Chip socket structure

a) Field of the Invention

The present invention relates to a chip socket structure, and more particularly to a chip socket structure wherein insertion slots of a fixing plate are corresponding to terminals, such that when pins of the terminals are correspondingly inserted into the insertion slots of fixing plate, they can be tidily arranged inside the insertion slots.

b) Description of the Prior Art

Referring to FIG. 1 and FIG. 2 , a center of conventional chip socket A is provided with a cavity A 2 for holding a chip A 2 , and peripheries of the cavity A 2 are arranged with insertion slots A 4 for terminals A 3 which are connected with each pin A 6 with connection plates A 5 . After the chip A 2 is implanted, the connection plates A 5 are broken off to separate the pins A 6 from one another, and the pins A 6 are extended in an approximately horizontal direction to form a suspension state at insertion parts A 7 . Therefore, after the chip socket A are assembled, the pins A 6 are easy to form an irregular configuration, such that when a surface mounting technology is applied to weld the chip socket A on a circuit board, the pins A 6 cannot be fixed horizontally and a void solder phenomenon is formed.

Accordingly, how to eliminate the aforementioned drawbacks is a technical issue to be solved by the inventor of present invention.

The present invention is to provide a chip socket structure, wherein insertion slots of a fixing plate are corresponding to terminals, such that when pins of the terminals are correspondingly inserted into the insertion slots of fixing plate, they can be tidily arranged inside the insertion slots; and upon welding the chip socket with a surface mounting technology, the terminals can be maintained at a horizontal direction, and there will be no void solder phenomenon resulted from welding the pins.

To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.

FIG. 1 shows a perspective view of a conventional chip socket.

FIG. 2 shows a cutaway view of a conventional chip socket.

FIG. 3 shows a perspective view of the present invention.

FIG. 4 shows an exploded view of the present invention.

FIG. 5 shows a cutaway view of the present invention.

FIG. 6 shows a schematic view of an embodiment of the present invention.

Referring to FIGS. 3 to 5 , the present invention is to provide an improved structure of a chip socket, which comprises a chip socket B, a fixing seat C, terminals D, and a chip E.

The chip socket B is a square fixing seat C, and a center of which is provided with a cavity C 1 for holding the chip E. Inner sides of the cavity C 1 are arranged with insertion slots C 2 for inserting the terminals D, and a side of the insertion slots C 2 is extended with a fixing plate F which is corresponding to pins D 1 .

The terminals D of insertion slots C 2 are connected to each pin D 1 with connection plates D 2 , such that after the terminals D are inserted into the insertion slots C 2 of fixing seat C, the connection plates D 2 can be broken off to separate each pin D 1 of terminals D from one another, thereby enabling the pins D 1 to be correspondingly inserted into insertion slots F 1 of the fixing plate F.

The pins D 1 of terminals D are corresponding to the fixing plate F and the insertion slots F 1 which are extended and arranged at a side of the fixing plate F. After the connection plates D 2 and terminals D are inserted into the insertion slots C 2 of fixing seat C, by using the insertion slots F 1 of fixing plate F as a horizontal baseline, each pin D 1 can be fixed without being adjusted and corrected, thereby achieving the objects of saving manpower and reducing production cost.

Accordingly, through the correspondence of insertion slots F 1 of fixing plate F to the terminals D, the pins D 1 of terminals D can be tidily arranged inside the insertion slots F 1 , such that when the chip socket B is welded with a surface mounting technology, the terminals D can be maintained at a horizontal direction and there will be no void solder phenomenon.

Referring to FIGS. 4 to 6 , the chip socket B is a square fixing seat C which is provided with a cavity C 1 for holding the chip E. The cavity C 1 is arranged with insertion slots C 2 for inserting the terminals D, wherein the terminals D are connected to each pin D 1 with connection plates D 2 . After the terminals D are inserted into the insertion slots C 2 of fixing seat C, the connection plates D 2 can be broken off to separate each pin D 1 of terminals D from one another.

The pins D 1 of terminals D are corresponding to the fixing plate F, and insertion slots F 1 which are extended and arranged at a side of the fixing plate F. After the connection plates D 2 and terminals D are inserted into the insertion slots C 2 of fixing seat C, by using the insertion slots F 1 of fixing plate F as a horizontal baseline, each pin D 1 can be fixed without being adjusted and corrected, thereby achieving the objects of saving manpower and reducing production cost.

Moreover, a center of the fixing seat C is provided with the fixing plate F, and a side of the fixing plate F is provided with the insertion slots F 1 which are corresponding to the terminals D. When the terminals D are inserted into the insertion slots C 2 of fixing seat C, through the correspondence of insertion slots F 1 of fixing plate F to the terminals D, the pins D 1 of terminals D can be tidily arranged inside the insertion slots F 1 , such that the terminals D can be maintained at a horizontal direction and there will be no void solder phenomenon, in welding the chip socket B with the surface mounting technology.

To further manifest the advancement and practicability of the present invention, the present invention is compared with a conventional chip socket as below:

Shortcomings of a Conventional Chip Socket

1. The pins are configured in an approximately horizontal direction to form a suspension state, thereby being easy to result in an irregular configuration. 2. According to item 1, when the chip socket is welded on a circuit board, it is easy to result in a void solder phenomenon.

Advantages of the Present Invention

1. By using the insertion slots of fixing plate as a horizontal baseline, each pin can be fixed without being adjusted or corrected, thereby achieving the objects of saving manpower and reducing production cost. 2. Through the correspondence of insertion slots of fixing plate to the pins of terminals, the pins of terminals can be tidily arranged inside the insertion slots, thereby enabling the pins of terminals to achieve a best conducting effect. 3. Through the correspondence of insertion slots of fixing plate to the pins of terminals, the terminals can be maintained at a horizontal direction and there will be no void solder phenomenon when the chip socket is welded with the surface mounting technology. 4. It is provided with the advancement and practicability. 5. It is provided with an industrial competitiveness. It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.