flow diagram of a method for forming a capacitive sensing apparatus with attenuated electrical interference across a plurality of routing traces in accordance with an embodiment of the present technology. For example, in one embodiment, a substantially transparent substrate (e.g., a glass, a plastic or a crystalline material) is utilized to fabricate the capacitive sensing device. A set of conductive traces is patterned above the substantially transparent substrate. Optionally, an insulating material may be deposited above the set of conductive traces. In one embodiment, the insulating material may act as protection for the set of conductive traces and also provide them electrical insulation from the outside world.

With reference now to 305 of FIG. 3 and to FIG. 2 , one embodiment forms a first sensor electrode 106 a on a substrate 204 . In one embodiment, substrate 204 is a substantially transparent substrate. For example, the substantially transparent substrate may include, but is not limited to, a glass, a plastic or a crystalline material. Additionally, the substantially transparent substrate may be a component of an information display device. For example, the substantially transparent substrate may be implemented as a part of a casing or front cover of the information display device. It is noted that the substantially transparent substrate may include a wide variety of materials in accordance with the present embodiment. In another embodiment, the substrate is not substantially transparent and may include, but is not limited to, silicon wafer, or the like.

First sensor electrode 106 a is normally formed from a plurality of sensor elements patterned above the substrate. The forming or patterning of first sensor electrode 106 a may be implemented in diverse ways. For example, the patterning of first sensor electrode 106 a can include, but is not limited to, a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA. It is noted that LIGA is the German abbreviation for LIthogafie Galvanoformung Abformung which in English means lithographic electrodeposition.

First sensor electrode 106 a can include substantially opaque material and/or substantially non-reflective material. Furthermore, first sensor electrode 106 a may be formed of at least one layer of material that is substantially non-reflective. It is noted that by locating a substantially opaque, non-reflective material such that it faces a user of the capacitive sensing device, it can optically obscure from the user any reflective materials included as part of the set of conductive traces that make up first sensor electrode 106 a . In this manner, the substantially non-reflective material makes the set of conductive traces more difficult to see by the user. It is noted that first sensor electrode 106 a can include at least one layer of substantially opaque material.

Moreover, first sensor electrode 106 a may be patterned such that each of the conductive traces has a width less than approximately 12 micrometers. It is noted that the width of each conductive trace may be understood to mean the width of each individual conductive element of the set of conductive traces forming first sensor electrode 106 a . In this manner, when a user is approximately at arm's length from the capacitive sensing device, the user's eyes are substantially unable to view the set of conductive traces of the capacitive sensing device. It is understood that by decreasing the width of each trace of the set of conductive traces, there is a point at which they are no longer resolvable by a human eye. In this fashion, there is no deleterious obstruction of an underlying image by the set of conductive traces that make up first sensor electrode 106 a.

With reference now to 310 of FIG. 3 and to FIG. 2 , one embodiment forms a first routing trace 108 a on the substrate 204 . The first routing trace 108 a coupled with the first senor electrode 106 a . In general, first routing trace 108 a may be formed in diverse ways. For example, first routing trace 108 a may be formed from a first material 208 having a first resistivity and a second material 210 having a second resistivity. For example, first material 208 may be a conductive ink such as silver ink while second material 210 may be ITO. However, it is also appreciated that first routing trace 108 a may be formed from a single material or compound having thicker local portions or wider local portions to produce lower resistance portions such as described and shown with respect to first material 208 and second material 210 .

Furthermore, the patterning of first routing trace 108 a can include patterning a landing pad region above substrate 204 to enable coupling of one or more sensing circuit components, such as controller 102 of FIG. 2 , to substrate 204 . For example, the landing pad region may include wiring for coupling integrated circuit (IC) chips, capacitors, resistors, connectors and other electronic components to the substantially transparent substrate. Additionally, to promote solderability, the landing pad region may be plated with gold, tin, copper or any other metal that is compatible with solder.

With reference now to 315 of FIG. 3 and to FIG. 2 , one embodiment forms a second sensor electrode 106 n on a substrate 204 . Second sensor electrode 106 n is normally formed from a plurality of sensor elements patterned above the substrate. The forming or patterning of second sensor electrode 106 n may be implemented in diverse ways. For example, the patterning of second sensor electrode 106 n can include, but is not limited to, a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA. It is noted that LIGA is the German abbreviation for LIthogafie Galvanoformung Abformung which in English means lithographic electrodeposition.

Second sensor electrode 106 n can include substantially opaque material and/or substantially non-reflective material. Furthermore, the set of conductive traces may be formed of at least one layer of material that is substantially non-reflective. It is noted that by locating a substantially opaque, non-reflective material such that it faces a user of the capacitive sensing device, it can optically obscure from the user any reflective materials included as part of the set of conductive traces. In this manner, the substantially non-reflective material makes the set of conductive traces more difficult to see by the user. It is noted that the set of conductive traces can include at least one layer of substantially opaque material.

In another embodiment, second sensor electrode 106 n may be patterned such that each of the conductive traces has a width less than approximately 12 micrometers. It is noted that the width of each conductive trace may be understood to mean the width of each individual conductive element of the set of conductive traces forming second sensor electrode 106 n . In this manner, when a user is approximately at arm's length from the capacitive sensing device, the user's eyes are substantially unable to view the set of conductive traces that make up second sensor electrode 106 n . It is understood that by decreasing the width of each trace of the set of conductive traces, there is a point at which they are no longer resolvable by a human eye. In this fashion, there is no deleterious obstruction of an underlying image by the set of conductive traces of the second sensor electrode 106 n.

With reference now to 320 of FIG. 3 and to FIG. 2 , one embodiment forms a second routing trace 108 n differing in length from the first routing trace 108 a on the substrate 204 . The second routing trace 108 n coupled with the second senor electrode 106 n.

In general, second routing trace 108 n may be formed in diverse ways. For example, second routing trace 108 n may be formed from a first material 208 having a first resistivity and a second material 210 having a second resistivity. For example, first material 208 may be a conductive ink such as silver ink while second material 210 may be ITO. However, it is also appreciated that first routing trace 108 a may be formed from a single material or compound having thicker local portions or wider local portions to produce lower resistance portions such as described and shown with respect to first material 208 and second material 210 .

Furthermore, the patterning of first routing trace 108 a can include patterning a landing pad region above substrate 204 to enable coupling of one or more sensing circuit components, such as controller 102 of FIG. 2 , to substrate 204 . For example, the landing pad region may include wiring for coupling integrated circuit (IC) chips, capacitors, resistors, connectors and other electronic components to the substantially transparent substrate. Additionally, to promote solderability, the landing pad region may be plated with gold, tin, copper or any other metal that is compatible with solder.

In one embodiment, second routing trace 108 n has an RC time constant that is approximately equal to the RC time constant of the first routing trace 108 a to attenuate electrical interference. For example, second material 210 may be overlaid or interspersed with respect to first material 208 . Thus, as described herein, by incorporating materials with different resistivity into each of the plurality of traces, or by modifying the shape of a single material to produce sections of the routing trace having different resistance values, the resultant impedance mismatch will allow each of the routing traces 108 a - 108 n to act as a radio frequency (RF) reflector. Further, the impedance mismatch will reduce trace antenna efficiencies thereby resulting in reduced interference properties at routing traces 108 a - 108 n . For example, small resistivity changes in routing traces 108 a - 108 n will significantly reduce the RF coupling efficiency. In other words, the impedance mismatch will deter routing traces 108 a - 108 n from acting as antenna when RF or other low frequency interference is encountered; such as when a sensor device is used in mobile phone applications, LCD applications, or the like.

In a further embodiment, the resistance of routing traces 108 a - 108 n may be varied such that an overall matching RC time constant is realized for each of routing traces 108 a - 108 n . In other words, by balancing the RC time constant across two or more routing traces 108 a - 108 n , common mode interference will be received at the controller 102 as common mode noise and will result in a capacitive sensing device with significantly better balanced common mode RF interference recognition and removal.

Thus, when a sensing frequency is varied each of routing traces 108 a - 108 n will be affected similarly; that is, in a common mode fashion. As such, embodiments described herein provide a cost effective method of adding this resistance to routing traces 108 a - 108 n . Moreover, since the sensor device controller firmware is presently designed to cope with common mode disturbances, the technology described herein will enable variable sensing frequencies, reduce clock modulation related jitter, and the like while adding little or no present or follow-on programming overhead to controller 102 . Additionally, embodiments described herein may also be utilized for RC sheet sensors.

In one embodiment, portions of the present technology are composed of computer-readable and computer-executable instructions that reside, for example, in computer-usable media of a computer system. That is, pluralities of computer systems and components having computer readable media disposed thereon (e.g. random access memory (RAM) and/or read-only memory (ROM)) may be used to implement embodiments, of the present technology. Moreover, embodiments described herein can operate on or within a number of different computer systems including general purpose networked computer systems, embedded computer systems, routers, switches, server devices, client devices, various intermediate devices/nodes, stand alone computer systems, and the like.

The foregoing descriptions of specific embodiments have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the presented technology to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the presented technology and its practical application, to thereby enable others skilled in the art to best utilize the presented technology and various embodiments with various modifications as are suited to the particular use contemplated. It is intended that the scope of the present technology be defined by the claims appended hereto and their equivalents.