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Inventor

Thomas Weiss

Inventor
Poughkeepsie, NY, US

Overview

68→
Patents
1985–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 68 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H01LSemiconductor devices14%
Y10TTechnical subjects covered by former us classification8%
G06FElectric digital data processing7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B23KSoldering or unsoldering4%
B05CApparatus for applying fluent materials to surfaces, in general2%
B26FPerforating2%
G08BSignalling systems, e.g. personal calling systems2%
PatentTitleYear
10,840,214Carrier and integrated memory202010,833,051Precision alignment of multi-chip high density interconnects202010,832,987Managing thermal warpage of a laminate202010,756,031Decoupling capacitor stiffener202010,636,746Method of forming an electronic package202010,624,202Tamper-respondent assemblies with bond protection202010,586,782Lead-free solder joining of electronic structures202010,515,929Carrier and integrated memory201910,431,563Carrier and integrated memory201910,424,527Electronic package with tapered pedestal201910,327,343Applying pressure to adhesive using CTE mismatch between components201910,264,665Tamper-respondent assemblies with bond protection201910,257,924Tamper-proof electronic packages formed with stressed glass201910,251,288Tamper-respondent assembly with vent structure201910,242,931Liquid cooled compliant heat sink and related method201910,177,075Liquid cooled compliant heat sink and related method201910,178,818Enclosure with inner tamper-respondent sensor(s) and physical security element(s)201910,172,232Tamper-respondent assemblies with enclosure-to-board protection20199,999,124Tamper-respondent assemblies with trace regions of increased susceptibility to breaking20189,913,370'Tamper-proof electronic packages formed with stressed glass'20189,913,362'Tamper-respondent assemblies with bond protection'20189,913,416'Enclosure with inner tamper-respondent sensor(s) and physical security element(s)'20189,913,389'Tamper-respondent assembly with vent structure'20189,894,749'Tamper-respondent assemblies with bond protection'20189,877,383Tamper-respondent assemblies with enclosure-to-board protection20189,875,986Micro-scrub process for fluxless micro-bump bonding20189,735,041'Universal clamping fixture to maintain laminate flatness during chip join'20179,716,028'Universal clamping fixture to maintain laminate flatness during chip join'20179,717,154'Enclosure with inner tamper-respondent sensor(s)'20179,673,177'Selectively soluble standoffs for chip joining'20179,661,747'Tamper-respondent assemblies with enclosure-to-board protection'20179,591,776'Enclosure with inner tamper-respondent sensor(s)'20179,578,764'Enclosure with inner tamper-respondent sensor(s) and physical security element(s)'20179,555,606'Applying pressure to adhesive using CTE mismatch between components'20179,554,477'Tamper-respondent assemblies with enclosure-to-board protection'20179,548,863'Method for unambiguous marking of an object'20179,543,253'Method for shaping a laminate substrate'20179,293,439'Electronic module assembly with patterned adhesive array'20169,278,401'Fill head interface with combination vacuum pressure chamber'20169,093,563'Electronic module assembly with patterned adhesive array'20159,089,052'Multichip module with stiffening frame and associated covers'20159,089,051'Multichip module with stiffening frame and associated covers'20159,059,240'Fixture for shaping a laminate substrate'20159,048,245'Method for shaping a laminate substrate'20159,002,167'Optical fiber management bridge'20158,940,550'Maintaining laminate flatness using magnetic retention during chip joining'20158,337,646'Greensheet via repair/fill tool'20128,297,222'Fully automated paste dispense system for dispensing small dots and lines'20128,123,088'Dispensing assembly with a controlled gas environment'20127,984,546'Tool for filling vias in a greensheet'20117,964,237'Fully automated paste dispense process for dispensing small dots and lines'20117,894,919'Fully automated paste dispense system for dispensing small dots and lines'20117,887,874'Fully automated paste dispense system for dispensing small dots and lines'20117,510,619'Greensheet via repair/fill tool'20097,401,637'Pressure-only molten metal valving apparatus and method'20087,119,421'Quad flat non-leaded package comprising a semiconductor device'20066,890,797'Method of making a surface mountable semiconductor device using a flexible foil and a semiconductor device obtained by means of said method'20056,679,146'Die set with disposable molybdenum die plate and improved window plate for universal gang-punch tool'20046,565,496'Fully automated precision punch head loader for universal gang-punch tool'20036,532,654'Method of forming an electrical connector'20036,529,021'Self-scrub buckling beam probe'20036,405,622'Support apparatus for positioning a workpiece'20026,389,940'Gang punch tool assembly'20026,314,852'Gang punch tool assembly'20016,223,636'Low-cost high-density gang punch'20016,133,540'Apparatus and method for producing punch pin with spherical head'20006,055,894'Support apparatus for positioning a workpiece'20004,549,134'Moisture probe and technique'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2020Patents assigned to IBM (61)· patent assignee history
2000–2002Based in Poughquag, NY, US· patent location history
2003–2020Based in Poughkeepsie, NY, US· patent location history
2005–2006Patents assigned to KONINKL PHILIPS ELECTRONICS NV (2)· patent assignee history
2005–2006Based in Hamburg, DE· patent location history
2012–2015Patents assigned to WEISS THOMAS (5)· patent assignee history
2012Patents assigned to LAPLANTE MARK J (2)· patent assignee history
2015Based in Telford, PA, US· patent location history
2016–2017Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2017Based in Salzburg, AT· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM612000–2020
WEISS THOMASself52012–2015
GLOBALFOUNDRIES INC22016–2017
KONINKL PHILIPS ELECTRONICS NV22005–2006
LAPLANTE MARK J22012
Locations
LocationPatentsSpan
Poughkeepsie, New York, US572003–2020
Poughquag, New York, US62000–2002
Hamburg, DE22005–2006
Salzburg, AT12017
Telford, Pennsylvania, US12015