Multilayer capacitor

1. Field of the Invention

The present invention relates to a multilayer capacitor.

2. Related Background Art

Known as this kind of multilayer capacitor is one comprising a multilayer body in which a plurality of dielectric layers and a plurality of inner electrodes are alternately laminated, and a plurality of terminal conductors formed on the multilayer body.

Power supplies for central processing units (CPUs) mounted in digital electronic devices have been increasing their load current and load transients while lowering their voltage. Therefore, it has become very difficult to suppress the fluctuation in power supply voltage under a tolerable level in response to a drastic change in load current, whereby a multilayer capacitor known as decoupling capacitor has come into use so as to be connected to a power supply. At the time when the load current fluctuates transiently, the multilayer capacitor supplies a current to the CPU, thereby suppressing the fluctuation of the power supply voltage.

In recent years, as the CPUs have further been raising their operating frequencies, the load current and load transients have been becoming faster and greater, whereby, the multilayer capacitor used in the decoupling capacitor is demanded to increase its capacity and equivalent series resistance (ESR) and lower its equivalent series inductance (ESL) to help maintain a constant impedance loadline over a broad frequency spectrum. Therefore, a multilayer capacitor whose terminal conductor has a multilayer structure including an inner resistance layer, so as to increase the equivalent series resistance has been under consideration. Traditional means to lower the ESL of a capacitor have also resulted in the lowering of ESR. The CPU system levels of needed impedance (as it relates to ESR) have been met by current products to the point that they need to be raised, while continuing to drive ESL lower.

However, the following problem exists when adjusting the multilayer capacitor equipped with a terminal conductor having a multilayer structure including an inner resistance layer to a desirable value. Namely, for adjusting the equivalent series resistance to a desirable value in a multilayer capacitor equipped with a terminal conductor having a multilayer structure including an inner resistance layer, the thickness and material composition of the inner resistance layer included in the terminal conductor must be regulated while remaining independent of the capacitor's capacitance and ESL, which makes it very difficult to control the equivalent series resistance.

For overcoming the above-mentioned problem, it is an object of the present invention to provide a multilayer capacitor which can regulate the equivalent series resistance easily with a high precision.

In a typical multilayer capacitor, all the inner electrodes are connected to their corresponding terminal conductors through lead conductors. Consequently, the lead conductors exist by the number of inner electrodes, thereby lowering the equivalent series resistance. As the number of layers of the dielectric layers and inner electrodes is made greater in order to increase the capacity of the multilayer capacitor, the number of lead conductors becomes greater. Since resistance components of lead conductors are connected to the terminal conductors in parallel, the equivalent series resistance of the multilayer capacitor further decreases as the number of lead conductors increases. Thus, the demand for increasing the capacity of the multilayer capacitor and the demand for increasing the equivalent series resistance contradict each other.

Therefore, the inventors diligently conducted studies about multilayer capacitors which can satisfy both of the demands for increasing the capacity and equivalent series resistance. As a result, the inventors have found a new fact that, even when the number of laminated inner electrodes is the same, the equivalent series resistance can be adjusted to a desirable value if the inner electrodes are connected to outer connecting conductors formed on the surface of the multilayer body and inner connecting conductors laminated within the multilayer body while making it possible to change the number of inner connecting conductors connected to the terminal conductors. The inventors have also found a new fact that the equivalent series resistance can be adjusted to a desirable value if the inner electrodes are connected to outer connecting conductors formed on the surface of the multilayer body and inner connecting conductors laminated within the multilayer body while making it possible to change positions of inner connecting conductors in the laminating direction of the multilayer body. When the number of inner connecting conductors connected to the terminal conductors is made smaller than that of inner electrodes in particular, the adjustment can be made such as to increase the equivalent series resistance.

In view of such results of studies, in one aspect, the present invention provides a multilayer capacitor comprising a multilayer body in which a plurality of dielectric layers and a plurality of inner electrodes are alternately laminated, and a plurality of outer conductors formed on the multilayer body; wherein the plurality of inner electrodes include a plurality of first inner electrodes and a plurality of second inner electrodes alternately arranged; wherein the plurality of outer conductors include a first terminal conductor, a second terminal conductor, a first outer connecting conductor electrically connected to the plurality of first inner electrodes, and a second outer connecting conductor electrically connected to the plurality of second inner electrodes; wherein the first terminal conductor is formed on a first side face of the multilayer body; wherein the second terminal conductor is formed on the first side face of the multilayer body or a second side face thereof opposing the first side face; wherein the first outer connecting conductor is formed on the first or second side face of the multilayer body; wherein the second outer connecting conductor is formed on the first or second side face of the multilayer body; wherein each of the first inner electrodes is electrically connected to the first outer connecting conductor through a lead conductor; wherein each of the second inner electrodes is electrically connected to the second outer connecting conductor through a lead conductor; wherein at least one first inner connecting conductor and at least one second inner connecting conductor are laminated in the multilayer body; wherein the first inner connecting conductor is electrically connected to the first terminal conductor and first outer connecting conductor, whereas the second inner connecting conductor is electrically insulated from the first inner connecting conductor but is electrically connected to the second terminal conductor and second outer connecting conductor; wherein the first and second inner connecting conductors are laminated in the multilayer body such that the multilayer body includes at least one set of the first and second inner electrodes neighboring each other with the dielectric layer in between; and wherein an equivalent series resistance is set to a desirable value by adjusting the number of first inner connecting conductors and the number of second inner connecting conductors respectively.

By adjusting the number of first inner connecting conductors and the number of second inner connecting conductors, the multilayer capacitor in accordance with this aspect of the present invention sets the equivalent series resistance to a desirable value, and thus can control the equivalent series resistance easily with a high precision. The outer conductors of the multilayer capacitor are formed on one or both of two side faces of the multilayer body, i.e., the first and second side faces opposing each other. Therefore, the outer conductors can be formed easily.

In another aspect, the present invention provides a multilayer capacitor comprising a multilayer body in which a plurality of dielectric layers and a plurality of inner electrodes are alternately laminated, and a plurality of outer conductors formed on the multilayer body; wherein the plurality of inner electrodes include a plurality of first inner electrodes and a plurality of second inner electrodes alternately arranged; wherein the plurality of outer conductors include a first terminal conductor, a second terminal conductor, a first outer connecting conductor electrically connected to the plurality of first inner electrodes, and a second outer connecting conductor electrically connected to the plurality of second inner electrodes; wherein the first terminal conductor is formed on a first side face of the multilayer body; wherein the second terminal conductor is formed on the first side face of the multilayer body or a second side face thereof opposing the first side face; wherein the first outer connecting conductor is formed on the first or second side face of the multilayer body; wherein the second outer connecting conductor is formed on the first or second side face of the multilayer body; wherein each of the first inner electrodes is electrically connected to the first outer connecting conductor through a lead conductor; wherein each of the second inner electrodes is electrically connected to the second outer connecting conductor through a lead conductor; wherein at least one first inner connecting conductor and at least one second inner connecting conductor are laminated in the multilayer body; wherein the first inner connecting conductor is electrically connected to the first terminal conductor and first outer connecting conductor, whereas the second inner connecting conductor is electrically insulated from the first inner connecting conductor but is electrically connected to the second terminal conductor and second outer connecting conductor; wherein the first and second inner connecting conductors are laminated in the multilayer body such that the multilayer body includes at least one set of the first and second inner electrodes neighboring each other with the dielectric layer in between; and wherein an equivalent series resistance is set to a desirable value by adjusting a position of the first inner connecting conductor in the multilayer body in the laminating direction and a position of the second inner connecting conductor in the multilayer body in the laminating direction respectively.

By adjusting the position and shape of the first inner connecting conductor in the multilayer body in the laminating direction and the position of the second inner connecting conductor in the multilayer body in the laminating direction, the multilayer capacitor in accordance with this aspect of the present invention sets the equivalent series resistance to a desirable value, and thus can control the equivalent series resistance easily with a high precision. The outer conductors of the multilayer capacitor are formed on one or both of two side faces of the multilayer body, i.e., the first and second side faces opposing each other. Therefore, the outer conductors can be formed easily.

Preferably, the first inner connecting conductor includes a region opposing the second inner electrode with the dielectric layer in between. In this case, the first inner connecting conductor also contributes to forming a capacity component, thus making it possible to further increase the capacity of the multilayer capacitor.

Preferably, the second inner connecting conductor includes a region opposing the first inner electrode with the dielectric layer in between. In this case, the second inner connecting conductor also contributes to forming a capacity component, thus making it possible to further increase the capacity of the multilayer capacitor.

Preferably, the first terminal conductor and the first outer connecting conductor are formed adjacent to each other on the same side face of the multilayer body. When this multilayer capacitor is mounted on a substrate or the like such that the first terminal conductor is directly connected to a land pattern while the first outer connecting conductor is kept from being directly connected to a land pattern, a magnetic field caused by a current flowing between the first terminal conductor and the first inner connecting conductor and a magnetic field caused by a current flowing between the first outer connecting conductor and the first inner electrode and first inner connecting conductor cancel each other out. As a result, this multilayer capacitor lowers its equivalent series inductance.

Preferably, the second terminal conductor and the second outer connecting conductor are formed adjacent to each other on the same side face of the multilayer body. When this multilayer capacitor is mounted on a substrate or the like such that the second terminal conductor is directly connected to a land pattern while the second outer connecting conductor is kept from being directly connected to a land pattern, a magnetic field caused by a current flowing between the second terminal conductor and the second inner connecting conductor and a magnetic field caused by a current flowing between the second outer connecting conductor and the second inner electrode and second inner connecting conductor cancel each other out. As a result, this multilayer capacitor lowers its equivalent series inductance.

It will be preferred if a plurality of first terminal conductors and a plurality of first outer connecting conductors are provided by the same number; a plurality of second terminal conductors and a plurality of second outer connecting conductors are provided by the same number; the plurality of first terminal conductors and the plurality of first outer connecting conductors are formed on the first side face of the multilayer body; the plurality of second terminal conductors and the plurality of second outer connecting conductors are formed on the second side face of the multilayer body; at least one of both neighboring sides of each first terminal conductor on the first side face is formed with the first outer connecting conductor; at least one of both neighboring sides of each first outer connecting conductor on the first side face is formed with the first terminal conductor; at least one of both neighboring sides of each second terminal conductor on the second side face is formed with the second outer connecting conductor; and at least one of both neighboring sides of each second outer connecting conductor on the second side face is formed with the second terminal conductor.

When the terminal conductors and outer connecting conductors are thus arranged, a remarkable canceling effect is obtained in a magnetic field caused by a current flowing between the terminal conductor and the inner connecting conductor and a magnetic field caused by a current flowing between the outer connecting conductor and the inner electrode and inner connecting conductor. As a result, this multilayer capacitor remarkably lowers its equivalent series inductance.

It will be preferred if at least one each of the first terminal conductor, second terminal conductor, first outer connecting conductor, and second outer connecting conductor are provided; the first terminal conductor or second terminal conductor is located at a position axisymmetrical to the first terminal conductor about a center axis of the multilayer body passing respective center points of two side faces of the multilayer body orthogonal to the laminating direction of the multilayer body; the first outer connecting conductor or second outer connecting conductor is located at a position axisymmetrical to the first outer connecting conductor about the center axis of the multilayer body; the first terminal conductor or second terminal conductor is located at a position axisymmetrical to the second terminal conductor about the center axis of the multilayer body; the first outer connecting conductor or second outer connecting conductor is located at a position axisymmetrical to the second outer connecting conductor about the center axis of the multilayer body; the first terminal conductor or second terminal conductor is located at a position opposing the first terminal conductor in a direction along which the first and second side faces of the multilayer body oppose each other; the first outer connecting conductor or second outer connecting conductor is located at a position opposing the first outer connecting conductor in the opposing direction of the first and second side faces of the multilayer body; the first terminal conductor or second terminal conductor is located at a position opposing the second terminal conductor in the opposing direction of the first and second side faces of the multilayer body; and the first outer connecting conductor or second outer connecting conductor is located at a position opposing the second outer connecting conductor in the opposing direction of the first and second side faces of the multilayer body. Thus arranging and forming the terminal conductors and outer connecting conductors makes it easier to mount the multilayer capacitor to a substrate or the like.

The present invention can provide a multilayer capacitor which can regulate the equivalent series resistance easily with a high precision.

The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not to be considered as limiting the present invention.

Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.

FIG. 1 is a perspective view of the multiplexer capacitor in accordance with a first embodiment;

FIG. 2 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the first embodiment;

FIG. 3 is a view for explaining a state where the multilayer capacitor in accordance with the first embodiment is mounted to a substrate;

FIG. 4 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a second embodiment;

FIG. 5 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a third embodiment;

FIG. 6 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a fourth embodiment;

FIG. 7 is a perspective view of the multilayer capacitor in accordance with a fifth embodiment;

FIG. 8 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the fifth embodiment;

FIG. 9 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a sixth embodiment;

FIG. 10 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a seventh embodiment;

FIG. 11 is a perspective view of the multilayer capacitor in accordance with an eighth embodiment;

FIG. 12 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the eighth embodiment;

FIG. 13 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a ninth embodiment;

FIG. 14 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a tenth embodiment;

FIG. 15 is a perspective view of the multilayer capacitor in accordance with an eleventh embodiment;

FIG. 16 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the eleventh embodiment;

FIG. 17 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twelfth embodiment;

FIG. 18 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a thirteenth embodiment;

FIG. 19 is a perspective view of the multilayer capacitor in accordance with a fourteenth embodiment;

FIG. 20 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the fourteenth embodiment;

FIG. 21 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a fifteenth embodiment;

FIG. 22 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a sixteenth embodiment;

FIG. 23 is a perspective view of the multilayer capacitor in accordance with a seventeenth embodiment;

FIG. 24 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the seventeenth embodiment;

FIG. 25 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with an eighteenth embodiment;

FIG. 26 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a nineteenth embodiment;

FIG. 27 is a perspective view of the multilayer capacitor in accordance with a twentieth embodiment;

FIG. 28 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twentieth embodiment;

FIG. 29 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twenty-first embodiment;

FIG. 30 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twenty-second embodiment;

FIG. 31 is a perspective view of the multilayer capacitor in accordance with a twenty-third embodiment;

FIG. 32 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-third embodiment;

FIG. 33 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twenty-fourth embodiment;

FIG. 34 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twenty-fifth embodiment;

FIG. 35 is a perspective view of the multilayer capacitor in accordance with a twenty-sixth embodiment;

FIG. 36 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-sixth embodiment;

FIG. 37 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twenty-seventh embodiment; and

FIG. 38 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with a twenty-eighth embodiment.

In the following, preferred embodiments of the present invention will be explained in detail with reference to the accompanying drawings. In the explanation, constituents identical to each other or those having functions identical to each other will be referred to with numerals identical to each other without repeating their overlapping descriptions. Words “left” and “right” used in the explanation conform to the lateral direction in each drawing.

First Embodiment

With reference to FIGS. 1 and 2 , the structure of the multilayer capacitor C 1 in accordance with a first embodiment will be explained. FIG. 1 is a perspective view showing the multilayer capacitor in accordance with the first embodiment. FIG. 2 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the first embodiment.

As shown in FIG. 1 , the multilayer capacitor C 1 comprises a multilayer body L 1 having a substantially rectangular parallelepiped form and a plurality of outer conductors formed on side faces of the multilayer body L 1 . The plurality of outer conductors include a plurality of (2 in this embodiment) first terminal conductors 3 A, 3 B, a plurality of (2 in this embodiment) second terminal conductors 4 A, 4 B, a plurality of (2 in this embodiment) first outer connecting conductors 5 A, 5 B, and a plurality of (2 in this embodiment) outer connecting conductors 6 A, 6 B. The plurality of outer conductors are formed so as to be electrically insulated from each other on the surface of the multilayer body L 1 .

Thus, a plurality of the first terminal conductors 3 A, 3 B and a plurality of the first outer connecting conductors 5 A, 5 B are provided by the same number (2 each in this embodiment). Also, a plurality of the second terminal conductors 4 A, 4 B and a plurality of the second outer connecting conductors 6 A, 6 B are provided by the same number (2 each in this embodiment).

Each of the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B is positioned on a first side face L 1 a in side faces parallel to the laminating direction of the multilayer body L 1 which will be explained later, i.e., the first side face L 1 a that is a side face extending along the longitudinal axis of side faces L 1 c , L 1 d orthogonal to the laminating direction of the multilayer body L 1 . The first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are formed such that the first terminal conductor 3 A, first outer connecting conductor 5 A, first outer connecting conductor 5 B, first terminal conductor 3 B are successively arranged from the left side to right side of FIG. 1 .

Therefore, the first, outer connecting conductor 5 A is formed on one (right side in FIG. 1 ) of both neighboring sides of the first terminal conductor 3 A on the first side face L 1 a . The first terminal conductor 3 A is formed on one (left side in FIG. 1 ) of both neighboring sides of the first outer connecting conductor 5 A on the first side face L 1 a . Thus, the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other on the first side face L 1 a that is the same side face of the multilayer body L 1 .

The first outer connecting conductor 5 B is formed on one (left side in FIG. 1 ) of both neighboring sides of the first terminal conductor 3 B on the first side face L 1 a . The first terminal conductor 3 B is formed on one (right side in FIG. 1 ) of both neighboring sides of the first outer connecting conductor 5 B on the first side face L 1 a . Thus, the first terminal conductor 3 B and first outer connecting conductor 5 B are formed adjacent to each other on the first side face L 1 a that is the same side face of the multilayer body L 1 .

Each of the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B is positioned on a second side face L 1 b in side faces parallel to the laminating direction of the multilayer body L 1 which will be explained later, i.e., the second side face L 1 b that is a side face extending along the longitudinal axis of side faces L 1 c , L 1 d orthogonal to the laminating direction of the multilayer body L 1 while opposing the first side face L 1 a . The second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are formed such that the second terminal conductor 4 A, second outer connecting conductor 6 A, second outer connecting conductor 6 B, second terminal conductor 4 B are successively arranged from the left side to right side of FIG. 1 .

Therefore, the second outer connecting conductor 6 A is formed on one (right side in FIG. 1 ) of both neighboring sides of the second terminal conductor 4 A on the second side face L 1 b . The second terminal conductor 4 A is formed on one (left side in FIG. 1 ) of both neighboring sides of the second outer connecting conductor 6 A on the second side face L 1 b . Thus, the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other on the second side face L 1 b that is the same side face of the multilayer body L 1 .

The second outer connecting conductor 6 B is formed on one (left side in FIG. 1 ) of both neighboring sides of the second terminal conductor 4 B on the second side face L 1 b . The second terminal conductor 4 B is formed on one (right side in FIG. 1 ) of both neighboring sides of the second outer connecting conductor 6 B on the second side face L 1 b . Thus, the second terminal conductor 4 B and second outer connecting conductor 6 B are formed adjacent to each other on the second side face L 1 b that is the same side face of the multilayer body L 1 .

The second terminal conductor 4 B is located at a position axisymmetrical to the first terminal conductor 3 A about a center axis Ax 1 passing respective center points Pc, Pd of the two side faces L 1 c , L 1 d orthogonal to the laminating direction of the multilayer body L 1 among center axes of the multilayer body L 1 . The second terminal conductor 4 A is located at a position axisymmetrical to the first terminal conductor 3 B about the center axis Ax 1 of the multilayer body L 1 . On the other hand, the first terminal conductor 3 A is located at a position axisymmetrical to the second terminal conductor 4 B about the center axis Ax 1 of the multilayer body L 1 . The first terminal conductor 3 B is located at a position axisymmetrical to the second terminal conductor 4 A about the center axis Ax 1 of the multilayer body L 1 .

The second outer connecting conductor 6 B is located at a position axisymmetrical to the first outer connecting conductor 5 A about the center axis Ax 1 of the multilayer body L 1 . The second outer connecting conductor 6 A is located at a position axisymmetrical to the first outer connecting conductor 5 B about the center axis Ax 1 of the multilayer body L 1 . On the other hand, the first outer connecting conductor 5 A is located at a position axisymmetrical to the second outer connecting conductor 6 B about the center axis Ax 1 of the multilayer body L 1 . The first outer connecting conductor 5 B is located at a position axisymmetrical to the second outer connecting conductor 6 A about the center axis Ax 1 of the multilayer body L 1 .

The second terminal conductor 4 A is located at a position opposing the first terminal conductor 3 A in a direction along which the first side face L 1 a and second side face L 1 b of the multilayer body L 1 oppose each other. The second terminal conductor 4 B is located at a position opposing the first terminal conductor 3 B in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 . On the other hand, the first terminal conductor 3 A is located at a position opposing the second terminal conductor 4 A in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 . The first terminal conductor 3 B is located at a position opposing the second terminal conductor 4 B in the opposing direction of the first side face L 1 a and second side-face L 1 b of the multilayer body L 1 .

The second outer connecting conductor 6 A is located at a position opposing the first outer connecting conductor 5 A in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 . The second outer connecting conductor 6 B is located at a position opposing the first outer connecting conductor 5 B in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 . On the other hand, the first outer connecting conductor 5 A is located at a position opposing the second outer connecting conductor 6 A in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 . The first outer connecting conductor 5 B is located at a position opposing the second outer connecting conductor 6 B in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 .

As shown in FIG. 2 , the multilayer body L 1 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 30 to 33 , 40 to 43 . In the actual multilayer capacitor C 1 , they are integrated to such an extent that no boundaries are discernible between the dielectric layers 10 to 20 .

Further, one first inner connecting conductor 50 and one second inner connecting conductor 60 are laminated in the multilayer body L 1 . In the multilayer body L 1 , the plurality of first inner electrodes 30 to 33 and the plurality of second inner electrodes 40 to 43 are arranged between the first inner connecting conductor 50 , which is a part of the two layers of inner connecting conductors 50 , 60 , and the second inner connecting conductor 60 , which is the remainder.

Each of the first inner electrodes 30 to 33 has a substantially rectangular form. The plurality of first inner electrodes 30 to 33 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 1 . The first inner electrodes 30 to 33 are formed with their corresponding lead conductors 35 A to 38 A, 35 B to 38 B taken out therefrom so as to extend to the first side face L 1 a of the multilayer body L 1 .

Each of the lead conductors 35 A and 35 B is integrally formed with the first inner electrode 30 so as to extend therefrom and reach the first side face L 1 a of the multilayer body L 1 . Each of the lead conductors 36 A and 36 B is integrally formed with the first inner electrode 31 so as to extend therefrom and reach the first side face L 1 a of the multilayer body L 1 . Each of the lead conductors 37 A and 37 B is integrally formed with the first inner electrode 32 so as to extend therefrom and reach the first side face L 1 a of the multilayer body L 1 . Each of the lead conductors 38 A and 38 B is integrally formed with the first inner electrode 33 so as to extend therefrom and reach the first side face L 1 a of the multilayer body L 1 .

The first inner electrode 30 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 35 A and 35 B, respectively. The first inner electrode 31 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 36 A and 36 B, respectively. The first inner electrode 32 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 37 A and 37 B, respectively. The first inner electrode 33 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 38 A and 38 B, respectively. As a consequence, the plurality of first inner electrodes 30 to 33 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the second inner electrodes 40 to 43 has a substantially rectangular form. The plurality of second inner electrodes 40 to 43 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 1 . The second inner electrodes 40 to 43 are formed with their corresponding lead conductors 45 A to 48 A, 45 B to 48 B taken out therefrom so as to extend to the second side face L 1 b of the multilayer body L 1 .

Each of the lead conductors 45 A and 45 B is integrally formed with the second inner electrode 40 so as to extend therefrom and reach the second side face L 1 b of the multilayer body L 1 . Each of the lead conductors 46 A and 46 B is integrally formed with the second inner electrode 41 so as to extend therefrom and reach the second side face L 1 b of the multilayer body L 1 . Each of the lead conductors 47 A and 47 B is integrally formed with the second inner electrode 42 so as to extend therefrom and reach the second side face L 1 b of the multilayer body L 1 . Each of the lead conductors 48 A and 48 B is integrally formed with the second inner electrode 43 so as to extend therefrom and reach the second side face L 1 b of the multilayer body L 1 .

The second inner electrode 40 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 45 A and 45 B, respectively. The second inner electrode 41 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 46 A and 46 B, respectively. The second inner electrode 42 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 47 A and 47 B, respectively. The second inner electrode 43 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 48 A and 48 B, respectively. As a consequence, the plurality of second inner electrodes 40 to 43 are electrically connected to each other through the first outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 50 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 60 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 50 and second inner connecting conductor 60 are electrically insulated from each other.

The first inner connecting conductor 50 includes a first conductor portion 50 A having an oblong form and second to fifth conductor portions 50 B to 50 E extending from the first conductor portion 50 A so as to be taken out to the first side face L 1 a of the multilayer body L 1 . The first conductor portion 50 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 1 a , L 1 b of the multilayer body L 1 . These multiple inner connecting conductors are imperative to form the resistive path to elevate the ESR and are not a means to alter the device's ESL.

The second to fifth conductor portions 50 B to 50 E of the first inner connecting conductor 50 are positioned such that the second conductor portion 50 B, fourth conductor portion 50 D, fifth conductor portion 50 E, and third conductor portion 50 C are arranged successively from the left side to right side in FIG. 2 . The second conductor portion 50 B is electrically connected to the first terminal conductor 3 A. The third conductor portion 50 C is electrically connected to the first terminal conductor 3 B. The fourth conductor portion 50 D is electrically connected to the first outer connecting conductor 5 A. The fifth conductor portion 50 E is electrically connected to the first outer connecting conductor 5 B. Therefore, the first inner connecting conductor 50 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductor 5 A, 5 B.

The second inner connecting conductor 60 includes a first conductor portion 60 A having an oblong form and second to fifth conductor portions 60 B to 60 E extending from the first conductor portion 60 A so as to be taken out to the second side face L 1 b of the multilayer body L 1 . The first conductor portion 60 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 1 a , L 1 b of the multilayer body L 1 .

The second to fifth conductor portions 60 B to 60 E of the second inner connecting conductor 60 are positioned such that the second conductor portion 60 B, fourth conductor portion 60 D, fifth conductor portion 60 E, and third conductor portion 60 C are arranged successively from the left side to right side in FIG. 2 . The second conductor portion 60 B is electrically connected to the second terminal conductor 4 A. The third conductor portion 60 C is electrically connected to the second terminal conductor 4 B. The fourth conductor portion 60 D is electrically connected to the second outer connecting conductor 6 A. The fifth conductor portion 60 E is electrically connected to the second outer connecting conductor 6 B. Therefore, the second inner connecting conductor 60 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductor 6 A, 6 B.

The first conductor portion 50 A of the first inner connecting conductor 50 is a region opposing the second inner electrode 43 with the dielectric layer 19 in between. The first conductor portion 60 A of the second inner connecting conductor 60 is a region opposing the first inner electrode 30 with the dielectric layer 11 in between.

The first and second inner connecting conductors 50 , 60 are laminated in the multilayer body L 1 such that the multilayer body L 1 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between. Specifically, the first and second inner connecting conductors 50 , 60 are laminated in the multilayer body L 1 such that the multilayer body L 1 includes the first inner electrode 30 and second inner electrode 40 neighboring each other b with the dielectric layer 12 in between, for example. Namely, in the multilayer body L 1 , both of the first and second inner connecting conductors 50 , 60 are arranged on the outside of the one set of first and second inner electrodes 30 , 40 in the laminating direction of the multilayer body L 1 .

A case where the multilayer capacitor C 1 is mounted to a substrate S will be shown by way of an example. FIG. 3 is a view for explaining a state where the multilayer capacitor is mounted to the substrate. FIG. 3 shows a state where the first terminal conductor 3 A, first terminal conductor 3 B, second terminal conductor 5 A, and second terminal conductor 5 B are connected to a cathode land pattern A 1 , a cathode land pattern A 2 , an anode land pattern B 1 , and an anode land pattern B 2 which are formed on the substrate S, respectively. FIG. 3 also shows a state where the cathode land patterns A 1 , A 2 are connected to a lead A 3 while the anode land patterns B 1 , B 2 are connected to a lead B 3 .

In the multilayer capacitor C 1 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 30 to 33 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 50 . Also, in the multilayer capacitor C 1 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 40 to 43 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 60 . As a result, the multilayer capacitor C 1 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first and second inner connecting conductors 50 , 60 directly connected to the first terminal conductors 3 A, 3 B and second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 1 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 1 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

Each of the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B which are outer conductors of the multilayer capacitor C 1 is formed on the first side face L 1 a of the multilayer body L 1 . Each of the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B which are outer conductors of the multilayer capacitor C 1 is formed on the second side face L 1 b opposing the first side face L 1 a of the multilayer body L 1 . Thus, all the outer conductors (first terminal conductors 3 A, 3 B, second terminal conductors 4 A, 4 B, first outer connecting conductors 5 A, 5 B, and second outer connecting conductors 6 A, 6 B) in the multilayer capacitor C 1 are formed on the two side faces L 1 a , L 1 b of the multilayer body L 1 opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, the multilayer capacitor C 1 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 1 can be made easily.

The first inner connecting conductor 50 has the first conductor portion 50 A that is a region opposing the second inner electrode 43 with the dielectric layer 19 in between. Therefore, the first inner connecting conductor 50 can also contribute to forming the capacity component of the multilayer capacitor C 1 . As a consequence, the multilayer capacitor C 1 can further increase its capacitance.

The second inner connecting conductor 60 has the first conductor portion 60 A that is a region opposing the first inner electrode 30 with the dielectric layer 11 in between. Therefore, the second inner connecting conductor 60 can also contribute to forming the capacity component of the multilayer capacitor C 1 . As a consequence, the multilayer capacitor C 1 can further increase its capacitance.

In the multilayer body L 1 of the multilayer capacitor C 1 , a plurality of first inner electrodes 30 to 33 and a plurality of second inner electrodes 40 to 43 are arranged between a part of the inner connecting conductors 50 , 60 (first inner connecting conductor 50 ) and the rest (second inner connecting conductor 60 ). Therefore, the multilayer capacitor C 1 can set the equivalent series resistance with a favorable balance.

On the first side face L 1 a of the multilayer body L 1 in the multilayer capacitor C 1 , the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other, and the first terminal conductor 3 B and first outer connecting conductor 5 B are formed adjacent to each other. Therefore, the following effects are obtained when the multilayer capacitor C 1 is mounted on a substrate or the like such that the first terminal conductors 3 A, 3 B are directly connected to land patterns whereas the first outer connecting conductors 5 A, 5 B are kept from being directly connected to land patterns as shown in FIG. 3 . Namely, a magnetic field caused by a current flowing between the first terminal conductors 3 A, 3 B and the first inner connecting conductor 50 (the second and third conductor portions 50 B, 50 C in the first inner connecting conductor 50 ) and a magnetic field caused by a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner electrodes 30 to 33 (the lead conductors 35 A to 38 A, 35 B to 38 B) and a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner connecting conductor 50 (the fourth and fifth conductor portions 50 D, 50 E in the first inner connecting conductor 50 ) cancel each other out. As a result, the multilayer capacitor C 1 can reduce its equivalent series inductance. When there is at least one pair of first terminal conductor and first outer connecting conductor adjacent to each other, the equivalent series inductance can be reduced.

On the second side face L 1 b of the multilayer body L 1 in the multilayer capacitor C 1 , the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other, and the second terminal conductor 4 B and second outer connecting conductor 6 B are formed adjacent to each other. Therefore, the following effects are obtained when the multilayer capacitor C 1 is mounted on a substrate or the like such that the second terminal conductors 4 A, 4 B are directly connected to land patterns whereas the second outer connecting conductors 6 A, 6 B are kept from being directly connected to land patterns as shown in FIG. 3 . Namely, a magnetic field caused by a current flowing between the second terminal conductors 4 A, 4 B and the second inner connecting conductor 60 (the second and third conductor portions 60 B, 60 C in the second inner connecting conductor 60 ) and a magnetic field caused by a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner electrodes 40 to 43 (the lead conductors 45 A to 48 A, 45 B to 48 B) and a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner connecting conductor 60 (the fourth and fifth conductor portions 60 D, 60 E in the second inner connecting conductor 60 ) cancel each other out. As a result, the multilayer capacitor C 1 can reduce its equivalent series inductance. When there is at least one pair of second terminal conductor and second outer connecting conductor adjacent to each other, the equivalent series inductance can be reduced.

The first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are formed by the same number (2 each) on the first side face L 1 a of the multilayer body L 1 . Further, on the first side face L 1 a of the multilayer body L 1 , the first outer connecting conductors 5 A and 5 B are formed adjacent to the first terminal conductors 3 A and 3 B, respectively, whereas the first terminal conductors 3 A and 3 B are formed adjacent to the first outer connecting conductors 5 A and 5 B, respectively. Therefore, a remarkable canceling effect is obtained in a magnetic field caused by a current flowing between the first terminal conductors 3 A, 3 B and the first inner connecting conductor 50 and a magnetic field caused by a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner electrodes 30 to 33 and a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner connecting conductor 50 .

On the other hand, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are formed by the same number (2 each) on the second side face L 1 b of the multilayer body L 1 . Further, on the second side face L 1 b of the multilayer body L 1 , the second outer connecting conductors 6 A and 6 B are formed adjacent to the second terminal conductors 4 A and 4 B, respectively, whereas the second terminal conductors 4 A and 4 B are formed adjacent to the second outer connecting conductors 6 A and 6 B, respectively. Therefore, a remarkable canceling effect is obtained in a magnetic field caused by a current flowing between the second terminal conductors 4 A, 4 B and the second inner connecting conductor 60 and a magnetic field caused by a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner electrodes 40 to 43 and a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner connecting conductor 60 .

As a result, the multilayer capacitor C 1 can reduce its equivalent series inductance further remarkably.

In the multilayer capacitor C 1 , about the center axis Ax 1 of the multilayer body L 1 , the first terminal conductors 3 A and 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A and 4 B, respectively, and the first outer connecting conductors 5 A and 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 A and 6 B, respectively. Therefore, even when the multilayer capacitor C 1 is rotated by 180 degrees about the center axis Ax 1 on the substrate or the like, the state of connection of the land patterns to the terminal conductors and outer connecting conductors is unchanged. Namely, even when the multilayer capacitor C 1 is mounted after being rotated by 180 degrees about the center axis Ax 1 of the multilayer body L 1 from the state where the multilayer capacitor C 1 is mounted as shown in FIG. 3 , the first terminal conductor 3 A, first terminal conductor 3 B, second terminal conductor 4 A, and second terminal conductor 4 B are connected to the land patterns B 2 , B 1 , A 2 , and A 1 , respectively, so that the outer connecting conductors are kept from being directly connected to the land patterns.

In the multilayer capacitor C 1 , the first terminal conductor 3 A, first terminal conductor 3 B, first outer connecting conductor 5 A, and first outer connecting conductor 5 B oppose the second terminal conductor 4 A, second terminal conductor 4 B, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively, in the opposing direction of the first side face L 1 a and second side face L 1 b of the multilayer body L 1 . Therefore, even when the multilayer capacitor C 1 is reversed such that it is mounted to a substrate or the like by a side face opposite from the original surface, the relationship of connection of the land patterns to the terminal conductors and outer connecting conductors is unchanged. Namely, even when the multilayer capacitor C 1 is reversed about an axis parallel to the side faces L 1 a to L 1 d from the state mounted as shown in FIG. 3 , the first terminal conductor 3 A, first terminal conductor 3 B, second terminal conductor 4 A, and second terminal conductor 4 B are connected to the land patterns B 1 , B 2 , A 1 , and A 2 , respectively, so that the outer connecting conductors are kept from being directly connected to the land patterns.

Further, even when the multilayer capacitor C 1 is reversed about an axis orthogonal to the side faces L 1 a , L 1 b from the state mounted as shown in FIG. 3 , the first terminal conductor 3 A, first terminal conductor 3 B, second terminal conductor 4 A, and second terminal conductor 4 B are connected to the land patterns A 2 , A 1 , B 2 , and B 1 , respectively, so that the outer connecting conductors are kept from being directly connected to the land patterns.

Since the terminal conductors 3 A, 3 B, 4 A, 4 B and outer connecting conductors 5 A, 5 B, 6 A, 6 B are arranged as mentioned above, the multilayer capacitor C 1 can be mounted in conformity to various mounting directions. Therefore, the multilayer capacitor C 1 can be mounted easily.

Second Embodiment

With reference to FIG. 4 , the configuration of the multilayer capacitor in accordance with a second embodiment will be explained. The multilayer capacitor in accordance with the second embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of positions of the inner connecting conductors 50 , 60 in the laminating direction. FIG. 4 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the second embodiment.

As with the multilayer capacitor C 1 , the multilayer capacitor in accordance with the second embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the second embodiment, the first and second inner connecting conductors 50 , 60 , provided one by one, are laminated between two layers each of first and second inner electrodes 30 , 31 , 40 , 41 and two layers each of first and second inner electrodes 32 , 33 , 42 , 43 as shown in FIG. 4 . More specifically, the first inner connecting conductor 50 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 60 is positioned so as to be held between dielectric layers 15 and 16 .

In the multilayer capacitor in accordance with the second embodiment, the first and second inner connecting conductors 50 , 60 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between. Specifically, the first and second inner connecting conductors 50 , 60 are laminated in the multilayer body such that the multilayer body includes the first inner electrode 30 and second inner electrode 40 neighboring each other with the dielectric layer 11 in between, for example.

In the multilayer capacitor in accordance with the second embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 30 to 33 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 50 . Also, in the multilayer capacitor in accordance with the second embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 40 to 43 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 60 . As a consequence, the multilayer capacitor in accordance with the second embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the second embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 1 in accordance with the first embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 50 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the second embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 50 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the second embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 1 in accordance with the first embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 60 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the second embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 60 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B.

Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the second embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 1 in accordance with the first embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 50 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 60 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the second embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the second embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the second embodiment can be made easily.

The first conductor portion 50 A of the first inner connecting conductor 50 opposes the second inner electrode 41 with the dielectric layer 14 in between. The first conductor portion 60 A of the second inner connecting conductor 60 opposes the first inner electrode 32 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the second embodiment, the first and second inner connecting conductors 50 , 60 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the second embodiment as in the multilayer capacitor C 1 . Therefore, the multilayer capacitor in accordance with the second embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the second embodiment as in the multilayer capacitor C 1 . Therefore, the multilayer capacitor in accordance with the second embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the second embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face of the multilayer body. Also, in the multilayer capacitor in accordance with the second embodiment, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face of the multilayer body. Therefore, the multilayer capacitor in accordance with the second embodiment can lower its equivalent series inductance further greatly.

In the multilayer capacitor in accordance with the second embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the second embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the second embodiment can be mounted easily.

Third Embodiment

The configuration of the multilayer capacitor in accordance with a third embodiment will be explained with reference to FIG. 5 . The multilayer capacitor in accordance with the third embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of positions of the first and second inner connecting conductors 50 , 60 in the laminating direction. FIG. 5 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the third embodiment.

As with the multilayer capacitor C 1 in accordance with the first embodiment, the multilayer capacitor in accordance with the third embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the third embodiment, the first and second inner connecting conductors 50 , 60 , provided one by one, are laminated on the outside of a multilayer body of four layers each of first and second inner electrodes 30 to 33 , 40 to 43 as shown in FIG. 5 . More specifically, the first inner connecting conductor 50 is positioned so as to be held between dielectric layers 18 and 19 . The second inner connecting conductor 60 is positioned so as to be held between dielectric layers 19 and 20 .

In the multilayer capacitor in accordance with the third embodiment, the first and second inner connecting conductors 50 , 60 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between. Specifically, the first and second inner connecting conductors 50 , 60 are laminated in the multilayer body such that the multilayer body includes the first inner electrode 30 and second inner electrode 40 neighboring each other with the dielectric layer 11 in between, for example.

In the multilayer capacitor in accordance with the third embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 30 to 33 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 50 . Also, in the multilayer capacitor in accordance with the third embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 40 to 43 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 60 . As a result, the multilayer capacitor in accordance with the third embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the third embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 1 in accordance with the first embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 50 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the third embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 50 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the third embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 1 in accordance with the first embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 60 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the third embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 60 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B.

Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the third embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 1 in accordance with the first embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 50 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 60 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the third embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the third embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the third embodiment can be made easily.

The first conductor portion 50 A of the first inner connecting conductor 50 opposes the second inner electrode 43 with the dielectric layer 18 in between. Therefore, in the multilayer capacitor in accordance with the third embodiment, the first inner connecting conductor 50 can also contributes to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the third embodiment as in the multilayer capacitor C 1 . Therefore, the multilayer capacitor in accordance with the third embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the third embodiment as in the multilayer capacitor C 1 . Therefore, the multilayer capacitor in accordance with the third embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the third embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face of the multilayer body. Also, in the multilayer capacitor in accordance with the third embodiment, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face of the multilayer body. Therefore, the multilayer capacitor in accordance with the third embodiment can lower its equivalent series inductance more greatly.

In the multilayer capacitor in accordance with the third embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the third embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the third embodiment can be mounted easily.

Fourth Embodiment

The configuration of the multilayer capacitor in accordance with a fourth embodiment will be explained with reference to FIG. 6 . The multilayer capacitor in accordance with the fourth embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of the number of first and second inner connecting conductors. FIG. 6 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the fourth embodiment.

As with the multilayer capacitor C 1 , the multilayer capacitor in accordance with the fourth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the fourth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 30 to 33 , 40 to 43 as shown in FIG. 6 .

In the multilayer body of the multilayer capacitor in accordance with the fourth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 50 , 51 and a plurality of (2 each in this embodiment) of second inner connecting conductors 60 , 61 are laminated. In the multilayer body of the multilayer capacitor in accordance with the fourth embodiment, four layers of first inner electrodes 30 to 33 and four layers of second inner electrodes 40 to 43 are arranged between one each of the first and second inner connecting conductors 50 , 60 which are a part of the plurality of inner connecting conductors 50 , 51 , 60 , 61 and the remaining first and second inner connecting conductors 51 , 61 .

In the multilayer capacitor in accordance with the fourth embodiment, the first inner connecting conductor 50 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 51 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 60 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 61 is positioned so as to be held between the dielectric layers 21 and 22 .

In the multilayer capacitor in accordance with the fourth embodiment, the first and second inner connecting conductors 50 , 51 , 60 , 61 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between. Specifically, the first and second inner connecting conductors 50 , 51 , 60 , 61 are laminated in the multilayer body such that the multilayer body includes the first inner electrode 30 and second inner electrode 40 neighboring each other with the dielectric layer 13 in between, for example.

In the multilayer capacitor in accordance with the fourth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 30 to 33 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 50 , 51 . Also, in the multilayer capacitor in accordance with the fourth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 40 to 43 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 60 , 61 . As a consequence, the multilayer capacitor in accordance with the fourth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 1 , the multilayer capacitor in accordance with the fourth embodiment has a greater number of first inner connecting conductors 50 , 51 , whereas the first inner connecting conductors 50 , 51 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. As the number of first inner connecting conductors 50 , 51 increases, the number of paths of currents flowing between the first terminal conductors 3 A, 3 B and the first inner electrodes 30 to 33 becomes greater. Also, the multilayer capacitor in accordance with the fourth embodiment has a greater number of second inner connecting conductors 60 , 61 , whereas the second inner connecting conductors 60 , 61 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. As the number of second inner connecting conductors 60 , 61 increases, the number of paths of currents flowing between the second terminal conductors 4 A, 4 B and the second inner electrodes 40 to 43 becomes greater. Therefore, the multilayer capacitor in accordance with the fourth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 1 .

As in the foregoing, by adjusting the number of first inner connecting conductors 50 , 51 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductors 60 , 61 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the fourth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the fourth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the fourth embodiment can be made easily.

The first conductor portion 51 A of the first inner connecting conductor 51 opposes the second inner electrode 43 with the dielectric layer 20 in between. The first conductor portion 60 A of the second inner connecting conductor 60 opposes the first inner electrode 30 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the fourth embodiment, the first and second inner connecting conductors 51 , 60 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the fourth embodiment, a plurality of first and second inner electrodes 30 to 33 , 40 to 43 are arranged between the first and second inner connecting conductors 50 , 60 and the first and second inner connecting conductors 51 , 61 . Therefore, the multilayer capacitor in accordance with the fourth embodiment can set the equivalent series resistance with a favorable balance.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the fourth embodiment as in the multilayer capacitor C 1 . Therefore, the multilayer capacitor in accordance with the fourth embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the fourth embodiment as in the multilayer capacitor C 1 . Therefore, the multilayer capacitor in accordance with the fourth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the fourth embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face of the multilayer body. Also, in the multilayer capacitor in accordance with the fourth embodiment, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face of the multilayer body. Therefore, the multilayer capacitor in accordance with the fourth embodiment can lower its equivalent series inductance more greatly.

In the multilayer capacitor in accordance with the fourth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the fourth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the fourth embodiment can be mounted easily.

Fifth Embodiment

The configuration of the multilayer capacitor C 2 in accordance with a fifth embodiment will be explained with reference to FIGS. 7 and 8 . FIG. 7 is a perspective view of the multilayer capacitor in accordance with the fifth embodiment. FIG. 8 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the fifth embodiment.

As shown in FIG. 7 , the multilayer capacitor C 2 in accordance with the fifth embodiment comprises a multilayer body L 2 , first terminal conductors 3 A, 3 B formed on the multilayer body L 2 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B is positioned on a first side face L 2 a which is a side face extending along the longitudinal axis of faces L 2 c , L 2 d orthogonal to the laminating direction of the multilayer body L 2 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are formed such that the first outer connecting conductor 5 A, first terminal conductor 3 A, first terminal conductor 3 B, and first outer connecting conductor 5 B are successively arranged from the left side to right side of FIG. 7 .

Therefore, the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other on the first side face L 2 a that is the same side face of the multilayer body L 2 . The first terminal conductor 3 B and first outer connecting conductor 5 B are formed adjacent to each other on the first side face L 2 a that is the same side face of the multilayer body L 2 .

Each of the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B is positioned on a second side face L 2 b which is a side face extending along the longitudinal axis of faces L 2 c , L 2 d orthogonal to the laminating direction of the multilayer body L 2 among side faces parallel to the laminating direction of the multilayer body while opposing the first side face L 2 a . The second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are formed such that the second outer connecting conductor 6 A, second terminal conductor 4 A, second terminal conductor 4 B, and second outer connecting conductor 6 B are successively arranged from the left side to right side of FIG. 7 .

Therefore, the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other on the second side face L 2 b that is the same side face of the multilayer body L 2 . The second terminal conductor 4 B and second outer connecting conductor 6 B are formed adjacent to each other on the second side face L 2 b that is the same side face of the multilayer body L 2 .

The first terminal conductor 3 A and second terminal conductor 4 B are axisymmetrical to each other about a center axis Ax 2 passing respective center points Pc, Pd of the two side faces L 2 c , L 2 d orthogonal to the laminating direction of the multilayer body L 2 among center axes of the multilayer body L 2 . The first terminal conductor 3 B and second terminal conductor 4 A are axisymmetrical to each other about the center axis Ax 2 of the multilayer body L 2 . The first outer connecting conductor 5 A and second outer connecting conductor 6 B are axisymmetrical to each other about the center axis Ax 2 of the multilayer body L 2 . The first outer connecting conductor 5 B and second outer connecting conductor 6 A are axisymmetrical to each other about the center axis Ax 2 of the multilayer body L 2 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 2 a and second side face L 2 b of the multilayer body L 2 oppose each other. The first terminal conductor 3 B and second terminal conductor 4 B oppose each other in the opposing direction of the first side face L 2 a and second side face L 2 b of the multilayer body L 2 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 2 a and second side face L 2 b of the multilayer body L 2 . The first outer connecting conductor 5 B and second outer connecting conductor 6 B oppose each other in the opposing direction of the first side face L 2 a and second side face L 2 b of the multilayer body L 2 .

As shown in FIG. 8 , the multilayer body L 2 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 70 to 73 , 80 to 83 . In the actual multilayer capacitor C 2 , they are integrated to such an extent that no boundaries are discernible between the dielectric layers 10 to 20 .

Further, one first inner connecting conductor 90 and one second inner connecting conductor 100 are laminated in the multilayer body L 2 . In the multilayer body L 2 , the plurality of first inner connecting conductors 70 to 73 and the plurality of second inner connecting conductor 80 to 83 are arranged between the second inner connecting conductor 100 and the first inner connecting conductor 90 .

Each of the first inner electrodes 70 to 73 has a substantially rectangular form. The plurality of first inner electrodes 70 to 73 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 2 .

Each of lead conductors 75 A, 75 B is integrally formed with the first inner electrode 70 so as to extend therefrom and reach the first side face L 2 a of the multilayer body L 2 . Each of lead conductors 76 A, 76 B is integrally formed with the first inner electrode 71 so as to extend therefrom and reach the first side face L 2 a of the multilayer body L 2 . Each of lead conductors 77 A, 77 B is integrally formed with the first inner electrode 72 so as to extend therefrom and reach the first side face L 2 a of the multilayer body L 2 . Each of lead conductors 78 A, 78 B is integrally formed with the first inner electrode 73 so as to extend therefrom and reach the first side face L 2 a of the multilayer body L 2 .

The first inner electrode 70 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 75 A and 75 B, respectively. The first inner electrode 71 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 76 A and 76 B, respectively. The first inner electrode 72 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 77 A and 77 B, respectively. The first inner electrode 73 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 78 A and 78 B, respectively. As a consequence, the plurality of first inner electrodes 70 to 73 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the second inner electrodes 80 to 83 has a substantially rectangular form. The plurality of second inner electrodes 80 to 83 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 2 .

Each of lead conductors 85 A, 85 B is integrally formed with the second inner electrode 80 so as to extend therefrom and reach the second side face L 2 b of the multilayer body L 2 . Each of lead conductors 86 A, 86 B is integrally formed with the second inner electrode 81 so as to extend therefrom and reach the second side face L 2 b of the multilayer body L 2 . Each of lead conductors 87 A, 87 B is integrally formed with the second inner electrode 82 so as to extend therefrom and reach the second side face L 2 b of the multilayer body L 2 . Each of lead conductors 88 A, 88 B is integrally formed with the second inner electrode 83 so as to extend therefrom and reach the second side face L 2 b of the multilayer body L 2 .

The second inner electrode 80 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 85 A and 85 B, respectively. The second inner electrode 81 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 86 A and 86 B, respectively. The second inner electrode 82 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 87 A and 87 B, respectively. The second inner electrode 83 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 88 A and 88 B, respectively. As a consequence, the plurality of second inner electrodes 80 to 83 are electrically connected to each other through the first outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 90 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 100 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 90 , 100 are electrically insulated from each other.

The first inner connecting conductor 90 includes a first conductor portion 90 A having an oblong form and second to fifth conductor portions 90 B to 90 E extending from the first conductor portion 90 A so as to be taken out to the first side face L 2 a of the multilayer body L 2 . The first conductor portion 90 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 2 a , L 2 b of the multilayer body L 2 .

The second, third, fourth, and fifth conductor portions 90 B, 90 C, 90 D, and 90 E are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, first outer connecting conductor 5 A, and first outer connecting conductor 5 B, respectively. As a consequence, the first inner connecting conductor 90 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B.

The second inner connecting conductor 100 includes a first conductor portion 100 A having an oblong form and second to fifth conductor portions 100 B to 100 E extending from the first conductor portion 100 A so as to be taken out to the second side face L 2 b of the multilayer body L 2 . The first conductor portion 100 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 2 a , L 2 b of the multilayer body L 2 .

The second, third, fourth, and fifth conductor portions 100 B, 100 C, 100 D, and 100 E are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively. As a consequence, the second inner connecting conductor 100 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B.

The first conductor portion 90 A of the first inner connecting conductor 90 is a region opposing the second inner electrode 83 with the dielectric layer 19 in between. The first conductor portion 100 A of the second inner connecting conductor 100 is a region opposing the first inner electrode 70 with the dielectric layer 11 in between.

The first and second inner connecting conductors 90 , 100 are laminated in the multilayer body L 2 such that the multilayer body L 2 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 2 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 70 to 73 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 90 . Also, in the multilayer capacitor C 2 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 80 to 83 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 100 . As a result, the multilayer capacitor C 2 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 90 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 100 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 2 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 2 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, which are outer conductors of the multilayer capacitor C 2 , are formed on the first and second side faces L 2 a , L 2 b of the multilayer body L 2 opposing each other. Therefore, as compared with the case where outer conductors are formed on four side faces of the multilayer body L 2 , the multilayer capacitor C 2 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 2 can be made easily.

The first conductor portion 90 A of the first inner connecting conductor 90 opposes the second inner electrode 83 with the dielectric layer 19 in between. The first conductor portion 100 A of the second inner connecting conductor 100 opposes the first inner electrode 70 with the dielectric layer 11 in between. Therefore, the first and second inner connecting conductor 90 , 100 can also contribute to forming the capacity component in the multilayer capacitor C 2 , whereby the multilayer capacitor C 2 can further increase its capacitance.

Since a plurality of first and second inner electrodes 70 to 73 , 80 to 83 are arranged between the first inner connecting conductor 90 and second inner connecting conductor 100 , the multilayer body L 2 of the multilayer capacitor C 2 can set the equivalent series resistance with a favorable balance.

On the first side face L 2 a of the multilayer body L 2 in the multilayer capacitor C 2 , the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other, and the first terminal conductor 3 B and first outer connecting conductor 5 B are formed adjacent to each other. Therefore, the following effects are obtained when the multilayer capacitor C 2 is mounted on a substrate or the like such that the first terminal conductors 3 A, 3 B are directly connected to land patterns whereas the first outer connecting conductors 5 A, 5 B are kept from being directly connected to land patterns. Namely, a magnetic field caused by a current flowing between the first terminal conductors 3 A, 3 B and the first inner connecting conductor 90 (the second and third conductor portions 90 B, 90 C in the first inner connecting conductor 90 ) and a magnetic field caused by a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner electrodes 70 to 73 (the lead conductors 75 A to 78 A, 75 B to 78 B) and a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner connecting conductor 90 (the fourth and fifth conductor portions 90 D, 90 E in the first inner connecting conductor 90 ) cancel each other out. As a result, the multilayer capacitor C 2 can reduce its equivalent series inductance.

On the second side face L 2 b of the multilayer body L 2 in the multilayer capacitor C 2 , the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other, and the second terminal conductor 4 B and second outer connecting conductor 6 B are formed adjacent to each other. Therefore, the following effects are obtained when the multilayer capacitor C 2 is mounted on a substrate or the like such that the second terminal conductors 4 A, 4 B are directly connected to land patterns whereas the second outer connecting conductors 6 A, 6 B are kept from being directly connected to land patterns. Namely, a magnetic field caused by a current flowing between the second terminal conductors 4 A, 4 B and the second inner connecting conductor 100 (the second and third conductor portions 100 B, 100 C in the second inner connecting conductor 100 ) and a magnetic field caused by a current flowing between the second outer connecting conductors 6 A, 6 B and the first inner electrodes 80 to 83 (the lead conductors 85 A to 88 A, 85 B to 88 B) and a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner connecting conductor 100 (the fourth and fifth conductor portions 100 D, 100 E in the second inner connecting conductor 100 ) cancel each other out. As a result, the multilayer capacitor C 2 can reduce its equivalent series inductance.

In the multilayer capacitor C 2 , the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face L 2 a of the multilayer body L 2 . Also, in the multilayer capacitor C 2 , the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face L 2 b of the multilayer body L 2 . Therefore, the multilayer capacitor C 2 can lower its equivalent series inductance further greatly.

In the multilayer capacitor C 2 , about the center axis Ax 2 of the multilayer body L 2 , the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first side face L 2 a and second side face L 2 b of the multilayer body L 2 in the multilayer capacitor C 2 , the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor C 2 can be mounted easily.

Sixth Embodiment

The configuration of the multilayer capacitor in accordance with a sixth embodiment will be explained with reference to FIG. 9 . The multilayer capacitor in accordance with the sixth embodiment differs from the multilayer capacitor C 2 in accordance with the fifth embodiment in terms of positions of the first and second inner connecting conductors 90 , 100 in the laminating direction. FIG. 9 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the sixth embodiment.

As with the multilayer capacitor C 2 in accordance with the fifth embodiment, the multilayer capacitor in accordance with the sixth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the sixth embodiment, the first and second inner connecting conductors 90 , 100 , provided one by one, are laminated between two layers each of first and second inner electrodes 70 , 71 , 80 , 81 and two layers each of first and second inner electrodes 72 , 73 , 82 , 83 as shown in FIG. 9 . More specifically, the first inner connecting conductor 90 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 100 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 90 , 100 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the sixth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 70 to 73 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 90 . Also, in the multilayer capacitor in accordance with the sixth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 80 to 83 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 100 . As a consequence, the multilayer capacitor in accordance with the sixth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the sixth embodiment differs from the multilayer capacitor C 2 in accordance with the fifth embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 2 in accordance with the fifth embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 90 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the sixth embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 90 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the sixth embodiment differs from the multilayer capacitor C 2 in accordance with the fifth embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 2 in accordance with the fifth embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 100 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the sixth embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 100 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the sixth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 2 in accordance with the fifth embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 90 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 100 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the sixth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the sixth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the sixth embodiment can be made easily.

The first conductor portion 90 A of the first inner connecting conductor 90 opposes the second inner electrode 81 with the dielectric layer 14 in between. The first conductor portion 100 A of the second inner connecting conductor 100 opposes the first inner electrode 72 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the sixth embodiment, the first and second inner connecting conductors 90 , 100 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the sixth embodiment as in the multilayer capacitor C 2 . Therefore, the multilayer capacitor in accordance with the sixth embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the sixth embodiment as in the multilayer capacitor C 2 . Therefore, the multilayer capacitor in accordance with the sixth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the sixth embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face of the multilayer body. Also, in the multilayer capacitor in accordance with the sixth embodiment, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face of the multilayer body. Therefore, the multilayer capacitor in accordance with the sixth embodiment can lower its equivalent series inductance more greatly.

In the multilayer capacitor in accordance with the sixth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the sixth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the sixth embodiment can be mounted easily.

Seventh Embodiment

The configuration of the multilayer capacitor in accordance with a seventh embodiment will be explained with reference to FIG. 10 . The multilayer capacitor in accordance with the seventh embodiment differs from the multilayer capacitor C 2 , in accordance with the fifth embodiment in terms of the number of inner connecting conductors. FIG. 10 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the seventh embodiment.

As with the multilayer capacitor C 2 in accordance with the fifth embodiment, the multilayer capacitor in accordance with the seventh embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the seventh embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 70 to 73 , 80 to 83 as shown in FIG. 10 .

In the multilayer body of the multilayer capacitor in accordance with the seventh embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 90 , 91 and a plurality of (2 each in this embodiment) of second inner connecting conductors 100 , 101 are laminated. In the multilayer body of the multilayer capacitor in accordance with the seventh embodiment, four layers of first inner electrodes 70 to 73 and four layers of second inner electrodes 80 to 83 are arranged between one each of the first and second inner connecting conductors 90 , 100 which are a part of the plurality of inner connecting conductors 90 , 91 , 100 , 101 and the remaining first and second inner connecting conductors 91 , 101 .

In the multilayer capacitor in accordance with the seventh embodiment, the first inner connecting conductor 90 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 91 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 100 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 101 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 90 , 91 , 100 , 101 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the seventh embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 70 to 73 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 90 , 91 . Also, in the multilayer capacitor in accordance with the seventh embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 80 to 83 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 100 , 101 . As a consequence, the multilayer capacitor in accordance with the seventh embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 2 , the multilayer capacitor in accordance with the seventh embodiment has a greater number of first inner connecting conductors 90 , 91 , whereas the first inner connecting conductors 90 , 91 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the seventh embodiment has a greater number of second inner connecting conductors 100 , 101 than that of the multilayer capacitor C 2 , whereas the second inner connecting conductors 100 , 101 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the seventh embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 2 .

As in the foregoing, by adjusting the number of first inner connecting conductors 90 , 91 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductors 100 , 101 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the seventh embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the seventh embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the seventh embodiment can be made easily.

The first conductor portion 91 A of the first inner connecting conductor 91 opposes the second inner electrode 83 with the dielectric layer 20 in between. The first conductor portion 100 A of the second inner connecting conductor 100 opposes the first inner electrode 70 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the seventh embodiment, the first and second inner connecting conductors 91 , 100 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the seventh embodiment, a plurality of first and second inner electrodes 70 to 73 , 80 to 83 are arranged between the first and second inner connecting conductors 90 , 100 and the first and second inner connecting conductors 91 , 101 . Therefore, the multilayer capacitor in accordance with the seventh embodiment can set the equivalent series resistance with a favorable balance.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the seventh embodiment as in the multilayer capacitor C 2 . Therefore, the multilayer capacitor in accordance with the seventh embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the seventh embodiment as in the multilayer capacitor C 2 . Therefore, the multilayer capacitor in accordance with the seventh embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the seventh embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face of the multilayer body. Also, in the multilayer capacitor in accordance with the seventh embodiment, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face of the multilayer body. Therefore, the multilayer capacitor in accordance with the seventh embodiment can lower its equivalent series inductance more greatly.

In the multilayer capacitor in accordance with the seventh embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the seventh embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the seventh embodiment can be mounted easily.

Eighth Embodiment

The configuration of the multilayer capacitor C 3 in accordance with an eighth embodiment will be explained with reference to FIGS. 11 and 12 . The multilayer capacitor in accordance with the eighth embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of arrangement of outer conductors formed on the first and second side faces of the multilayer body. FIG. 11 is a perspective view of the multilayer capacitor in accordance with the eighth embodiment. FIG. 12 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the eighth embodiment.

As shown in FIG. 11 , the multilayer capacitor C 3 in accordance with the eighth embodiment comprises a multilayer body L 3 , first terminal conductors 3 A, 3 B formed on the multilayer body L 3 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B and second outer connecting conductors 6 A, 6 B is positioned on a first side face L 3 a which is a side face extending along the longitudinal axis of faces L 3 c , L 3 d orthogonal to the laminating direction of the multilayer body L 3 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B and second outer connecting conductors 6 A, 6 B are formed such that the first terminal conductor 3 A, second outer connecting conductor 6 A, second outer connecting conductor 6 B, and first terminal conductor 3 B are successively arranged from the left side to right side of FIG. 11 .

Each of the second terminal conductors 4 A, 4 B and first outer connecting conductors 5 A, 5 B is positioned on a second side face L 3 b which is a side face extending along the longitudinal axis of faces L 3 c , L 3 d orthogonal to the laminating direction of the multilayer body L 3 among side faces parallel to the laminating direction of the multilayer body L 3 while opposing the first side face L 3 a . The second terminal conductors 4 A, 4 B and first outer connecting conductors 5 A, 5 B are formed such that the second terminal conductor 4 A, first outer connecting conductor 5 A, first outer connecting conductor 5 B, and, second terminal conductor 4 B are successively arranged from the left side to right side of FIG. 11 .

The first terminal conductor 3 A and second terminal conductor 4 B are axisymmetrical to each other about a center axis Ax 3 passing respective center points Pc, Pd of the two side faces L 3 c , L 3 d orthogonal to the laminating direction of the multilayer body L 3 among center axes of the multilayer body L 3 . The first terminal conductor 3 B and second terminal conductor 4 A are axisymmetrical to each other about the center axis Ax 3 of the multilayer body L 3 . The first outer connecting conductor 5 A and second outer connecting conductor 6 B are axisymmetrical to each other about the center axis Ax 3 of the multilayer body L 3 . The first outer connecting conductor 5 B and second outer connecting conductor 6 A are axisymmetrical to each other about the center axis Ax 3 of the multilayer body L 3 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 3 a and second side face L 3 b of the multilayer body L 3 oppose each other. The first terminal conductor 3 B and second terminal conductor 4 B oppose each other in the opposing direction of the first side face L 3 a and second side face L 3 b of the multilayer body L 3 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 3 a and second side face L 3 b of the multilayer body L 3 . The first outer connecting conductor 5 B and second outer connecting conductor 6 B oppose each other in the opposing direction of the first side face L 3 a and second side face L 3 b of the multilayer body L 3 .

As shown in FIG. 12 , the multilayer body L 3 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 110 to 113 , 120 to 123 . In the actual multilayer capacitor C 3 , they are integrated to such an extent that no boundaries are discernible between the dielectric layers 10 to 20 .

Further, one first inner connecting conductor 130 and one second inner connecting conductor 140 are laminated in the multilayer body L 3 . In the multilayer body L 3 , the plurality of first inner connecting conductors 110 to 113 and the plurality of second inner connecting conductor 120 to 123 are arranged between the second inner connecting conductor 140 and the first inner connecting conductor 130 .

Each of the first inner electrodes 110 to 113 has a substantially rectangular form. The plurality of first inner electrodes 110 to 113 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 3 .

Each of lead conductors 115 A, 115 B is integrally formed with the first inner electrode 110 so as to extend therefrom and reach the second side face L 3 b of the multilayer body L 3 . Each of lead conductors 116 A, 116 B is integrally formed with the first inner electrode 111 so as to extend therefrom and reach the second side face L 3 b of the multilayer body L 3 . Each of lead conductors 117 A, 117 B is integrally formed with the first inner electrode 112 so as to extend therefrom and reach the second side face L 3 b of the multilayer body L 3 . Each of the lead conductors 118 A, 118 B is integrally formed with the first inner electrode 113 so as to extend therefrom and reach the second side face L 3 b of the multilayer body L 3 .

The first inner electrode 110 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 115 A and 115 B, respectively. The first inner electrode 111 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 116 A and 116 B, respectively. The first inner electrode 112 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 117 A and 117 B, respectively. The first inner electrode 113 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 118 A and 118 B, respectively. As a consequence, the plurality of first inner electrodes 110 to 113 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the second inner electrodes 120 to 123 has a substantially rectangular form. The plurality of second inner electrodes 120 to 123 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 3 .

Each of lead conductors 125 A, 125 B is integrally formed with the second inner electrode 120 so as to extend therefrom and reach the first side face L 3 a of the multilayer body L 3 . Each of lead conductors 126 A, 126 B is integrally formed with the second inner electrode 121 so as to extend therefrom and reach the first side face L 3 a of the multilayer body L 3 . Each of lead conductors 127 A, 127 B is integrally formed with the second inner electrode 122 so as to extend therefrom and reach the first side face L 3 a of the multilayer body L 3 . Each of lead conductors 128 A, 128 B is integrally formed with the second inner electrode 123 so as to extend therefrom and reach the first side face L 3 a of the multilayer body L 3 .

The second inner electrode 120 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 125 A and 125 B, respectively The second inner electrode 121 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 126 A and 126 B, respectively. The second inner electrode 122 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 127 A and 127 B, respectively. The second inner electrode 123 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 128 A and 128 B, respectively. As a consequence, the plurality of second inner electrodes 120 to 123 are electrically connected to each other through the first outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 130 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 140 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 130 , 140 are electrically insulated from each other.

The first inner connecting conductor 130 includes a first conductor portion 130 A having an oblong form, second and third conductor portions 130 B, 130 C extending from the first conductor portion 130 A so as to be taken out to the first side face L 3 a of the multilayer body L 3 , and fourth and fifth conductor portions 130 D, 130 E extending from the first conductor portion 130 A so as to be taken out to the second side face L 3 b of the multilayer body L 3 . The first conductor portion 130 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 3 a , L 3 b of the multilayer body L 3 .

The second inner connecting conductor 140 includes a first conductor portion 140 A having an oblong form, second and third conductor portions 140 B, 140 C extending from the first conductor portion 140 A so as to be taken out to the second side face L 3 b of the multilayer body L 3 , and fourth and fifth conductor portions 140 D, 140 E extending from the first conductor portion 140 A so as to be taken out to the first side face L 3 a of the multilayer body L 3 . The first conductor portion 140 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 3 a , L 3 b of the multilayer body L 3 .

In the first inner connecting conductor 130 , the second, third, fourth, and fifth conductor portions 130 B, 130 C, 130 D, and 130 E are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, first outer connecting conductor 5 A, and first outer connecting conductor 5 B, respectively. As a consequence, the first inner connecting conductor 130 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B.

In the second inner connecting conductor 140 , the second, third, fourth, and fifth conductor portions 140 B, 140 C, 140 D, and 140 E are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively. As a consequence, the second inner connecting conductor 140 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B.

The first conductor portion 130 A of the first inner connecting conductor 130 is a region opposing the second inner electrode 123 with the dielectric layer 19 in between. The second conductor portion 140 A of the second inner connecting conductor 140 is a region opposing the first inner electrode 110 with the dielectric layer 11 in between.

The first and second inner connecting conductors 110 , 120 are laminated in the multilayer body L 3 such that the multilayer body L 3 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 3 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 110 to 113 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 130 . Also, in the multilayer capacitor C 3 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 120 to 123 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 140 . As a consequence, the multilayer capacitor C 3 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 130 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 140 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 3 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 3 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, which are outer conductors of the multilayer capacitor C 3 , are formed on the first and second side faces L 3 a , L 3 b of the multilayer body L 3 opposing each other. Therefore, as compared with the case where outer conductors are formed on four side faces of the multilayer body L 2 , the multilayer capacitor C 3 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 3 can be made easily.

The first conductor portion 130 A of the first inner connecting conductor 130 opposes the second inner electrode 123 with the dielectric layer 19 in between. The first conductor portion 140 A of the second inner connecting conductor 140 opposes the first inner electrode 110 with the dielectric layer 11 in between. Therefore, the first and second inner connecting conductor 130 , 140 can also contribute to forming the capacity component in the multilayer capacitor C 3 , whereby the multilayer capacitor C 3 can further increase its capacitance.

Since a plurality of first and second inner electrodes 110 to 113 , 120 to 123 are arranged between the first inner connecting conductor 130 and second inner connecting conductor 140 , the multilayer body L 3 of the multilayer capacitor C 3 can set the equivalent series resistance with a favorable balance.

In the multilayer capacitor C 3 , about the center axis Ax 3 of the multilayer body L 3 , the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first side face L 3 a and second side face L 3 b of the multilayer body L 3 in the multilayer capacitor C 3 , the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor C 3 can be mounted easily.

Ninth Embodiment

The configuration of the multilayer capacitor in accordance with a ninth embodiment will be explained with reference to FIG. 13 . The multilayer capacitor in accordance with the ninth embodiment differs from the multilayer capacitor C 3 in accordance with the eighth embodiment in terms of positions of the first and second inner connecting conductors 130 , 140 in the laminating direction. FIG. 13 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the ninth embodiment.

As with the multilayer capacitor C 3 in accordance with the eighth embodiment, the multilayer capacitor in accordance with the ninth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the ninth embodiment, the first and second inner connecting conductors 130 , 140 , provided one by one, are laminated between two layers each of first and second inner electrodes 110 , 111 , 120 , 121 and two layers each of first and second inner electrodes 112 , 113 , 122 , 123 as shown in FIG. 13 . More specifically, the first inner connecting conductor 130 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 140 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 130 , 140 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the ninth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 110 to 113 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 130 . Also, in the multilayer capacitor in accordance with the ninth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 120 to 123 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 140 . As a consequence, the multilayer capacitor in accordance with the ninth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the ninth embodiment differs from the multilayer capacitor C 3 in accordance with the eighth embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 3 in accordance with the eighth embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 130 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the ninth embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 130 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the ninth embodiment differs from the multilayer capacitor C 3 in accordance with the eighth embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 3 in accordance with the eighth embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 140 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the ninth embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 140 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the ninth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 3 in accordance with the eighth embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 130 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 140 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the ninth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the ninth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the ninth embodiment can be made easily.

The first conductor portion 130 A of the first inner connecting conductor 130 opposes the second inner electrode 121 with the dielectric layer 14 in between. The first conductor portion 140 A of the second inner connecting conductor 140 opposes the first inner electrode 112 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the ninth embodiment, the first and second inner connecting conductors 130 , 140 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer capacitor in accordance with the ninth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the ninth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the ninth embodiment can be mounted easily.

Tenth Embodiment

The configuration of the multilayer capacitor in accordance with a tenth embodiment will be explained with reference to FIG. 14 . The multilayer capacitor in accordance with the tenth embodiment differs from the multilayer capacitor C 3 in accordance with the eighth embodiment in terms of the number of inner connecting conductors. FIG. 14 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the tenth embodiment.

As with the multilayer capacitor C 3 in accordance with the eighth embodiment, the multilayer capacitor in accordance with the tenth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the tenth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 110 to 113 , 120 to 123 as shown in FIG. 14 .

In the multilayer body of the multilayer capacitor in accordance with the tenth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 130 , 131 and a plurality of (2 each in this embodiment) of second inner connecting conductors 140 , 141 are laminated. In the multilayer body of the multilayer capacitor in accordance with the tenth embodiment, four layers of first inner electrodes 110 to 113 and four layers of second inner electrodes 120 to 123 are arranged between one each of the first and second inner connecting conductors 130 , 140 which are a part of the plurality of inner connecting conductors 130 , 131 , 140 , 141 and the remaining first and second inner connecting conductors 131 , 141 .

In the multilayer capacitor in accordance with the tenth embodiment, the first inner connecting conductor 130 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 131 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 140 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 141 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 130 , 131 , 140 , 141 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the tenth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 110 to 113 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 130 , 131 . Also, in the multilayer capacitor in accordance with the tenth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 120 to 123 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 140 , 141 . As a consequence, the multilayer capacitor in accordance with the tenth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 3 , the multilayer capacitor in accordance with the tenth embodiment has a greater number of first inner connecting conductors 130 , 131 , whereas the first inner connecting conductors 130 , 131 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the tenth embodiment has a greater number of second inner connecting conductors 140 , 141 than that in the multilayer capacitor C 3 , whereas the second inner connecting conductors 140 , 141 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the tenth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 3 .

As in the foregoing, by adjusting the number of first inner connecting conductors 130 , 131 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductors 140 , 141 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the tenth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the tenth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the tenth embodiment can be made easily.

The first conductor portion 131 A of the first inner connecting conductor 131 opposes the second inner electrode 123 with the dielectric layer 20 in between. The first conductor portion 140 A of the second inner connecting conductor 140 opposes the first inner electrode 110 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the tenth embodiment, the first and second inner connecting conductors 131 , 140 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the tenth embodiment, a plurality of first and second inner electrodes 110 to 113 , 120 to 123 are arranged between the first and second inner connecting conductors 130 , 140 and the first and second inner connecting conductors 131 , 141 . Therefore, the multilayer capacitor in accordance with the tenth embodiment can set the equivalent series resistance with a favorable balance.

In the multilayer capacitor in accordance with the tenth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the tenth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the tenth embodiment can be mounted easily.

Eleventh Embodiment

The configuration of the multilayer capacitor C 4 in accordance with an eleventh embodiment will be explained with reference to FIGS. 15 and 16 . The multilayer capacitor in accordance with the eleventh embodiment differs from the multilayer capacitor C 1 in accordance with the first embodiment in terms of arrangement of outer conductors formed on the first and second side faces of the multilayer body. FIG. 15 is a perspective view of the multilayer capacitor in accordance with the eleventh embodiment. FIG. 16 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the eleventh embodiment.

As shown in FIG. 15 , the multilayer capacitor C 4 in accordance with the eleventh embodiment comprises a multilayer body L 4 , first terminal conductors 3 A, 3 B formed on the multilayer body L 4 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B and second outer connecting conductors 6 A, 6 B is positioned on a first side face L 4 a which is a side face extending along the longitudinal axis of faces L 4 c , L 4 d orthogonal to the laminating direction of the multilayer body L 4 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B and second outer connecting conductors 6 A, 6 B are formed such that the second outer connecting conductor 6 A, first terminal conductor 3 A, first terminal conductor 3 B, and second outer connecting conductor 6 B are successively arranged from the left side to right side of FIG. 15 .

Each of the second terminal conductors 4 A, 4 B and first outer connecting conductors 5 A, 5 B is positioned on a second side face L 4 b which is a side face extending along the longitudinal axis of faces L 4 c , L 4 d orthogonal to the laminating direction of the multilayer body L 4 among side faces parallel to the laminating direction of the multilayer body L 4 while opposing the first side face L 4 a . The second terminal conductors 4 A, 4 B and first outer connecting conductors 5 A, 5 B are formed such that the first outer connecting conductor 5 A, second terminal conductor 4 A, second terminal conductor 4 B, and first outer connecting conductor 5 B are successively arranged from the left side to right side of FIG. 15 .

The first terminal conductor 3 A and second terminal conductor 4 B are positioned axisymmetrical to each other about a center axis Ax 4 passing respective center points Pc, Pd of the two side faces L 4 c , L 4 d orthogonal to the laminating direction of the multilayer body L 4 among center axes of the multilayer body L 4 . The first terminal conductor 3 B and second terminal conductor 4 A are positioned axisymmetrical to each other about the center axis Ax 4 of the multilayer body L 4 . The first outer connecting conductor 5 A and second outer connecting conductor 6 B are positioned axisymmetrical to each other about the center axis Ax 4 of the multilayer body L 4 . The first outer connecting conductor 5 B and second outer connecting conductor 6 A are positioned axisymmetrical to each other about the center axis Ax 4 of the multilayer body L 4 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 4 a and second side face L 4 b of the multilayer body L 4 oppose each other. The first terminal conductor 3 B and second terminal conductor 4 B oppose each other in the opposing direction of the first side face L 4 a and second side face L 4 b of the multilayer body L 4 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 4 a and second side face L 4 b of the multilayer body L 4 . The first outer connecting conductor 5 B and second outer connecting conductor 6 B oppose each other in the opposing direction of the first side face L 4 a and second side face L 4 b of the multilayer body L 4 .

As shown in FIG. 16 , the multilayer body L 4 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 150 to 153 , 160 to 163 . In the actual multilayer capacitor C 4 , they are integrated to such an extent that no boundaries are discernible between the dielectric layers 10 to 20 .

Further, one first inner connecting conductor 170 and one second inner connecting conductor 180 are laminated in the multilayer body L 4 . In the multilayer body L 4 , the plurality of first inner connecting conductors 150 to 153 and the plurality of second inner connecting conductor 160 to 163 are arranged between the second inner connecting conductor 180 and the first inner connecting conductor 170 .

Each of the first inner electrodes 150 to 153 has a substantially rectangular form. The plurality of first inner electrodes 150 to 153 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 4 .

Each of lead conductors 155 A, 155 B is integrally formed with the first inner electrode 150 so as to extend therefrom and reach the second side face L 4 b of the multilayer body L 4 . Each of lead conductors 156 A, 156 B is integrally formed with the first inner electrode 151 so as to extend therefrom and reach the second side face L 4 b of the multilayer body L 4 . Each of lead conductors 157 A, 157 B is integrally formed with the first inner electrode 152 so as to extend therefrom and reach the second side face L 4 b of the multilayer body L 4 . Each of lead conductors 158 A, 158 B is integrally formed with the first inner electrode 153 so as to extend therefrom and reach the second side face L 4 b of the multilayer body L 4 .

The first inner electrode 150 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 155 A and 155 B, respectively. The first inner electrode 151 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 156 A and 156 B, respectively. The first inner electrode 152 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 157 A and 157 B, respectively. The first inner electrode 153 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 158 A and 158 B, respectively. As a consequence, the plurality of first inner electrodes 150 to 153 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the second inner electrodes 160 to 163 has a substantially rectangular form. The plurality of second inner electrodes 160 to 163 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 4 .

Each of lead conductors 165 A, 165 B is integrally formed with the second inner electrode 160 so as to extend therefrom and reach the first side face L 4 a of the multilayer body L 4 . Each of lead conductors 166 A, 166 B is integrally formed with the second inner electrode 161 so as to extend therefrom and reach the first side face L 4 a of the multilayer body L 4 . Each of lead conductors 167 A, 167 B is integrally formed with the second inner electrode 162 so as to extend therefrom and reach the first side face L 4 a of the multilayer body L 4 . Each of lead conductors 168 A, 168 B is integrally formed with the second inner electrode 163 so as to extend therefrom and reach the first side face L 4 a of the multilayer body L 4 .

The second inner electrode 160 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 165 A and 165 B, respectively. The second inner electrode 161 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 166 A and 166 B, respectively. The second inner electrode 162 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 167 A and 167 B, respectively. The second inner electrode 163 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 168 A and 168 B, respectively. As a consequence, the plurality of second inner electrodes 160 to 163 are electrically connected to each other through the first outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 170 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 180 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 170 , 180 are electrically insulated from each other.

The first inner connecting conductor 170 includes a first conductor portion 170 A having an oblong form, second and third conductor portions 170 B, 170 C extending from the first conductor portion 170 A so as to be taken out to the first side face L 4 a of the multilayer body L 4 , and fourth and fifth conductor portions 170 D, 170 E extending from the first conductor portion 170 A so as to be taken out to the second side face L 4 b of the multilayer body L 4 . The first conductor portion 170 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 4 a , L 4 b of the multilayer body L 4 .

The second inner connecting conductor 180 includes a first conductor portion 180 A having an oblong form, second and third conductor portions 180 B, 180 C extending from the first conductor portion 180 A so as to be taken out to the second side face L 4 b of the multilayer body L 4 , and fourth and fifth conductor portions 180 D, 180 E extending from the first conductor portion 180 A so as to be taken out to the first side face L 4 a of the multilayer body L 4 . The first conductor portion 180 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 4 a , L 4 b of the multilayer body L 4 .

In the first inner connecting conductor 170 , the second, third, fourth, and fifth conductor portions 170 B, 170 C, 170 D, and 170 E are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, first outer connecting conductor 5 A, and first outer connecting conductor 5 B, respectively. As a consequence, the first inner connecting conductor 170 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B.

In the second inner connecting conductor 180 , the second, third, fourth, and fifth conductor portions 180 B, 180 C, 180 D, and 180 E are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively. As a consequence, the second inner connecting conductor 180 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B.

The first conductor portion 170 A of the first inner connecting conductor 170 is a region opposing the second inner electrode 163 with the dielectric layer 19 in between. The second conductor portion 180 A of the second inner connecting conductor 180 is a region opposing the first inner electrode 150 with the dielectric layer 11 in between.

The first and second inner connecting conductors 150 , 160 are laminated in the multilayer body L 4 such that the multilayer body L 4 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 4 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 150 to 153 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 170 . Also, in the multilayer capacitor C 4 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 160 to 163 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 180 . As a consequence, the multilayer capacitor C 4 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 170 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 180 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 4 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 4 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, which are outer conductors of the multilayer capacitor C 4 , are formed on the first and second side faces L 4 a , L 4 b of the multilayer body L 4 opposing each other. Therefore, as compared with the case where outer conductors are formed on four side faces of the multilayer body L 4 , for example, the multilayer capacitor C 4 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 4 can be made easily.

The first conductor portion 170 A of the first inner connecting conductor 170 opposes the second inner electrode 163 with the dielectric layer 19 in between. The first conductor portion 180 A of the second inner connecting conductor 180 opposes the first inner electrode 150 with the dielectric layer 11 in between. Therefore, the first and second inner connecting conductor 170 , 180 can also contribute to forming the capacity component in the multilayer capacitor C 4 , whereby the multilayer capacitor C 4 can further increase its capacitance.

Since a plurality of first and second inner electrodes 150 to 153 , 160 to 163 are arranged between the first inner connecting conductor 170 and second inner connecting conductor 180 , the multilayer body L 4 of the multilayer capacitor C 4 can set the equivalent series resistance with a favorable balance.

In the multilayer capacitor C 4 , about the center axis Ax 4 of the multilayer body L 4 , the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first side face L 4 a and second side face L 4 b of the multilayer body L 4 in the multilayer capacitor C 4 , the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor C 4 can be mounted easily.

Twelfth Embodiment

The configuration of the multilayer capacitor in accordance with a twelfth embodiment will be explained with reference to FIG. 17 . The multilayer capacitor in accordance with the twelfth embodiment differs from the multilayer capacitor C 4 in accordance with the eleventh embodiment in terms of positions of the first and second inner connecting conductors 170 , 180 in the laminating direction. FIG. 17 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twelfth embodiment.

As with the multilayer capacitor C 4 in accordance with the eleventh embodiment, the multilayer capacitor in accordance with the twelfth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the twelfth embodiment, the first and second inner connecting conductors 170 , 180 , provided one by one, are laminated between two layers each of first and second inner electrodes 150 , 151 , 160 , 161 and two layers each of first and second inner electrodes 152 , 153 , 162 , 163 as shown in FIG. 17 . More specifically, the first inner connecting conductor 170 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 180 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 170 , 180 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twelfth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 150 to 153 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 170 . Also, in the multilayer capacitor in accordance with the twelfth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 160 to 163 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 180 . As a consequence, the multilayer capacitor in accordance with the twelfth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the twelfth embodiment differs from the multilayer capacitor C 4 in accordance with the eleventh embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 4 in accordance with the eleventh embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 170 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the twelfth embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 170 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the twelfth embodiment differs from the multilayer capacitor C 4 in accordance with the eleventh embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 4 in accordance with the eleventh embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 180 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the twelfth embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 180 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the twelfth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 4 in accordance with the eleventh embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 170 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 180 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the twelfth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the twelfth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twelfth embodiment can be made easily.

The first conductor portion 170 A of the first inner connecting conductor 170 opposes the second inner electrode 161 with the dielectric layer 14 in between. The first conductor portion 180 A of the second inner connecting conductor 180 opposes the first inner electrode 152 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the twelfth embodiment, the first and second inner connecting conductors 170 , 180 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer capacitor in accordance with the twelfth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the ninth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the twelfth embodiment can be mounted easily.

Thirteenth Embodiment

The configuration of the multilayer capacitor in accordance with a thirteenth embodiment will be explained with reference to FIG. 18 . The multilayer capacitor in accordance with the thirteenth embodiment differs from the multilayer capacitor C 4 in accordance with the eleventh embodiment in terms of the number of inner connecting conductors. FIG. 18 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the thirteenth embodiment.

As with the multilayer capacitor C 4 in accordance with the eleventh embodiment, the multilayer capacitor in accordance with the twelfth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the thirteenth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 150 to 153 , 160 to 163 as shown in FIG. 18 .

In the multilayer body of the multilayer capacitor in accordance with the thirteenth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 170 , 171 and a plurality of (2 each in this embodiment) of second inner connecting conductors 180 , 181 are laminated. In the multilayer body of the multilayer capacitor in accordance with the thirteenth embodiment, four layers of first inner electrodes 150 to 153 and four layers of second inner electrodes 160 to 163 are arranged between one each of the first and second inner connecting conductors 170 , 180 which are a part of the plurality of inner connecting conductors 170 , 171 , 180 , 181 and the remaining first and second inner connecting conductors 171 , 181 .

The first inner connecting conductor 170 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 171 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 180 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 181 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 170 , 171 , 180 , 181 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the thirteenth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 150 to 153 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 170 , 171 . Also, in the multilayer capacitor in accordance with the thirteenth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 160 to 163 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 180 , 181 . As a consequence, the multilayer capacitor in accordance with the thirteenth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 4 , the multilayer capacitor in accordance with the thirteenth embodiment has a greater number of first inner connecting conductors 170 , 171 , whereas the first inner connecting conductors 170 , 171 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the thirteenth embodiment has a greater number of second inner connecting conductors 180 , 181 than that in the multilayer capacitor C 4 , whereas the second inner connecting conductors 180 , 181 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the thirteenth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 4 .

As in the foregoing, by adjusting the number of first inner connecting conductors 170 , 171 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductors 180 , 181 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision.

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the thirteenth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the thirteenth embodiment can be made easily.

The first conductor portion 171 A of the first inner connecting conductor 171 opposes the second inner electrode 163 with the dielectric layer 20 in between. The first conductor portion 180 A of the second inner connecting conductor 180 opposes the first inner electrode 150 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the thirteenth embodiment, the first and second inner connecting conductors 171 , 180 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the thirteenth embodiment, a plurality of first and second inner electrodes 150 to 153 , 160 to 163 are arranged between the first and second inner connecting conductors 170 , 180 and the first and second inner connecting conductors 171 , 181 . Therefore, the multilayer capacitor in accordance with the thirteenth embodiment can set the equivalent series resistance with a favorable balance.

In the multilayer capacitor in accordance with the thirteenth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, respectively, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the thirteenth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the thirteenth embodiment can be mounted easily.

Fourteenth Embodiment

The configuration of the multilayer capacitor C 5 in accordance with a fourteenth embodiment will be explained with reference to FIGS. 19 and 20 . FIG. 19 is a perspective view of the multilayer capacitor in accordance with the fourteenth embodiment. FIG. 20 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the fourteenth embodiment.

As shown in FIG. 19 , the multilayer capacitor C 5 in accordance with the fourteenth embodiment comprises a multilayer body L 5 , first terminal conductors 3 A, 3 B formed on the multilayer body L 5 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B, first outer connecting conductor 5 A, and second outer connecting conductors 6 A is positioned on a first side face L 5 a which is a side face extending along the longitudinal axis of faces L 5 c , L 5 d orthogonal to the laminating direction of the multilayer body L 5 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B, first outer connecting conductor 5 A, and second outer connecting conductors 6 A are formed such that the first terminal conductor 3 A, second outer connecting conductor 6 A, first outer connecting conductor 5 A, and first terminal conductor 3 B are successively arranged from the left side to right side of FIG. 19 .

Each of the second terminal conductors 4 A, 4 B, first outer connecting conductor 5 B, and second outer connecting conductor 6 B is positioned on a second side face L 5 b which is a side face extending along the longitudinal axis of faces L 5 c , L 5 d orthogonal to the laminating direction of the multilayer body L 5 among side faces parallel to the laminating direction of the multilayer body L 5 while opposing the first side face L 5 a . The second terminal conductors 4 A, 4 B, first outer connecting conductor 5 B, and second outer connecting conductor 6 B are formed such that the second terminal conductor 4 A, first outer connecting conductor 5 B, second outer connecting conductor 6 B, and second terminal conductor 4 B are successively arranged from the left side to right side of FIG. 19 .

The first terminal conductor 3 A and second terminal conductor 4 B are positioned axisymmetrical to each other about a center axis Ax 5 passing respective center points Pc, Pd of the two side faces L 5 c , L 5 d orthogonal to the laminating direction of the multilayer body L 5 among center axes of the multilayer body L 5 . The first terminal conductor 3 B and second terminal conductor 4 A are positioned axisymmetrical to each other about the center axis Ax 5 of the multilayer body L 5 . The first outer connecting conductors 5 A and 5 B are positioned axisymmetrical to each other about the center axis Ax 5 of the multilayer body L 5 . The second outer connecting conductors 6 A and 6 B are positioned axisymmetrical to each other about the center axis Ax 5 of the multilayer body L 5 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 5 a and second side face L 5 b of the multilayer body L 5 oppose each other. The first terminal conductor 3 B and second terminal conductor 4 B oppose each other in the opposing direction of the first side face L 5 a and second side face L 5 b of the multilayer body L 5 . The first outer connecting conductor 5 A and second outer connecting conductor 6 B oppose each other in the opposing direction of the first side face L 5 a and second side face L 5 b of the multilayer body L 5 . The first outer connecting conductor 5 B and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 5 a and second side face L 5 b of the multilayer body L 5 .

As shown in FIG. 20 , the multilayer body L 5 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 190 to 193 , 200 to 203 . In the actual multilayer capacitor C 5 , they are integrated to such an extent that no boundaries are discernible between the dielectric layers 10 to 20 .

Further, one first inner connecting conductor 210 and one second inner connecting conductor 220 are laminated in the multilayer body L 5 . In the multilayer body L 5 , the plurality of first inner connecting conductors 190 to 193 and the plurality of second inner connecting conductor 200 to 203 are arranged between the second inner connecting conductor 220 and the first inner connecting conductor 210 .

Each of the first inner electrodes 190 to 193 has a substantially rectangular form. The plurality of first inner electrodes 190 to 193 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 5 .

Each of lead conductors 195 A, 195 B is integrally formed with the first inner electrode 190 . Each of lead conductors 196 A, 196 B is integrally formed with the first inner electrode 191 . Each of lead conductors 197 A, 197 B is integrally formed with the first inner electrode 192 . Each of lead conductors 198 A, 198 B is integrally formed with the first inner electrode 193 .

The lead conductor 195 A extends from the first inner electrode 190 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 195 B extends from the first inner electrode 190 so as to reach the second side face L 5 b of the multilayer body L 5 . The lead conductor 196 A extends from the first inner electrode 191 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 196 B extends from the first inner electrode 191 so as to reach the second side face L 5 b of the multilayer body L 5 . The lead conductor 197 A extends from the first inner electrode 192 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 197 B extends from the first inner electrode 192 so as to reach the second side face L 5 b of the multilayer body L 5 . The lead conductor 198 A extends from the first inner electrode 193 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 198 B extends from the first inner electrode 193 so as to reach the second side face L 5 b of the multilayer body L 5 .

The first inner electrode 190 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 195 A and 195 B, respectively. The first inner electrode 191 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 196 A and 196 B, respectively. The first inner electrode 192 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 197 A and 197 B, respectively. The first inner electrode 193 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 198 A and 198 B, respectively. As a consequence, the plurality of first inner electrodes 190 to 193 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the second inner electrodes 200 to 203 has a substantially rectangular form. The plurality of first inner electrodes 200 to 203 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 5 .

Each of lead conductors 205 A, 205 B is integrally formed with the second inner electrode 200 . Each of lead conductors 206 A, 206 B is integrally formed with the second inner electrode 201 . Each of lead conductors 207 A, 207 B is integrally formed with the second inner electrode 202 . Each of lead conductors 208 A, 208 B is integrally formed with the second inner electrode 203 .

The lead conductor 205 A extends from the second inner electrode 200 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 205 B extends from the second inner electrode 200 so as to reach the second side face L 5 b of the multilayer body L 5 . The lead conductor 206 A extends from the second inner electrode 201 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 206 B extends from the second inner electrode 201 so as to reach the second side face L 5 b of the multilayer body L 5 . The lead conductor 207 A extends from the second inner electrode 202 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 207 B extends from the second inner electrode 202 so as to reach the second side face L 5 b of the multilayer body L 5 . The lead conductor 208 A extends from the second inner electrode 203 so as to reach the first side face L 5 a of the multilayer body L 5 . The lead conductor 208 B extends from the second inner electrode 203 so as to reach the second side face L 5 b of the multilayer body L 5 .

The second inner electrode 200 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 205 A and 205 B, respectively. The second inner electrode 201 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 206 A and 206 B, respectively. The second inner electrode 202 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 207 A and 207 B, respectively. The second inner electrode 203 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 208 A and 208 B, respectively. As a consequence, the plurality of second inner electrodes 200 to 203 are electrically connected to each other through the second outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 210 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 220 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 210 , 220 are electrically insulated from each other.

The first inner connecting conductor 210 includes a first conductor portion 210 A having an oblong form, second, third, and fourth conductor portions 210 B, 210 C, 210 D extending from the first conductor portion 210 A so as to be taken out to the first side face L 5 a of the multilayer body L 5 , and a fifth conductor portion 210 E extending from the first conductor portion 210 A so as to be taken out to the second side face L 5 b of the multilayer body L 5 . The first conductor portion 210 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 5 a , L 5 b of the multilayer body L 5 .

The second inner connecting conductor 220 includes a first conductor portion 220 A having an oblong form, second, third, and fifth conductor portions 220 B, 220 C, 220 E extending from the first conductor portion 220 A so as to be taken out to the second side face L 5 b of the multilayer body L 5 , and fourth conductor, portion 220 D extending from the first conductor portion 220 A so as to be taken out to the first side face L 5 a of the multilayer body L 5 . The first conductor portion 220 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 5 a , L 5 b of the multilayer body L 5 .

In the first inner connecting conductor 210 , the second, third, fourth, and fifth conductor portions 210 B, 210 C, 210 D, and 210 E are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, first outer connecting conductor 5 A, and first outer connecting conductor 5 B, respectively. As a consequence, the first inner connecting conductor 210 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B.

In the second inner connecting conductor 220 , the second, third, fourth, and fifth conductor portions 220 B, 220 C, 220 D, and 220 E are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively. As a consequence, the second inner connecting conductor 220 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B.

The first conductor portion 210 A of the first inner connecting conductor 210 is a region opposing the second inner electrode 203 with the dielectric layer 19 in between. The second conductor portion 220 A of the second inner connecting conductor 220 is a region opposing the first inner electrode 190 with the dielectric layer 11 in between.

The first and second inner connecting conductors 190 , 200 are laminated in the multilayer body L 5 such that the multilayer body L 5 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 5 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 190 to 193 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 210 . Also, in the multilayer capacitor C 5 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 200 to 203 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 220 . As a consequence, the multilayer capacitor C 5 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 210 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 220 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 5 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 5 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, which are outer conductors of the multilayer capacitor C 5 , are formed on the first and second side faces L 5 a , L 5 b of the multilayer body L 5 opposing each other. Therefore, as compared with the case where outer conductors are formed on four side faces of the multilayer body L 5 , for example, the multilayer capacitor C 5 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 5 can be made easily.

The first conductor portion 210 A of the first inner connecting conductor 210 opposes the second inner electrode 203 with the dielectric layer 19 in between. The first conductor portion 220 A of the second inner connecting conductor 220 opposes the first inner electrode 190 with the dielectric layer 11 in between. Therefore, the first and second inner connecting conductor 210 , 220 can also contribute to forming the capacity component in the multilayer capacitor C 5 , whereby the multilayer capacitor C 5 can further increase its capacitance.

Since a plurality of first and second inner electrodes 190 to 193 , 200 to 203 are arranged between the first inner connecting conductor 210 and second inner connecting conductor 220 , the multilayer capacitor C 5 can set the equivalent series resistance with a favorable balance.

On the first side face L 5 a of the multilayer body L 5 in the multilayer capacitor C 5 , the first terminal conductor 3 B and first outer connecting conductor 5 A are formed adjacent to each other. Therefore, the following effects are obtained when the multilayer capacitor C 5 is mounted on a substrate or the like such that the first terminal conductor 3 B is directly connected to a land pattern whereas the first outer connecting conductor 5 A is kept from being directly connected to a land pattern. Namely, a magnetic field caused by a current flowing between the first terminal conductor 3 B and the first inner connecting conductor 210 (the third conductor portion 210 C in the first inner connecting conductor 210 ) and a magnetic field caused by a current flowing between the first outer connecting conductor 5 A and the first inner electrodes 190 to 193 (the lead conductors 195 A to 198 A) and a current flowing between the first outer connecting conductor 5 A and the first inner connecting conductor 210 (the fourth conductor portion 210 D in the first inner connecting conductor 210 ) cancel each other out. As a result, the multilayer capacitor C 5 can reduce its equivalent series inductance.

On the second side face L 5 b of the multilayer body L 5 in the multilayer capacitor C 5 , the second terminal conductor 4 B and second outer connecting conductor 6 B are formed adjacent to each other. Therefore, the following effects are obtained when the multilayer capacitor C 5 is mounted on a substrate or the like such that the second terminal conductor 4 B is directly connected to a land pattern whereas the second outer connecting conductor 6 B is kept from being directly connected to a land pattern. Namely, a magnetic field caused by a current flowing between the second terminal conductor 4 B and the second inner connecting conductor 220 (the third conductor portion 220 C in the second inner connecting conductor 220 ) and a magnetic field caused by a current flowing between the second outer connecting conductor 6 B and the second inner electrodes 200 to 203 (the lead conductors 205 B to 208 B) and a current flowing between the second outer connecting conductor 6 B and the second inner connecting conductor 220 (the fifth conductor portion 220 E in the second inner connecting conductor 220 ) cancel each other out. As a result, the multilayer capacitor C 5 can reduce, its equivalent series inductance.

In the multilayer capacitor C 5 , about the center axis Ax 5 of the multilayer body L 5 , the first terminal conductors 3 A, 3 B, first outer connecting conductor A, and second outer connecting conductor 6 A are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, first outer connecting conductor 5 B, and second outer connecting conductor 6 B, respectively. Also, in the opposing direction of the first side face L 5 a and second side face L 5 b of the multilayer body L 5 in the multilayer capacitor C 5 , the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B oppose the second terminal conductors 4 A and 4 B and second outer connecting conductors 6 B, 6 A, respectively. Therefore, the multilayer capacitor C 5 can be mounted easily.

Fifteenth Embodiment

The configuration of the multilayer capacitor in accordance with a fifteenth embodiment will be explained with reference to FIG. 21 . The multilayer capacitor in accordance with the fifteenth embodiment differs from the multilayer capacitor C 5 in accordance with the fourteenth embodiment in terms of the positions of first and second inner connecting conductors 210 , 220 in the laminating direction. FIG. 21 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the fifteenth embodiment.

As with the multilayer capacitor C 5 in accordance with the fourteenth embodiment, the multilayer capacitor in accordance with the fifteenth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the fifteenth embodiment, the first and second inner connecting conductors 210 , 220 , provided one by one, are laminated between two layers each of first and second inner electrodes 190 , 191 , 200 , 201 and two layers each of first and second inner electrodes 192 , 193 , 202 , 203 as shown in FIG. 21 . More specifically, the first inner connecting conductor 210 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 220 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 210 , 220 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the fifteenth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 190 to 193 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 210 . Also, in the multilayer capacitor in accordance with the fifteenth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 200 to 203 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 220 . As a consequence, the multilayer capacitor in accordance with the fifteenth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the fifteenth embodiment differs from the multilayer capacitor C 5 in accordance with the fourteenth embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 5 in accordance with the fourteenth embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 210 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the fifteenth embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 210 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the fifteenth embodiment differs from the multilayer capacitor C 5 in accordance with the fourteenth embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 5 in accordance with the fourteenth embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 220 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the fifteenth embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 220 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the fourteenth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 5 in accordance with the fourteenth embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 210 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 220 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the fifteenth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the fifteenth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the fifteenth embodiment can be made easily.

The first conductor portion 210 A of the first inner connecting conductor 210 opposes the second inner electrode 201 with the dielectric layer 14 in between. The first conductor portion 220 A of the second inner connecting conductor 220 opposes the first inner electrode 192 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the fifteenth embodiment, the first and second inner connecting conductors 210 , 220 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductor 3 B and the first outer connecting conductor 5 B are formed adjacent to each other on the first side face of the multilayer body in the multilayer capacitor in accordance with the fifteenth embodiment as in the multilayer capacitor C 5 . Therefore, the multilayer capacitor in accordance with the fifteenth embodiment can lower its equivalent series inductance.

The second terminal conductor 4 B and the second outer connecting conductor 6 B are formed adjacent to each other on the second side face of the multilayer body in the multilayer capacitor in accordance with the fifteenth embodiment as in the multilayer capacitor C 5 . Therefore, the multilayer capacitor in accordance with the fifteenth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the fifteenth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B, first outer connecting conductor 5 A, and second outer connecting conductor 6 A are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, first outer connecting conductor 5 B, and second outer connecting conductor 6 B, respectively. Also, in the opposing direction of the first side face L 5 a and second side face L 5 b of the multilayer body L 5 in the multilayer capacitor in accordance with the fifteenth embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B oppose the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 B, 6 A, respectively. Therefore, the multilayer capacitor in accordance with the fifteenth embodiment can be mounted easily.

Sixteenth Embodiment

The configuration of the multilayer capacitor in accordance with a sixteenth embodiment will be explained with reference to FIG. 22 . The multilayer capacitor in accordance with the sixteenth embodiment differs from the multilayer capacitor C 5 in accordance with the fourteenth embodiment in terms of the number of inner connecting conductors. FIG. 22 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the sixteenth embodiment.

As with the multilayer capacitor C 5 in accordance with the fourteenth embodiment, the multilayer capacitor in accordance with the sixteenth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the sixteenth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 190 to 193 , 200 to 203 as shown in FIG. 22 .

In the multilayer body of the multilayer capacitor in accordance with the sixteenth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 210 , 211 and a plurality of (2 each in this embodiment) of second inner connecting conductors 220 , 221 are laminated. In the multilayer body of the multilayer capacitor in accordance with the sixteenth embodiment, four layers of first inner electrodes 190 to 193 and four layers of second inner electrodes 200 to 203 are arranged between one each of the first and second inner connecting conductors 210 , 220 which are a part of the plurality of inner connecting conductors 210 , 211 , 220 , 221 and the remaining first and second inner connecting conductors 211 , 221 .

The first inner connecting conductor 210 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 211 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 220 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 221 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 210 , 211 , 220 , 221 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the sixteenth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 190 to 193 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 210 , 211 . Also, in the multilayer capacitor in accordance with the sixteenth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 200 to 203 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 220 , 221 . As a consequence, the multilayer capacitor in accordance with the sixteenth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 5 , the multilayer capacitor in accordance with the sixteenth embodiment has a greater number of first inner connecting conductors 210 , 211 , whereas the first inner connecting conductors 210 , 211 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the sixteenth embodiment has a greater number of second inner connecting conductors 220 , 221 than that in the multilayer capacitor C 5 , whereas the second inner connecting conductors 220 , 221 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the sixteenth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 5 .

As in the foregoing, by adjusting the number of first inner connecting conductors 210 , 211 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductors 220 , 221 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the sixteenth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the sixteenth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the sixteenth embodiment can be made easily.

The first conductor portion 211 A of the first inner connecting conductor 211 opposes the second inner electrode 203 with the dielectric layer 20 in between. The first conductor portion 220 A of the second inner connecting conductor 220 opposes the first inner electrode 190 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the sixteenth embodiment, the first and second inner connecting conductors 211 , 220 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the sixteenth embodiment, a plurality of first and second inner electrodes 190 to 193 , 200 to 203 are arranged between the first and second inner connecting conductors 210 , 220 and the first and second inner connecting conductors 211 , 221 . Therefore, the multilayer capacitor in accordance with the sixteenth embodiment can set the equivalent series resistance with a favorable balance.

The first terminal conductor 3 B and the first outer connecting conductor 5 B are formed adjacent to each other on the first side face of the multilayer body in the multilayer capacitor in accordance with the sixteenth embodiment as in the multilayer capacitor C 5 . Therefore, the multilayer capacitor in accordance with the sixteenth embodiment can lower its equivalent series inductance.

The second terminal conductor 4 B and the second outer connecting conductor 6 B are formed adjacent to each other on the second side face of the multilayer body in the multilayer capacitor in accordance with the sixteenth embodiment as in the multilayer capacitor C 5 . Therefore, the multilayer capacitor in accordance with the sixteenth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the sixteenth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B, first outer connecting conductor 5 A, and second outer connecting conductor 6 A are formed at positions axisymmetrical to the second terminal conductors 4 B, 4 A, first outer connecting conductor 5 B, and second outer connecting conductor 6 B, respectively. Also, in the opposing direction of the first side face L 5 a and second side face L 5 b of the multilayer body L 5 , the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B oppose the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 B, 6 A, respectively. Therefore, the multilayer capacitor in accordance with the sixteenth embodiment can be mounted easily.

Seventeenth Embodiment

The configuration of the multilayer capacitor C 6 in accordance with a seventeenth embodiment will be explained with reference to FIGS. 23 and 24 . FIG. 23 is a perspective view of the multilayer capacitor in accordance with the seventeenth embodiment. FIG. 24 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the seventeenth embodiment.

As shown in FIG. 23 , the multilayer capacitor C 6 in accordance with the seventeenth embodiment comprises a multilayer body L 6 , first terminal conductors 3 A, 3 B formed on the multilayer body L 6 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B is positioned on a first side face L 6 a which is a side face extending along the longitudinal axis of faces L 6 c , L 6 d orthogonal to the laminating direction of the multilayer body L 6 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B and first outer connecting conductor 5 A, 5 B are formed such that the first terminal conductor 3 A, first outer connecting conductor 5 A, first terminal conductor 3 B, and first outer connecting conductor 5 B are successively arranged from the left side to right side of FIG. 23 .

Therefore, the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other on the first side face L 6 a that is the same side face of the multilayer body L 6 . The first terminal conductor 3 B and first outer connecting conductor 5 B are formed adjacent to each other on the first side face L 6 a that is the same side face of the multilayer body L 6 .

Each of the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B is positioned on a second side face L 6 b which is a side face extending along the longitudinal axis of faces L 6 c , L 6 d orthogonal to the laminating direction of the multilayer body L 6 among side faces parallel to the laminating direction of the multilayer body. The second terminal conductors 4 A, 4 B and second outer connecting conductor 6 A, 6 B are formed such that the second terminal conductor 4 A, second outer connecting conductor 6 A, second terminal conductor 4 B, and second outer connecting conductor 6 B are successively arranged from the left side to right side of FIG. 23 .

Therefore, the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other on the second side face L 6 b that is the same side face of the multilayer body L 6 . The second terminal conductor 4 B and second outer connecting conductor 6 B are formed adjacent to each other on the second side face L 6 b that is the same side face of the multilayer body L 6 .

As shown in FIG. 24 , the multilayer body L 6 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 230 to 233 , 240 to 243 .

Further, one first inner connecting conductor 250 and one second inner connecting conductor 260 are laminated in the multilayer body L 6 . In the multilayer body L 6 , the plurality of first inner connecting conductors 240 to 243 and the plurality of second inner connecting conductor 230 to 233 are arranged between the second inner connecting conductor 260 and the first inner connecting conductor 250 .

Each of the first inner electrodes 230 to 233 has a substantially rectangular form. The plurality of first inner electrodes 230 to 233 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 6 .

Each of lead conductors 235 A, 235 B is integrally formed with the first inner electrode 230 so as to extend therefrom and reach the first side face L 6 a of the multilayer body L 6 . Each of lead conductors 236 A, 236 B is integrally formed with the first inner electrode 231 so as to extend therefrom and reach the first side face L 6 a of the multilayer body L 6 . Each of lead conductors 237 A, 237 B is integrally formed with the first inner electrode 232 so as to extend therefrom and reach the first side face L 6 a of the multilayer body L 6 . Each of lead conductors 238 A, 238 B is integrally formed with the first inner electrode 233 so as to extend therefrom and reach the first side face L 6 a of the multilayer body L 6 .

The first inner electrode 230 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 235 A and 235 B, respectively. The first inner electrode 231 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 236 A and 236 B, respectively. The first inner electrode 232 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 237 A and 237 B, respectively. The first inner electrode 233 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 238 A and 238 B, respectively. As a consequence, the plurality of first inner electrodes 230 to 233 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the first inner electrodes 240 to 243 has a substantially rectangular form. The plurality of first inner electrodes 240 to 243 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 6 .

Each of lead conductors 245 A, 245 B is integrally formed with the first inner electrode 240 so as to extend therefrom and reach the second side face L 6 b of the multilayer body L 6 . Each of lead conductors 246 A, 246 B is integrally formed with the first inner electrode 241 so as to extend therefrom and reach the second side face L 6 b of the multilayer body L 6 . Each of lead conductors 247 A, 247 B is integrally formed with the second inner electrode 242 so as to extend therefrom and reach the second side face L 6 b of the multilayer body L 6 . Each of lead conductors 248 A, 248 B is integrally formed with the second inner electrode 243 so as to extend therefrom and reach the second side face L 6 b of the multilayer body L 6 .

The second inner electrode 240 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 245 A and 245 B, respectively. The second inner electrode 241 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 246 A and 246 B, respectively. The second inner electrode 242 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 247 A and 247 B, respectively. The second inner electrode 243 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 248 A and 248 B, respectively. As a consequence, the plurality of second inner electrodes 240 to 243 are electrically connected to each other through the second outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 250 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 260 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 250 , 260 are electrically insulated from each other.

The first inner connecting conductor 250 includes a first conductor portion 250 A having an oblong form, and second, third, fourth, and fifth conductor portions 250 B to 250 E extending from the first conductor portion 250 A so as to be taken out to the first side face L 6 a of the multilayer body L 6 . The first conductor portion 250 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 6 a , L 6 b of the multilayer body L 6 .

The second inner connecting conductor 260 includes a first conductor portion 260 A having an oblong form, and second, third, fourth, and fifth conductor portions 260 B to 260 E extending from the first conductor portion 260 A so as to be taken out to the second side face L 6 b of the multilayer body L 6 . The first conductor portion 260 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 6 a , L 6 b of the multilayer body L 6 .

In the first inner connecting conductor 250 , the second, third, fourth, and fifth conductor portions 250 B, 250 C, 250 D, and 250 E are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, first outer connecting conductor 5 A, and first outer connecting conductor 5 B, respectively. As a consequence, the first inner connecting conductor 250 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B.

In the second inner connecting conductor 260 , the second, third, fourth, and fifth conductor portions 260 B, 260 C, 260 D, and 260 E are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively. As a consequence, the second inner connecting conductor 260 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B.

The first conductor portion 250 A of the first inner connecting conductor 250 is a region opposing the second inner electrode 243 with the dielectric layer 19 in between. The second conductor portion 260 A of the second inner connecting conductor 260 is a region opposing the first inner electrode 230 with the dielectric layer 11 in between.

The first and second inner connecting conductors 250 , 260 are laminated in the multilayer body L 6 such that the multilayer body L 6 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 6 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 230 to 233 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 250 . Also, in the multilayer capacitor C 6 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 240 to 243 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 260 . As a consequence, the multilayer capacitor C 6 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 250 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 260 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 6 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 6 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, which are outer conductors of the multilayer capacitor C 6 , are formed on the first and second side faces L 6 a , L 6 b of the multilayer body L 6 opposing each other. Therefore, as compared with the case where outer conductors are formed on four side faces of the multilayer body L 6 , for example, the multilayer capacitor C 6 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 6 can be made easily.

The first inner connecting conductor 250 has the first conductor portion 250 A that is a region opposing the second inner electrode 243 with the dielectric layer 19 in between. The second inner connecting conductor 260 has the first conductor portion 260 A that is a region opposing the first inner electrode 230 with the dielectric layer 11 in between. As a consequence, both the first and second inner connecting conductors 250 , 260 can contribute to forming the capacity component of the multilayer capacitor C 6 . Therefore, the multilayer capacitor C 6 can further increase its capacitance.

Since a plurality of first and second inner electrodes 230 to 233 , 240 to 243 are arranged between the first inner connecting conductor 250 and second inner connecting conductor 260 , the multilayer capacitor C 6 can set the equivalent series resistance with a favorable balance.

On the first side face L 6 a of the multilayer body 6 in the multilayer capacitor C 6 , the first terminal conductors 3 A and 3 B are formed adjacent to the first outer connecting conductors 5 A and 5 B, respectively. Therefore, a remarkable canceling effect is obtained when the multilayer capacitor C 6 is mounted on a substrate or the like such that the first terminal conductors 3 A, 3 B are directly connected to land patterns whereas the first outer connecting conductors 5 A, 5 B are kept from being directly connected to land patterns. Namely, a magnetic field caused by a current flowing between the first terminal conductors 3 A, 3 B and the first inner connecting conductor 250 (the second and third conductor portions 250 B, 250 C in the first inner connecting conductor 250 ) and a magnetic field caused by a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner electrodes 230 to 233 (the lead conductors 235 A to 238 A, 235 B to 238 B) and a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner connecting conductor 250 (the fourth and fifth conductor portions 250 D, 250 E in the first inner connecting conductor 250 ) cancel each other out. As a result, the multilayer capacitor C 6 can reduce its equivalent series inductance.

On the second side face L 6 b of the multilayer body 6 in the multilayer capacitor C 6 , the second terminal conductors 4 A and 4 B are formed adjacent to the second outer connecting conductors 6 A and 6 B, respectively. Therefore, a remarkable canceling effect is obtained when the multilayer capacitor C 6 is mounted on a substrate or the like such that the second terminal conductors 4 A, 4 B are directly connected to land patterns whereas the second outer connecting conductors 6 A, 6 B are kept from being directly connected to land patterns. Namely, a magnetic field caused by a current flowing between the second terminal conductors 4 A, 4 B and the second inner connecting conductor 260 (the second and third conductor portions 260 B, 260 C in the second inner connecting conductor 260 ) and a magnetic field caused by a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner electrodes 240 to 243 (the lead conductors 245 A to 248 A, 245 B to 248 B) and a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner connecting conductor 250 (the fourth and fifth conductor portions 260 D, 260 E in the second inner connecting conductor 260 ) cancel each other out. As a result, the multilayer capacitor C 6 can reduce its equivalent series inductance.

In the multilayer capacitor C 6 , the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face L 6 a of the multilayer body L 6 . Also, in the multilayer capacitor in accordance with the second embodiment, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face L 6 b of the multilayer body L 6 . Therefore, a remarkable canceling effect is obtained in a magnetic field caused by a current flowing through the multilayer capacitor C 6 . As a result, the multilayer capacitor C 6 can lower its equivalent series inductance further greatly.

Eighteenth Embodiment

With reference to FIG. 25 , the configuration of the multilayer capacitor in accordance with an eighteenth embodiment will be explained. The multilayer capacitor in accordance with the eighteenth embodiment differs from the multilayer capacitor C 6 in accordance with the seventeenth embodiment in terms of positions of the inner connecting conductors 250 , 260 in the laminating direction. FIG. 25 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the eighteenth embodiment.

As with the multilayer capacitor C 6 in accordance with the seventeenth embodiment, the multilayer capacitor in accordance with the eighteenth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

In the multilayer capacitor in accordance with the eighteenth embodiment, the first inner connecting conductor 250 and second inner connecting conductor 260 , provided one by one, are laminated. In the multilayer capacitor in accordance with the eighteenth embodiment, the first and second inner connecting conductors 250 , 260 , provided one by one, are laminated between two layers each of first and second inner electrodes 230 , 231 , 240 , 241 and two layers each of first and second inner electrodes 232 , 233 , 242 , 243 as shown in FIG. 25 . More specifically, the first inner connecting conductor 250 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 260 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 250 , 260 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the eighteenth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 230 to 233 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 250 . Also, in the multilayer capacitor in accordance with the eighteenth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 240 to 243 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 260 . As a consequence, the multilayer capacitor in accordance with the eighteenth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the eighteenth embodiment differs from the multilayer capacitor C 6 in accordance with the seventeenth embodiment in terms of how the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 6 in accordance with the seventeenth embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 250 , so as to be connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the eighteenth embodiment, on the other hand, each of the resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 250 as a boundary, and the resulting resistance components are connected in parallel to their corresponding first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the eighteenth embodiment differs from the multilayer capacitor C 6 in accordance with the seventeenth embodiment in terms of how the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the seventeenth embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 260 , so as to be connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the eighteenth embodiment, on the other hand, each of the resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 260 as a boundary, and the resulting resistance components are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the eighteenth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 6 in accordance with the seventeenth embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 250 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 260 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the eighteenth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the eighteenth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the eighteenth embodiment can be made easily.

The first conductor portion 250 A of the first inner connecting conductor 250 opposes the second inner electrode 241 with the dielectric layer 14 in between. The first conductor portion 260 A of the second inner connecting conductor 260 opposes the first inner electrode 232 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the eighteenth embodiment, the first and second inner connecting conductors 250 , 260 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the eighteenth embodiment as in the multilayer capacitor C 6 . Therefore, the multilayer capacitor in accordance with the eighteenth embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the eighteenth embodiment as in the multilayer capacitor C 6 . Therefore, the multilayer capacitor in accordance with the eighteenth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the eighteenth embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face L 6 a of the multilayer body L 6 . Also, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face of the multilayer body. Therefore, the multilayer capacitor in accordance with the eighteenth embodiment can lower its equivalent series inductance further greatly.

Nineteenth Embodiment

The configuration of the multilayer capacitor in accordance with a nineteenth embodiment will be explained with reference to FIG. 26 . The multilayer capacitor in accordance with the nineteenth embodiment differs from the multilayer capacitor C 6 in accordance with the seventeenth embodiment in terms of the number of inner connecting conductors. FIG. 26 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the nineteenth embodiment.

As with the multilayer capacitor C 6 in accordance with the seventeenth embodiment, the multilayer capacitor in accordance with the nineteenth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the nineteenth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 230 to 233 , 240 to 243 as shown in FIG. 26 .

In the multilayer body of the multilayer capacitor in accordance with the nineteenth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 250 , 251 and a plurality of (2 each in this embodiment) of second inner connecting conductors 260 , 261 are laminated. In the multilayer body of the multilayer capacitor in accordance with the nineteenth embodiment, four layers of first inner electrodes 230 to 233 and four layers of second inner electrodes 240 to 243 are arranged between one each of the first and second inner connecting conductors 250 , 260 and one each of the first and second inner connecting conductors 251 , 261 .

The first inner connecting conductor 250 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 251 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 260 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 261 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 250 , 251 , 260 , 261 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the nineteenth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 230 to 233 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 250 , 251 . Also, in the multilayer capacitor in accordance with the nineteenth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 240 to 243 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 260 , 261 . As a consequence, the multilayer capacitor in accordance with the nineteenth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 6 , the multilayer capacitor in accordance with the nineteenth embodiment has a greater number of first inner connecting conductors 250 , 251 , whereas the first inner connecting conductors 250 , 251 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the nineteenth embodiment has a greater number of second inner connecting conductors 260 , 261 than that of the multilayer capacitor C 6 , whereas the second inner connecting conductors 260 , 261 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the nineteenth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 6 .

As in the foregoing, by adjusting the number of first inner connecting conductors 250 , 251 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductors 260 , 261 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision.

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the nineteenth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the nineteenth embodiment can be made easily.

The first conductor portion 251 A of the first inner connecting conductor 251 opposes the second inner electrode 243 with the dielectric layer 20 in between. The first conductor portion 260 A of the second inner connecting conductor 260 opposes the first inner electrode 230 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the nineteenth embodiment, the first and second inner connecting conductors 251 , 260 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the nineteenth embodiment, a plurality of first and second inner electrodes 230 to 233 , 240 to 243 are arranged between the first and second inner connecting conductors 250 , 260 and the first and second inner connecting conductors 251 , 261 . Therefore, the multilayer capacitor in accordance with the nineteenth embodiment can set the equivalent series resistance with a favorable balance.

The first terminal conductors 3 A, 3 B and the first outer connecting conductors 5 A, 5 B are formed adjacent to each other, respectively, on the first side face of the multilayer body in the multilayer capacitor in accordance with the nineteenth embodiment as in the multilayer capacitor C 6 . Therefore, the multilayer capacitor in accordance with the nineteenth embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductors 6 A, 6 B are formed adjacent to each other, respectively, on the second side face of the multilayer body in the multilayer capacitor in accordance with the nineteenth embodiment as in the multilayer capacitor C 6 . Therefore, the multilayer capacitor in accordance with the nineteenth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the nineteenth embodiment, the first terminal conductors 3 A, 3 B and first outer connecting conductors 5 A, 5 B are arranged by the same number while forming neighboring pairs on the first side face L 6 a of the multilayer body L 6 . Also, the second terminal conductors 4 A, 4 B and second outer connecting conductors 6 A, 6 B are arranged by the same number while forming neighboring pairs on the second side face L 6 b of the multilayer body L 6 . Therefore, the multilayer capacitor in accordance with the nineteenth embodiment can lower its equivalent series inductance more greatly.

Twentieth Embodiment

The configuration of the multilayer capacitor C 7 in accordance with a twentieth embodiment will be explained with reference to FIGS. 27 and 28 . FIG. 27 is a perspective view of the multilayer capacitor in accordance with the twentieth embodiment. FIG. 28 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twentieth embodiment.

As shown in FIG. 27 , the multilayer capacitor C 7 in accordance with the twentieth embodiment comprises a multilayer body L 7 , first terminal conductors 3 A, 3 B formed on the multilayer body L 7 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B and first outer connecting conductor 5 A is positioned on a first side face L 7 a which is a side face extending along the longitudinal axis of faces L 7 c , L 7 d orthogonal to the laminating direction of the multilayer body L 7 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B and first outer connecting conductor 5 A are formed such that the first terminal conductor 3 A, first outer connecting conductor 5 A, and first terminal conductor 3 B are successively arranged from the left side to right side of FIG. 27 .

Therefore, the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other on the first side face L 7 a that is the same side face of the multilayer body L 7 . The first terminal conductor 3 B and first outer connecting conductor 5 A are formed adjacent to each other on the first side face L 7 a that is the same side face of the multilayer body L 7 .

Each of the second terminal conductors 4 A, 4 B and second outer connecting conductor 6 A is positioned on a second side face L 7 b which is a side face extending along the longitudinal axis of faces L 7 c , L 7 d orthogonal to the laminating direction of the multilayer body L 7 among side faces parallel to the laminating direction of the multilayer body. The second terminal conductors 4 A, 4 B and second outer connecting conductor 6 A are formed such that the second terminal conductor 4 A, second outer connecting conductor 6 A, and second terminal conductor 4 B are successively arranged from the left side to right side of FIG. 27 .

Therefore, the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other on the second side face L 7 b that is the same side face of the multilayer body L 7 . The second terminal conductor 4 B and second outer connecting conductor 6 A are formed adjacent to each other on the second side face L 7 b that is the same side face of the multilayer body L 7 .

The first terminal conductor 3 A and second terminal conductor 4 B are axisymmetrical to each other about a center axis Ax 7 passing respective center points Pc, Pd of the two side faces L 7 c , L 7 d orthogonal to the laminating direction of the multilayer body L 7 among center axes of the multilayer body L 7 . The first terminal conductor 3 B and second-terminal conductor 4 A are axisymmetrical to each other about the center axis Ax 7 of the multilayer body L 7 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A are axisymmetrical to each other about the center axis Ax 7 of the multilayer body L 7 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 7 a and second side face L 7 b of the multilayer body L 7 oppose each other. The first terminal conductor 3 B and second terminal conductor 4 B oppose each other in the opposing direction of the first side face L 7 a and second side face L 7 b of the multilayer body L 7 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 7 a and second side face L 7 b of the multilayer body L 7 .

As shown in FIG. 28 , the multilayer body L 7 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 270 to 273 , 280 to 283 .

Further, one first inner connecting conductor 290 and one second inner connecting conductor 300 are laminated in the multilayer body L 7 . In the multilayer body L 7 , the plurality of first inner connecting conductors 270 to 273 and the plurality of second inner connecting conductor 280 to 283 are arranged between the second inner connecting conductor 300 and the first inner connecting conductor 290 .

Each of the first inner electrodes 270 to 273 has a substantially rectangular form. The plurality of first inner electrodes 270 to 273 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 7 .

A lead conductor 275 A is integrally formed with the first inner electrode 270 so as to extend therefrom and reach the first side face L 7 a of the multilayer body L 7 . A lead conductor 276 A is integrally formed with the first inner electrode 271 so as to extend therefrom and reach the first side face L 7 a of the multilayer body L 7 . A lead conductor 277 A is integrally formed with the first inner electrode 272 so as to extend therefrom and reach the first side face L 7 a of the multilayer body L 7 . A lead conductor 278 A is integrally formed with the first inner electrode 273 so as to extend therefrom and reach the first side face L 7 a of the multilayer body L 7 .

The first inner electrode 270 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 275 A. The first inner electrode 271 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 276 A. The first inner electrode 272 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 277 A. The first inner electrode 273 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 278 A. As a consequence, the plurality of first inner electrodes 270 to 273 are electrically connected to each other through the first outer connecting conductor 5 A.

Each of the second inner electrodes 280 to 283 has a substantially rectangular form. The plurality of second inner electrodes 280 to 283 are formed at respective-positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 7 .

A lead conductor 285 A is integrally formed with the second inner electrode 280 so as to extend therefrom and reach the second side face L 7 b of the multilayer body L 7 . A lead conductor 286 A is integrally formed with the second inner electrode 281 so as to extend therefrom and reach the second side face L 7 b of the multilayer body L 7 . A lead conductor 287 A is integrally formed with the second inner electrode 282 so as to extend therefrom and reach the second side face L 7 b of the multilayer body L 7 . A lead conductor 288 A is integrally formed with the second inner electrode 283 so as to extend therefrom and reach the second side face L 7 b of the multilayer body L 7 .

The second inner electrode 280 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 285 A. The second inner electrode 281 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 286 A. The second inner electrode 282 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 287 A. The second inner electrode 283 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 288 A. As a consequence, the plurality of second inner electrodes 280 to 283 are electrically connected to each other through the second outer connecting conductor 6 A.

The first inner connecting conductor 290 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 300 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 290 , 300 are electrically insulated from each other.

The first inner connecting conductor 290 includes a first conductor portion 290 A having an oblong form and second, third, and fourth conductor portions 290 B to 290 D extending from the first conductor portion 290 A so as to be taken out to the first side face L 7 a of the multilayer body L 7 . The first conductor portion 290 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 7 a , L 7 b of the multilayer body L 7 .

The second inner connecting conductor 300 includes a first conductor portion 300 A having an oblong form and second, third, and fourth conductor portions 300 B to 300 D extending from the first conductor portion 300 A so as to be taken out to the second side face L 7 b of the multilayer body L 7 . The first conductor portion 300 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 7 a , L 7 b of the multilayer body L 7 .

In the first inner connecting conductor 290 , the second, third, and fourth conductor portions 290 B, 290 C, and 290 D are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, and first outer connecting conductor 5 A, respectively. As a consequence, the first inner connecting conductor 290 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductor 5 A.

In the second inner connecting conductor 300 , the second, third, and fourth conductor portions 300 B, 300 C, and 300 D are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, and second outer connecting conductor 6 A, respectively. As a consequence, the second inner connecting conductor 300 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductor 6 A.

The first conductor portion 290 A of the first inner connecting conductor 290 is a region opposing the second inner electrode 283 with the dielectric layer 19 in between. The first conductor portion 300 A of the second inner connecting conductor 300 is a region opposing the first inner electrode 270 with the dielectric layer 11 in between.

The first and second inner connecting conductors 290 , 300 are laminated in the multilayer body L 7 such that the multilayer body L 7 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 7 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 270 to 273 not directly, but electrically through the first outer connecting conductor 5 A and first inner connecting conductor 290 . Also, in the multilayer capacitor C 7 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 280 to 283 not directly, but electrically through the second outer connecting conductor 6 A and second inner connecting conductor 300 . As a result, the multilayer capacitor C 7 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 290 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 300 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 7 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 7 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 6 A, which are outer conductors of the multilayer capacitor C 7 , are formed on the first and second side faces L 7 a , L 7 b of the multilayer body L 7 opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of the multilayer body L 7 , the multilayer capacitor C 7 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 7 can be made easily.

The first inner connecting conductor 290 has the first conductor portion 290 A that is a region opposing the second inner electrode 283 with the dielectric layer 19 in between. The second inner connecting conductor 300 has the second conductor portion 300 A that is a region opposing the first inner electrode 270 with the dielectric layer 11 in between. Therefore, both of the first and second inner connecting conductors 290 , 300 can contribute to forming the capacity component of the multilayer capacitor C 7 . As a consequence, the multilayer capacitor C 7 can further increase its capacitance.

Since a plurality of first and second inner electrodes 270 to 273 , 280 to 283 are arranged between the first inner connecting conductor 290 and second inner connecting conductor 300 , the multilayer capacitor C 7 can set the equivalent series resistance with a favorable balance.

On the first side face L 7 a of the multilayer body L 7 in the multilayer capacitor C 7 , both of the first terminal conductors 3 A, 3 B are formed adjacent to the first outer connecting conductor 5 A. Therefore, the following effects are obtained when the multilayer capacitor C 7 is mounted on a substrate or the like such that the first terminal conductors 3 A, 3 B are directly connected to land patterns whereas the first outer connecting conductor 5 A is kept from being directly connected to a land pattern. Namely, a magnetic field caused by a current flowing between the first terminal conductors 3 A, 3 B and the first inner connecting conductor 290 (the second and third conductor portions 290 B, 290 C in the first inner connecting conductor 290 ) and a magnetic field caused by a current flowing between the first outer connecting conductor 5 A and the first inner electrodes 270 to 273 (the lead conductors 275 A to 278 A) and a current flowing between the first outer connecting conductor 5 A and the first inner connecting conductor 290 (the fourth conductor portion 290 D in the first inner connecting conductor 290 ) cancel each other out. As a result, the multilayer capacitor C 7 can reduce its equivalent series inductance.

On the second side face L 7 b of the multilayer body L 7 in the multilayer capacitor C 7 , both of the second terminal conductors 4 A, 4 B are formed adjacent to the second outer connecting conductor 6 A. Therefore, the following effects are obtained when the multilayer capacitor C 7 is mounted on a substrate or the like such that the second terminal conductors 4 A, 4 B are directly connected to land patterns whereas the second outer connecting conductor 6 A is kept from being directly connected to a land pattern. Namely, a magnetic field caused by a current flowing between the second terminal conductors 4 A, 4 B and the second inner connecting conductor 300 (the second and third conductor portions 300 B, 300 C in the second inner connecting conductor 300 ) and a magnetic field caused by a current flowing between the second outer connecting conductor 6 A and the second inner electrodes 280 to 283 (the lead conductors 285 A to 288 A) and a current flowing between the second outer connecting conductor 6 A and the second inner connecting conductor 300 (the fourth conductor portion 300 D in the first inner connecting conductor 300 ) cancel each other out. As a result, the multilayer capacitor C 7 can reduce its equivalent series inductance.

In the multilayer capacitor C 7 , about the center axis Ax 7 of the multilayer body L 7 , the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A are formed at positions axisymmetrical to each other. Also, in the opposing direction of the first side face L 7 a and second side face L 7 b of the multilayer body L 7 in the multilayer capacitor C 7 , the first-terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other. Therefore, the multilayer capacitor C 7 can be mounted easily.

Twenty-First Embodiment

With reference to FIG. 29 , the configuration of the multilayer capacitor in accordance with a twenty-first embodiment will be explained. The multilayer capacitor in accordance with the twenty-first embodiment differs from the multilayer capacitor C 7 in accordance with the twentieth embodiment in terms of positions of the inner connecting conductors 290 , 300 in the laminating direction. FIG. 29 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-first embodiment.

As with the multilayer capacitor C 7 in accordance with the twentieth embodiment, the multilayer capacitor in accordance with the twenty-first embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body, though they are not depicted.

The first and second inner connecting conductors 290 , 300 , provided one by one, are laminated in the multilayer body of the multilayer capacitor in accordance with the twenty-first embodiment. In the multilayer capacitor in accordance with the twenty-first embodiment, the first and second inner connecting conductors 290 , 300 , provided one by one, are laminated between two layers each of first and second inner electrodes 270 , 271 , 280 , 281 and two layers each of first and second inner electrodes 272 , 273 , 282 , 283 as shown in FIG. 29 . More specifically, the first inner connecting conductor 290 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 300 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 290 , 300 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twenty-first embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 270 to 273 not directly, but electrically through the first outer connecting conductor 5 A and first inner connecting conductor 290 . Also, in the multilayer capacitor in accordance with the twenty-first embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 280 to 283 not directly, but electrically through the second outer connecting conductor 6 A and second inner connecting conductor 300 . As a consequence, the multilayer capacitor in accordance with the twenty-first embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the twenty-first embodiment differs from the multilayer capacitor C 7 in accordance with the twentieth embodiment in terms of how the resistance component of the first outer connecting conductor 5 A is connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 7 in accordance with the twentieth embodiment, the resistance component of the first outer connecting conductor 5 A is connected in series to the first inner connecting conductor 290 , so as to be connected to each of the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the twenty-first embodiment, on the other hand, the resistance component of the first outer connecting conductor 5 A is split at the first inner connecting conductor 290 as a boundary, and the resulting resistance components are connected in parallel to each of the first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the twenty-first embodiment differs from the multilayer capacitor C 7 in accordance with the twentieth embodiment in terms of how the resistance component of the second outer connecting conductor 6 A is connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 7 in accordance with the twentieth embodiment, the resistance component of the second outer connecting conductor 6 A is connected in series to the second inner connecting conductor 300 , so as to be connected to each of the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the twenty-first embodiment, on the other hand, the resistance component of the second outer connecting conductor 6 A is split at the second inner connecting conductor 300 as a boundary, and the resulting resistance components are connected in parallel to each of the second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 6 A, the multilayer capacitor in accordance with the twenty-first embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 7 in accordance with the twentieth embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 290 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 300 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the twenty-first embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 6 A) in the multilayer capacitor in accordance with the twenty-first embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twenty-first embodiment can be made easily.

The first conductor portion 290 A of the first inner connecting conductor 290 opposes the second inner electrode 281 with the dielectric layer 14 in between. The first conductor portion 300 A of the second inner connecting conductor 300 opposes the first inner electrode 272 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the twenty-first embodiment, the first and second inner connecting conductors 290 , 300 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductors 3 A, 3 B are formed adjacent to the first outer connecting conductor 5 A on the first side face of the multilayer body in the multilayer capacitor in accordance with the twenty-first embodiment as in the multilayer capacitor C 7 . Therefore, the multilayer capacitor in accordance with the twenty-first embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B are formed adjacent to the second outer connecting conductor 6 A on the second side face of the multilayer body in the multilayer capacitor in accordance with the twenty-first embodiment as in the multilayer capacitor C 7 . Therefore, the multilayer capacitor in accordance with the twenty-first embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the twenty-first embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A are formed at positions axisymmetrical to each other. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the twenty-first embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other. Therefore, the multilayer capacitor in accordance with the twenty-first embodiment can be mounted easily.

Twenty-Second Embodiment

The configuration of the multilayer capacitor in accordance with a twenty-second embodiment will be explained with reference to FIG. 30 . The multilayer capacitor in accordance with the twenty-second embodiment differs from the multilayer capacitor C 7 in accordance with the twentieth embodiment in terms of the number of inner connecting conductors. FIG. 30 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-second embodiment.

As with the multilayer capacitor C 7 in accordance with the twentieth embodiment, the multilayer capacitor in accordance with the twenty-second embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the twenty-second embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 270 to 273 , 280 to 283 as shown in FIG. 30 .

In the multilayer body of the multilayer capacitor in accordance with the twenty-second embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 290 , 291 and a plurality of (2 each in this embodiment) of second inner connecting conductors 300 , 301 are laminated. In the multilayer body of the multilayer capacitor in accordance with the twenty-second embodiment, four layers of first inner electrodes 270 to 273 and four layers of second inner electrodes 280 to 283 are arranged between one each of the first and second inner connecting conductors 290 , 300 and one each of the first and second inner connecting conductors 291 , 301 .

The first inner connecting conductor 290 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 291 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 300 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 301 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 290 , 291 , 300 , 301 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twenty-second embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 270 to 273 not directly, but electrically through the first outer connecting conductor 5 A and first inner connecting conductors 290 , 291 . Also, in the multilayer capacitor in accordance with the twenty-second embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 280 to 283 not directly, but electrically through the second outer connecting conductor 6 A and second inner connecting conductors 300 , 301 . As a consequence, the multilayer capacitor in accordance with the twenty-second embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 7 , the multilayer capacitor in accordance with the twenty-second embodiment has a greater number of first inner connecting conductors 290 , 291 , whereas the first inner connecting conductors 290 , 291 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the twenty-second embodiment has a greater number of second inner connecting conductors 300 , 301 than that of the multilayer capacitor C 7 , whereas the second inner connecting conductors 300 , 301 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the twenty-second embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 7 .

As in the foregoing, by adjusting the number of first inner connecting conductors 290 , 291 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductors 300 , 301 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision.

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 6 A) in the multilayer capacitor in accordance with the twenty-second embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twenty-second embodiment can be made easily.

The first conductor portion 291 A of the first inner connecting conductor 291 opposes the second inner electrode 283 with the dielectric layer 20 in between. The first conductor portion 300 A of the second inner connecting conductor 300 opposes the first inner electrode 270 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the twenty-second embodiment, the first and second inner connecting conductors 291 , 300 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the twenty-second embodiment, a plurality of first and second inner electrodes 270 to 273 , 280 to 283 are arranged between the first and second inner connecting conductors 290 , 300 and the first and second inner connecting conductors 291 , 301 . Therefore, the multilayer capacitor in accordance with the twenty-second embodiment can set the equivalent series resistance with a favorable balance.

The first terminal conductors 3 A, 3 B and the first outer connecting conductor 5 A are formed adjacent to each other on the first side face of the multilayer body in the multilayer capacitor in accordance with the twenty-second embodiment as in the multilayer capacitor C 7 . Therefore, the multilayer capacitor in accordance with the twenty-second embodiment can lower its equivalent series inductance.

The second terminal conductors 4 A, 4 B and the second outer connecting conductor 6 A are formed adjacent to each other on the second side face of the multilayer body in the multilayer capacitor in accordance with the twenty-second embodiment as in the multilayer capacitor C 7 . Therefore, the multilayer capacitor in accordance with the twenty-second embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the twenty-second embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A are formed at positions axisymmetrical to each other. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the twenty-second embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other. Therefore, the multilayer capacitor in accordance with the twenty-second embodiment can be mounted easily.

Twenty-Third Embodiment

The configuration of the multilayer capacitor C 8 in accordance with a twenty-third embodiment will be explained with reference to FIGS. 31 and 32 . FIG. 31 is a perspective view of the multilayer capacitor in accordance with the twenty-third embodiment. FIG. 32 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-third embodiment.

As shown in FIG. 31 , the multilayer capacitor C 8 in accordance with the twenty-third embodiment comprises a multilayer body L 8 , a first terminal conductor 3 A formed on the multilayer body L 8 , a second terminal conductor 4 A similarly formed on the multilayer body, first outer connecting conductors 5 A, 5 B similarly formed on the multilayer body, and second outer connecting conductors 6 A, 6 B similarly formed on the multilayer body.

Each of the first terminal conductor 3 A and first outer connecting conductors 5 A, 5 B is positioned on a first side face L 8 a which is a side face extending along the longitudinal axis of faces L 8 c , L 8 d orthogonal to the laminating direction of the multilayer body L 8 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductor 3 A and first outer connecting conductors 5 A, 5 B are formed such that the first outer connecting conductor 5 A, first terminal conductor 3 A, and first outer connecting conductor 5 B are successively arranged from the left side to right side of FIG. 31 .

Therefore, the first terminal conductor 3 A and first outer connecting conductor 5 A are formed adjacent to each other on the first side face L 8 a that is the same side face of the multilayer body L 8 . The first terminal conductor 3 A and first outer connecting conductor 5 B are formed adjacent to each other on the first side face L 8 a that is the same side face of the multilayer body L 8 .

Each of the second terminal conductor 4 A and second outer connecting conductors 6 A, 6 B is positioned on a second side face L 8 b which is a side face extending along the longitudinal axis of faces L 8 c , L 8 d orthogonal to the laminating direction of the multilayer body L 8 among side faces parallel to the laminating direction of the multilayer body. The second terminal conductor 4 A and second outer connecting conductors 6 A, 6 B are formed such that the second outer connecting conductor 6 A, second terminal conductor 4 A, and second outer connecting conductor 6 B are successively arranged from the left side to right side of FIG. 31 .

Therefore, the second terminal conductor 4 A and second outer connecting conductor 6 A are formed adjacent to each other on the second side face L 8 b that is the same side face of the multilayer body L 8 . The second terminal conductor 3 B and second outer connecting conductor 6 B are formed adjacent to each other on the second side face L 8 b that is the same side face of the multilayer body L 8 .

The first terminal conductor 3 A and second terminal conductor 4 A are axisymmetrical to each other about a center axis Ax 8 passing respective center points Pc, Pd of the two side faces L 8 c , L 8 d orthogonal to the laminating direction of the multilayer body L 8 among center axes of the multilayer body L 8 . The first outer connecting conductor 5 A and second outer connecting conductor 6 B are axisymmetrical to each other about the center axis Ax 8 of the multilayer body L 8 . The first outer connecting conductor 5 B and second outer connecting conductor 6 A are axisymmetrical to each other about the center axis Ax 8 of the multilayer body L 8 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 8 a and second side face L 8 b of the multilayer body L 8 oppose each other. The first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 8 a and second side face L 8 b of the multilayer body L 8 . The first outer connecting conductor 5 B and second outer connecting conductor 6 B oppose each other in the opposing direction of the first side face L 8 a and second side face L 8 b of the multilayer body L 8 .

As shown in FIG. 32 , the multilayer body L 8 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 310 to 313 , 320 to 323 .

Further, one first inner connecting conductor 330 and one second inner connecting conductor 340 are laminated in the multilayer body L 8 . In the multilayer body L 8 , the plurality of first inner connecting conductors 310 to 313 and the plurality of second inner connecting conductor 320 to 323 are arranged between the second inner connecting conductor 340 and the first inner connecting conductor 330 .

Each of the first inner electrodes 310 to 313 has a substantially rectangular form. The plurality of first inner electrodes 310 to 313 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 8 .

Each of lead conductors 315 A, 315 B is integrally formed with the first inner electrode 310 so as to extend therefrom and reach the first side face L 8 a of the multilayer body L 8 . Each of lead conductors 316 A, 316 B is integrally formed with the first inner electrode 311 so as to extend therefrom and reach the first side face L 8 a of the multilayer body L 8 . Each of lead conductors 317 A, 317 B is integrally formed with the first inner electrode 312 so as to extend therefrom and reach the first side face L 8 a of the multilayer body L 8 . Each of lead conductors 318 A, 318 B is integrally formed with the first inner electrode 313 so as to extend therefrom and reach the first side face L 8 a of the multilayer body L 8 .

The first inner electrode 310 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 315 A and 315 B, respectively. The first inner electrode 311 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 316 A and 316 B, respectively. The first inner electrode 312 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 317 A and 317 B, respectively. The first inner electrode 313 is electrically connected to the first outer connecting conductors 5 A and 5 B through the lead conductors 318 A and 318 B, respectively. As a consequence, the plurality of first inner electrodes 310 to 313 are electrically connected to each other through the first outer connecting conductors 5 A, 5 B.

Each of the second inner electrodes 320 to 323 has a substantially rectangular form. The plurality of second inner electrodes 320 to 323 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 8 .

Each of lead conductors 325 A, 325 B is integrally formed with the second inner electrode 320 so as to extend therefrom and reach the second side face L 8 b of the multilayer body L 8 . Each of lead conductors 326 A, 326 B is integrally formed with the second inner electrode 321 so as to extend therefrom and reach the second side face L 8 b of the multilayer body L 8 . Each of lead conductors 327 A, 327 B is integrally formed with the second inner electrode 322 so as to extend therefrom and reach the second side face L 8 b of the multilayer body L 8 . Each of lead conductors 328 A, 328 B is integrally formed with the first inner electrode 323 so as to extend therefrom and reach the second side face L 8 b of the multilayer body L 8 .

The second inner electrode 320 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 325 A and 325 B, respectively. The second inner electrode 321 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 326 A and 326 B, respectively. The second inner electrode 322 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 327 A and 327 B, respectively. The second inner electrode 323 is electrically connected to the second outer connecting conductors 6 A and 6 B through the lead conductors 328 A and 328 B, respectively. As a consequence, the plurality of first inner electrodes 320 to 323 are electrically connected to each other through the second outer connecting conductors 6 A, 6 B.

The first inner connecting conductor 330 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 340 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 330 , 340 are electrically insulated from each other.

The first inner connecting conductor 330 includes a first conductor portion 330 A having an oblong form and second, third, and fourth conductor portions 330 B to 330 D extending from the first conductor portion 330 A so as to be taken out to the first side face L 8 a of the multilayer body L 8 . The first conductor portion 330 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 8 a , L 8 b of the multilayer body L 8 .

The second inner connecting conductor 340 includes a first conductor portion 340 A having an oblong form and second, third, and fourth conductor portions 340 B to 340 D extending from the first conductor portion 340 A so as to be taken out to the second side face L 8 b of the multilayer body L 8 . The first conductor portion 340 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 8 a , L 8 b of the multilayer body L 8 .

In the first inner connecting conductor 330 , the second, third, and fourth conductor portions 330 B, 330 C, and 330 D are electrically connected to the first terminal conductor 3 A, first outer connecting conductor 5 A, and first outer connecting conductor 5 B, respectively. As a consequence, the first inner connecting conductor 330 is electrically connected to the first terminal conductors 3 A and first outer connecting conductors 5 A, 5 B.

In the second inner connecting conductor 340 , the second, third, and fourth conductor portions 340 B, 340 C, and 340 D are electrically connected to the second terminal conductor 4 A, second outer connecting conductor 6 A, and second outer connecting conductor 6 B, respectively. As a consequence, the second inner connecting conductor 340 is electrically connected to the second terminal conductor 4 A and second outer connecting conductors 6 A, 6 B.

The first conductor portion 330 A of the first inner connecting conductor 330 is a region opposing the second inner electrode 323 with the dielectric layer 19 in between. The first conductor portion 340 A of the second inner connecting conductor 340 is a region opposing the first inner electrode 310 with the dielectric layer 11 in between.

The first and second inner connecting conductors 330 , 340 are laminated in the multilayer body L 8 such that the multilayer body L 8 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 8 , the first terminal conductor 3 A is connected to the first inner electrodes 310 to 313 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 330 . Also, in the multilayer capacitor C 8 , the second terminal conductor 4 A is connected to the second inner electrodes 320 to 323 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 340 . As a result, the multilayer capacitor C 8 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 330 directly connected to the first terminal conductor 3 A and the number of second inner connecting conductor 340 directly connected to the second terminal conductor 4 A in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 8 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 8 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 4 A and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, which are outer conductors of the multilayer capacitor C 8 , are formed on the first and second side faces L 8 a , L 8 b of the multilayer body L 8 opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of the multilayer body L 8 , the multilayer capacitor C 8 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 8 can be made easily.

The first inner connecting conductor 330 has the first conductor portion 330 A that is a region opposing the second inner electrode 323 with the dielectric layer 19 in between in the laminating direction of the multilayer body L 8 . The second inner connecting conductor 340 has the second conductor portion 340 A that is a region opposing the first inner electrode 310 with the dielectric layer 11 in between. Therefore, both of the first and second inner connecting conductors 330 , 340 can contribute to forming the capacity component of the multilayer capacitor C 8 . As a consequence, the multilayer capacitor C 8 can further increase its capacitance.

Since a plurality of first and second inner electrodes 310 to 313 , 320 to 323 are arranged between the first inner connecting conductor 330 and second inner connecting conductor 340 , the multilayer capacitor C 8 can set the equivalent series resistance with a favorable balance.

On the first side face L 8 a of the multilayer body L 8 in the multilayer capacitor C 8 , the first terminal conductors 3 A is formed adjacent to both of the first outer connecting conductors 5 A and 5 B. Therefore, the following effects are obtained when the multilayer capacitor C 8 is mounted on a substrate or the like such that the first terminal conductor 3 A is directly connected to a land pattern whereas the first outer connecting conductors 5 A, 5 B are kept from being directly connected to land patterns. Namely, a magnetic field caused by a current flowing between the first terminal conductor 3 A and the first inner connecting conductor 330 (the second conductor portion 330 B in the first inner connecting conductor 330 ) and a magnetic field caused by a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner electrodes 310 to 313 (the lead conductors 315 A to 318 A, 315 B to 318 B) and a current flowing between the first outer connecting conductors 5 A, 5 B and the first inner connecting conductor 330 (the third and fourth conductor portions 330 C, 330 D in the first inner connecting conductor 330 ) cancel each other out. As a result, the multilayer capacitor C 8 can reduce its equivalent series inductance.

On the second side face L 8 b of the multilayer body L 8 in the multilayer capacitor C 8 , the second terminal conductors 4 A is formed adjacent to both of the second outer connecting conductors 6 A and 6 B. Therefore, the following effects are obtained when the multilayer capacitor C 8 is mounted on a substrate or the like such that the second terminal conductor 4 A is directly connected to a land pattern whereas the second outer connecting conductors 6 A, 6 B are kept from being directly connected to land patterns. Namely, a magnetic field caused by a current flowing between the second terminal conductor 4 A and the second inner connecting conductor 340 (the second conductor portion 340 B in the second inner connecting conductor 340 ) and a magnetic field caused by a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner electrodes 320 to 323 (the lead conductors 325 A to 328 A, 325 B to 328 B) and a current flowing between the second outer connecting conductors 6 A, 6 B and the second inner connecting conductor 340 (the third and fourth conductor portions 340 C, 340 D in the second inner connecting conductor 340 ) cancel each other out. As a result, the multilayer capacitor C 8 can reduce its equivalent series inductance.

In the multilayer capacitor C 8 , about the center axis Ax 8 of the multilayer body L 8 , the first terminal conductor 3 A and second terminal conductor 4 A are formed at positions axisymmetrical to each other, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first side face L 8 a and second side face L 8 b of the multilayer body L 8 in the multilayer capacitor C 8 , the first terminal conductor 3 A and second terminal conductor 4 A oppose each other, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor C 8 can be mounted easily.

Twenty-Fourth Embodiment

With reference to FIG. 33 , the configuration of the multilayer capacitor in accordance with a twenty-fourth embodiment will be explained. The multilayer capacitor in accordance with the twenty-fourth embodiment differs from the multilayer capacitor C 8 in accordance with the twenty-third embodiment in terms of positions of the inner connecting conductors 330 , 340 in the laminating direction. FIG. 33 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-fourth embodiment.

As with the multilayer capacitor C 8 in accordance with the twenty-third embodiment, the multilayer capacitor in accordance with the twenty-fourth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body, though they are not depicted.

The first and second inner connecting conductors 330 , 340 , provided one by one, are laminated in the multilayer body of the multilayer capacitor in accordance with the twenty-fourth embodiment. In the multilayer capacitor in accordance with the twenty-fourth embodiment, the first and second inner connecting conductors 330 , 340 , provided one by one, are laminated between two layers each of first and second inner electrodes 310 , 311 , 320 , 321 and two layers each of first and second inner electrodes 312 , 323 , 322 , 323 as shown in FIG. 33 . More specifically, the first inner connecting conductor 330 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 340 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 330 , 340 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twenty-fourth embodiment, the first terminal conductor 3 A is connected to the first inner electrodes 310 to 313 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductor 330 . Also, in the multilayer capacitor in accordance with the twenty-fourth embodiment, the second terminal conductor 4 A is connected to the second inner electrodes 320 to 323 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductor 340 . As a consequence, the multilayer capacitor in accordance with the twenty-fourth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductor 3 A is concerned, the multilayer capacitor in accordance with the twenty-fourth embodiment differs from the multilayer capacitor C 8 in accordance with the twenty-third embodiment in terms of how the resistance components of the first outer connecting conductors 5 A, 5 B are connected to the first terminal conductor 3 A. In the multilayer capacitor C 8 in accordance with the twenty-third embodiment, the respective resistance components of the first outer connecting conductors 5 A, 5 B are connected in series to the first inner connecting conductor 330 , so as to be connected to the first terminal conductor 3 A. In the multilayer capacitor in accordance with the twenty-fourth embodiment, on the other hand, each of the respective resistance components of the first outer connecting conductors 5 A, 5 B is split at the first inner connecting conductor 330 as a boundary, and the resulting resistance components are connected in parallel to the first terminal conductor 3 A.

When the second terminal conductor 4 A is concerned, the multilayer capacitor in accordance with the twenty-fourth embodiment differs from the multilayer capacitor C 8 in accordance with the twenty-third embodiment in terms of how the resistance components of the second outer connecting conductors 6 A, 6 B are connected to the second terminal conductor 4 A. In the multilayer capacitor C 8 in accordance with the twenty-third embodiment, the respective resistance components of the second outer connecting conductors 6 A, 6 B are connected in series to the second inner connecting conductor 340 , so as to be connected to the second terminal conductor 4 A. In the multilayer capacitor in accordance with the twenty-fourth embodiment, on the other hand, each of the respective resistance components of the second outer connecting conductors 6 A, 6 B is split at the second inner connecting conductor 340 as a boundary, and the resulting resistance components are connected in parallel to the second terminal conductor 4 A. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B, the multilayer capacitor in accordance with the twenty-fourth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 8 in accordance with the twenty-third embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 330 directly connected to the first terminal conductor 3 A and the second inner connecting conductor 340 directly connected to the second terminal conductor 4 A in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the twenty-fourth embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 4 A and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the twenty-fourth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twenty-fourth embodiment can be made easily.

The first conductor portion 330 A of the first inner connecting conductor 330 opposes the second inner electrode 321 with the dielectric layer 14 in between. The first conductor portion 340 A of the second inner connecting conductor 340 opposes the first inner electrode 312 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the twenty-fourth embodiment, the first and second inner connecting conductors 330 , 340 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

The first terminal conductor 3 A is formed adjacent to both of the first outer connecting conductors 5 A, 5 B on the first side face of the multilayer body in the multilayer capacitor in accordance with the twenty-fourth embodiment as in the multilayer capacitor C 8 . Therefore, the multilayer capacitor in accordance with the twenty-fourth embodiment can lower its equivalent series inductance.

The second terminal conductor 4 A is formed adjacent to both of the second outer connecting conductors 6 A, 6 B on the second side face of the multilayer body in the multilayer capacitor in accordance with the twenty-fourth embodiment as in the multilayer capacitor C 8 . Therefore, the multilayer capacitor in accordance with the twenty-fourth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the twenty-fourth embodiment, about the center axis of the multilayer body, the first terminal conductor 3 A and second terminal conductor 4 A are formed at positions axisymmetrical to each other, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the twenty-fourth embodiment, the first terminal conductor 3 A and second terminal conductor 4 A oppose each other, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the twenty-fourth embodiment can be mounted easily.

Twenty-Fifth Embodiment

The configuration of the multilayer capacitor in accordance with a twenty-fifth embodiment will be explained with reference to FIG. 34 . The multilayer capacitor in accordance with the twenty-fifth embodiment differs from the multilayer capacitor C 8 in accordance with the twenty-third embodiment in terms of the number of inner connecting conductors. FIG. 34 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-fifth embodiment.

As with the multilayer capacitor C 8 in accordance with the twenty-third embodiment, the multilayer capacitor in accordance with the twenty-fifth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the twenty-fifth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 310 to 313 , 320 to 323 as shown in FIG. 34 .

In the multilayer body of the multilayer capacitor in accordance with the twenty-fifth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 330 , 331 and a plurality of (2 each in this embodiment) of second inner connecting conductors 340 , 341 are laminated. In the multilayer body of the multilayer capacitor in accordance with the twenty-fifth embodiment, four layers of first inner electrodes 310 to 313 and four layers of second inner electrodes 320 to 323 are arranged between one each of the first and second inner connecting conductors 330 , 340 and one each of the first and second inner connecting conductors 331 , 341 .

The first inner connecting conductor 330 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 331 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 340 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 341 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 330 , 331 , 340 , 341 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twenty-fifth embodiment, the first terminal conductors 3 A is connected to the first inner electrodes 310 to 313 not directly, but electrically through the first outer connecting conductors 5 A, 5 B and first inner connecting conductors 330 , 331 . Also, in the multilayer capacitor in accordance with the twenty-fifth embodiment, the second terminal conductor 4 A is connected to the second inner electrodes 320 to 323 not directly, but electrically through the second outer connecting conductors 6 A, 6 B and second inner connecting conductors 340 , 341 . As a consequence, the multilayer capacitor in accordance with the twenty-fifth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 8 , the multilayer capacitor in accordance with the twenty-fifth embodiment has a greater number of first inner connecting conductors 330 , 331 , whereas the first inner connecting conductors 330 , 331 are connected in parallel to the first terminal conductor 3 A. Also, the multilayer capacitor in accordance with the twenty-fifth embodiment has a greater number of second inner connecting conductors 340 , 341 than that of the multilayer capacitor C 8 , whereas the second inner connecting conductors 340 , 341 are connected in parallel to the second terminal conductor 4 A. Therefore, the multilayer capacitor in accordance with the twenty-fifth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 8 .

As in the foregoing, by adjusting the number of first inner connecting conductors 330 , 331 directly connected to the first terminal conductor 3 A and the number of second inner connecting conductors 340 , 341 directly connected to the second terminal conductor 4 A, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision.

All the outer conductors (first and second terminal conductors 3 A, 4 A and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B) in the multilayer capacitor in accordance with the twenty-fifth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twenty-fifth embodiment can be made easily.

The first conductor portion 331 A of the first inner connecting conductor 331 opposes the second inner electrode 323 with the dielectric layer 20 in between. The first conductor portion 340 A of the second inner connecting conductor 340 opposes the first inner electrode 310 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the twenty-fifth embodiment, the first and second inner connecting conductors 331 , 340 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the twenty-fifth embodiment, a plurality of first and second inner electrodes 310 to 313 , 320 to 323 are arranged between the first and second inner connecting conductors 330 , 340 and the first and second inner connecting conductors 331 , 341 . Therefore, the multilayer capacitor in accordance with the twenty-fifth embodiment can set the equivalent series resistance with a favorable balance.

The first terminal conductor 3 A is formed adjacent to the first outer connecting conductors 5 A, 5 B on the first side face of the multilayer body in the multilayer capacitor in accordance with the twenty-fifth embodiment as in the multilayer capacitor C 8 . Therefore, the multilayer capacitor in accordance with the twenty-fifth embodiment can lower its equivalent series inductance.

The second terminal conductor 4 A is formed adjacent to the second outer connecting conductors 6 A, 6 B on the second side face of the multilayer body in the multilayer capacitor in accordance with the twenty-fifth embodiment as in the multilayer capacitor C 8 . Therefore, the multilayer capacitor in accordance with the twenty-fifth embodiment can lower its equivalent series inductance.

In the multilayer capacitor in accordance with the twenty-fifth embodiment, about the center axis of the multilayer body, the first terminal conductor 3 A and second terminal conductor 4 A are formed at positions axisymmetrical to each other, and the first outer connecting conductors 5 A, 5 B are formed at positions axisymmetrical to the second outer connecting conductors 6 B, 6 A, respectively. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the twenty-fifth embodiment, the first terminal conductor 3 A and second terminal conductor 4 A oppose each other, and the first outer connecting conductors 5 A, 5 B oppose the second outer connecting conductors 6 A, 6 B, respectively. Therefore, the multilayer capacitor in accordance with the twenty-second embodiment can be mounted easily.

Twenty-Sixth Embodiment

The configuration of the multilayer capacitor C 9 in accordance with a twenty-sixth, embodiment will be explained with reference to FIGS. 35 and 36 . FIG. 35 is a perspective view of the multilayer capacitor in accordance with the twenty-sixth embodiment. FIG. 36 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-sixth embodiment.

As shown in FIG. 35 , the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment comprises a multilayer body L 9 , first terminal conductors 3 A, 3 B formed on the multilayer body L 9 , second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body.

Each of the first terminal conductors 3 A, 3 B and second outer connecting conductor 6 A is positioned on a first side face L 9 a which is a side face extending along the longitudinal axis of faces L 9 c , L 9 d orthogonal to the laminating direction of the multilayer body L 9 among side faces parallel to the laminating direction of the multilayer body. The first terminal conductors 3 A, 3 B and second outer connecting conductor 6 A are formed such that the first terminal conductor 3 A, second outer connecting conductor 6 A, and first terminal conductor 3 B are successively arranged from the left side to right side of FIG. 35 .

Each of the second terminal conductors 4 A, 4 B and first outer connecting conductor 5 A is positioned on a second side face L 9 b which is a side face extending along the longitudinal axis of faces L 9 c , L 9 d orthogonal to the laminating direction of the multilayer body L 9 among side faces parallel to the laminating direction of the multilayer body. The second terminal conductors 4 A, 4 B and first outer connecting conductor 5 A are formed such that the second terminal conductor 4 A, first outer connecting conductor 5 A, and second terminal conductor 4 B are successively arranged from the left side to right side of FIG. 35 .

The first terminal conductor 3 A and second terminal conductor 4 B are axisymmetrical to each other about a center axis Ax 9 passing respective center points Pc, Pd of the two side faces L 9 c , L 9 d orthogonal to the laminating direction of the multilayer body L 9 among center axes of the multilayer body L 9 . The first terminal conductor 3 B and second terminal conductor 4 A are axisymmetrical to each other about the center axis Ax 9 of the multilayer body L 9 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A are axisymmetrical to each other about the center axis Ax 9 of the multilayer body L 9 .

The first terminal conductor 3 A and second terminal conductor 4 A oppose each other in a direction along which the first side face L 9 a and second side face L 9 b of the multilayer body L 9 oppose each other. The first terminal conductor 3 B and second terminal conductor 4 B oppose each other in the opposing direction of the first side face L 9 a and second side face L 9 b of the multilayer body L 9 . The first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other in the opposing direction of the first side face L 9 a and second side face L 9 b of the multilayer body L 9 .

As shown in FIG. 36 , the multilayer body L 9 is constructed by alternately laminating a plurality of (11 in this embodiment) dielectric layers 10 to 20 and a plurality of (4 each in this embodiment) of first and second inner electrodes 350 to 353 , 360 to 363 .

Further, one first inner connecting conductor 370 and one second inner connecting conductor 380 are laminated in the multilayer body L 9 . In the multilayer body L 9 , the plurality of first inner connecting conductors 350 to 353 and the plurality of second inner connecting conductor 360 to 363 are arranged between the second inner connecting conductor 380 and the first inner connecting conductor 370 .

Each of the first inner electrodes 350 to 353 has a substantially rectangular form. The plurality of first inner electrodes 350 to 353 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the dielectric layers 10 to 20 (hereinafter simply referred to as “laminating direction”) in the multilayer body L 9 .

A lead conductor 355 A is integrally formed with the first inner electrode 350 so as to extend therefrom and reach the second side face L 9 b of the multilayer body L 9 . A lead conductor 356 A is integrally formed with the first inner electrode 351 so as to extend therefrom and reach the second side face L 9 b of the multilayer body L 9 . A lead conductor 357 A is integrally formed with the first inner electrode 352 so as to extend therefrom and reach the second side face L 9 b of the multilayer body L 9 . A lead conductor 358 A is integrally formed with the first inner electrode 353 so as to extend therefrom and reach the second side face L 9 b of the multilayer body. L 9 .

The first inner electrode 350 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 355 A. The first inner electrode 351 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 356 A. The first inner electrode 352 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 357 A. The first inner electrode 353 is electrically connected to the first outer connecting conductor 5 A through the lead conductor 358 A. As a consequence, the plurality of first inner electrodes 350 to 353 are electrically connected to each other through the first outer connecting conductor 5 A.

Each of the second inner electrodes 360 to 363 has a substantially rectangular form. The plurality of second inner electrodes 360 to 363 are formed at respective positions separated by a predetermined distance from a side face parallel to the laminating direction of the multilayer body L 9 .

A lead conductor 365 A is integrally formed with the second inner electrode 360 so as to extend therefrom and reach the first side face L 9 a of the multilayer body L 9 . A lead conductor 366 A is integrally formed with the second inner electrode 361 so as to extend therefrom and reach the first side face L 9 a of the multilayer body L 9 . A lead conductor 367 A is integrally formed with the second inner electrode 362 so as to extend therefrom and reach the first side face L 9 a of the multilayer body L 9 . A lead conductor 368 A is integrally formed with the second inner electrode 363 so as to extend therefrom and reach the first side face L 9 a of the multilayer body L 9 .

The second inner electrode 360 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 365 A. The second inner electrode 361 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 366 A. The second inner electrode 362 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 367 A. The second inner electrode 363 is electrically connected to the second outer connecting conductor 6 A through the lead conductor 368 A. As a consequence, the plurality of second inner electrodes 360 to 363 are electrically connected to each other through the second outer connecting conductor 6 A.

The first inner connecting conductor 370 is positioned so as to be held between the dielectric layers 19 and 20 . The second inner connecting conductor 380 is positioned so as to be held between the dielectric layers 10 and 11 . The first and second inner connecting conductors 370 , 380 are electrically insulated from each other.

The first inner connecting conductor 370 includes a first conductor portion 370 A having an oblong form and second, third, and fourth conductor portions 370 B to 370 D extending from the first conductor portion 370 A so as to be taken out to the first side face L 9 a of the multilayer body L 9 . The first conductor portion 370 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 9 a , L 9 b of the multilayer body L 9 .

The second inner connecting conductor 380 includes a first conductor portion 380 A having an oblong form and second, third, and fourth conductor portions 380 B to 380 D extending from the first conductor portion 380 A so as to be taken out to the second side face L 9 b of the multilayer body L 9 . The first conductor portion 380 A is arranged such that its longitudinal axis is parallel to the first and second side faces L 9 a , L 9 b of the multilayer body L 9 .

In the first inner connecting conductor 370 , the second, third, and fourth conductor portions 370 B, 370 C, and 370 D are electrically connected to the first terminal conductor 3 A, first terminal conductor 3 B, and first outer connecting conductor 5 A, respectively. As a consequence, the first inner connecting conductor 370 is electrically connected to the first terminal conductors 3 A, 3 B and first outer connecting conductor 5 A.

In the second inner connecting conductor 380 , the second, third, and fourth conductor portions 380 B, 380 C, and 380 D are electrically connected to the second terminal conductor 4 A, second terminal conductor 4 B, and second outer connecting conductor 6 A, respectively. As a consequence, the second inner connecting conductor 380 is electrically connected to the second terminal conductors 4 A, 4 B and second outer connecting conductor 6 A.

The first conductor portion 370 A of the first inner connecting conductor 370 is a region opposing the second inner electrode 363 with the dielectric layer 19 in between. The first conductor portion 380 A of the second inner connecting conductor 380 is a region opposing the first inner electrode 350 with the dielectric layer 11 in between.

The first and second inner connecting conductors 370 , 380 are laminated in the multilayer body L 9 such that the multilayer body L 9 includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor C 9 , the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 350 to 353 not directly, but electrically through the first outer connecting conductor 5 A and first inner connecting conductor 370 . Also, in the multilayer capacitor C 9 , the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 360 to 363 not directly, but electrically through the second outer connecting conductor 6 A and second inner connecting conductor 380 . As a result, the multilayer capacitor C 9 yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

By adjusting the number of first inner connecting conductor 370 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductor 380 directly connected to the second terminal conductors 4 A, 4 B in such a manner, this embodiment sets the equivalent series resistance of the multilayer capacitor C 9 to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor C 9 can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 6 A, which are outer conductors of the multilayer capacitor C 9 , are formed on the first and second side faces L 9 a , L 9 b of the multilayer body L 9 opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of the multilayer body L 9 , the multilayer capacitor C 9 can reduce steps required for forming the outer conductors. As a consequence, the multilayer capacitor C 9 can be made easily.

The first inner connecting conductor 370 has the first conductor portion 370 A that is a region opposing the second inner electrode 363 with the dielectric layer 19 in between. The second inner connecting conductor 380 has the second conductor portion 380 A that is a region opposing the first inner electrode 350 with the dielectric layer 11 in between. Therefore, both of the first and second inner connecting conductors 370 , 380 can contribute to forming the capacity component of the multilayer capacitor C 9 . As a consequence, the multilayer capacitor C 9 can further increase its capacitance.

Since a plurality of first and second inner electrodes 350 to 353 , 360 to 363 are arranged between the first inner connecting conductor 370 and second inner connecting conductor 380 , the multilayer capacitor C 9 can set the equivalent series resistance with a favorable balance.

In the multilayer capacitor C 9 , about the center axis Ax 9 of the multilayer body L 9 , the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A are formed at positions axisymmetrical to each other. Also, in the opposing direction of the first side face L 9 a and second side face L 9 b of the multilayer body L 9 in the multilayer capacitor C 9 , the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other. Therefore, the multilayer capacitor C 9 can be mounted easily.

Twenty-Seventh Embodiment

With reference to FIG. 37 , the configuration of the multilayer capacitor in accordance with a twenty-seventh embodiment will be explained. The multilayer capacitor in accordance with the twenty-seventh embodiment differs from the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment in terms of positions of the inner connecting conductors 370 , 380 in the laminating direction. FIG. 37 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-seventh embodiment.

As with the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment, the multilayer capacitor in accordance with the twenty-seventh embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body, though they are not depicted.

The first and second inner connecting conductors 370 , 380 , provided one by one, are laminated in the multilayer body of the multilayer capacitor in accordance with the twenty-seventh embodiment. In the multilayer capacitor in accordance with the twenty-seventh embodiment, the first and second inner connecting conductors 370 , 380 , provided one by one, are laminated between two layers each of first and second inner electrodes 350 , 351 , 360 , 361 and two layers each of first and second inner electrodes 352 , 353 , 362 , 363 as shown in FIG. 37 . More specifically, the first inner connecting conductor 370 is positioned so as to be held between dielectric layers 14 and 15 . The second inner connecting conductor 380 is positioned so as to be held between dielectric layers 15 and 16 .

The first and second inner connecting conductors 370 , 380 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twenty-seventh embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 350 to 353 not directly, but electrically through the first outer connecting conductor 5 A and first inner connecting conductor 370 . Also, in the multilayer capacitor in accordance with the twenty-seventh embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 360 to 363 not directly, but electrically through the second outer connecting conductor 6 A and second inner connecting conductor 380 . As a consequence, the multilayer capacitor in accordance with the twenty-seventh embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

Meanwhile, when the first terminal conductors 3 A, 3 B are concerned, the multilayer capacitor in accordance with the twenty-seventh embodiment differs from the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment in terms of how the resistance component of the first outer connecting conductor 5 A is connected to the first terminal conductors 3 A, 3 B. In the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment, the resistance component of the first outer connecting conductor 5 A is connected in series to the first inner connecting conductor 370 , so as to be connected to each of the first terminal conductors 3 A, 3 B. In the multilayer capacitor in accordance with the twenty-seventh embodiment, on the other hand, the resistance component of the first outer connecting conductor 5 A is split at the first inner connecting conductor 370 as a boundary, and the resulting resistance components are connected in parallel to each of the first terminal conductors 3 A, 3 B.

When the second terminal conductors 4 A, 4 B are concerned, the multilayer capacitor in accordance with the twenty-seventh embodiment differs from the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment in terms of how the resistance component of the second outer connecting conductor 6 A is connected to the second terminal conductors 4 A, 4 B. In the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment, the resistance component of the second outer connecting conductor 6 A is connected in series to the second inner connecting conductor 380 , so as to be connected to each of the second terminal conductors 4 A, 4 B. In the multilayer capacitor in accordance with the twenty-seventh embodiment, on the other hand, the resistance component of the second outer connecting conductor 6 A is split at the second inner connecting conductor 380 as a boundary, and the resulting resistance components are connected in parallel to each of the second terminal conductors 4 A, 4 B. Therefore, because of the difference in resistance components of the first and second outer connecting conductors 5 A, 6 A, the multilayer capacitor in accordance with the twenty-seventh embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment.

As in the foregoing, by adjusting the positions of the first inner connecting conductor 370 directly connected to the first terminal conductors 3 A, 3 B and the second inner connecting conductor 380 directly connected to the second terminal conductors 4 A, 4 B in the laminating direction, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision. Also, since the equivalent series resistance is controlled by the first and second inner connecting conductors, the multilayer capacitor in accordance with the twenty-seventh embodiment can regulate the equivalent series resistance while setting its capacitance to a desirable value (e.g., a larger value).

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 6 A) in the multilayer capacitor in accordance with the twenty-seventh embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twenty-seventh embodiment can be made easily.

The first conductor portion 370 A of the first inner connecting conductor 370 opposes the second inner electrode 361 with the dielectric layer 14 in between. The first conductor portion 380 A of the second inner connecting conductor 380 opposes the first inner electrode 352 with the dielectric layer 16 in between. Therefore, in the multilayer capacitor in accordance with the twenty-seventh embodiment, the first and second inner connecting conductors 370 , 380 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer capacitor in accordance with the twenty-seventh embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A are formed at positions axisymmetrical to each other. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the twenty-seventh embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other. Therefore, the multilayer capacitor in accordance with the twenty-seventh embodiment can be mounted easily.

Twenty-Eighth Embodiment

The configuration of the multilayer capacitor in accordance with a twenty-eighth embodiment will be explained with reference to FIG. 38 . The multilayer capacitor in accordance with the twenty-eighth embodiment differs from the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment in terms of the number of inner connecting conductors. FIG. 38 is an exploded perspective view of the multilayer body included in the multilayer capacitor in accordance with the twenty-eighth embodiment.

As with the multilayer capacitor C 9 in accordance with the twenty-sixth embodiment, the multilayer capacitor in accordance with the twenty-eighth embodiment comprises a multilayer body, first terminal conductors 3 A, 3 B formed on the multilayer body, second terminal conductors 4 A, 4 B similarly formed on the multilayer body, a first outer connecting conductor 5 A similarly formed on the multilayer body, and a second outer connecting conductor 6 A similarly formed on the multilayer body, though they are not depicted.

The multilayer capacitor in accordance with the twenty-eighth embodiment is constructed by alternately laminating a plurality of (13 in this embodiment) dielectric layers 10 to 22 and a plurality of (4 each in this embodiment) of first and second inner electrodes 350 to 353 , 360 to 363 as shown in FIG. 38 .

In the multilayer body of the multilayer capacitor in accordance with the twenty-eighth embodiment, a plurality of (2 each in this embodiment) of first inner connecting conductors 370 , 371 and a plurality of (2 each in this embodiment) of second inner connecting conductors 380 , 381 are laminated. In the multilayer body of the multilayer capacitor in accordance with the twenty-eighth embodiment, four layers of first inner electrodes 350 to 353 and four layers of second inner electrodes 360 to 363 are arranged between one each of the first and second inner connecting conductors 370 , 380 and one each of the first and second inner connecting conductors 371 , 381 .

The first inner connecting conductor 370 is positioned so as to be held between the dielectric layers 10 and 11 . The first inner connecting conductor 371 is positioned so as to be held between the dielectric layers 20 and 21 . The second inner connecting conductor 380 is positioned so as to be held between the dielectric layers 11 and 12 . The second inner connecting conductor 381 is positioned so as to be held between the dielectric layers 21 and 22 .

The first and second inner connecting conductors 370 , 371 , 380 , 381 are laminated in the multilayer body such that the multilayer body includes at least one set (4 sets in this embodiment) of first and second inner electrodes neighboring each other with the dielectric layer in between.

In the multilayer capacitor in accordance with the twenty-eighth embodiment, the first terminal conductors 3 A, 3 B are connected to the first inner electrodes 350 to 352 not directly, but electrically through the first outer connecting conductor 5 A and first inner connecting conductors 370 , 371 . Also, in the multilayer capacitor in accordance with the twenty-eighth embodiment, the second terminal conductors 4 A, 4 B are connected to the second inner electrodes 360 to 363 not directly, but electrically through the second outer connecting conductor 6 A and second inner connecting conductors 380 , 381 . As a consequence, the multilayer capacitor in accordance with the twenty-eighth embodiment yields an equivalent series resistance greater than that of the conventional multilayer capacitor in which all the inner electrodes are connected to their corresponding terminal conductors through lead conductors.

As compared with the multilayer capacitor C 9 , the multilayer capacitor in accordance with the twenty-eighth embodiment has a greater number of first inner connecting conductors 370 , 371 , whereas the first inner connecting conductors 370 , 371 are connected in parallel to their corresponding first terminal conductors 3 A, 3 B. Also, the multilayer capacitor in accordance with the twenty-eighth embodiment has a greater number of second inner connecting conductors 380 , 381 than that of the multilayer capacitor C 9 , whereas the second inner connecting conductors 380 , 381 are connected in parallel to their corresponding second terminal conductors 4 A, 4 B. Therefore, the multilayer capacitor in accordance with the twenty-eighth embodiment yields an equivalent series resistance smaller than that of the multilayer capacitor C 9 .

As in the foregoing, by adjusting the number of first inner connecting conductors 370 , 371 directly connected to the first terminal conductors 3 A, 3 B and the number of second inner connecting conductors 380 , 381 directly connected to the second terminal conductors 4 A, 4 B, this embodiment sets the equivalent series resistance of the multilayer capacitor to a desirable value, and thus can regulate the equivalent series resistance easily with a high precision.

All the outer conductors (first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 6 A) in the multilayer capacitor in accordance with the twenty-eighth embodiment are formed on the first and second side faces of the multilayer body opposing each other. Therefore, as compared with the case where outer conductors are formed on three or more side faces (e.g., four side faces) of a multilayer body, steps required for forming the outer conductors can be reduced, whereby the multilayer capacitor in accordance with the twenty-eighth embodiment can be made easily.

The first conductor portion 371 A of the first inner connecting conductor 371 opposes the second inner electrode 363 with the dielectric layer 20 in between. The first conductor portion 380 A of the second inner connecting conductor 380 opposes the first inner electrode 350 with the dielectric layer 12 in between. Therefore, in the multilayer capacitor in accordance with the twenty-eighth embodiment, the first and second inner connecting conductors 371 , 380 can also contribute to forming the capacity component, and thus can further increase the capacitance of the multilayer capacitor.

In the multilayer body of the multilayer capacitor in accordance with the twenty-eighth embodiment, a plurality of first and second inner electrodes 350 to 353 , 360 to 363 are arranged between the first and second inner connecting conductors 370 , 380 and the first and second inner connecting conductors 371 , 381 . Therefore, the multilayer capacitor in accordance with the twenty-eighth embodiment can set the equivalent series resistance with a favorable balance.

In the multilayer capacitor in accordance with the twenty-eighth embodiment, about the center axis of the multilayer body, the first terminal conductors 3 A, 3 B are formed at positions axisymmetrical to the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A are formed at positions axisymmetrical to each other. Also, in the opposing direction of the first and second side faces of the multilayer body in the multilayer capacitor in accordance with the twenty-eighth embodiment, the first terminal conductors 3 A, 3 B oppose the second terminal conductors 4 A, 4 B, respectively, and the first outer connecting conductor 5 A and second outer connecting conductor 6 A oppose each other. Therefore, the multilayer capacitor in accordance with the twenty-eighth embodiment can be mounted easily.

Though preferred embodiments of the present invention is explained in detail in the foregoing, the present invention is not limited to the above-mentioned embodiments. For example, the number of laminated dielectric layers 10 to 22 and the numbers of laminated first and second inner electrodes 30 to 33 , 70 to 73 , 110 to 113 , 150 to 153 , 190 to 193 , 230 to 233 , 270 to 273 , 310 to 313 , 350 to 353 , 40 to 43 , 80 to 83 , 120 to 123 , 160 to 163 , 200 to 203 , 240 to 243 , 280 to 283 , 320 to 323 , and 360 to 363 are not limited to those described in the above-mentioned embodiments.

The numbers of the first inner connecting conductors 50 , 51 , 90 , 91 , 130 , 131 , 170 , 171 , 210 , 211 , 250 , 251 , 290 , 291 , 330 , 331 , 370 , 371 and their positions in the laminating direction are not limited to those described in the above-mentioned embodiments. The numbers of the second inner connecting conductors 60 , 61 , 70 , 71 , 140 , 141 , 180 , 181 , 220 , 221 , 260 , 261 , 300 , 301 , 340 , 341 , 380 , 381 and their positions in the laminating direction are not limited to those described in the above-mentioned embodiments.

The forms of the first inner connecting conductors 50 , 51 , 90 , 91 , 130 , 131 , 170 , 171 , 210 , 211 , 250 , 251 , 290 , 291 , 330 , 331 , 370 , 371 are not limited to those described in the above-mentioned embodiments as long as they are electrically connected to the first terminal conductor and first outer connecting conductor. The forms of the second inner connecting conductors 60 , 61 , 70 , 71 , 140 , 141 , 180 , 181 , 220 , 221 , 260 , 261 , 300 , 301 , 340 , 341 , 380 , 381 are not limited to those described in the above-mentioned embodiments as long as they are electrically connected to the second terminal conductor and second outer connecting conductor.

It is not necessary for the first inner connecting conductors 50 , 51 , 90 , 91 , 130 , 131 , 170 , 171 , 210 , 211 , 250 , 251 , 290 , 291 , 330 , 331 , 370 , 371 to have a region opposing the second inner electrode in the laminating direction of the multilayer body. It is not necessary for the second inner connecting conductors 60 , 61 , 70 , 71 , 140 , 141 , 180 , 181 , 220 , 221 , 260 , 261 , 300 , 301 , 340 , 341 , 380 , 381 to have a region opposing the first inner electrode in the laminating direction of the multilayer body.

The numbers of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B are not limited to those described in the above-mentioned embodiments. Therefore, the first and second terminal conductors may be provided one each or three or more each, for example. The first and second terminal conductors 3 A, 3 B, 4 A, 4 B may be provided by numbers different from each other. The numbers of the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B are not limited to those described in the above-mentioned embodiments. Therefore, the first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B may be provided one each or three or more each, for example. The first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B may be provided by numbers different from each other.

The positions of the first and second terminal conductors 3 A, 3 B, 4 A, 4 B and first and second outer connecting conductors 5 A, 5 B, 6 A, 6 B are not limited to those described in the above-mentioned embodiments as long as they are formed on at least one of the first and second side faces of the multilayer body opposing each other. Therefore, the second terminal conductor may be formed on the first side face of the multilayer body. The first outer connecting conductor may be formed on the second side face of the multilayer body. The second outer connecting conductor may be formed on the first side face of the multilayer body.

When a plurality of first terminal conductors 3 A, 3 B are provided, it is not necessary for the plurality of first terminal conductors to be formed on the same side face. When a plurality of second terminal conductors 4 A, 4 B are provided, it is not necessary for the plurality of second terminal conductors to be formed on the same side face. When a plurality of first outer connecting conductors 5 A, 5 B are provided, it is not necessary for the plurality of first outer connecting conductors to be formed on the same side face. When a plurality of second outer connecting conductors 6 A, 6 B are provided, it is not necessary for the plurality of second outer connecting conductors to be formed on the same side face.

It is not necessary for the first terminal conductor and first outer connecting conductor to be adjacent to each other on the same side face of the multilayer capacitor. It is not necessary for the second terminal conductor and second outer connecting conductor to be adjacent to each other on the same side face of the multilayer capacitor.

The first terminal conductors may be positioned axisymmetrical to each other about the center axis (e.g., Ax 1 to Ax 9 ) of the multilayer body. The second terminal conductors may be positioned axisymmetrical to each other about the center axis (e.g., Ax 1 to Ax 9 ) of the multilayer body. The first outer connecting conductors may be positioned axisymmetrical to each other about the center axis (e.g., Ax 1 to Ax 9 ) of the multilayer body. The second outer connecting conductors may be positioned axisymmetrical to each other about the center axis (e.g., Ax 1 to Ax 9 ) of the multilayer body. It is not necessary for the terminal conductors to be positioned axisymmetrical to each other about the center axis (e.g., Ax 1 to Ax 9 ) of the multilayer body. It is not necessary for the outer connecting conductors to be positioned axisymmetrical to each other about the center axis (e.g., Ax 1 to Ax 9 ) of the multilayer body.

The first terminal conductors may be located at positions opposing each other in the opposing direction of the first and second side faces of the multilayer body. The second terminal conductors may be located at positions opposing each other in the opposing direction of the first and second side faces of the multilayer body. The first outer connecting conductor may be located at a position opposing the second outer connecting conductor in the opposing direction of the first and second side faces of the multilayer body. It is not necessary for the terminal conductors to be located at positions opposing each other in the opposing direction of the first and second side faces of the multilayer body. It is not necessary for the outer connecting conductors to be located at positions opposing each other in the opposing direction of the first and second side faces of the multilayer body.

In the multilayer body of the multilayer capacitor in accordance with the present invention, dielectric layers may further be laminated, or dielectric layers and inner electrodes may be laminated alternately.

From the invention thus described, it will be obvious that the invention may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended for inclusion within the scope of the following claims.