Inventor
Yat Kit Tsui
Inventor
Hong Kong, CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices25%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%
H05KPrinted circuits8%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
9,713,284'Locally enhanced direct liquid cooling system for high power applications'20179,117,715'Wafer-level device packaging'20158,823,126'Low cost backside illuminated CMOS image sensor package with high integration'20148,754,507'Forming through-silicon-vias for multi-wafer integrated circuits'20148,232,626'Via and method of via forming and method of via filling'2012Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2012–2015Patents assigned to HK APPLIED SCIENCE & TECH RES (4)· patent assignee history
2012–2015Patents assigned to TSUI YAT KIT (4)· patent assignee history
2012–2015Patents assigned to YANG DAN (3)· patent assignee history
2012Based in Tuen Mun, HK· patent location history
2014–2015Patents assigned to LAW PUI CHUNG (2)· patent assignee history
2014–2017Based in Hong Kong, CN· patent location history
2017Patents assigned to HONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HK APPLIED SCIENCE & TECH RES | 4 | 2012–2015 |
| TSUI YAT KITself | 4 | 2012–2015 |
| YANG DAN | 3 | 2012–2015 |
| LAW PUI CHUNG | 2 | 2014–2015 |
| HONG KONG APPLIED SCIENCE AND TECH RES INST CO LTD | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hong Kong, CN | 4 | 2014–2017 |
| Tuen Mun, HK | 1 | 2012 |