Differential amplifier circuit and method for reducing thermally induced offsets caused by large differential signals
Granted 26 Jun 2007 · 1 office action
Assignee: Texas Instruments
Law firm: Law firm · Log in to unlock
Attorney: Attorney · Log in to unlock
Inventors: Ahmad Dashtestani, Joel M. Halbert · Examiner: Benny Lee · AU 2817 · TC 2800
Life of the application
8 dated eventsAbstract
An amplifier includes a differential amplifier ( 10 ) having an input stage ( 20 ) for amplifying a differential input signal (Vin), and an output stage ( 6 ) coupled to the input stage ( 20 ) for producing and output signal (Vout). The input stage ( 20 ) includes main input circuitry ( 20 A) for amplifying small-signal values of the input signal (Vin) and alternative input circuitry ( 20 B) for amplifying the input signal (Vin) during conditions which cause thermal imbalance in the main input circuitry ( 20 B). The input stage ( 20 ) includes switching circuitry ( 12 ) for coupling the input signal (Vin) to the main input circuitry ( 20 A) during normal small-signal operating conditions and to the alternative input circuitry ( 20 A) during large-signal operating conditions that cause thermal imbalance in the main input circuitry ( 20 B).
Description
11 parts›BACKGROUND OF THE INVENTION · 1 of 2
The present invention relates generally to problems associated with differential thermal effects caused by steady-state or transient power imbalances in integrated circuit chips, and particularly to circuits and techniques for reducing the time required for recovery from such differential thermal effects.
It is well known that transient or steady-state large-signal input conditions can cause circuit operation that creates large power imbalances within an integrated circuit. In some cases, the integrated circuit must be operated so as to allow it sufficient time to “recover” from the large power imbalances before proper circuit operation can continue. The power imbalances can cause a temporary temperature imbalance that substantially changes the operating characteristics of circuit components such as transistors located in the region of the temperature imbalance. This may result in unacceptably inaccurate circuit performance until enough “recovery time” has elapsed to allow the temperature to be balanced within the region.
Various other conditions are known to cause similar imbalanced thermal conditions in integrated circuit chips. For example, large-signal slewing conditions or transient imbalances may cause recovery settling “tails” in the output response of a circuit. Input signal overdrive conditions beyond the linear range of an amplifier and its feedback loop may result in thermal imbalance conditions of long duration. Also, various special-purpose applications that cause linear feedback in an amplifier circuit to be interrupted or limited (e.g. in sample/hold amplifiers, peak detector circuits, and limiting/clamping amplifiers), can cause thermal imbalance conditions of the kind referred to above in. Although a thermal imbalance condition can occur due to simple transient slewing, it may be most problematic in applications in which a feedback loop is interrupted for a relatively long interval, for example in a sample/hold amplifier, a peak detector circuit, a limiting or clamping amplifier, or a multiplexed amplifier.
FIG. 1 shows a conventional closed loop feedback network that includes an operational amplifier 1 which receives a differential input signal Vin applied between a (−) input conductor 3 and a (+) input conductor 4 . The input conductors 3 and 4 are connected to the inputs of a differential input transistor pair in circuitry 2 A of an input stage 2 of amplifier 1 . Input stage 2 typically also includes a folded cascode circuit, the output of which drives the high impedance compensation node 5 (i.e., “comp” node 5 of folded cascode stage 2 A is connected to the input of a conventional output driver circuit 6 A of an output stage 6 . Output driver circuit 6 A produces an output signal Vout on conductor 7 , which is connected to the input of a feedback network 8 (which often is simply a feedback resistor). The output of feedback network 8 is connected to inverting input 3 . FIG. 2 shows a schematic diagram of a conventional differential input circuit and folded cascode stage which can be used as input stage 2 of FIG. 1 .
Referring to FIG. 2 , Vin− is applied to the base of an NPN input transistor Q 1 , and Vin+ is applied to the base of an NPN input transistor Q 2 , the emitter of which is coupled by conductor 27 to the collector of an NPN current source transistor Q 12 . The emitter of transistor Q 12 is coupled by a resistor R 3 to a power supply voltage VEE. The emitter of input transistor Q 1 is connected by conductor 26 to the collector of a current source transistor Q 11 , the emitter of which is coupled by a resistor R 2 to VEE. A resistor R 1 is connected between conductors 26 and 27 . The bases of current source transistors Q 11 and Q 12 are connected to a bias voltage VB 1 on conductor 22 . The collector of input transistor Q 1 is coupled by a conductor 24 to the emitter of a folded cascode PNP transistor Q 6 and to one terminal of a resistor R 5 coupled between conductor 24 and a power supply voltage VCC. Similarly, the collector of input transistor Q 2 is coupled by a conductor 25 to the emitter of a folded cascode PNP transistor Q 5 and to one terminal of a resistor R 4 coupled between conductor 24 and VCC. The bases of cascode transistors Q 5 and Q 6 are connected to a bias voltage VB 2 by conductor 28 . Typically, the high impedance compensation or “comp” node of the entire circuit 2 is the collector of transistor Q 6 . In FIG. 2 , the collector of transistor Q 5 is coupled to an output of a current mirror 30 . The collector of transistor Q 6 is connected by conductor 5 to an input of current mirror 30 . The voltage on conductor 5 is labeled Vcomp.
In the conventional closed loop feedback network of FIG. 1 , the differential input error voltage is forced by the feedback loop to be nearly zero. Therefore, input stage 2 is driven to a balanced condition. Typical symmetrical construction of such circuitry on the integrated circuit chip and, along with the balanced operating condition due to the nearly-zero error voltage value of Vin, result in a thermally balanced condition of each of the power-dissipating circuit elements with respect to corresponding balanced components on the other side of the symmetrical construction.
However, if the differential input voltage Vin between the bases of transistors Q 1 and Q 2 is excessively large, then one of transistors Q 1 and Q 2 carries much more current than the other, and therefore dissipates much more than the normal amount of power and, therefore increases the temperature of that transistor. Computer analysis and laboratory measurements have shown that the increased temperature can result in significant thermally-induced offset voltages in transistors Q 1 , Q 2 , Q 5 and Q 6 . The effect of this on the output voltage Vout ( FIG. 1 ) appears as a delay in the waveform “A” shown in FIG. 6 .
For example, if Vin+ is much larger than Vin−, then input transistor Q 1 is turned off and dissipates no power, and a large current flows through input transistor Q 2 , causing it to dissipate a large amount of power. This results in substantially higher temperature in input transistor Q 2 than in input transistor Q 1 , which can substantially change the operating characteristic of transistor Q 2 relative to transistor Q 1 . After the above described Vin input “overdrive” condition ends, the feedback loop causes Vin=Vin+−Vin− to be essentially zero so the feedback loop is properly balanced, and an amount of time (i.e., the thermal recovery time or “tail”) is required for the temperature of input transistor Q 2 to recover to the temperature of input transistor Q 1 so that the thermally sensitive circuitry including transistors Q 1 and Q 2 is balanced and the thermally-induced input offset voltage settles to a negligible value. Only then can a reliable precise value of Vout be obtained from the feedback amplifier. However, the thermal recovery time or “tail” shown in waveform “A” of FIG. 6 may be unacceptably long. Also, during the Vin overdrive condition the same current flowing through transistor Q 2 is subtracted from the current flowing through cascode transistor Q 5 , which reduces the power dissipation in transistor Q 5 . This causes a thermal imbalance between cascode transistors Q 5 and Q 6 .
›BACKGROUND OF THE INVENTION · 2 of 2
Prior techniques are known for switching the amplifier signal path back and forth between separate differential input stages of a single operational amplifier. For example, the assignee's line of SWOP AMP operational amplifiers (“switchable op amps”) uses this technique. However, the switching of the differential input stages therein is performed in response to a timed external signal, such as a clock signal or a control signal.
There appears to be no previously known practical solution to reducing the above described long thermal recovery “tails”.
Thus, there is an unmet need for a circuit and technique for reducing or preventing transient or temporary power imbalances in an integrated circuit amplifier which cause transient inaccuracies in an output signal produced by the amplifier.
There also is an unmet need for a circuit and technique for reducing or preventing a transient or temporary power imbalance in a particular region of an integrated circuit amplifier which causes a thermal tail of a signal produced by the amplifier.
There also is an unmet need for a circuit and technique for reducing or preventing a transient or temporary power imbalance in a particular region of an integrated circuit amplifier due to an excessively large input signal.
There also is an unmet need for a circuit and technique for reducing or preventing a transient or temporary power imbalance in a particular region of an integrated circuit amplifier due to an interruption in a feedback loop in the amplifier.
There also is an unmet need for a circuit and technique for reducing or preventing a transient or temporary power imbalance in regions of both a differential input circuit amplifier and a folded cascode circuit in an integrated circuit due to an excessively large input signal.
There also is an unmet need for a circuit and technique for electrically detecting signal conditions which would cause transient or temporary thermal imbalances in an integrated circuit without relying on system timing or control signals.
›SUMMARY OF THE INVENTION · 1 of 3
It is an object of the invention to provide a circuit and technique for reducing or preventing transient or temporary power imbalances in an integrated circuit amplifier which cause transient inaccuracies in an output signal produced by the amplifier.
It is an object of the invention to provide a circuit and technique for reducing or preventing a transient or temporary power imbalance in a particular region of an integrated circuit amplifier which cause a thermal tail of a signal produced by the amplifier.
It is an object of the invention to provide a circuit and technique for reducing or preventing a transient or temporary power imbalance in a particular region of an integrated circuit amplifier due to an excessively large input signal.
It is an object of the invention to provide a circuit and technique for reducing or preventing a transient or temporary power imbalance in a particular region of an integrated circuit amplifier due to an interruption in a feedback loop of the amplifier.
It is an object of the invention to provide a circuit and technique for reducing or preventing a transient or temporary power imbalance in the regions of a differential input circuit and/or a folded cascode circuit in an integrated circuit amplifier due to an excessively large input signal.
It is another object of the invention to provide a control signal within an integrated circuit amplifier that indicates whether the value of an input signal of the amplifier is within a predetermined range solely in response to that input signal and utilize that control signal to prevent transient or temporary power imbalances in the integrated circuit amplifier due to out-of-range values of the input signal.
It is another object of the invention to provide a circuit and technique for electrically detecting signal conditions which would cause transient or temporary thermal imbalances in an integrated circuit without relying on system timing or control signals.
It is another object of the invention to provide a circuit and technique for reducing or preventing transient or temporary thermal imbalances in an integrated circuit amplifier which would cause transient inaccuracies in an output signal produced by the amplifier and which is easily extendable to multiple signal processing stages of the amplifier.
Briefly described, and in accordance with one embodiment, the present invention provides an amplifier including a differential amplifier ( 10 ) having an input stage ( 20 ) for amplifying a differential input signal (Vin), and an output stage ( 6 ) coupled to the input stage ( 20 ) for producing an output signal (Vout). The input stage ( 20 ) includes main input circuitry ( 20 A) for amlifying small-signal values of the input signal (Vin) and alternative input circuitry ( 20 B) for amplifying the input signal (Vin) during conditions which cause thermal imbalance in the main input circuitry ( 20 A). The input stage ( 20 ) includes switching circuitry ( 22 ) for coupling the input signal (Vin) to the main input circuitry ( 20 A) during normal small-signal operating conditions and to the alternative input circuitry ( 20 B) during conditions which cause thermal imbalance in the main input circuitry ( 20 A).
In a described embodiment, the input stage ( 20 ) includes main input circuitry ( 20 A) including a first portion (e.g., Q 1 , 2 , 11 , 12 or Q 5 , 6 , 15 , 16 ) of the first stage ( 200 A) for amplifying the relatively small-value signals in the signal path of the differential input signal (Vin), and also includes alternative input circuitry ( 20 B) including a second portion (e.g., Q 3 , 4 , 13 , 14 or Q 7 , 8 , 15 , 16 ) of the first stage ( 200 A) for amplifying the relatively large-value signals in the signal path of the differential input signal (Vin) which if amplified by the main input circuitry ( 20 A) would cause thermal imbalance in the main input circuitry ( 20 A). The input stage ( 20 ) also includes switching circuitry ( 12 ) for selectively coupling signals in the signal path of the differential input signal (Vin) to the first portion (Q 1 , 2 , 11 , 12 ) of the first stage ( 200 A) or the second portion (Q 3 , 4 , 13 , 14 ) of the first stage ( 200 A), and also includes detection circuitry ( 60 ) coupled to receive signals in the signal path of the differential input signal (Vin). The detection circuitry ( 60 ) is coupled to the first portion (Q 1 , 2 , 11 , 12 ) of the first stage ( 200 A) to cause the first portion (Q 1 , 2 , 11 , 12 ) of the first stage ( 200 A) to amplify signals in the signal path of the differential input signal (Vin) during small-signal operating conditions, and also is coupled to the second portion (Q 3 , 4 , 13 , 14 ) of the first stage ( 200 A) to cause the second portion (Q 3 , 4 , 13 , 14 ) of the first stage ( 200 A) to amplify signals in the signal path of the differential input signal (Vin) during large-signal operating conditions to reduce thermal imbalance in the main input circuitry ( 20 A). The input stage ( 20 ) also can include a second stage ( 200 B) coupled in the path of the differential input signal (Vin), wherein the main circuitry ( 20 A) includes a first portion (e.g., Q 5 , 6 , 15 , 16 ) of the second stage ( 200 B) for amplifying relatively small-value signals in the signal path of the differential input signal (Vin), wherein the alternative circuitry ( 20 B) includes a second portion (e.g., Q 7 , 8 , 15 , 16 ) of the second stage ( 200 B) for amplifying relatively large-value signals in the signal path of the differential input signal (Vin). The detection circuitry ( 60 ) is coupled to the first portion (e.g., Q 5 , 6 , 15 , 16 ) of the second stage ( 200 B) to cause the first portion (e.g., Q 5 , 6 , 15 , 16 ) of the second stage ( 200 B) to amplify signals in the signal path of the differential input signal (Vin) during small-signal operating conditions, and also is coupled to the second portion (e.g., Q 7 , 8 , 15 , 16 ) of the second stage ( 200 B) to cause the second portion (e.g., Q 7 , 8 , 15 , 16 ) of the second stage ( 200 B) to amplify signals in the signal path of the differential input signal (Vin) during large-signal operating conditions to further reduce thermal imbalance in the main input circuitry ( 20 A). In the described embodiment, the first stage ( 200 A) includes a differential cascode stage coupled to receive signals in the signal path of the differential input signal (Vin), and the second stage ( 200 B) includes a differential cascode stage coupled to receive signals in the signal path of the differential input signal (Vin). The differential input signal (Vin) can be equal to the difference between first (Vin+) and second (Vin−) time-varying signals, or can be equal to the difference between a first time-varying signal (e.g., Vin+) and a fixed reference signal (e.g., ground).
›SUMMARY OF THE INVENTION · 2 of 3
In the described embodiment, the detection circuitry ( 60 ) is operative to produce a first control signal (VBmain) indicative of when the differential input signal (Vin) is a relatively small-value signal for controlling the first portion (Q 1 , 2 , 11 , 12 ) of the first stage ( 200 A) and a second control signal (VBalt) indicative of when the differential input signal (Vin) is a relatively large-value signal for controlling the second portion (Q 3 , 4 , 13 , 14 ) of the first stage ( 200 A). The switching circuitry ( 12 ) also decouples the input signal (Vin) from a first one of the main input circuitry ( 20 A) and the alternative input circuitry ( 20 B) while coupling the input signal (Vin) to the other of the main input circuitry ( 20 A) and the alternative input circuitry ( 20 B).
In the described embodiment, the input stage ( 20 ) includes a switched differential amplifier section including first (Q 1 ), second (Q 2 ), third (Q 3 ) and fourth (Q 4 ) input transistors, and first (Q 11 ), second (Q 12 ), third (Q 13 ) and fourth (Q 14 ) switching transistors. The collectors of the first (Q 1 ) and third (Q 3 ) input transistors are coupled by a first conductor ( 32 ) to a first terminal of a first load device (R 5 ), collectors of the second (Q 2 ) and fourth (Q 4 ) are coupled by a second conductor ( 33 ) to a first terminal of a second load device (R 4 ), bases of the first (Q 1 ) and third (Q 3 ) input transistors are coupled to a first input signal (Vin−), bases of the second (Q 2 ) and fourth (Q 4 ) input transistors are coupled to a second input signal (Vin+). An emitter of the first input transistor (Q 1 ) are coupled by a first diode (D 1 ) to a collector of the first switching transistor (Q 11 ), an emitter of the second input transistor (Q 2 ) are coupled by a second diode (D 2 ) to a collector of the second switching transistor (Q 12 ), an emitter of the third input transistor (Q 3 ) are coupled by a third diode (D 3 ) to a collector of the third switching transistor (Q 13 ), an emitter of the fourth input transistor (Q 4 ) are coupled by a fourth diode (D 4 ) to a collector of the fourth switching transistor (Q 14 ), emitters of the first (Q 11 ) and third (Q 13 ) switching transistors are coupled to a first terminal of a first current source (R 2 ), and emitters of the second (Q 12 ) and fourth (Q 14 ) switching transistors are coupled to a first terminal of a second current source (R 3 ). A first emitter degeneration resistor (R 1 ) are coupled between the emitters of the first (Q 1 ) and second (Q 2 ) input transistors, a second emitter degeneration resistor (R 6 ) are coupled between the emitters of the third (Q 3 ) and fourth (Q 4 ) input transistors. Bases of the first (Q 11 ), second (Q 12 ), third (Q 13 ) and fourth (Q 14 ) switching transistors are coupled to the switching circuitry ( 12 ). The first emitter degeneration resistor (R 1 ) is coupled between cathodes of the first (D 1 ) and second (D 2 ) diodes and between collectors of the first (Q 11 ) and second (Q 12 ) switching transistors, and the second emitter degeneration resistor (R 6 ) is coupled between cathodes of the third (D 3 ) and fourth (D 4 ) diodes and between the collectors of the third (Q 13 ) and fourth Q 14 ) switching transistors. A first resistor (R 10 ) is coupled between an anode of the first diode (D 1 ) and the cathode of the third diode (D 3 ). A second resistor (R 11 ) is coupled between an anode of the second diode (D 2 ) and the cathode of the fourth diode (D 4 ). The bases of the first, second, third, and fourth switching transistors are coupled to the switching circuitry ( 12 ) to turn the first (Q 11 ) and second (Q 12 ) switching transistors on during the normal small-signal operating conditions and to turn the third (Q 13 ) and fourth (Q 14 ) switching transistors on during the condition which causes the thermal imbalance. The detection circuitry ( 60 ) is operative to produce a first control signal (VBmain) indicative of when the differential input signal (Vin) is a relatively small-value signal for controlling the first portion (Q 1 , 2 , 11 , 12 ) of the first stage ( 200 A) and a second control signal (VBalt) indicative of when the differential input signal (Vin) is a relatively large-value signal for controlling the second portion (Q 3 , 4 , 13 , 14 ) of the first stage ( 200 A), the first control signal (VBmain) being coupled to the bases of the first (Q 11 ) and second (Q 12 ) switching transistors, the second control signal (VBalt) being coupled to the bases of the third (Q 13 ) and fourth (Q 14 ) switching transistors.
In the described embodiment, the input stage ( 20 ) includes a switched folded cascode section including a first main cascode transistor (Q 5 ) having a collector coupled to an output of a current mirror ( 30 ) and a base coupled to the switching circuitry ( 12 ), a second main cascode transistor (Q 6 ) having a collector coupled to an input of the current mirror ( 30 ) and a base coupled to the switching circuitry ( 12 ), a first alternate cascode transistor (Q 7 ) having a collector coupled to the collector of the first main cascode transistor (Q 5 ) and a base coupled to the switching circuitry ( 12 ), and a second alternate cascode transistor (Q 8 ) having a collector coupled to the collector of the second main cascode transistor Q 6 ) and a base coupled to the switching circuitry ( 12 ). The collector of the first main cascode transistor (Q 5 ) is coupled to the output of the current mirror ( 30 ) by means of a first series cascode transistor (Q 9 ) and the collector of the second main cascode transistor Q 6 ) is coupled to the input of the current mirror ( 30 ) by means of a second series cascode transistor (Q 10 ). The bases of the first (Q 5 ) and second (Q 6 ) main cascode transistors are coupled to the switching circuitry ( 12 ) to turn them on during the small-signal operating conditions and wherein bases of the first (Q 7 ) and second (Q 8 ) alternative cascode transistors are coupled to the switching circuitry ( 12 ) to turn them on during the large-signal operating conditions.
›SUMMARY OF THE INVENTION · 3 of 3
In the described embodiment, the detection circuitry ( 60 ) includes a first detector input stage including a first detector input transistor (Q 30 ) having a first terminal coupled to a first current source (I 1 ), a control terminal coupled to a first input conductor ( 4 ), and a second terminal coupled to a first conductor ( 47 ), a second detector input transistor (Q 17 ) having a first terminal coupled to a first terminal of a first detector diode (D 6 ) having a second terminal coupled to the first current source (I 1 ), a control terminal coupled to a second input conductor ( 3 ), and a second terminal coupled to a second conductor ( 48 ). A second detector input stage includes a third detector input transistor (Q 31 ) having a first terminal coupled to a second current source (I 2 ), a control terminal coupled to the second input conductor ( 3 ), and a second terminal coupled to the first conductor ( 47 ), a fourth detector input transistor (Q 18 ) having a first terminal coupled to a first terminal of a second detector diode (D 7 ) having a second terminal coupled to the second current source (I 2 ), a control terminal coupled to the first input conductor ( 4 ), and a second terminal coupled to the second conductor ( 48 ). A detector output stage includes a third current source (I 3 ) coupled to the first conductor ( 47 ), a first detector resistor (R 15 ) having a first terminal coupled to the second conductor ( 48 ) and a second terminal coupled to a reference voltage source (VB 1 ), and a second detector resistor (R 15 ) having a first terminal coupled to the first conductor ( 47 ) and a second terminal coupled to the reference voltage source (VB 1 ), the first conductor ( 47 ) being coupled to the first portion (Q 1 , 2 , 11 , 12 ) of the first stage ( 200 A) and conducting a signal (VBmain) for indicating that the differential input signal (Vin) has a small-signal value, the second conductor ( 48 ) being coupled to the second portion of the first stage ( 200 A and conducting a signal (VBalt) for indicating that the differential input signal (Vin) has a large-signal value. The input stage ( 20 ) also includes a switched folded cascode section including a first main cascode transistor (Q 5 ) having a collector coupled to an output of a current mirror ( 30 ) and a base coupled to the switching circuitry ( 12 ), a second main cascode transistor (Q 6 ) having a collector coupled to an input of the current mirror ( 30 ) and a base coupled to the switching circuitry ( 12 ), a first alternate cascode transistor (Q 7 ) having a collector coupled to the collector of the first main cascode transistor (Q 5 ) and a base coupled to the switching circuitry ( 12 ), and a second alternate cascode transistor (Q 8 ) having a collector coupled to the collector of the second main cascode transistor (Q 6 ) and a base coupled to the switching circuitry ( 12 ). The collector of the first main cascode transistor (Q 5 ) is coupled to the output of the current mirror ( 30 ) by means of a first series cascode transistor (Q 9 ) and the collector of the second main cascode transistor (Q 6 ) is coupled to the input of the current mirror ( 30 ) by means of a second series cascode transistor (Q 10 ).
›BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a block diagram of a conventional feedback amplifier.
FIG. 2 is a schematic diagram of the folded cascode input stage of the feedback amplifier of FIG. 1 .
FIG. 3 is a block diagram of a preferred embodiment of the present invention.
FIG. 4 is a basic schematic diagram of the folded cascode input stage 20 of FIG. 3 including separate selectable stages in the input signal path for separately handling small-value and large-value signals in the input signal path.
FIG. 5 is a schematic diagram illustrating a circuit for generating the switching control signals VBmain and VBalt in FIG. 4 .
FIG. 6 is a diagram illustrating waveforms showing recovery of Vout for the prior art circuit of FIG. 2 and the circuit of the present invention as shown in FIG. 4 .
FIG. 7 is a diagram showing waveforms of Vin and Vout for the circuit of FIG. 4 under small-signal conditions which do not cause switching of the folded cascode input stage.
FIG. 8 is a diagram showing waveforms of Vin and Vout for the circuit of FIG. 4 under large-signal conditions which cause switching of the folded cascode input stage.
FIGS. 9A and 9B constitute a detailed schematic diagram illustrating a preferred implementation of the circuit of FIG. 4 and FIG. 5 .
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 1 of 5
The present invention provides a circuit and technique which can mitigate or nearly eliminate the above-mentioned output signal recovery tails that result from thermal imbalances in an integrated circuit amplifier caused by large-signal inputs, large-signal internal operating conditions and/or interruptions of a feedback loop.
FIG. 3 shows a block diagram of a feedback amplifier including an operational amplifier 10 which includes a switched input stage 20 according to the present invention, and also includes a conventional output stage 6 . The input signal Vin=Vin+−Vin− is applied between input conductors 3 and 4 of switching circuitry that is “conceptually” illustrated in block 12 . Switching circuitry 12 , in effect, applies Vin either via a signal path 14 to the input of main input circuitry 20 A or via a signal path 15 to the input of alternative input circuitry 20 B. Switching circuitry 12 also can be coupled to main input circuitry and alternative input circuitry in various other parts of operational amplifier 10 , for example, in PNP cascode transistors Q 5 and Q 6 of input stage 20 in section 200 B of subsequently described FIG. 4 , output circuitry 6 A, and/or any other circuitry in which thermal imbalance occurs due to variable signal conditions or other variable conditions and causes troublesome accuracy problems.
Conceptually, a switching circuit or element 12 A in block 12 illustrates the switching of Vin through one or the other of main input circuitry 20 A or alternative input circuitry 20 B. The outputs of main input circuitry 20 A and alternative input circuitry 20 B both are connected to comp node conductor 5 , which is connected to the input of an output amplifier or buffer circuit 6 A of output stage 6 . Switching circuit/element 12 A is controlled by a detector circuit 60 , the inputs of which are connected to Vin. Detector circuit 60 detects whether Vin presently is at a normal or low-level signal value or is at an excessively high-level signal value which may cause troublesome thermal imbalances of the kind mentioned above. Output circuit 6 A produces Vout on conductor 7 , which is applied to an input of block 16 . It should be appreciated that some or all of the switching circuitry conceptually indicated as being in block 12 of FIG. 3 could be included in either or both of main input circuitry 20 A and alternative input circuitry 20 B.
Note that the total amount of power dissipation in input stage 20 is not necessarily changed when Vin is switched from main input circuitry 20 A to alternative input circuitry 20 B during large-signal operating conditions. Instead, the high amount of power dissipation and associated power imbalance caused by a large-signal value of Vin is shifted from main input circuitry 20 A to alternative input circuitry 20 B. Therefore, the main signal path of Vin through main input circuitry 20 A for small-signal operation is unaffected by the thermal imbalances caused by large-signal values of Vin.
Block 16 in FIG. 3 conceptually represents a possible interruption in the feedback loop including feedback network 8 . An example of such an interruption is disclosed in commonly assigned patent application Ser. No. 10/609,209 entitled “Output Stage, Amplifier and Associated Method for Limiting and Amplifier Output”, filed Jun. 27, 2003, and incorporated herein by reference. The above-mentioned patent application describes the kind of interruption represented by block 16 in the feedback loop of FIG. 3 , which occurs as a result of switching between alternative output stages to suitably limit the range of the output signal. While the feedback loop is interrupted the feedback to inverting input conductor 3 is meaningless. Although the circuitry described in the foregoing patent application has the thermal tail recovery problem previously described herein, it does not suggest any solution to that problem.
The output of block 16 is coupled by conductor 17 to the input of feedback network 8 (which often is simply a feedback resistor). The output of feedback network 8 is connected to the inverting input 3 of amplifier 10 . (Note that block 16 in FIG. 3 does not actually represent a physical switch circuit, and instead represents the existence of an interruption or discontinuity of the feedback loop through operational amplifier 10 and feedback network 8 .) When the feedback loop is closed, amplifier 10 has very high gain and therefore tries to force Vin to zero. But if the feedback loop is interrupted, then even a very minute value of Vin causes Vout to swing to either a maximum or minimum rail voltage, which ordinarily would cause a thermal imbalance leading to a thermal recovery tail as shown by waveform “A” in FIG. 6 (without the benefit of alternative input circuitry 20 B and associated switching circuitry of the present invention).
Computer simulations have shown that the main contributors to thermal imbalance that causes a long thermal recovery due to thermally induced input offset voltages are associated with input transistors Q 1 and Q 2 and cascode transistors Q 5 and Q 6 . (The computer simulations also indicate, but to a much lesser extent, that there also may be thermally induced offset voltages associated with the current mirror 30 of subsequently described FIG. 4 .) Specifically, the simulations showed that the thermal imbalance effects on the operational amplifier 10 were approximately 30 percent for the differential input stage, approximately 65 percent for the cascode transistors, and approximately 5 percent for the rest of operational amplifier 10 .
FIG. 4 is a basic schematic diagram of the folded cascode input stage 20 of FIG. 3 , including the separate small-signal-handling main input circuitry 20 A and large-signal-handling alternative input circuitry 20 B. Referring to FIG. 4 , folded cascode input stage 20 includes switched differential input circuitry 200 A and switched folded cascode circuitry 200 B. Switched differential input circuitry 200 A includes NPN input transistors Q 1 , Q 2 , Q 3 and Q 4 , diodes D 1 , D 2 , D 3 and D 4 , and NPN switched current source transistors Q 11 , Q 12 , Q 13 , and Q 14 . Vin+ is connected to the bases of input transistors Q 2 and Q 4 , and Vin− is connected to the bases of input transistors Q 1 and Q 3 , Vin being equal to Vin+ minus Vin−. The collectors of input transistors Q 1 and Q 3 are connected by conductor 32 to one input of switched folded cascode circuitry 200 B, and the collectors of input transistors Q 2 and Q 4 are connected by conductor 33 to another input of switched folded cascode circuit 200 B.
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 2 of 5
The emitter of input transistor Q 1 is connected by conductor 34 to the anode of a diode D 1 and to one terminal of a resistor R 10 , the other terminal of which is connected to a conductor 35 . The cathode of diode D 1 is connected by a conductor 38 to the collector of NPN switched current source transistor Q 11 , the emitter of which is connected to one terminal of a current source or resistor R 2 . The other terminal of resistor R 2 is connected to VEE. Conductor 38 also is connected to one terminal of a resistor R 1 , the other terminal of which is connected to a conductor 39 . Similarly, the emitter of transistor Q 3 is connected to the anode of diode D 3 , the cathode of which is connected by conductor 35 to one terminal of a resistor R 6 , the other terminal of which is connected to a conductor 36 . Conductor 35 is also connected to the collector of NPN switched current source transistor Q 13 , the emitter of which is connected to the emitter of switched current source transistor Q 11 .
The base of switched current source transistor Q 11 is connected by conductor 54 to a control signal VBmain, and the base of switched current source transistor Q 13 is connected by conductor 55 to a control signal VBalt. The emitter of input transistor Q 2 is connected by a conductor 37 to one terminal of a resistor R 11 , the other terminal of which is connected to conductor 36 . Conductor 37 also is connected to the anode of diode D 2 , the cathode of which is connected to conductor 39 . Conductor 39 is connected to the collector of NPN switched current source transistor Q 12 , which has its base connected by conductor 54 to VBmain. The emitter of input transistor Q 4 is connected to the anode of diode D 4 which has its cathode connected by conductor 36 to the collector of NPN switched current source transistor Q 14 , which has its emitter connected to the emitter of switched current source transistor Q 12 and to one terminal of a current source or resistor R 3 having its other terminal connected to VEE.
Thus, section 200 A of input stage 20 amplifies differential input signal Vin by means of input transistors Q 1 and Q 2 of main input circuitry 20 A in response to VBmain during small-signal operating conditions, and amplifies differential input signal Vin by means of input transistors Q 3 and Q 4 of alternative input circuitry 20 B in response to VBalt during large-signal operating conditions. The large amount of power dissipated during large-signal operating conditions is thereby shifted from input transistor Q 1 or Q 2 of main input circuitry 20 A to either alternative input transistor Q 3 or Q 4 of alternative input circuitry 20 B during large-signal operating conditions, and therefore does not cause a thermal imbalance between main input transistors Q 1 and Q 2 , and therefore does not generate a thermally induced offset between them.
Switched folded cascode circuitry 200 B includes PNP switched folded cascode transistors Q 5 , Q 6 , Q 7 , and Q 8 , differentially coupled NPN switching transistors Q 15 and Q 16 , and PNP cascode transistors Q 9 and Q 10 . The base of switching transistor Q 15 is connected to VBmain, and its emitter is connected to the emitter of switching transistor Q 16 and to one terminal of a current source or resistor R 7 having its other terminal connected to VEE. The base of switching transistor Q 16 is connected to Vbalt. The collector of switching transistor Q 15 is connected by a conductor 40 to one terminal of a load resistor R 8 having its other terminal connected by conductor 45 to the (−) terminal of a voltage level shift circuit VB 2 , the (+) terminal of which is connected to VCC. Similarly, the collector of switching transistor Q 16 is connected by a conductor 41 to one terminal of a load resistor R 9 , the other terminal of which is connected to conductor 45 .
Conductor 40 also is connected to the bases of switched cascode transistors Q 5 and Q 6 . Conductor 41 is connected to the bases of switched cascode transistors Q 7 and Q 8 . The emitters of switched cascode transistors Q 5 and Q 7 are connected to conductor 33 , which is connected to to one terminal of a load resistor R 4 , the other terminal of which is connected to VCC. Similarly, the emitters of switched cascode transistors Q 8 and Q 6 are connected by conductor 32 to one terminal of a load resistor R 5 , the other terminal of which is connected to VCC. The collectors of switched cascode transistors Q 5 and Q 7 are connected by conductor 42 to the emitter of cascode transistor Q 9 , the collector of which is connected by conductor 44 to an output of a current mirror circuit 30 . Similarly, the collectors of switched cascode transistors Q 8 and Q 6 are connected by conductor 43 to the emitter of cascode transistor Q 10 , the collector of which is connected by conductor 5 to Vcomp and to an input of current mirror circuit 30 . The bases of cascode transistors Q 9 and Q 10 are connected to a bias voltage VB 1 .
Switched cascode transistors Q 5 and Q 6 are included in main input circuitry 20 A ( FIG. 3 ), and are turned on in response to VBmain during small-signal operating conditions. Switched cascode transistors Q 7 and Q 8 are included in alternative input circuitry 20 B ( FIG. 3 ), and are turned on in response to VBalt during large-signal operating conditions. Additional series cascode transistors Q 9 and Q 10 function to reduce additional offset that would be caused if the collector-emitter voltages of transistors Q 5 and Q 6 are not equal, which is what would occur during circuit operation if series cascode transistors Q 9 and Q 10 were to be omitted and instead conductors 42 and 43 were to be connected to conductors 44 and 5 , respectively. This would occur irrespective of the switching of power from main input transistors Q 5 and Q 6 to alternative input transistors Q 7 and Q 8 , because during circuit operation the voltage of conductor 44 is essentially constant (at the current mirror input voltage) while Vcomp on conductor 5 may have a wide range of values. Large values of Vcomp would cause a significant offset between main input transistors Q 5 and Q 6 even if the Vin signal path has been switched to alternative input transistors Q 7 and Q 8 during large-signal operating conditions, unless series cascode transistors Q 9 and Q 10 are provided as shown.
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 3 of 5
Thus, section 200 B of input stage 20 further amplifies differential input signal Vin by means of cascode transistors Q 5 and Q 6 of main input circuitry 20 A in response to VBmain during small-signal operating conditions, and further amplifies differential input signal Vin by means of cascode transistors Q 7 and Q 8 of alternative input circuitry 20 B in response to VBalt during large-signal operating conditions. The large amount of power dissipated during large-signal operating conditions is thereby shifted from cascode transistor Q 5 or Q 6 of main input circuitry 20 A to either alternative cascode transistor Q 7 or Q 8 of alternative input circuitry 20 B during large-signal operating conditions, and therefore does not cause a thermal imbalance between main cascode transistors Q 5 and Q 6 , and therefore does not generate a thermally induced offset between them.
Note that transistors Q 1 , Q 2 , Q 11 , Q 12 , Q 5 , and Q 6 in FIG. 4 are the same as in the conventional folded cascode circuit shown in FIG. 2 , and are included in main input circuitry 20 A in FIG. 3 . During normal or small-signal mode of operation, the foregoing transistors perform the signal “differencing” and the “gain” functions of input stage 20 . Transistors Q 3 , Q 4 , Q 13 , Q 14 , Q 7 , and Q 8 are included in alternative input circuitry 20 B of input stage 20 of FIG. 3 .
It should be appreciated that the circuitry in FIG. 4 can be implemented without diodes D 1 – 4 . Resistors R 1 and R 6 are emitter degeneration resistors for differential transistor pairs Q 1 , 2 and Q 3 , 4 , respectively, and typically have a resistance of approximately 300 ohms, so as to degenerate and linearize the amplification. Resistors R 10 and R 11 are very large-value resistors, typically 50 to 100 kilohms, and may be omitted because they merely function to prevent conductors 34 , 35 , 36 and 37 from floating to indeterminant voltage levels and thereby result in smoother transitions when the signal path of Vin is switched between main input circuitry 20 A and alternative input circuitry 20 B.
This is significant because the transitions wherein the signal path of Vin is switched between main input circuitry 20 A and alternative input circuitry 20 B should be smooth to provide low amplifier signal distortion. The switching waveforms in FIG. 8 are for the case wherein the values of Vin exceed the large-signal threshold. If the horizontal scale in FIG. 8 is amplified, relatively linear portions that represent a fairly smooth transition between main input circuitry 20 A and alternative input circuitry 20 B can be easily recognized. For example, if the differential input signal Vin is incremented in small steps, a point can be found at which main input circuitry 20 A and alternative input circuitry 20 B are equally on and contribute equally to Vout. That is, the switching circuitry 12 can be designed to have a suitable amount of gain in order to provide the needed level of smoothness in the transition in which the signal path of Vin is switched between main input circuitry 20 A and alternative input circuitry 20 B.
The purpose of diodes D 1 – 4 in FIG. 4 is to protect transistors Q 1 – 4 if they are turned off when there large voltages across them, so as to, in effect, increase their breakdown voltages and at the same time add to the emitter degeneration resistances for transistors Q 1 – 4 . The resistances of resistors R 10 and R 11 are so large that they conduct practically no current but nevertheless prevent conductors 34 , 35 , 36 and 37 from electrically floating when transistors Q 1 – 4 are off. This results in smoother switching between main circuitry 20 A and alternative input circuitry 20 B. Although a preferred embodiment of the invention is shown in FIG. 4 , it should be appreciated that differential input stage 200 A can be simplified by omitting diodes D 1 – 4 and resistors R 10 and R 11 , so resistor R 6 is the degeneration resistor associated with transistors Q 3 and Q 4 , and resistor R 1 is the degeneration resistor associated with transistors Q 1 and Q 2 .
There may be various practical methods for detecting the presence or absence of large-signal conditions in the circuit of FIG. 4 and accordingly switching the amplifier signal path of Vin to one or the other of main input circuitry 20 A and alternative input circuitry 20 B. The switching is controlled by means of the two control signals VBmain and VBalt. During small-signal operation, VBmain is at a higher voltage, causing Vin to be amplified by main input circuitry 20 A. However, during large-signal operation, VBalt is at a higher voltage than VBmain, which causes alternative input circuitry 20 B to “take over” the amplification of Vin and causes main input stage 20 A to shut down and therefore remain thermally balanced. Consequently, a much shorter thermal tail recovery time is required when Vin is switched back to the input of main input circuitry 20 A.
FIG. 5 shows a circuit that is used to generate the above-mentioned control signals VBmain and VBalt directly from the differential input signal Vin. Referring to FIG. 5 , detector circuit 60 includes PNP input transistors Q 30 , Q 31 , Q 17 , and Q 18 and diodes D 6 and D 7 . Vin+ is connected by conductor 4 to the bases of transistors Q 30 and Q 18 . Similarly, Vin− is connected by conductor 3 to the bases of transistors Q 31 and Q 17 . The emitter of transistor Q 30 is connected to a tail current source I 1 , which is also coupled to the anode of diode D 6 , the cathode of which is connected to the emitter of transistor Q 17 . The emitter of transistor Q 31 is connected to another tail current source I 2 , which is also connected to the anode of diode D 7 , the cathode of which is connected to the emitter of transistor Q 18 . (Diodes D 6 and D 7 may be low-voltage Schottky diodes.) The collectors of transistors Q 17 and Q 18 are connected by conductor 48 to the input of a unity gain buffer 50 and to one terminal of a load resistor R 15 , the other terminal of which is connected to conductor 51 . Similarly, the collectors of transistors Q 30 and Q 31 are connected by conductor 47 to the input of a unity gain buffer 49 and to one terminal of a resistor R 16 having its other terminal connected to conductor 51 . Conductor 51 is coupled to the (+) terminal of a level shift circuit VB 1 having its (−) terminal connected to VEE. Conductor 47 also is connected to a bias current source I 3 .
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 4 of 5
Thus, the same input signal Vin which appears at the differential inputs of operational amplifier input stage 20 is also applied to the bases of transistors Q 30 , Q 17 , Q 18 , and Q 31 in detector circuit 60 of FIG. 5 , so that transistors Q 30 and Q 31 both are on during small-signal operation and therefore conduct tail currents I 1 and I 2 , respectively. Preferably, tail currents I 1 and I 2 and a bias current I 3 each have a value Iswitch. Then, for small-signal operation, a current equal to 2*Iswitch from tail current sources I 1 and I 2 is sourced into resistor R 16 , and a value Iswitch from bias current source I 3 is subtracted from 2*Iswitch. The result is that resistor R 16 has a net current equal to Iswitch and the current in resistor R 15 is zero. This causes VBmain to be at a higher level than VBalt because no current flows through resistor R 15 and consequently no voltage is developed across it.
Either transistor Q 17 or transistor Q 18 will also start conducting current when the value of the voltage Vin=Vin+−Vin− approaches the value of the turn-on voltage of diodes D 6 and D 7 . This input voltage difference for switching threshold voltage, which roughly determines the onset of “large-signal” conditions, is somewhat arbitrary and could be set to various different values by minor circuit design modifications, as subsequently explained.
Under large-signal conditions, transistors Q 17 , Q 18 , Q 30 and Q 31 all are on if either Vin+>>Vin− or if Vin+<<Vin−. That is, if the magnitude of Vin=(Vin− minus Vin+) exceeds a particular threshold voltage, the value of tail current source I 1 or I 2 is sourced and the value of bias current source I 3 is subtracted from it, and resistor R 15 receives a current of value Iswitch (from either tail current source I 1 or I 2 ) while resistor R 16 receives a net current of 0. Therefore, during large-signal conditions VBalt is at a higher value than VBmain, so alternative input circuitry 20 B “takes over” the amplification of Vin from main input circuitry 20 A, and main input circuitry 20 A is shut down and therefore remains in a thermally balanced condition, and the thermal recovery tail will be short.
The “on” voltage of diodes D 6 and D 7 is approximately 0.4 volts for a typical semiconductor manufacturing process, and that “on” voltage establishes the threshold for determining whether the differential input voltage Vin is a “high-level” signal. By “stacking” one or more additional diodes (not shown), in series with each of diodes D 6 and D 7 , the threshold beyond which Vin is considered to be a “high-level” signal can be proportionately increased. For smoother switching between main input circuitry 20 A and alternative input circuitry 20 B, diodes D 6 and D 7 can be replaced by optional resistors as shown by the dashed lines in FIG. 5 , and the current through the optional resistors, multiplied by their respective resistances, establishes the threshold for the switching from main input circuitry 20 A to alternative input circuitry 20 B.
The above described embodiment of the invention avoids the previously described thermal imbalance effects that otherwise would occur during low-level Vin conditions in main input circuitry 20 A by switching the Vin signal path through alternative input stage 20 B any time operating conditions would cause thermal imbalance in the main input circuitry 20 A. For example, simulated waveform “B” in FIG. 6 shows substantially reduced improved time for thermal recovery of the disturbance of Vout of the circuit of FIG. 4 caused by a particular simulated large thermal imbalance, compared to the much longer corresponding thermal recovery time and much larger magnitude of disturbance for the prior art circuit of FIG. 2 . Also, the magnitude of the disturbance of Vout caused by the large thermal imbalance is much lower than that for the prior art circuit of FIG. 2 . FIG. 7 shows simulated waveforms of VBmain and VBalt for normal small-signal operation wherein no input stage switching occurs. FIG. 8 shows simulated waveforms for large-signal operation wherein input stage switching does occur.
An analysis has been performed to compare the harmonic distortion of the circuit of FIG. 4 associated with the circuit of prior art FIG. 1 , 2 with the harmonic distortion of switched differential input circuit of FIG. 4 including the switched folded cascode circuit 200 B. The results of that analysis indicate that the difference in harmonic distortion between the prior art circuit of FIGS. 1 , 2 and the circuit of FIGS. 3 , 4 is insignificant over the range of frequencies of interest. Specifically, in each case the harmonic distortion is below −65 dB in the range between 1 MHz and 7 MHz.
FIGS. 9A and 9B include a somewhat more detailed implementation of the above described circuitry of FIGS. 4 and 5 , with corresponding reference characters, wherein specific implementations of voltage sources VB 1 , VB 2 , buffers 49 and 50 , and various current sources and current mirror circuits are shown.
It should be appreciated that the input stage of above described operational amplifier 10 can be different Vin the one illustrated in FIG. 4 . For example, rather than using cascode stage 200 B as shown in FIG. 4 , another differential stage could be used having its inputs connected to the outputs of the differential stage 200 A.
It should also be appreciated that there would be an advantage to using the switching technique between main and alternative signal path stages in either the differential input stage 200 A alone or cascode stage 200 B alone, although the advantage would be less than using the above described Vin signal path switching technique in both. Also, those skilled in the art will recognize that the more gain there is in the signal path ahead of a point at which the technique of switching the signal path between a main circuit is utilized during small-signal conditions and another high-power path is utilized during large-signal conditions, the less advantage will be achieved from the switching; this is because the gain is “referred back” to the input of the operational amplifier. Consequently, it is usually more advantageous to use the technique of the present invention closer to the amplifier input than to the amplifier output. Also, it should be noted that the thermal imbalance anywhere in the signal path of Vin can be reduced by reducing the collector-emitter voltages of transistors in that signal path.
›DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS · 5 of 5
By way of definition, the term “differential” as used herein to describe, for example, a differential input stage or a differential signal, is not intended to be limited to the generally “symmetrical” circuit configurations illustrated herein. It is intended that the term “differential signal” encompass any signal that is referenced to another time-variable signal or to a fixed referenced signal such as ground (as indicated by the dashed line connected to Vin− shown in FIG. 3 ), and that the term “differential” can be used to refer to any circuit providing a signal path for such a differential signal.
While the invention has been described with reference to several particular embodiments thereof, those skilled in the art will be able to make various modifications to the described embodiments of the invention without departing from its true spirit and scope. It is intended that all elements or steps which are insubstantially different from those recited in the claims but perform substantially the same functions, respectively, in substantially the same way to achieve the same result as what is claimed are within the scope of the invention.
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