Electrical connector

1. Field of the Invention

The present invention relates to the art of electrical connectors, and more particularly to an electrical connector for electrically connecting between an IC package with a substrate.

2. Description of the Related Art

One conventional electrical connector 5 ′ is shown in FIG. 3 to include an insulative connector body 51 ′ with a plurality of contacts 52 ′ attached thereto. The connector body 51 ′ includes a base section 511 ′ with four side walls 512 ′ surrounded thereby to form an interior cavity adapted to receive an IC package (not shown). Each of two adjacent side walls 512 ′ is provided with a pair of datum protrusions 5120 ′, which are utilized to precisely locate the contacts and the IC package relative to the side walls 512 ′ of the connector body 51 ′. Typically, the IC package is loaded into the connector body 51 ′ so as to establish electrical continuity between the IC package and a substrate (not shown). Frequent loading processes of the IC package onto the connector body 51 ′ will result in stress concentration adjacent the datum protrusions 5120 ′, particularly around a joint portion between the base section 511 ′ and the respective side walls 512 ′, thereby causing the joint portion cracked or somewhat fragile undesirable to the user of the electrical connector 5 ′. Therefore, there is a need to provide a new electrical connector to resolve the above-mentioned shortcoming.

An electrical connector according to one embodiment of the present invention includes a connector body holding a plurality of contacts. The connector body includes a base section with four side walls surrounded thereby to form an interior cavity adapted to receive an IC package. A datum protrusion is provided on each of two adjacent side walls and configured to laterally invade the interior cavity. A chamfered surface is formed along a joint between each of two adjacent side walls and the base section, and further adjacent each of the datum protrusions, thereby avoiding stress generation around the joint between each side wall and the base section.

Other features and advantages of the present invention will become more apparent to those skilled in the art upon examination of the following drawings and detailed description of preferred embodiments, in which:

FIG. 1 is a perspective view of an electrical connector according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a part “V” of the electrical connector of FIG. 1 ; and

FIG. 3 is a perspective view of a conventional electrical connector.

Referring to FIGS. 1 and 2 , an electrical connector 5 according to the embodiment is shown to include an insulative connector body 51 with a plurality of contacts 52 attached thereto. The electrical connector body 51 includes a base section 511 with four side walls 512 surrounded thereby to form an interior cavity adapted to receive an IC package (not shown). Each of two adjacent side walls 512 is provided with at least three datum protrusions 5120 evenly arranged along a length edge of each side wall 512 , thereby forming additional force bearing points for the IC package after the IC package is loaded onto the connector body. Each datum protrusion 5120 has an outer face facing towards the interior cavity, with the outer faces of the datum protrusions 5120 disposed in a coplanar manner. The providence of additional datum protrusions 5120 can result in even force pushed against the IC package from the evenly-arranged datum protrusions 5120 , thereby assuring the precise location of the IC package with respect to the peripheral side walls 512 of the connector body 51 . Firstly, a chamfered/curved surface 513 is formed along a joint between each of two adjacent side walls 512 and the base section 511 and adjacent each datum protrusion 5120 , and secondly the protrusion 5120 is spaced from a top face of the base section 511 , thereby avoiding stress generation/concentration around the joint between each side wall 512 and the base section 511 . In addition, an inspection window 5110 is formed on the base section 511 and proximate to each datum protrusion 5120 , thereby enabling a measurement of the IC package in a first direction and a second direction substantially perpendicular to the first direction (as known in the prior art). In such a manner, registry of the IC package can be accurately controlled.

While the present invention has been described with reference to preferred embodiments, the description of the invention is illustrative and is not to be construed as limiting the invention. Various of modifications to the present invention can be made to preferred embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.