Inventor

Wei-Ming Chen

Inventor

Hsinchu, TW

Overview

1995–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 72 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%

H01LSemiconductor devices9%

H10DInorganic electric semiconductor devices4%

G02BOptical elements, systems or apparatus3%

G06FElectric digital data processing3%

C08JWorking-up3%

C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms3%

H10BElectronic memory devices3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%

PatentTitleYear

10,755,630Mobile terminal2020 D0878809Air cushion2020 10,590,478Nucleotide sequence, universal reverse primer, and universal RT primer2020 10,561,392Optical interferometric scanning detector for cardiovascular function monitoring2020 10,415,085Nucleotide sequence, universal reverse primer, universal RT primer, method for designing primer and miRNA detection method2019 10,276,532Three-dimensional chip stack and method of forming the same2019 10,170,457COWOS structures and method of forming the same2019 10,163,856Stacked integrated circuit structure and method of forming2018 10,163,853Formation method of chip package2018 10,073,205Optical module of vehicle light and light guide2018 10,039,824Traditional chinese medicine mulberry leaves polysaccharide and eucommia polysaccharide immunostimulant and application thereof2018 9,984,282Systems and methods for distinguishing facial features for cosmetic application2018 9,976,191Rice whole genome breeding chip and application thereof2018 9,931,506Artificial retinal prosthesis system, optical device and retina chip2018 9,899,305'Semiconductor package structure'2018 9,861,676'Herbal composition and method of use'2018 9,818,720'Structure and formation method for chip package'2017 9,806,058'Chip package having die structures of different heights and method of forming same'2017 9,741,669'Forming large chips through stitching'2017 9,698,115'Three-dimensional chip stack and method of forming the same'2017 9,668,311'Integrated circuits for AC LED lamps and control methods thereof'2017 9,661,696'AC LED lighting systems and control methods efficiently providing operating voltage'2017 9,514,765'Method for reducing noise and computer program thereof and electronic device'2016 9,472,898'Small form-factor pluggable connector with a locking and unlocking mechanism'2016 9,435,316'Wave power generation system and motion control module thereof'2016 9,423,575'Small form-factor pluggable connector'2016 9,411,649'Resource allocation method'2016 9,355,980'Three-dimensional chip stack and method of forming the same'2016 9,348,351'Switch circuit'2016 9,295,963'Processes for producing light olefins'2016 9,234,493'Wave power generation system and hydraulic component thereof'2016 9,134,769'Portable electronic device and an input module and a flexible bridging board thereof'2015 9,034,229'Composition and process for preparing NIR shielding masterbatch and NIR shielding masterbatch and application thereof'2015 8,966,402'System and method for editing interactive three-dimension multimedia, and online editing and exchanging architecture and method thereof'2015 8,937,433'LED lighting systems, LED controllers and LED control methods for a string of LEDs'2015 8,895,447'Semiconductor hole structure'2014 8,860,217'Electronic device package'2014 8,823,179'Electronic device package and method for fabricating the same'2014 8,772,932'Electronic device package'2014 8,766,431'Power MOSFET package'2014 8,728,871'Method for fabricating electronic device package'2014 8,723,316'Chip package structure using flexible substrate'2014 8,692,045'Processes for producing light olefins'2014 8,590,298'Changeable damping wave power capturing device driven by bidirectional screw rod'2013 8,564,133'Chip package and method for forming the same'2013 8,541,877'Electronic device package and method for fabricating the same'2013 8,449,801'Composition and process for preparing NIR shielding masterbatch and NIR shielding masterbatch and application thereof'2013 8,410,599'Power MOSFET package'2013 8,372,902'Non-dripping flame retarding masterbatch, composition and process for preparing the same and flame retarding article containing the same'2013 8,319,347'Electronic device package and fabrication method thereof'2012 8,310,050'Electronic device package and fabrication method thereof'2012 8,227,532'Non-dripping flame retarding masterbatch, composition and process for preparing the same and flame retarding article containing the same'2012 8,227,927'Chip package and fabrication method thereof'2012 8,189,354'Voltage converter with high efficiency'2012 7,718,366'Methods and compositions relating to COL2A1 gene mutations and osteonecrosis'2010 7,663,237'Butted contact structure'2010 7,642,176'Electrical fuse structure and method'2010 7,349,234'Magnetic memory array'2008 7,173,841'Magnetic memory array'2007 7,165,939'Shaft structure for cooling fan rotor'2007 7,161,801'Commutate silencer of computer system'2007 7,117,460'Method for physical parameter extraction for transistor model'2006 6,794,203'Method of calculating the real added defect counts'2004 6,684,164'True defect monitoring through repeating defect deletion'2004 6,225,167'Method of generating multiple oxide thicknesses by one oxidation step using NH3 nitridation followed by re-oxidation'2001 6,133,093'Method for forming an integrated circuit'2000 5,998,529'Colorful coating material'1999 5,969,383'Split-gate memory device and method for accessing the same'1999 5,855,373'Equilibrium game device'1999 5,824,584'Method of making and accessing split gate memory device'1998 5,545,574'Process for forming a semiconductor device having a metal-semiconductor compound'1996 5,432,723'Parallel infinite impulse response (IIR) filter with low quantization effects and method therefor'1995

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1995–2000Patents assigned to MOTOROLA INC (5)· patent assignee history

1995–2000Based in Austin, TX, US· patent location history

1999–2019Based in Taipei, TW· patent location history

2001–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (7)· patent assignee history

2001–2018Based in Hsinchu, TW· patent location history

2007–2018Patents assigned to CHEN WEI-MING (17)· patent assignee history

2012–2013Patents assigned to CHANG SHU-MING (5)· patent assignee history

2015–2016Based in New Taipei, TW· patent location history

2016–2020Based in Hsinchu County, TW· patent location history

2017–2019Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
CHEN WEI-MINGself	17	2007–2018
TAIWAN SEMICONDUCTOR MFG CO LTD	9	2017–2019
TAIWAN SEMICONDUCTOR MFG	7	2001–2016
CHANG SHU-MING	5	2012–2013
MOTOROLA INC	5	1995–2000

Locations

Location	Patents	Span
Hsinchu, TW	26	2001–2018
Taipei, TW	16	1999–2019
Austin, Texas, US	5	1995–2000
Hsinchu County, TW	3	2016–2020
New Taipei, TW	3	2015–2016