USPatent applicationPatented

Wide-dispersal package and cap assembly

Granted 22 Feb 2011 · 2 office actions

Current assignee: PENN BOTTLE AND SUPPLY CO. · originally TricorBraun Inc.

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Attorney: Attorney · Log in to unlock

Inventors: David A. Snyder, Scott Seanor Wolff · Examiner: Robin Hylton · AU 3781 · TC 3700

Life of the application

19 dated events
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Abstract

A wide-dispersal package cap includes a rim and a domed portion formed within the rim and mounted thereto. The domed portion includes a plurality of orifices each having an internal opening and an external opening relative to a thickness of the domed portion. The orifices are formed spaced apart from one another through the domed portion at an angle, such that the external opening of a particular orifice is off-set from the corresponding internal opening, to thereby enhance wide-dispersal of contents of a package to which the cap is attached.

Description

8 parts
›RELATED APPLICATIONS

This application relies upon and claims benefit, under 35 U.S.C. 119(e), of pending U.S. Provisional Patent Application Ser. No. 60/678,868, filed May 7, 2005.

›TECHNICAL FIELD OF THE INVENTION

This invention relates generally to the field of molded packaging and, more particularly, to a package cap designed for wide dispersal of liquid, powdered, granulated, or similar products.

›DESCRIPTION OF RELATED ART

Previously, packages for dispersal of products such as powders, liquids or granules, such as granules of fertilizer or salt, for example, have included a variety of mechanisms such as spouts, punch-out holes, twist tops with openings, or simply complete removal of the package cap for pour-out of the package contents. These package cap mechanisms permit pouring or sprinkling of contents in a stream or very limited diameter area, i.e. effectively limited to the diameter of the cap opening(s) and offer some amount of control for applications requiring controlled spread. However, there has not been known any satisfactory cap for such a package that permits facile yet wide-spread dispersal of the package contents.

›SUMMARY OF THE INVENTION

One aspect of the invention generally pertains to a cap for a package, the cap having a pattern and shape of outlet holes suitable for wide-spread dispersal of the package contents.

Another aspect of the invention pertains to a wide-dispersal cap with a flip top closure.

Yet another aspect of the invention pertains to a one-piece molded cap have an integrated flip top closure and a pattern of bi-level orifices.

Accordingly, in keeping with the above goals and advantages, the invention is, briefly, a wide-dispersal package cap including a rim and a domed portion formed within the rim and mounted thereto. The domed portion includes a plurality of orifices each having an internal opening and an external opening relative to a thickness of the domed portion. The orifices are formed spaced apart from one another through the domed portion at an angle, such that the external opening of a particular orifice is off-set from the corresponding internal opening, to thereby enhance wide-dispersal of contents of a package to which the cap is attached.

The above-mentioned aspects are merely illustrative of the innumerable aspects associated with the present invention and should not be deemed as limiting in any manner. These and other aspects, features and advantages of the present invention will become apparent from the following detailed description when taken in conjunction with the referenced drawings.

›BRIEF DESCRIPTION OF THE DRAWINGS

Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views.

FIG. 1A is a perspective view of the wide-dispersal package cap of the present invention in closed position.

FIG. 1B is a perspective view of the wide-dispersal package cap of FIG. 1A in semi-open position.

FIG. 1C is a perspective view of the wide-dispersal package cap of FIG. 1A in open position.

FIG. 2 is a bottom plan view of the wide-dispersal package cap of FIG. 1 .

FIG. 3 is a front elevational view of the wide-dispersal package cap of FIG. 2 .

FIG. 4 is a side elevational view of the wide-dispersal package cap of FIG. 2 .

FIG. 5 is a top plan view of the wide-dispersal package cap of FIG. 2 with the flip top closure in the closed position.

FIG. 6 is a sectional view of a wide-dispersal package cap according to another embodiment.

FIG. 6A is an enlarged schematic view of the front portion of the cap of FIG. 6 , taken at circle 6 A.

FIG. 7 is a top plan view of the domed orifice portion of another embodiment of the present invention, showing some examples of suitable dimensions.

FIG. 8 is a side elevational view of a domed orifice portion of a wide-dispersal package cap of FIG. 7 .

FIG. 9 is an enlarged top plan view of the domed orifice portion of FIG. 7 , partially cut away, illustrating the offset hole structure.

FIG. 10 is an enlarged side elevational view of the domed orifice portion of FIG. 7 , partially cut away, illustrating the offset hole structure.

›DETAILED DESCRIPTION · 1 of 2

In the following detailed description numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. For example, the invention is not limited in scope to the particular type of industry application depicted in the figures. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

FIGS. 1A-10 illustrate a one-piece wide-dispersal package cap 10 according to one embodiment of the present invention. The cap 10 can be manufactured using any suitable production method and raw materials. However, in the preferred embodiment, the cap is a single molded piece manufactured from a material such as high density polyethylene, polyethylene, or polypropylene. Those of skill in the art will recognize that a number of different materials are suitable for constructing the cap 10 .

Cap 10 includes a rim 12 that provides structure, such as a snap-fit, press-fit or threaded engagement for connecting the cap 10 to a package (not shown), such as for example, a bottle, jar or other hand-held container. In alternative embodiments, the cap 10 can be molded with the associated package in a known manner. In the embodiment illustrated in FIGS. 1A-6A the walls of rim 12 are generally vertical, that is, substantially parallel to the longitudinal axis of the cap. Rim 12 is preferably circular in shape, as shown in the disclosed embodiment, and includes a slight recess or depression 14 . The recess 14 provides a thumb grip to aid in opening the preferred flip top closure 16 . At a point on rim 12 , approximately opposite recess 14 , a living hinge 18 is provided to integrally connect the rim 12 and the flip top closure 16 . While this is the preferred method of connecting a top closure to rim 12 , other known structures can be conceived that will suffice and are in keeping with the invention. For example, the closure can be provided as a piece independent from but connectable to the rim.

In the embodiment shown, in FIGS. 6 and 6A , a series of triangular cut-outs or serrations 20 runs along the annular inner side of the wall of the rim 12 . These serrations 20 create additional friction and interference at the intersection of the rim 12 and the associated package to inhibit rotation of the cap 10 relative to the package, for child safety purposes.

As can be seen in FIG. 5 and the enlargement of FIG. 6A , the flip top closure 16 has a diameter roughly equivalent to that of the rim 12 . However, the recess 14 in the rim 12 allows the perimeter of flip top closure 16 to slightly overhang the rim 12 at the location of the recess 1 . 4 , thereby providing a small are of the surface upon which to exert an upward force against flip top closure 16 for opening, to expose the domed portion 28 there beneath.

Rim 12 includes an outer annular surface 22 . Surface 22 includes a projecting ring 24 having a roughly rectangular cross sectional shape. Other cross-sectional shapes may be used in alternate embodiments. The flip top closure 16 is provided with a correspondingly shaped annular recess 26 that engages the projecting ring 24 of the rim 12 when closure 16 is in the closed position, thereby creating multiple sealing surfaces ( FIG. 6A ). In the preferred embodiment illustrated, the rim 12 and flip top closure 16 include another projecting ring/recess combination immediately inside of the first ring 24 /recess 26 combination to provide additional detenting engagement and sealing surfaces 40 .

A valve seal 27 is formed beneath the underside (the container facing side) of the rim's outer surface 22 . In a preferred embodiment, valve seal 27 as shown has a triangular cross-sectional shape. However, other cross-sectional shapes may be used. The most beneficial shape for valve seal 27 may be driven by the characteristics of the neck of the package to which the cap 10 is attached. Valve seal 27 captures the neck of the attached package between seal 27 and the interior vertical surface of rim 12 to create a seal between cap 10 and package.

Substantially centrally of rim 12 , there is a domed portion 28 which curves outwardly toward and into closure 16 when the cap is closed. Dome 28 can be molded to rim 12 as a single piece or conceivably provided as a separate piece from the rim. Domed portion 28 has a plurality of spaced apart through-holes, or orifices 30 . Each of the orifices 30 is formed with a bi-level design, as show in FIGS. 9 and 10 , with a first (lower) level 32 and a second (upper) level 34 . First level 32 and second level 34 remain in communication but are slightly offset from one another. In particular, the second, or upper, level 34 is shifted slightly off vertical toward the periphery of the domed portion 28 . In other words, orifices 30 are each formed as a tunnel through domed portion 28 so that the two open ends of each tunnel are necessarily offset from one another, as illustrated in FIGS. 2 and 9 , for example. This offset causes the contents of the package to move in an outward direction (radially from the axis of the package) as the contents pass through cap orifices 30 . This outward radial movement results in an increased width of the resulting product dispersal pattern. The combination of the bi-level orifices 30 with the dome shape of portion 28 of cap 10 further widens the resulting product distribution pattern when the container contents are dispersed from the package. In the embodiment illustrated in FIG. 9 , the offset between a pair of upper and lower orifice openings is approximately 0.120″. However, multiple offset ranges are contemplated within the scope of this invention. It is important to provide a sufficient overlap between first level 32 and second level 34 to maintain a suitable flow rate of material. In the example shown in FIG. 10 this overlap dimension is 0.050″. The offset and overlap dimensions will vary depending on the product being dispensed (i.e., particle size for powdered and granulated materials and viscosity for liquid materials will be important considerations) and the desired dispersal pattern.

›DETAILED DESCRIPTION · 2 of 2

At the approximate center of the domed portion 28 is a vent hole 36 . Vent hole 36 is isolated from the orifices 30 on the interior of the cap by a connected or integral vent tube 38 . Vent tube 38 is open at its bottom end (internally directed) and mates with an extension tube (not shown) that leads to the bottom interior area of the associated package. This venting structure is arranged to allow air to enter the inverted package to replace the volume of the product dispensed from the package, thus facilitating product flow from the package. Product is not dispensed through vent hole 36 because the preferably cylindrical side wall of the vent tube 38 prevents flow from inside the package of contents to vent hole 36 . Thus package product is dispersed only via orifices 30 .

The preferred embodiment of the invention has been described above to explain the principles of the invention and its practical application to thereby enable others skilled in the art to utilize the invention in the best mode known to the inventors. However, as various modifications could be made in the constructions and methods herein described and illustrated without departing from the scope of the invention, it is intended that all matter contained in the foregoing description or shown in the accompanying drawings shall be interpreted as illustrative rather than limiting. Thus, the breadth and scope of the present invention should not be limited by the above-described exemplary embodiment, but should be defined only in accordance with the following claims appended hereto and their equivalents.

›PARTS LIST

10 Cap

12 Rim of 10

14 Depression

16 Closure

18 Living Hinge on 12

20 Serrations

22 Outer Annular Surface

24 Projecting Ring

26 Ring Shaped Recess

27 Valve Seal

28 Domed Portion

30 Orifices

32 1 st Level

34 2 nd Level

36 Vent Hole

38 Vent Tube

40 Multiple Sealing Surfaces

Claims as granted

17 claims

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Classifications

14 codes
IPC · International Patent Classification
Section B — Performing operations; transporting
  • B65D43/08
  • B67D3/00
  • B65D47/00
  • B65D51/18
  • B65D51/16
  • B65D43/14
USPC · US Patent Classification
220/254.3220/839220/796222/481220/367.1222/480222/565222/556

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File wrapper

⤢ drag to zoomJul 2006Jan 2007Jul 2007Jan 2008Jul 2008Jan 2009Jul 2009Jan 2010Jul 2010Jan 2011USPTOApplicantNon-final rejectionResponse after non-finalResponse after non-final
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Pendency
4.8 y
1,754 days filing → grant
Office actions
2
non-final + final
Responses
2
no RCE
Interviews
2
examiner interview summaries
Examiner
Robin Hylton
art unit 3781 · TC 3700
Citations: 6 back · 3 forward

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