USPatent applicationPatented

Liquid crystal display

Granted 16 Feb 2010 · 3 office actions

Life of the application

12 dated events
⤢ drag to zoom20062008201020122014201620182020202220242026ProsecutionOwnershipTerm & fees
ProsecutionOwnershipTerm & feeshover for detail · click to open

Description

17 parts
›This application is a Continuation-In-Part of copending application…

This application is a Continuation-In-Part of copending application Ser. No. 11/283,872 filed on Nov. 22, 2005, the entire contents of which are hereby incorporated by reference and for which priority is claimed under 35 U.S.C. § 120.

›BACKGROUND

The invention relates to a liquid crystal display, and more specifically to a polyimide liquid crystal display.

With advances in information and digitization, light, thin, and portable electronic products utilizing thin display panels have become popular. However, they are inconvenient for transport and complicated fabrication may cause low yield.

Thus, a transparent and flexible plastic substrate (0.1˜0.2 mm) has been developed. Such plastic substrate is thin, light, durable, and portable, and produced by a continuous rolling process, significantly reducing costs

Unfortunately, problems such as deposition of indium tin oxide (ITO) and thin film transistor (TFT) thereon and backend panel assembly occur. Additionally, the glass transition temperature (Tg) of the optical-level plastic substrate such as PET, PEN, PC, or m-COC (Arton or Zeonor) is lower than 200° C., unfavorable for fabrication. Also, PES substrate has insufficient solvent resistance, with yellowing and cracking at high temperatures (200° C.). Furthermore, some polyimide plastic substrates capable of thermal and solvent resistance, being dark brown, are only suitable for use in reflective LCD panels, not transmissive LCD panels.

Conventional extended polyimide has a lower coefficient of-thermal expansion (CTE) of about 20 ppm/° C., its retardation, however, is too large (Rth>1000 nm) for use in LCD panels.

Additionally, the plastic substrate must be fixed to a glass substrate by resin glue to facilitate subsequent multi-lithography and etching due to difficulty in handling. However, TFT element breakage and residual resin glue may easily occur when the plastic substrate is taken off the glass substrate.

›SUMMARY

The invention provides a liquid crystal display comprising a color filter substrate and an array substrate, wherein at least one of the color filter substrate and the array substrate comprises polyimide having formula (I):

wherein A and A′ are the same or different and comprise cycloaliphatic compounds or aromatic compounds, B and B′ are the same or different and comprise ycloaliphatic compounds or aromatic compounds, and x and y are 10˜10000, wherein at least one of A and A′ is a cycloaliphatic compound.

A detailed description is given in the following embodiments with reference to the accompanying drawing.

›BRIEF DESCRIPTION OF THE DRAWINGS

The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawing, wherein:

FIG. 1 is a cross section of a liquid crystal display of the invention.

›DETAILED DESCRIPTION

The invention provides a liquid crystal display comprising a color filter substrate and an array substrate. At least one of the color filter substrate and the array substrate comprises polyimide having formula (I):

The polyimide may be further mixed with inorganic powder such as silicate, silicon oxide or titanium oxide. The inorganic powder has a diameter of about 10˜400 nm, preferably 10˜100 nm. In the mixture, the inorganic powder has a weight ratio of about 1˜20 wt %, preferably 2˜10 wt %.

The polyimide material mixed with inorganic nano powder formed by the organic/inorganic nano hybrid technique of the invention provides size stability, high heat resistance, high chemical resistance, and high pencil hardness. Also, the inorganic powder can reduce retardation of PI substrate, achieving optical compensation of-LCD panel.

In formula (I), A and A′ may be the same or different and comprise cycloaliphatic compounds such as

wherein X, Y, and Z may comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C 1-18 alkyl, bromine, chlorine, or iodine, or aromatic compounds such as

wherein X and Y may comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C 1-18 alkyl, bromine, chlorine, or iodine and Z may comprise —O—, —CH 2 —, —S—, —SO 2 —, —C(CH 3 ) 2 —, —Ar—O—Ar—, —Ar—CH 2 —Ar—, —O—Ar—C(CH 3 ) 2 —Ar—O—, —O—Ar—Ar—O—, —O—Ar—C(CF 3 ) 2 —Ar—O—, or —Ar—C(CH 3 ) 2 —Ar—, wherein Ar is phenyl.

B and B′ may be the same or different and comprise cycloaliphatic compounds such as

or aromatic compounds such as

wherein X and Y may comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C 1-18 alkoxy, bromine, chlorine, or iodine and Z may comprise —O—, —SO 2 —, —CH 2 —, —C(CH 3 ) 2 —, —COO(CH 3 ) 2 COO—, —C(CF 3 ) 2 —, —Ar—O—Ar—, —O—Ar—O—, —Ar—CH 2 —Ar—, —O—Ar—C(CH 3 ) 2 —Ar—O—, —O—Ar—Ar—O—, —O—Ar—C(CF 3 ) 2 —Ar—O—, or —Ar—C(CH 3 ) 2 —Ar—, wherein Ar is phenyl. B and B′ may be

and x and y may be 10˜10000.

The polyimide having formula (I) provided by the invention comprises

wherein x and y may be 10˜10000.

The polyimide provided by the invention may have formula (II):

In formula (II), A may be a cycloaliphatic compound such as

wherein X, Y, and Z may comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C1-18 alkyl, bromine, chlorine, or iodine.

B may be an aromatic compound such as

wherein X and Y may comprise hydrogen, methyl, trifluoromethyl, hydroxyl, C 1-18 alkoxy, bromine, chlorine, or iodine and Z may comprise —O—, —SO 2 —, —CH 2 —, —C(CH 3 ) 2 —, —COO(CH 3 ) 2 COO—, —C (CF 3 ) 2 —, —Ar—O—Ar—, —O—Ar—O—, —Ar—CH 2 —Ar—, —O—Ar—C (CH 3 ) 2 —Ar—O—, —O—Ar—Ar—O—, —O—Ar—C(CF 3 ) 2 —Ar—O—, or —Ar—C(CH 3 ) 2 —Ar—, wherein Ar is phenyl. B and B′ may be

and n may be 10˜10000.

The polyimide having formula (II) provided by the invention comprises

The compound of formula (II) is prepared in two steps as follows. First, a diamine such as 4,4-methylene bis(cyclohexylamine) (DACH), a dianhydride monomer such as 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), and a polar solvent such as N-methyl-2-pyrrolidone (NMP) or N,N-dimethylacetamide (DMAc) are added to a flask and reacted to form a poly(amic acid) (PAA). The PAA is then imidized at about 300˜400° C. to form a polyimide via dehydration and cyclization. The reaction scheme is shown below.

Second, a diamine such as 4,4-methylene bis(cyclohexylamine) (DACH), a dianhydride monomer such as 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA), and a solvent such as m-cresol or phenol are added to a flask and reacted at a reflux temperature to form a polyimide via PAA formation, dehydration, and cyclization. The reaction scheme is shown below.

Compared to the traditional polyimide, the disclosed polyimide, a partial phenyl structure, comprising a cycloaliphatic diamine monomer and an aromatic dianhydride monomer, provides higher thermal resistance and transmission rate and improved workability and chemical resistance due to conduction of the cycloaliphatic compounds thereto.

The polyimide film has haze less than 3%, a transmission rate exceeding 70%, a yellow index less than 6.5, a glass transition temperature of about 250˜350° C., a coefficient of thermal expansion of about 20˜75 ppm/° C., a pencil hardness exceeding 2H, retardation less than 200 nm and a thickness of about 20˜200 μm, preferably 50˜150 μm.

In FIG. 1 , a liquid crystal display structure of the invention is illustrated. A liquid crystal display 10 comprises an array substrate 11 , a color filter substrate 12 , spacers 13 , and liquid crystals 14 . At least one of the array substrate 11 and color filter substrate 12 is composed of polyimide. The array substrate 11 is opposite to the color filter substrate 12 and the spacers 13 and liquid crystals 14 are formed the therebetween.

EXAMPLES
›Examples11
›Example 1

Preparation of 6FDA-DACH (PI-FD)

2.32 g DACH was dissolved in 41 g DMAc at room temperature under nitrogen gas. Next, 5 g 6 FDA was added to form a sticky PAA solution with stirring for 3 hr. The PAA solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless polyimide film.

›Example 2

Preparation of 6FDA-m-TB-HG-co-6FDA-IPDA (PI-FTI)

1.64 g m-TB-HG and 0.56 g IPDA were dissolved in 41 g DMAc at room temperature under nitrogen gas. Next, 5 g 6FDA was added to form a sticky PAA solution with stirring for 3 hr. The PAA solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless polyimide film.

›Example 3

Preparation of 6FDA-m-TB-HG-co-6FDA-DACH (PI-FTD)

1.63 g M-TB-HG and 0.70 g DACH were dissolved in 42 g DMAC at room temperature under nitrogen gas. Next, 5 g 6FDA was added to form a sticky PAA solution with stirring for 3 hr. The PAA solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless polyimide film.

›Example 4

Preparation of 6FDA-m-DACH-co-DSDA-DACH (PI-FDD)

3.12 g DACH was dissolved in 46 g DMAc at room temperature under nitrogen gas. Next, 3 g 6FDA and 3 g DSDA were added to form a sticky PAA solution with stirring for 3 hr. The PAA solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless polyimide film.

›Example 5

Preparation of ODPA-BAPPm-co-ODPA-IPDA (PI-OBI)

4.53 g BAPPm and 0.81 g IPDA were dissolved in 59 g DMAc at room temperature under nitrogen gas. Next, 5 g ODPA was added to form a sticky PAA solution with stirring for 3 hr. The PAA solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless polyimide film.

›Example 6

Preparation of B1317-BAPPm-co-B1317-DACH (PI-BD)

16.2 g BAPPm and 8.3 g DACH were dissolved in 250 g DMAc at room temperature under nitrogen gas. Next, 20 g B1317 was added to form a sticky PAA solution with stirring for 3 hr. The PAA solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless polyimide film.

›Example 7

Preparation of PI-BD/Silicate Composition

50 g silicate was added to 900 g DMAc at 60° C. with high-speed pulverizing and dispersing to form a clarifying solution containing 80˜150 nm powders. Next, 1 wt % silicate clarifying solution was added to the PI-BD PAA solution at 25° C. with stirring for 4 hr to form a sticky PI-BD PAA/silicate solution. The resulting solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless PI-BD/silicate composition (weight ratio=99:1).

›Example 8

Preparation of PI-BD/Silicate Composition

50 g silicate was added to 900 g DMAc at 60° C. with high-speed pulverizing and dispersing to form a clarifying solution containing 80˜150 nm powders. Next, 3 wt % silicate clarifying solution was added to the PI-BD PAA solution at 25° C. with stirring for 4 hr to form a sticky PI-BD PAA/silicate solution. The resulting solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless PI-BD/silicate composition (weight ratio=97:3).

›Example 9

Preparation of PI-BD/Silicate Composition

50 g silicate was added to 900 g DMAc at 60° C. with high-speed pulverizing and dispersing to form a clarifying solution containing 80˜150 nm powders. Next, 5 wt % silicate clarifying solution was added to the PI-BD PAA solution at 25° C. with stirring for 4 hr to form a sticky PI-BD PAA/silicate solution. The resulting solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless PI-BD/silicate composition (weight ratio=95:5).

›Example 10

Preparation of PI-BD/Silicate Composition

50 g silicate was added to 900 g DMAC at 60° C. with high-speed pulverizing and dispersing to form a clarifying solution containing 80˜150 nm powders. Next, 10 wt % silicate clarifying solution was added to the PI-BD PAA solution at 25° C. with stirring for 4 hr to form a sticky PI-BD PAA/silicate solution. The resulting solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless PI-BD/silicate composition (weight ratio=90:10).

›Example 11

Preparation of PI-BD/Silicate Composition

50 g silicate was added to 900 g DMAc at 60° C. with high-speed pulverizing and dispersing to form a clarifying solution containing 80˜150 nm powders. Next, 20 wt % silicate clarifying solution was added to the PI-BD PAA solution at 25° C. with stirring for 4 hr to form a sticky PI-BD PAA/silicate solution. The resulting solution was then filmed on a glass substrate by a doctor blade and imidized at 100° C., 200° C., and 300° C., respectively, for 1 hr to form a transparent and colorless PI-BD/silicate composition (weight ratio=80:20).

Thickness, haze, transmission rate, yellow index, glass transition temperature, and coefficient of thermal expansion of the disclosed polyimide film (such as PI-FD, PI-FTI, PI-FTD, PI-FDD, and PI-OBI) and conventional material (such as PES, Kapton, and Ube) are compared in Table 1.

Compared to the disclosed polyimide, the conventional PES is a poor substrate material because of its lower glass transition temperature even with optimal haze, transmission rate, and yellow index. Kapton and Ube are also unsuitable for use due to raised yellow index and deteriorated transmission rate.

Thickness, haze, transmission rate, yellow index, glass transition temperature, coefficient of thermal expansion, pencil hardness and retardation of the disclosed PI-BD PI films mixed with inorganic silicate powder (weight ratio of 1 wt %, 3 wt %, 5 wt %, 10 wt % and 20 wt %, respectively) and conventional material (such as PES, Kapton, and Ube) are compared in Table 2.

Additionally, the disclosed polyimide can be directly filmed on a glass substrate without use of resin glue and easily removed after multi-lithography and etching or treating with a water bath, simplifying the TFT processes. The polyimide can be widely used in flexible LCDs, PDPs, FEDs, SEDs, E-inks, and E-papers, or OLEDs.

While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

›Tables in the description — 2
TABLE 1
GlassCoefficient
transitionof thermal
ThicknessTransmissionYellowtemperatureexpansion
(μm)Haze (%)rate (%)index(° C.)(ppm/° C.)
Polyimide
PI-FD590.2490.36.3332668
PI-FTI691.9689.43.5933671
PI-FTD791.7490.03.9830775
PI-FDD601.7490.72.7830161
PI-OBI522.9189.06.3728573
Conventional
material
PES2000.3089.00.9722558
Kapton250.7273.682.3431816
Ube512.4932.166.4633223
TABLE 2
ThicknessTransmission
(μm)Haze (%)rate (%)Yellow index
Polyimide
PI-BD/1 wt %500.6689.02.04
PI-BD/3 wt %530.8388.32.52
PI-BD/5 wt %471.9588.53.83
PI-BD/10 wt %413.2387.84.57
PI-BD/20 wt %443.6887.05.60
Conventional
material
PES2000.3089.00.97
Kapton250.7273.682.34
Ube512.4932.166.46
GlassCoefficient
transitionof thermalPencil
temperatureexpansionhardnessRetardation
(° C.)(ppm/° C.)(H)(nm)
Polyimide
PI-BD/1 wt %321702H207
PI-BD/3 wt %330633H173
PI-BD/5 wt %335513H159
PI-BD/10 wt %325424H148
PI-BD/20 wt %318364H124
Conventional
material
PES22558H25
Kapton31816H6923
Ube33223H>9999
1 of 17 part labels are ours — the grant heads the rest

Claims as granted

28 claims

Log in to read the claims of this application.

Log in to unlock

Classifications

3 codes
IPC · International Patent Classification
Section B — Performing operations; transporting
  • B32B27/28
USPC · US Patent Classification
428/1.6349/158

Claim changes

Soon
Coming soonHow the claims changed between publication and grant

See which claims were amended, added or cancelled during examination, with every added and removed word marked.

AmendedAddedCancelledUnchanged

The published claims of this application are not paired with the granted ones in what we hold.

File wrapper

⤢ drag to zoomJul 2006Jan 2007Jul 2007Jan 2008Jul 2008Jan 2009Jul 2009Jan 2010USPTOApplicantNon-final rejectionResponse after non-finalRequest for continued examinationResponse after non-finalNotice of allowance
USPTOApplicanthover for detail · click to open
Pendency
3.9 y
1,418 days filing → grant
Office actions
3
non-final + final
Responses
3
1 RCE
Examiner
David R Sample
art unit 1794 · TC 1700
Citations: 20 back · 3 forward

See the full prosecution history — every USPTO and applicant action on this file, in order.

Log in to unlock

Documents

Log in to open the documents of this file: the application as filed, every office action and response, the notice of allowance.

Log in to unlock

Chain of title

⤢ drag to zoom20062008201020122014201620182020202220242026Owner 1
Titlehover for detail · click to open

See the full assignment history — every owner this patent has passed through, with recordation dates and reel/frame numbers.

Log in to unlock